mobile cis comparison 2019...©2019 by system plus consulting | mobile cmos image sensor comparison...

©2019 by System Plus Consulting | Mobile CMOS Image Sensor Comparison 2019 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Mobile CIS Comparison 2019Physical Analysis & Cost ComparisonImaging report by Audrey LAHRACHPhysical Analysis done by Guillaume CHEVALIER March 2019 – version 1

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 7

o Smartphones Level

6 OEMs

Teardown smartphones

o CIS Level

3 Visible CIS Manufacturers

3 Infrared CIS Manufacturers

Physical Comparison 35

o CIS Summary

o Rear-Facing

Dual Camera

Triple Camera

o Front-Facing

Standard Camera

Dual Camera (NIR CM)

Physical Evolution 40

o OEM Evolution

Apple

Samsung

Huawei

Xiaomi

o CIS Manufacturer Evolution

Manufacturing Process 65

o Visible

Sony

Samsung

Omnivision

o Infrared

Omnivision

STMicroelectronics

Samsung

Cost Comparison 90

o Visible (Sony, Samsung & Omnivision)

o Infrared (Omnivision, STMicroelectronics & Samsung)

o CIS Dies Cost per smartphone

Deep Physical Analysis 110

o Summary of the Physical Analysis

o CM Opening, CIS Overview & Cross-Section

iPhone X

Samsung Galaxy S9+

Oppo Find X

Xiaomi Mi8

Vivo X21 UD

Huawei P20 Pro

Huawei Mate 20 Pro

Feedbacks 290

SystemPlus Consulting services 292




Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile

Physical Comparison

Physical Evolution

Manufacturing Process

Cost Comparison

Detailed Physical Analysis

Related Reports

About System Plus

Executive Summary

To offer an idea of the actual state-of-the-art in CMOS Image Sensors for leading flagships sold in 2018, Yole Developpementand SystemPlus Consulting offer two connected reports. Along with Yole Development’s “Status of CMOS Image Sensor Industry2018”, this overview will give you a comprehensive technical and cost evaluation of the main OEM choices.

We have conducted this comparative study to provide insights into the structure and technology of 28 CIS die in seven flagshipsmartphones from several major brands: the Apple iPhone X; Samsung Galaxy S9 Plus; Huawei P20 Pro; Huawei Mate 20 Pro;Xiaomi Mi8 Explorer Version; Oppo Find X; and Vivo X21UD. This report is connected to the SystemPlus Consulting’s “MobileCamera Module Comparison 2019” report, which gives an overview and details about the structure of each camera module.

The report has shown that the four manufacturers of CIS presented in the flagships, Sony, Samsung, Omnivision andSTMicroelectronics, have totally different approaches. For example, Sony is the only manufacturer using hybrid bonding in theanalyzed devices, having completely dropped fusion bonding with Through-Silicon Vias (TSVs). We have extracted furthertechnical choices from the four players from the analysis and comparisons.

We analyze the CIS dies integrated in rear and front-facing CMOS Camera Modules (CCMs) including main cameras, wide angle,telephoto and near global shutter infrared, from technology node to die size. Additionally, we have studied the costs of the CISsto compare the economic choices of the manufacturers.




Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile

Physical Comparison

Physical Evolution


Cost Comparison


Related Reports

About System Plus

Reverse Costing Methodology

The reverse costing analysis is conducted in 3 phases:

Teardown analysis

•The dies are extracted in order to get overall data: dimensions, technology node, pad number and die marking.• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price




Overview / Introduction

Company Profileo Smartphones Level

o 6 OEMso Teardown

smartphoneso CIS Level

o 3 Visible CIS Mnf.o 3 Infrared CIS Mnf.

Physical Comparison

Physical Evolution


Cost Comparison


Related Reports

About System Plus

Camera Module Overview: Breakdown per Type and CIS Manufacturer






o 6 OEMso Teardown



Physical Comparison

Physical Evolution


Cost Comparison


Related Reports

About System Plus

Overview From Smartphones Level to CIS Die Level

RGB Front Camera Module Overview©2019 by System Plus Consulting

Example of Camera Module Exploded View

Camera Module Extraction Example






o 6 OEMso Teardown



Physical Comparison

Physical Evolution


Cost Comparison


Related Reports

About System Plus

Apple iPhone X – CMOS Image Sensors Overview

Telephoto Camera - CIS Die Overview©2019 by System Plus Consulting

Wide Angle Camera - CIS Die Overview©2019 by System Plus Consulting

Front Color Camera - CIS Die Overview©2019 by System Plus Consulting

NIR Front Color Camera - CIS Die Overview©2019 by System Plus Consulting

Die Area: xxxmm²(xx x xx mm)

Pad number: xxx

Pixel array: xxxmm²

Resolution: xxxMp

Pixel size: xxxµm


Pad number: xx


Resolution: xxxMp

Pixel size: xµm

Rear

Front

Total Silicon Die Area: xxxmm²


Pad number: xxx


Resolution: xxxMp

Pixel size: xxxµm


Pad number: xx


Resolution: xxxMp

Pixel size: xµm

CIS Manufacturer logo CIS Manufacturer logo

CIS Manufacturer

logo

CIS Manufacturer

logo





Company Profile

Physical Comparisono Front Facing Standardo Front Facing Dualo Rear Facing Dual Separateo Rear Facing Dual on same

substrateo Rear Facing Tri-Camera

Physical Evolution


Cost Comparison


Related Reports

About System Plus

Summary of all CCM Analyzed





Company Profile

Physical Comparisono Front Facing Standardo Front Facing Dualo Rear Facing Dual Separateo Rear Facing Dual on same

substrateo Rear Facing Tri-Camera

Physical Evolution


Cost Comparison


Related Reports

About System Plus

Standard Front CM Comparison – Sensor Die

xx mm

Pixel Array

Xx mm

Xx m

m

Xx

mm

Huawei P20 Pro – CIS Die©2018 by System Plus Consulting

xx mm

Pixel Array

Xxx mm

Xxx m

m

Xx

mm

Vivo X21 UD – CIS Die©2018 by System Plus Consulting

Both pixel arrays are close to xxmm² but the Huawei P20 Pro CIS die has a xxx xxx more xxx than the Vivo X21 UD.Huawei has integrated a xxxx CIS die which used a pixel size of xxxµm and a xxxxx xxxxx process unlike Vivo that has integrated a sensor from xxxx which used a pixel size of xxxµm with a xxxxxx process.





Company Profile

Physical Comparison

Physical Evolutiono OEM Evolution

o Appleo Samsungo Huaweio Xiaomi

o CIS Manufacturer Evolution


Cost Comparison


Related Reports

About System Plus

Rear CCM Comparison – Sensor Die

Xiaomi Mi6 – Telephoto©2018 by System Plus Consulting

Xiaomi Mi8 – Color CIS©2018 by System Plus Consulting

Xiaomi Mi8 – Telephoto©2018 by System Plus Consulting

Xiaomi Mi6 – Color CIS©2018 by System Plus Consulting

Xxx

mm

Xx mm

Pixel Array

Xx mm

Xx m

m Xxx

mm

Xxx mm

Pixel Array

Xxx mm

Xxx m

m

Xx mm

Pixel Array

Xxx mm

Xxx m

m

Xxx

mm

Xxx mm

Pixel Array

Xxx mm

Xxx m

m

Xxx

mm

Xiaomi has kept the same die from xxxxx for his telephoto camera in the Xiaomi Mi6 and the Mi8.The second die (wide angle) from xxxxx has changed, they has kept the same xxxxxx but has changed the xxxxx and so the xxxxx.





Company Profile

Physical Comparison

Physical Evolution

Manufacturing Processo Visible

o Sonyo Samsungo Omnivision

o Infrared

o Omnivisiono STMicroelectronicso Samsung

Cost Comparison


Related Reports

About System Plus

Cu-Cu Hybrid Bonding Process





Company Profile

Physical Comparison

Physical Evolution


Cost Comparisono Visible


o Infraredo Omnivisiono STMicroelectronicso Samsung


Related Reports

About System Plus

Infrared Front CM – CIS Front-End Cost





Company Profile

Physical Comparison

Physical Evolution






Related Reports

About System Plus

Infrared Front CM – CIS Front-End Cost





Company Profile

Physical Comparison

Physical Evolution






Related Reports

About System Plus

Infrared Front CM – CIS Die Cost





Company Profile

Physical Comparison

Physical Evolution


Cost Comparison

Detailed Physical Analysiso Summaryo CM Opening, CIS Overview &

Cross-Sectiono iPhone Xo Samsung galaxy S9o Oppo Find Xo Xiaomi Mi8o Vivo X21UDo Huawei P20 Proo Mate 20 Pro

Related Reports

About System Plus

CIS Manufacturer’s choice by OEM





Company Profile

Physical Comparison

Physical Evolution


Cost Comparison



Related Reports

About System Plus

Total CIS Die Area per smartphone

80

100

120

140

160

3 Camera Modules 4 Camera Modules 5 Camera Modules(mm²)

60





Company Profile

Physical Comparison

Physical Evolution


Cost Comparison



Related Reports

About System Plus

Rear CIS Die xxx – Cross-Section – ‘Manufacturer’ – xxx Bonding

Pixel Array + Logic Circuits Cross-section – SEM View©2019 by System Plus Consulting

Active silicon with pixels

Microlenses & Color filters

CIS Circuit x Metal Layers

Logic Circuit x Metal Layers

Silicon Substrate

xxxxx xxxxx

xxxxxxxxx

Pixel Array circuit(BSI)

Logic circuit





Company Profile

Physical Comparison

Physical Evolution


Cost Comparison



Related Reports

About System Plus

Rear CIS Die xxx – Cross-Section – ‘Manufacturer’ – xxx Bonding

Pixel Array + Logic Circuits Cross-section – SEM View©2019 by System Plus Consulting

Active silicon with pixels

Microlenses & Color filters

CIS Circuit 4 Metal Layers

Logic Circuit x Metal Layers

Silicon Substrate

xxxxxxxx

xxxxxxx

Pixel Array circuit(BSI)

Logic circuit





Company Profile

Physical Comparison

Physical Evolution


Cost Comparison


Related Reports

About System Plus

Linked Report

Status of the CMOS Image Sensor Industry 2018 – by YoleDéveloppement

Proliferation of cameras for imaging and sensing is driving CMOSimage sensor (CIS) growth

KEY FEATURES OF THE REPORT• 2017-2023 Forecast• 2017 M&A activity• Ecosystem update• Dual and 3D camera trends for mobile• Mobile applications and technologyBundle offer possible with the Mobile CMOS Image Sensor Comparison 2019 report by System PlusConsulting, contact us for more information.



https://www.i-micronews.com/category-listing/product/status-of-the-cis-industry-2018.html

mailto:[email protected]





Company Profile

Physical Comparison

Physical Evolution


Cost Comparison


Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

IMAGING• Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics• Status of the CMOS Image Sensor Industry 2018• 3D Imaging & Sensing 2018

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IMAGING• Mobile Camera Module Comparison 2019• Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Edition• Orbbec’s Front 3D Depth Sensing System in the Oppo Find X• STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X• Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP



https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html


https://www.i-micronews.com/produit/status-of-the-camera-module-industry-2019-focus-on-wafer-level-optics/





https://www.systemplus.fr/reverse-costing-reports/sony-imx400-tri-layer-stacked-cmos-image-sensor-cis-with-integrated-dram-and-dsp/


https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-near-infrared-camera-sensor-in-the-apple-iphone-x/


https://www.systemplus.fr/reverse-costing-reports/mobile-camera-module-comparison-2019/

https://www.systemplus.fr/reverse-costing-reports/mantis-visions-3d-depth-sensing-system-in-the-xiaomi-mi8-explorer-edition/

https://www.systemplus.fr/reverse-costing-reports/orbbecs-front-3d-depth-sensing-system-in-the-oppo-find-x/











CMOS Image Sensors for leading flagships

sold in 2018, Yole Développement and

System Plus Consulting offer two

connected reports. , this overview will

give you a comprehensive technical and

cost evaluation of the main OEM choices.

System Plus Consulting has conducted a

comprehensive technical and cost

evaluation of CMOS Image Sensors in

leading flagships sold in 2018. Discover

the comparative study that provides

insights into the structure and technology

of 28 CIS dies in seven flagship

smartphones from several major brands:

Apple iPhone X; Samsung Galaxy S9 Plus;

Huawei P20 Pro; Huawei Mate 20 Pro;

Xiaomi Mi8 Explorer Version; Oppo Find

X; and Vivo X21UD. This report is

connected to the System Plus Consulting’s

“Mobile Camera Module Comparison

2019” report, which gives an overview

and details about the structure of each

camera module.

The report has shown that the four

manufacturers of CIS presented in the

flagships, Sony, Samsung, Omnivision and

STMicroelectronics, have totally different

approaches. For example, Sony is the only

manufacturer using hybrid bonding in the

analyzed devices, having completely

dropped fusion bonding with Through-

Silicon Vias (TSVs). We have extracted

further technical choices from the four

players from the analysis and

comparisons.

We analyze the CIS dies integrated in rear

and front-facing CMOS Camera Modules

(CCMs) including main cameras, wide

angle, telephoto and near global shutter

infrared, from technology node to die

size. Additionally, we have studied the

costs of the CISs to compare the economic

choices of the manufacturers.

COMPLETE TEARDOWN WITH

• Detailed photos

• Precise measurements

• Die cross-sections

• Sensor measurements

• Material analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Physical comparisons

• Cost comparisons

Physical analysis and cost comparison of 28 CMOS Image Sensors found in sevenleading flagship smartphone cameras from Apple, Samsung, Huawei, Xiaomi,Oppo and Vivo.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Title: Mobile CIS Comparison 2019

Pages: 300

Date: March 2019

Format: PDF & Excel file

Price: EUR 6,490

Mobile CMOS Image Sensor Comparison 2019

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

TABLE OF CONTENTS

Overview/Introduction• Executive Summary• Reverse Costing Methodology

Company Profile• Smartphones level

o 6 OEMso Teardown smartphones

• CIS Levelo 3 visible CIS manufacturerso 3 infrared CIS manufacturers

Physical Comparison• CIS Summary• Rear-Facing

o Dual camerao Triple camera

• Front-Facingo Standard camerao Dual camera (NIR CM)

Physical Evolution• OEM Evolution

o Appleo Samsungo Huaweio Xiaomi

• CIS Manufacturer EvolutionManufacturing ProcessVisible

• Sony

AUTHORS

• Samsung• OmniVision

Infrared• OmniVision• STMicroelectronics• Samsung

Cost ComparisonVisible

• Sony CIS Die• Samsung CIS Die• OmniVision CIS Die

Infrared• OmniVision CIS Die• STMicroelectronics CIS• Samsung CIS Die

Cost per SmartphonesDetailed Physical Analysis

• Summary of the Physical Analysis• CM Opening, CIS Overview & Cross-Section

o iPhone Xo Samsung Galaxy S9+o Oppo Find Xo Xiaomi Mi8o Vivo X21 UDo Huawei P20 Proo Huawei Mate 20 Pro

MOBILE CMOS IMAGE SENSOR COMPARISON 2019

RELATED REPORTS

Mobile Camera Module Comparison 2019January 2019 - EUR 6,490*

Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer EditionDecember 2018 - EUR 3,990*

Orbbec’sFront 3D Depth Sensing System in the OppoFind XNovember 2018 - EUR 3,990*

Audrey Lahrach is in charge of costinganalyses for IC, LCD & OLED Displaysand Sensor Devices. She holds aMaster degree in Microelectronicsfrom the University of Nantes.

Guillaume Chevalier has joinedSystem Plus Consulting in early 2018to perform physical analyses. He holdsa two-year university degree intechnology of physical measurementsand instrumentation technics.

LINKED REPORT

Status of the CMOS Image Sensor Industry 2018– Market and

Technology Report by Yole Développement

Bundle offer possible with the Mobile CMOS Image Sensor

Comparison 2019, contact us for more information at

[email protected]

COSTING TOOLS

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Process-BasedCosting Tools

ParametricCosting Tools

WHAT IS A REVERSE COSTING®?

Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.

IC Price+

MEMS CoSim+

MEMS Price+

Power CoSim+

Power Price+

LED CoSim+

3D PackageCoSim+

DisplayPrice+

PCBPrice+

SYSCost+

CONTACTS

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting is specialized

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from semiconductor devices to

electronic systems.

A complete range of services and

costing tools to provide in-depth

production cost studies and to

estimate the objective selling price of

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Our services:

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Our analysis is performed with our costing tools 3D Packaging CoSim+ and IC Price+.

System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from

single chip to complex structures.

IC Price+The tool performs the necessary cost simulation ofany Integrated Circuit: ASICs, microcontrollers,memories, DSP, smartpower…

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