mkid arrays: panoramic detectors for cmb experiments · semnario finale, 23 ottobre 2009. microwave...
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MKID MKID arraysarrays: : panoramicpanoramic
detectors for detectors for CMBCMB
experimentsexperiments
Dottoranda: Claudia GiordanoDottoranda: Claudia Giordano
Docente guida: Prof. Paolo de Docente guida: Prof. Paolo de BernardisBernardis
Università di Roma “Sapienza”
Dottorato di Ricerca in Fisica, XXII ciclo
Semnario finale, 23 ottobre 2009
MMicrowaveicrowave KKineticinetic IInductancenductance DDetectorsetectors
Superconductors below a critical temperature Tc have electrons divided in two
different populations:
-the Cooper Pairs, electrons bound together with an energy E=2 3.528*kbTc by the
electron-phonon interaction. They act as superconducting carriers.
- the Quasi-Particles, single electrons which act as carriers in a normal metal.
In this two fluids model the total conductivity
of the material is:
= 1(nQP) - j 2(nCP)
Quasi-Particles
Zs = Rs( 1, 2) + iXs ( 1, 2)
Cooper Pairs
and the complex surface impedance is:
Xs= Lint= (Lm,int+Lk)
Rs and Xs can be estimated using theMattis-Bardeen integrals for 1 and 2:
= (T) temperature (K)
Rs (
/sq
ua
re)
temperature (K)
Xs (
/sq
ua
re)
temperature (K)
dX
s/d
T (
/sq
ua
re K
-1)
nQ
P (μ
m-3
)
temperature (K)
The values of Rs and Xs depend on the
densities of QPs and CPs. By measuring
them, we can get information on nQP .
Which are the effects of incoming radiation
on a superconducting strip?
n CP< nCP
QP
CP
T<Tc
h >2 E
Zs changes because:
• nCP increases
• nQP decreases
• both Rs and Xs increase, in particular Lkin
How can we measure the small variation in Lk?film thickness (nm)
Lx (
pH
/sq
ua
re)
Cc
RQPLkin
Lmag
Cl
The superconductor can be inserted in a resonating circuit with extremely high Q.
Two different possibilities:
Feedline
Inductive Coupling
Inductive
section
Capacitive
section
1) Distributed l= bias/4 resonators
2) Lumped resonators l<< bias
response depends on
where the photon hits the
sensor
equivalent circuit: RLC series
needs some sort
of antenna
no current variation along its
length, acts as free absorberequivalent circuit: RLC series
Effect of a signal transmitted through the feed line past the resonator:
d
d
dNQP
= responsivity
x
x
xdNQP=(responsivity)-1 * d
Pabs =dNQP (0)
QP
(0), known
QP measurable
amplitude
dA
f01
LintC
phase
d
df0 d
x
C1
R1QPL1
kin
L1mag
C2
R2QP
L2kin
L2mag
CN
RNQPLN
kin
LNmag
RF carrier (f 1 + f 2 + f 3 + ... + f N)
Pixel 1, f 1 Pixel 2, f
2 Pixel N, f N
The fact that each resonator has no effect even few MHz away from its resonant
frequency makes these detectors ideal for frequency domain multiplexing:
Very resistant: materials are all suitable for satellite and space missions, like CMB mission.
Extremely simple cold electronics: one single
amplifier can be used for 103-104 pixels. The rest
of the readout is warm.
Very flexible: different materials and
geometries can be chosen to tune detectors
to specific needs.
order of 103-104 pixels read with a single coax
low thermal load!
CMB signals are very low
0,1μK B modes
missions 100 times more sensitive are
needed to get the polarization data
such a gain has to arise from larger focal planes,
with arrays of thousands of independent detectors
Low temperature detectors like spider web bolometers
at 0.1K work in BLIP conditions, so
1μK E modes
higher S/N, faster mapping speed
Lumped resonators for millimetric wavelengths: design process
1) pixel size: needs to be of order of at least one wavelength
2) meander section: optimization of the matching with the free space impedance
If >>s Zeff = Z(w + s)
w
=(Zeff Z0)
(Zeff + Z0)
3) Capacitive section: choice of the resonance frequency
2mm
2m
m
4μm
280μm
Sonnet simulation
CPWMS
• 9 frequencies
• 3 distances
from the
feedline
Our mask: 34 chips 1cmx1cm
+ 2 large arrays 3cmx3cm
• CPW, MS• line width 2μm, 4μm
• optical wavelength: 2mm, 1,25mm
• different numbers of resonators
Superconducting metal: Aluminum
• ok for mm waves: gap= 90 GHz
• Tc = 1.2 K
d
dNQP
QdT
dNQP
Q
V=LintL
1
t
Aluminum thickness t:
Lumped resonators for millimetric
wavelengths: materials and their thicknesses
lower t higher responsivity
lower t higher resistivity = better free space matching
Substrate material: Silicon and Sapphire
t=20nm, 40nm
Si 400μm, Si 170μm, Sa 300μm
Si 389μmSi 400μm
free space substrate resonator back short
The mask has been fabricated at FBK (“Fondazione Bruno Kessler”)
measured during my phd
better results on wafer 11
WAFER
SCN-CN coax
2xDC block
30dB cold amplifier
2xDC block
2x10dB atten
1xDC block1xDC block
1x10dB atten
KID
300K
30K
2K
300mK
CN-CN coax
Nb-Nb coax
amplifier
KIDs testbench: cryogenic system and RF circuit
3x10dB atten
bias generator and
acquisition data system
VNA : slower, easier, can give information on
the sanity of the whole circuit. Ideal for the
first runs.
IQ mixers: faster, essential to measure
noise, QP lifetime.36mm
Mechanical
supports for
the devices
Using IQ mixers it is possible to plot
S21 in the complex plane
0.3K 4K
Re(S21)
Im(S21)
information on both the
amplitude and the phase
of the signal.
frequency
fmax=4.0001GHz
fmin=3.9999GHz
fresonance=4.0000GHzS21
min
xiQ
xiQSS
min
+
+=
21
221
21
0
0=x
In microwave theory circuits are
described by the S parameters. S21
gives the ratio of the transmitted
wave to the incident wave
For an ideal RLC circuit:
Measurements: transition temperature
Tc =1.36K
n (1.4K)
n (300K)=R(300K)
R(1.4K)= 3.6
n (1.4K) = 3.61
2.67 10 8( m)=1.35 108( m)
RRR (Residual Resistance Ratio)=
Measurements: resonances
280±7288±710292±943423.354±0.01277
729±31763±2016161±5633375.301±0.01266
1923±772089±8124190±2543318.800±0.01555
4337±975913±10016271±2403254.320±0.02144
5878±3710902±2812754±743195.848±0.23333
7959±5319343±7613523±733144.330±0.1222
10799±9915032±10313523±2343091.392±0.06611
Q±Q± QQQQee±± QeQeQQii±± QiQiff00±± f0 f0 ((MHzMHz))# # lekidlekid
Power sweep
Effect of temperature sweep on:
phaseamplitude
Higher T Higher nqp Higher losses
Higher T Lower ncp Lower f0
=LintLTOT
f0(T)
f0(0)=
1
2
Lint (T)
Lint (0)= 0.062 ± 0.001
Distributed MKIDs with t=200nm have = 0.018
Effect of temperture variation on
the quality factors Qi, Qe and Q:
Qi = 0
L
R
Qi =LZ0
0M2
increases with decreasing
temperature
constant
weakly coupled lekid
strongly coupled lekid Q Qe
d
dnQP= 0.035 ± 0.003 (deg/μm-3)
the red crosses correspond to
the base temperature resonant
frequency
Volume 780μm3d
dNQP
= 4.5 10 5 deg/QP
All responsivity are in the interval:
2.3 10 6÷ 9.9 10 5 deg/QP
maximum power before saturation:
6.2 10 12÷1.4 10 13Watt
System modified for optical measurements:
300K 30K 2K
300mK
Po
lye
thile
ne
win
do
w
Flu
oro
go
ld
(40
0G
Hz lo
wp
ass)
Flu
oro
go
ld +
14
5G
Hz b
an
dp
ass filte
r
BB(77K)
chopper
KID
d
Ain
2dA
in=
Pin ( ,T) = ( ) BB( ,T) AKID
300mK
Signal 11deg
d =11deg
dNQP 2 105
d
dNQP
= 5.7 10 5 deg/QP
(0) 1.764kBTc0.57
Pabs =dNQP (0)
QP
The quasi-particles lifetime:
QP=33.56±0.14μs
Pabs =dNQP (0)
QP
= 0.34 pW Absorption efficiency abs =PabsPin
=0.34 pW
2.2pW=16%
Si 400μm
distributed MKID’s have abs 2%
Signal 8deg
Signal 13deg
abs=23%
abs=38%
Lekid 3 3196MHz: front illumination
Lekid 3 3196MHz: back illumination
Noise level 1.6 10 3 deg
Hz
S
N= 6.9 103 Hz
NEP =2.2 10 12W
6.9 103 Hz= 3.2 10 16 W
Hz
The Noise Equivalent Power:
S =11deg
Conclusions The Microwave Kinetic Inductance Detectors have many characteristics that
make them ideal for CMB experiments which require large arrays of detectors.
The first measurements already done on distributed Al and NbN chips were
very promising and confirmed the potential of these detectors.
We have developed a detector with a lumped geometry in order to optimize its
coupling to the millimetric radiation.
We have fabricated a mask and tested the first chips, determining theircharacteristic parameters (Q, responsivity) and the material properties (Tc, n , QP).
We have observed a light signal finding absorption efficiencies up to 38%, in
good agreement with the theoretical predictions and much higher than what we
obtained with the distributed MKIDs.
The measured NEP is
Some open issues:
the simultaneous measurement of more pixels
The development of a system to reach lower
temperatures
Work in progress!
3.2 10 16 W
Hz
Examples of typical lithographic
problems on wafer 12