microtechniek drukken van polymere rfid tags 20100218
TRANSCRIPT
April 12, 2023
Drukken van polymere RFID tags
Gerwin Gelinck
RFID meer dan hype
18 february 2010, Eindhoven
Presentation
overview
Gerwin Gelinck - RF ID, meer dan Hype?
Holst Centre – a short introductionRF ID is dead, long live RF sensors
Smart Blister
Enabling technologies
Printing of thin Si chips
Printed transistors
© Holst Centre
Gerwin Gelinck - RF ID, meer dan Hype?
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Partner in research
• Independent, with reputed parents Founded by IMEC (1300 fte, Belgium) and TNO
(4500 fte, the Netherlands) Established in 2005
• Critical mass Staff of 150 researchers; 25 nationalities 60 resident researchers from industry and
universities
• Global network Industrial and academic partners
• Supported by Dutch government Measured by its international excellence, long-
term vision and impact on Dutch economy
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At the hotspot of human-focused innovation
• High-Tech Campus, initiated by Philips
• >90 companies, 7000 researchers
• Shared labs (www.miplaza.com); >8000 m² cleanrooms
• Open Innovation research centres (e.g. Holst Centre)
Materials Analysis
Electronic measurement
Thin Filmclean room
OLED Device Processing
Reliability lab
Photonics cleanroom
ElectronicPrototyping
EquipmentEngineering
Life Sciences
EMC lab
Holst CentreR2R lab
Holst Centre Offices
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Industrial partners from across the value chain
Presentation
overview
Gerwin Gelinck - RF ID, meer dan Hype?
Holst Centre
From RF ID to RF sensorsSmart Blister
Enabling technologies
Printing of thin Si chips
Printed transistors
© Holst Centre
Gerwin Gelinck - RF ID, meer dan Hype?
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RF ID – hype or reality?
IBM CEO Sam Palmisano (Nov 6, 2008 speech highlighting ‘Big Blue’s vision of a ‘Smart Planet’)
• “There will likely be 4 billion mobile phone subscribers by the end of this year … and 30 billion RF ID tags produced globally within two years.”
• “Sensors are being embedded across entire ecosystemd – supplychains, healthcare, network, cities … even natural systems like rivers.”
• “Very soon there will be 2 billion people on the internet. But in an instrumented world, systems and objects can now “speak” to one another, too. Think about the prospect of a trillion connected and intelligent things – cars, appliances, cameras, roadways, pipelines … even pharmaceuticals and livestock.”
IDTechEx Market Analyses (2008)• Item-level tag volume in 2015: 163 billion units, $5.3billion, 101% CAGR
Note this implies average sale price of 3ct/tag• RTLS (real time location systems) in 2017:$2.71billion; now ‘increasing sharply’
“Some of the largest companies in the world are now active in RTLS, … These companies include Mitsubishi, Cisco, IBM, Motorola and Microsoft.”
IDC report (2005)• “As RFID evolves and incorporates such implementations as sensors …, the number
of devices in circulation breaks into the trillions.”
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Smart packaging
• incorporating electronic functionalities on thin flexible foils enhancing Safety, Quality & Authenticity of the packed product
Low power wireless sensors
Flexible foilsSmart
packagingProgram
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Market opportunities: Smart packaging applications
Food• Inefficient supply chains: $40 billion
is lost each year • Product freshness and expiration: $48
billion in food is thrown away annually.
• Meat and poultry recalled: 300 million pounds in the U.S. past fifteen years.
Pharma• 10% of the drugs on the world wide market
is counterfeit• Need for rapid and cost-effective recalls• Therapy non-compliance results in:
125.000 Deaths per year in USA caused by non-compliance (Smith, 1989)
Yearly cost USA: 300Bln US$ (Medco Health Systems, 2005)
(30 Billion packages global shipments 2007)
Presentation
overview
Gerwin Gelinck - RF ID, meer dan Hype?
Holst Centre
From RF ID to RF sensors
Smart BlisterEnabling technologies
Printing of thin Si chips
Printed transistors
© Holst Centre
Gerwin Gelinck - RF ID, meer dan Hype?
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Smart blister
• Embedding electronic monitoring and sensing functionality in blister lid foil/film Electronic registration push-out of pills by breaking tracks
behind each blister• Key component in a larger system
Auto detection and communication via active RFID function. Data is read from blister via wireless NFC Link (13.56 MHz)
• Platform for extended features
Blister
Blister
Pharmacist collects and reads blister in exchange for new blister.
NFC
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Smart blister – key component in a larger system
OtCM™ OtCM™ “Comfort- “Comfort-
to-Know”to-Know”Real Time Compliance Data measuring unit dose
Real Time Compliance Data measuring unit dose
Influencing patient behavior Influencing patient behavior
Feedback loops(sms, call, Internet)Feedback loops(sms, call, Internet)
Secured & Convenient data transferSecured & Convenient data transfer
Measuring Real Time Diagnostic OutcomeMeasuring Real Time Diagnostic Outcome
Analysis of Compliance data and Diagnostic outcomes
Analysis of Compliance data and Diagnostic outcomes
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125.000 Deaths per year in USA caused by non-compliance (Smith, 1989)
Yearly cost USA: 300Bln US$ (Medco Health Systems, 2005)
• Direct healthcare cost: 77Bln US$ (Cutting Edge Information, 2004)(wasted medication, re-test, re-hospitalization)• Indirect cost: 193Bln US$(loss in productivity)
A growing problem• Growing population• Aging western population• Rising GDP in developing countries will increase health problems(e.g. diabetes, cholesterol)
Monitoring patient therapy compliance
Therapy non-compliance. If a patient doesn’t comply to the doctor’s or pharmacist instructions concerning medication usage: e.g. continuation, dosage or interval, we speak of: “Mal- or Non-Compliance”
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Challenges of smart blister
Printed conducting linesPrinted conducting lines
electronic circuitry on electronic circuitry on fr4 or flex foil materialfr4 or flex foil material BatteryBattery
Printed Printed AntennaAntenna
Heat bonding processHeat bonding process
Printed tracksPrinted tracks
IC RFID/ NFCIC RFID/ NFC
BatteryBattery
AntennaAntenna
Features:• Assembled • “3D”-system• High cost• Added to existing package, not compatible with R2R
The Holst approach
e.g. StoraEnso Pharma DDSi
Holst Centre System in Foil
Near Future:• Fully integrated • 2D-System in Foil• Low cost, mass fabrication• Roll to Roll compatible
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By monitoring patient therapy compliance
• Forgetting will become a distant memory your mobile phone will receive an e-mail alert in a matter of
seconds.• Healthcare costs are better spent
Doctors can use this information to recommend lifestyle changes and treatments.
Pharmaceutical companies will also be able to engineer new, more effective medications that are targeted for each of us as individual patients.
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Roadmap of smart packaging
• Smart blister. Developed jointly with DSM
• Future developments under consideration. From pharmaceuticals to nutraceuticals Perishable food monitoring Intelligent shopping
• Technically all this requires Advanced sensors Power autonomy Integration technologies on flexible foils Market acceptance and cost-benefit sharing
Presentation
overview
Gerwin Gelinck - RF ID, meer dan Hype?
Holst Centre
From RF ID to RF sensors
Smart Blister
Enabling technologiesPrinting of thin Si chips
Printed transistors
© Holst Centre
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Conventional Silicon Conventional LCD High quality printing• $40 000/m2 $200/m2 $0.25/m2
• X-Si a-Si/poly-Si Inks• Wafer glass plates R2R• 32 nm 3m >20m
Comparison of technology
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Foil characterization/handling
1.70
1.72
1.74
1.76
1.780° (MD)
15°30°
45°
60°
75°
90° (TD)
105°
120°
135°
150°165°
180°195°
210°
225°
240°
255°
270°
285°
300°
315°
330°345°
35 cm
1.70
1.72
1.74
1.76
1.780° (MD)
15°30°
45°
60°
75°
90° (TD)
105°
120°
135°
150°165°
180°195°
210°
225°
240°
255°
270°
285°
300°
315°
330°345°
50 cm
1.70
1.72
1.74
1.76
1.780° (MD)
15°30°
45°
60°
75°
90° (TD)
105°
120°
135°150°
165°180°
195°210°
225°
240°
255°
270°
285°
300°
315°330°
345°
12 cm 35 cm 50 cm
MD 16.1TD 17.4
MD 15.4TD 17.1
MD 18.1TD 18.8
Reported by DuPont Teijin CTE is 18ppm/°C
Index of refractionPEN foil
Transversal
Mach
ine
Edge of web Centre
Coefficient of thermal expansion
MD
TD
1 m
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R2R pick ‘n’ place process• mass chip placement of ultrathin chips• smart blister case
Goal:• chip: 1 x 1 mm, 15 µm thickness, 20 IO’s• process: R2R place/bond 10-50 chips/second
Principle:• combination of self-assembly of chips
to place, then do backside contactingthrough foil
“Printing” of (ultrathin) Si dies
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Printing of RD IDMaterials, processes, electronics
Printed circuitry is a multidisciplinary field and requires collaboration
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• Advantages of printing process Simple process and non-vacuum Less expensive equipment Size expandable High productivity
• are well-placed when applications demand Large area Mechanical flexibility Low cost/area … only moderate performance of
~ 1 cm2/Vs
• Two main application drivers Large area flexible displays Low-cost electronic tags
Printed transistorsLargest reported carrier mobility of organic FETs over time
Year1986 1990 1994 1998 2002 2006
Lar
ges
t re
prt
ed c
arri
er m
ob
ility
(cm
2 /Vs)
10-5
10-4
10-3
10-2
10-1
100
101
solution-processedpolymersvacuum-depositedsmall-moleculessolution-processedsmall-moleculessingle-crystals
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Circuit demonstrators
Better materials and downscaling of technology leads to record-fast circuits Data rate compatible with Electronic Product Code Plastic rectifiers working at 867 MHz
ISSCC’080.8 kbit/s
Plastic transponder
ISSCC’091.5 kbit/s
Plastic transponder50 kbit/s
Plastic transponder
14
12
10
8
6
4
2
0
Vou
t [V
]
120100806040200
Time [ms]
Data rate 752 b/sVDD 14 V
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• 128 bit organic RFID at 13.56 MHz, >1300 organic transistors integrated, operating at 50 kHz
• Based on pMOS
Status
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New semiconductors
• Organic semiconductors Printable n-types Mobility of ~1 cm2/Vs achieved
• Metal oxide semiconductors Amorphous, Low temperature, transparent High mobility achieved (> 10 cm2/Vs)
5
4
3
2
1
0
Vdc
[V]
102
103
104
105
106
107
Freq [Hz]
L=3 pentacene (µ = 0.15 cm2/Vs) L=5 a-GIZO (µ > 10 cm2/Vs)
10
8
6
4
2
0
Vou
t [V
]
422421420419418time [s] x 10
-6
5-stage oscillatorL=5µm, diode-logic
f=870kHz @ VDD=20V f=1.2MHz @ VDD=25V
Ring oscillators @ MHz frequency High-efficiency MHz rectification
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Multi-year technical roadmap
• Step-by-step performance improvement New materials
• Step-by-step process simplification Carrier-less foil processes From batch processes to linear processes, eventually roll-to-roll
Cost
dow
n
Performance
=0.5 cm2/Vs =5 cm2/Vs
Litho + foil-on-carrier
Litho + carrier-less foil
Printed + carrier-less foil
Roll-to-roll
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Unique infrastructure
2008: R2R coating/print lineR2R vacuum deposition line being specified now
2009: R2R lamination line2009: maskless lithography tool2010: R2R multilayer imprint line
Inkjet printers1x multi single nozzle printer (MicroFab)1 nozzle at the time, the nozzle can easily be exchangednozzle diameters ranging from 30 to 100µm
2 LEP and 2 PEDOT printersSpectra SX3 and Galaxy printheads (Fujifilm)nominal drop volume ranging from 30 to 80 plmax DoD frequency 5 kHz128 (SX3) and 256 (Galaxy) nozzles
1x 4 printhead setupGalaxy or SX3 printheadsspecs according to the LEP and PEDOT printer, except there are 4 printheads in a row, so possibly 4 different inks
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Linear deposition of pentacene from gas phase
• Linear showerhead deposits continuous layer on moving substrate• High quality (mobility) at high deposition speed
Flupke Series: Saturation mobility vs Deposition speed
00.20.4
0.60.8
11.2
1.41.6
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
Sd (µm²/s)
µsat
(cm
²/V
s)
30nm film at 1m/min
30nm film at 2m/min
500 µm²/s is roughly equivalent to 50 Å/s on a 4’’ substrate and 1m/min web speed
1000 µm²/s is roughly equivalent to 100 Å/s on a 4’’ substrate and 2m/min web speed
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Patterning of OSC• Ink jet printing
Decrease material consumption High throughput compatible process Ink optimization on viscosity, surface wetting
10 fA
1 pA
100 pA
10 nA
1 µA
100 µA
I DS [A
]
-10 -5 0 5 10
VG [V]
ISD , VSD = -1 V ISD , VSD = -10 V
= 1.1 cm2/Vs
50 um
50 um
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Multi-year technical roadmap
32
2005First HF rectifier
2006Integrated HF
rectifier
200764 bit HF
tag@
acceptedEM field
2008128 bit transponder
and UHF rectifier
200925 kbit/s
andAnti-collision
2010Bi-directional
communication
2011UHF tag
+ IntegratedPlastic NVM
2012-2015EPC-like
tag
2009First OLEDbackplane
2010Integration to
display with OLED
2011Outdoor-readable
OLEDdisplay with
oxide
2012-2015AM sensor arrays
(e.g. medical,Smart bandage,…)
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Summary
• Perceived value of remote identification (RF ID) is low, remote sensing is the way forward.
• At Holst Centre, we work with our industrial partners on wireless sensors on foil, communicating with your
mobile phone. First application: smart blister Enabling technologies
Embedding thinned Si on plastic foil Direct printing of thin film transistor circuits. First application
of printed transistors will be flexible displays.
Visit us at
www.holstcentre.com