micro systems packaging

Introduction to Microsystems Packaging

CHALMERS UNIVERSITY OF TECHNOLOGY Department of Microtechnology and Nanoscience,

Bionano Systems Laboratory

Kemivägen 9, Se-412 96, Gothenburg, SWEDEN

1

Course PM


MKM105

(7,5p Q1, 2009)

Contact persons

Examiner: Professor Johan Liu, phone: 031-772 3067 or

070-569 3821

Lecturers: Professor Johan Liu

Course assistants: Ph D. student Carl Zandén

Ph.D. student Björn Carlberg

Ph.D. student Teng Wang

Objectives of the course

The objective of the course is to give the students an insight of the conditions and

environment that they are going to work with after their studies if they choose the

electronics/microsystem industry. Basic concepts and knowledge about microelectronics and

microsystems packaging and integration technology as well as production technology will be

given. The students will after the course understand the driving forces for the quick

development and fast changes related to the microelectronics/microsystem industry and

products.





2

Course content and organization

Lectures

Exercises (home work exercises are compulsory)

Laboratory work (compulsory)

Industrial visit (compulsory)

Project work (in groups of two students) (compulsory)

Review one project (compulsory)

Oral presentation (compulsory)

A number of lectures will be organized in the course in order to give a background on

microelectronics/microsystems packaging and production.

In addition to this, exercises and laboratory work will enhance the students understanding of

the basic concepts in microelectronics and microsystems packaging and production.

We will also have one visit to a company that develops and manufactures electronic products.

Furthermore, a project work in the form of a literature search in a relevant field will be

performed in groups of two students. The project work will be presented both in written and

oral form. Each group will also review another group’s project work and will function as the

official opponent at the oral presentation (has to put some questions).

Lectures

Introduction to microelectronics/microsystems packaging and production

Electronic components and their packaging

IC assembly

Passives

Sealing and encapsulation

System-level PWB technology

Board assembly, packaging materials and processes

Wafer level packaging and other advanced packages

MEMS

RF- and optopackaging

PCB design

Laboratory work

Lab A: Surface mount technology

Lab B: Flip-chip technology: Solders and Conductive Adhesives

Lab C: CAD demonstration

All the labs are compulsory. Labs A-B will take place at MC2 building, floor 5, rooms A511-

515 and lab C will take place at MC2, floor 6.





3

Project work:

A compulsory project work is included in the course. The aim is to further develop and deep

the student’s knowledge in some field of interest, related to electronics microsystems and

integration. Each student group of two students will choose one topic (either from the topic

list offered by the examiner or something else that the students are interested in and with

relevance for the course) and it will be performed as a literature survey.

The project work shall represent around one week’s work, and be presented in both written

and oral format. The written report shall be no less than 15 pages. Each group has 15 min for

their oral presentation plus 5 min discussion time (a total of 20 min for each group).

Furthermore, each group shall review another project work and function as opponent at the

oral presentation. The students shall critically read a report from another group and give at

least 2 questions during the oral session about the work.

The project work has to be decided as soon as possible or latest by the end of week 2 and

finished and delivered at the latest on Thursday on study week 6. The project work will be

graded with: not passed, 3, 4 and 5 and is worth 20% of the final grade.

Visits

In the course there will one compulsory industrial visit.

SES at Kallebäck (preliminary)

Compulsory exercises

Before every exercise tutorial the students are supposed to solve one home problem and

deliver the solved problem to CA at the beginning of the class. The exercises will be graded

with: not passed, 3, 4 and 5 and will weigh 10% of the final grade of the course.

Examination

a) Written examination with scales: not passed, 340% (28 points), 4>60% (42 points),

5>80% (56 points).

b) Project work with scales: not passed, 3, 4, and 5.

a. Delivered written report

b. Oral presentation done

c. Review of another project work.

c) Exercises: not passed, passed.

d) The labs passed

e) The visit passed.

f) Written examination (80%), Project work (10%) and Exercises and Labs and all others

(10%) in the counting of the final grade.

Course literature

Rao Tummala: “Fundamentals of Microsystems Packaging”, McGraw Hill, New

York, USA, 2001, ISBN: 0-07-137169-9





4

Course schedule 09 for MKM105

Date Time Class-

room

Contents

Teacher Form

Week 1

Tuesday

1/9

08:00-

09:45

Luftbryggan Introduction to the course. Practical aspects.

Lectures, exercises, labs, project work hand-

out, literature,

Introduction to microelectronics production

and packaging, Chapters 1-3

JL,

CZ,TW,

BC

Lecture1

Friday

4/9

08:00-

09:45

Luftbryggan Questions 1-6 in Chapter 1

Questions 1,2 and 5 in Chapter 2

Question 2 in chapter 3

CZ Tutorial

1

Week 2

Tuesday

8/9

10:00-

11:45

Kollektorn Electronic components and their packaging

Chapters 7 and 8

Deadline: Final decision for project work

JL Lecture

2

Friday

11/9

08:00-

09:45

Luftbryggan Fundamentals of IC Assembly

Chapter 9

JL Lecture

3

10:00-

11:45

Luftbryggan Question 8 in Chapter 7

Questions 1-4,6 in Chapter 8

CZ Tutorial

2

Week 3

Tuesday

15/9

08:00-

11:45

A520 Group 1 & 2: Lab A, B BC Lab

Friday

18/9

08:00-

09:45

Luftbryggan Fundamentals of passives,

Chapter 11

JL

Lecture

4

10:00-

11:45

Luftbryggan Questions 1-6 in Chapter 9

Questions 1-7 in Chapter 11

CZ Tutorial

3

Week 4

Tuesday

22/9

08.00-

11.45

A520 Group 3 & 4: Lab A, B TW, BC Lab

13:15-

17:00


Monday

21/9

09:00-

12:00

RUAG AB Industrial visit RAUG AB in kallebäck

(Preliminary date)

CZ Visit





5

Week 5

Tuesday

29/9

10:00-

11:45

Kollektorn Fundamentals of sealing and encapsulation

Chapter 15

JL Lecture

5

Friday

2/10

08:00-

09:45

Luftbryggan Fundamentals of System-level PWB

technology

Chapter 16

JL Lecture

6

Friday

2/10

10:00-

11:45

Luftbryggan Questions 1,3,7,11,12 and 13 in Chapter 15

CZ Tutorial

4

Week 6

Tuesday

6/10

08:00-

11:45


Wednesday

7/10

10:00-

11:45

Luftbryggan Optical packaging, Chapter 12

Guest lecturer from Ericsson AB

AA Guest

Lecture

Friday

9/10

08:00-

09:45

Luftbryggan PCB Design, Chapter 4

JL Lecture

7

10:00-

11:45

Luftbryggan Wafer level packaging, Chapter10

MEMS; Chapter 14

JL Lecture

8

17:00 Deadline: The project reports have to be

delivered both to us and to the opponents

Deadline

Week 7

Monday

12/10

13:15-

17:00

6C

Landscape

Lab C Cad-Star, group 1 & 2

YF Lab

Tuesday

13/10

08:00-

09:45

Kollektorn Questions in Chapter 4

Questions 1-6 in chapter 10

CZ Tutorial

5

10:00-

11:45

Kollektorn Fundamentals of board assembly, packaging

materials and processes: soldering

Chapters 17

JL Lecture

9

13:15-

17:00

6C

Landscape

Lab C Cad-Star, group 3 & 4

YF Lab

Thursday

15/10

08:00-

11:45

6C

Landscape

Lab C, Cad-Star, extra time for other labs YF Lab

Friday

16/10

08:00-

09:45

Luftbryggan Fundamentals of board assembly, packaging

materials and processes: conductive adhesive

joining, Chapter 18

JL Lecture

10

Friday

16/10

09:45-

11:45

Luftbryggan Questions 3,4,5,7,8,11 in chapter 18

Questions in chapter 12

CZ Tutorial

6

13:15-

17:00

Luftbryggan Go through old examination between 1 and 2

pm followed by Oral presentation of project

reports between 2 and 5.

JL,CZ Deadline





6

Week 8

Thursday

22/10

14:00-

18:00

Johanneberg Written examination JL, CZ Exam

Contact persons

Short version Name E-mail address Telephone Office

CZ Carl Zandén [email protected] 772 30 68 MC2

JL Johan Liu [email protected] 772 30 67 MC2

TW Teng Wang [email protected] 772 30 92 MC2

BC Björn Carlberg [email protected] 772 30 75 MC2

Links to important web pages:

To student portal: http://www.student.chalmers.se/. At this page you can download the

material from all the courses given at Chalmers.

Company visit

In the course there is one mandatory visit to RUAG in Kallebäck. To Kallebäck everybody

has to go by his or her own. Suggestions how to get there:

1. You can take the green or the red express bus from Kungportsplatsen and go off at

Delsjömotet. There you go under the viaduct and then uphill. From there you will see

RUAG.

2. Go by a tram from Chalmers station through the tunnel to Korsvägen. Then take a bus

to delsjömotet from there.

3. Follow Carl there. Time and place will be announced later.

How to find the class rooms

Kollektorn lecture hall, room number A423, meaning MC2 building, A house, 4th

floor.

Fasrummet, room number A820, meaning MC2 building, A house, 8th

floor.

Valensbandet, room number A504, meaning MC2 building, A house, 5th

floor.

A520, lab room at MC2, house A, 5th

floor.

6C landscape is in the 6th

floor

Luftbryggan, A section, 8th

floor

mailto:[email protected]

https://webmail.chalmers.se/webmail/src/compose.php?send_to=bjorn.carlberg%40chalmers.se

http://www.student.chalmers.se/

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