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METROLOGY FOR PROCESS CONTROL IN HETEROGENEOUS PACKAGING
Friday, June 28th, 2019➢ Prototyping Pilot Line Workshop
➢ ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 2
UnitySC Overview
Technology Trend
UnitySC Process Control
LETI-UnitySC collaboration
1234
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 3
Unitysc Overview
Technology Trend
UnitySC Process Control
LETI-UnitySC collaboration
1234
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 4
1983 2004 2016 2017 2018 2019
• FOGALE
nanotech
creation
• Semiconductor
Business Unit creation
• Nanotech Solution, subsidiary of Fogale,
acquires Altatech from Soitec, a company
specialized into wafer inspection technology
• Altatech becomes Unity Semiconductor SAS,
designed to carry the semiconductor business
of Fogale group
• The company is now able to deliver full process
control tools and software for advanced
semiconductor manufacturers
• Acquisition by Unity
Semiconductor SAS of
the commercial branch
of Austin (USA)
• Disposal of the activity
Deposition, lastly carried
by Unity Semiconductor
SAS to the benefit of
Kobus
• Kamel Ait Mahiout
joins as new CEO
• Acquisition of HSEB, a
company dedicated to
optical inspection, review
and metrology for
semiconductor applications
• Opening of Unity
SC’s 3rd
commercial
branch in Taïwan
• Skyverse-Unity
SC JV for China
• Opening of
UnitySC's Asian
HQ office in
Singapore
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 5
Mobile Wireless
wearables IoT
Advance Packaging MEMS SiP Sensors
Automotive
Power Devices, SiC, GaN, Sensors
HPC-Memory-Photonics
3D Memory, TSV, Photonics
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 6
2019 Revenue Growth
2019 Gross Margin
EmployeesWorldwide
Patents Grantedand Pending
R&D Team
Installed Units
Demo Centers in Europe
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 7
LIGHTiX LIGHTSee LIGHtSpeed NST
Inspection Inspection Inspection Metrology
Key capability Front, Back, Edge Advanced Materials
Wafer thinning
Non Visible defects
(slip line, crystallographic
dislocation, delamination)
Unpatterned wafer
Competitor for SP1/SP2
Opaque & transparent
Laser groove metrology,
wafer thinning, TSV, RST,
MOLD thickness, dry film
thickness, CMP control,
Overlay
Application Front End
Advanced packaging
Power Front End Front End to Advanced
Packaging
Key differentiator Speed at sub-µm sensitivity Unique capabilities with
non visible defects
Efficiency
Cost of ownership
Unique on transparent
material
Versatility
Best in class GR&R
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 8
Unitysc Overview
Technology Trend
UnitySC Process Control
LETI-UnitySC collaboration
1234
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 9
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 10
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 11
1234
UnitySC Overview
Technology Trend
UnitySC Process Control
LETI-UnitySC collaboration
2019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM 12
Metrology platform for Advanced Packaging
It combine FLEXIBILITY with STABILITY/THROUGHPUT
INDUSTRIAL DESIGN
Manufacturing fully outsourced
Single and multiple transparent layers thickness
TTV, Bow, Warp (Up to 5mm warped wafers)
PR opening, Top/Bottom CD, Trench Depth
Bump diameter/height, Cu nail reveal, Coplanarity
RDL metrology
Surface profiling, Topography, Dishing and erosion
Roughness
Mold compound metrology
In and out of the plane 3D Overlay
Nanotopography at die level
Defect imaging at embedded and bonding interface
by NIR Microscope
132019-07-02 LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Unity Confidential2019-07-02 14
Fabrication of different devices will add topography at different wavelength (transistors, mems, die and wafer)
Edge Roll off High resolution
nanotopography
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Application Cases
2019-07-02 15LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Hybrid bonding: BSI
–Goal: Yield>90%
–Alignment Defect detection before annealing/thinning is mandatory
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Wafer to Wafer hybrid bonding using Cu & SiO2
Thinning
NST/TMAP Series
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
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Hybrid Bonding Application
Pre deposition
Post deposition
a b
Nanotopography
Centre die Edge die
Edge Roll Off
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GR&R test over 5 days
0 50 100 µm
µm
0
20
40
60
80
100
120
nm
0
1
2
3
4
5
6
7
8
Surface analysed
0 100 200 µm
µm
0
50
100
150
200
nm
0
1
2
3
4
5
6
7
8
9
Surface measured
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Unity Confidential2019-07-02 19
Non corrected data
Correction of offset
Correction of offset et rotation Residual
Hybrid bonding overlay
Enhanced IR image by dual
side filtered illumination
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Unity Confidential2019-07-02 20
Line Pitch 0.72 µm
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Application Cases
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PROCESS
CONTROL
D2W
TSV RST
Cu NAILS
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Wafer1 Wafer2 Wafer7 Wafer15 Mean
Depth Max 76.89µm 77.45µm 77.08µm 77.82µm 77.31µm
Depth Min 71.65µm 72.25µm 71.75µm 72.14µm 71.95µm
Range 5.23µm 5.20µm 5.31µm 5.68µm 5.34µm
R² = 0,9997
72
73
74
75
76
70 75 80
Dep
th (
µm
)
XSEM …
→ Strong radial non uniformity
Courtesy of ST Micro Electronics
In-line process control with
one of best
accuracy/precision in
industry
T-Map T-Map
2019-07-02 22LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
10 times repeat 1 location
REPEAT
(nm) Dense Isolated
MEAN -16.1 -14.3
3-SIGMA 0.35 0.75
DENSE TARGET ISOLATED TARGET
nm
0
5
10
15
20
25
30
nm
0
5
10
15
20
White Light Full Field
Interferometry
NST NST
2019-07-02 23LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Nail reveal by Full-
Field Interferometry
4,5
5
5,5
6
-150 -50 50 150
RST before TSV reveal across 300mm wafer diameter
RST
carrier
RST
T-Map
NST
2019-07-02 24LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
3D Full Field InterferometricNST
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Profile: Step height + line width
calculation
3D Full Field Interferometric
NST
NST
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Dicing, Wafer Thinning
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Grinding/thinning process control: simultaneous measurement of remaining si thickness (RST) after grinding on backside of device, device thickness & glue/carrier thickness
Added value:
– accurate site location on TAG/GATE pad target thanks to pattern recognition through Si material by NIR
microscopy
– Fully automatic solution no matter customer process flow (glass carrier, taiko, dicing frame)
glass
adhesive
metal patternsilicon
Top sensor
Bottom sensorPattern recognition by NIR
microscopy through the Si from
top camera
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
Width & depth
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5 dies / wafer
at 22 WPH
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
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Trench etching process control: simultaneous measurement of depth, width & pitch of trenches in Si wafer
Added value:
–True value at device location with primary technology without need of modelling
–Sub-micron resolution
–Fully automatic solution for trenches wider than 0.6 µm
4,0
4,5
5,0
5,5
6,0
6,5
Site 1 Site 2 Site 3 Site 4 Site 5 Site 6 Site 7 Site 8 Site 9 Site 10
D E P T H
W21 W22
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1234
UnitySC Overview
Technology Trend
UnitySC Process Control
LETI-UnitySC collaboration
LETY INNOVATION Days / ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
2019-07-02 31
4 YEARS outstanding collaboration
EU funded collaborative projects (3D STACK, …)
Most recent Conference Papers
ASMC 2019IMAPS DCP 2018
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4 YEARS outstanding collaboration
13th International Conference on Nitride Semiconductors (2019)
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