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©2017 by System Plus Consulting | MEMS Packaging – Reverse Costing Review 1

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MEMS Packaging Reverse Technology ReviewEnvironmental Sensor, Inertial, Optical Sensor, Microphones & RF

MEMS report by Audrey LAHRACHOctober 2017 – Version 1


Table of Contents

Overview / Introduction 4

o Executive Summary

o Analyzed Devices

o Reverse Costing Methodology

Technology Review 14

o Environmental Sensor

o Pressure Sensors

o Consumer (x5)

o Automotive (4)

o TPMS (x2)

o Humidity Sensors

o Consumer (x10)

o Gas Sensors

o Consumer (x4)

o Combo Sensors

o Consumer (x2)

o Inertial Sensors

o Accelerometer

o Consumer (x7)

o Automotive (x7)

o Gyroscopes

o Consumer (User Motion) (x5)

o Consumer (OIS) (x2)

o Automotive (x2)

o Magnetometers

o Consumer (x16)

o Combo + Sensor Hubs

o Consumer (x13)

o Automotive (x6)

o Optical MEMS

o Microbolometers

o Consumer (x3)

o Micromirrors

o Consumer (x2)

o Industrial/ Medical (x1)

o Acoustic Sensors

o Microphones

o Consumer (x6)

o RF Components

o Antenna Tuners

o Consumer (x2)

o RF Filters

o Consumer (x5)

o Oscillators

o Consumer (x2)

Company services 300


Overview / Introductiono Executive Summaryo Analyzed Deviceso MEMS Packaging Matrixo Reverse Costing

Methodology

Technologies Review

About System Plus

Executive Summary

This comparative technology review has been conducted to provide insight on structure and technology for over 80 Consumerand 20 Automotive MEMS from the main suppliers (Bosch, TI, Broadcom, STMicroelectronics, Knowles…).

We analyze and compare several types of device: Environmental sensors, including pressure, humidity, gas and combo sensors;Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS includingmicrobolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters andoscillators. We look at their package dimensions and internal structures, substrate types, die numbers and dimensions andpackage cross-sections to answer key questions about MEMS packaging, including:

- What are the main encapsulation processes used by manufacturers, single-chip wafer level packages or multi-chip moldedpackages?

- What is the preferred interconnection method, wire bonding, flip chip, or through-silicon vias (TSVs)?

- Which innovations can we observe for each manufacturer, and what differences are there between the main competitors?

- Which manufacturers offer the best component integration and which one offers the maximum functionality inside onecomponent?

This 300 page report includes multiple comparisons based on physical analyses of over 100 MEMS components. It offersbuyers the unique possibility of seeing MEMS package technology evolution, tracked by manufacturer.



Methodology

Technologies Review

About System Plus

Analyzed Devices

Type Manufacturer Reference Application

Pressure Infineon DPS310 Consumer

Pressure STMicroelectronics LPS331AP Consumer

Pressure STMicroelectronics LPS22HB Consumer

Pressure Bosch BMP280 Consumer

Pressure Bosch BMP380 Consumer

Pressure Infineon KP200 Automotive

Pressure Bosch #1 Automotive

Pressure Bosch #2 Automotive

Pressure Melexis MLX90809 Automotive

TPMS Infineon SP37 Automotive

TPMS Freescale FXTH87 Automotive

• Environmental SensorsType Manufacturer Reference Application

Humidity Sensirion SHT21 Consumer

Humidity Sensirion SHTC1 Consumer

Humidity Sensirion SHT31 Consumer

Humidity STMicroelectronics HTS221 Consumer

Humidity Bosch BME680 Consumer

Humidity ALPS HSHCAA006A Consumer

Humidity SiLabs Si7021 Consumer

Humidity SiLabs Si7034 Consumer

Humidity MEAS HPP845E031R4 Consumer

Humidity TI HDC1000 Consumer

Gas Cambridge (ams) CCS801 Consumer

Gas Ams AS-MLV-P2 Consumer

Gas Sensirion SGP30 Consumer

Gas Sensirion SGPC3 Consumer

Gas Bosch BME680 Consumer

Combo Sensor Bosch BME280 Consumer

Combo Sensor Bosch BME680 Consumer



Methodology

Technologies Review

About System Plus

Analyzed Devices


Accelerometer

mCube MC3413 Consumer



Bosch Sensortec BMA280 Consumer

Bosch Sensortec BMA355 Consumer

STMicroelectronics LIS2DHI2 Consumer

STMicroelectronics LIS302DL Consumer

STMicroelectronics AISxxx Automotive

Bosch SMA582 Automotive

Analog Devices ADXL278 Automotive

Analog Devices ADXL189 Automotive

Murata SCA3100 Automotive

Murata SCA2120 Automotive

NXP (Freescale) MMA5248 Automotive

• Inertial Sensors


Gyroscope

Bosch BMG160 Consumer (User Motion)

Bosch BMG250 Consumer (User Motion)

STMicroelectronics L3GD20H Consumer (User Motion)

NXP FXAS21002CQR1

Consumer (User Motion)

Maxim MAX210000 Consumer (User Motion)

Invensense IDG-2030 Consumer (OIS)

STMicroelectronics L2G2IS Consumer (OIS)

Bosch SMG550 Automotive

STMicroelectronics A3G4250D (Navigation)

Automotive



Methodology

Technologies Review

About System Plus

Analyzed Devices


Magnetometer

AKM AK8973 Consumer

AKM AK8975 Consumer

AKM AK8963 Consumer

AKM AK09911 Consumer

AKM AK09918C Consumer

Yamaha YAS529 Consumer

Yamaha YAS532B Consumer

Yamaha YAS537 Consumer

STMicroelectronics LIS3MDL Consumer

STMicroelectronics LSM303D Consumer

Bosch BMM150 Consumer

ALPS BMC150 Consumer

ALPS HSCDTD008A Consumer

MEMSIC MMC3316xMT Consumer

Honeywell HMC5883 Consumer

Freescale MAG3110 Consumer

• Inertial Sensors


Combo/Sensor Hub

Bosch BMI160 Consumer

Bosch BMF055 Consumer

Bosch BMX055 Consumer

Bosch iPhone 8 Consumer

Bosch Apple Watch 3 Consumer

STMicroelectronics LSM6DS3 Consumer

STMicroelectronics LSM6DSL/M Consumer



On Semi (Fairchild) FIS110 Consumer

Invensense iPhone 7 (6-axis) Consumer

Invensense ICM-30630 Consumer

Invensense MPU-9250 Consumer

Murata SCC2000 Automotive

Murata SCC1300 Automotive

Bosch SMI540 Automotive

Bosch SMI500/510 Automotive

Silicon Sensing CMS300 Automotive

Bosch SMI130 (Navigation)

Automotive



Methodology

Technologies Review

About System Plus

Analyzed Devices


Microphone

Invensense ICS43432 Consumer

Knowles iPhone 5S (x2) Consumer

Knowles iPhone 7 (x3) Consumer

Vesper VM1000 Consumer

Wolfson WM7121 Consumer

Wolfson WM7132 Consumer

• Acoustic Sensors



Methodology

Technologies Review

About System Plus

Analyzed Devices


Microbolometer

Ulis PICO384P Consumer

Raytheon EXC001 Consumer

Flir ISC1406L Consumer

• Optical Sensors


Micromirror DLP TI DLP1700 Consumer

Micromirror DLP TI DLP3000 Industrial/Medical

Resonant Mirror STMicroelectronics PM53A Consumer



Methodology

Technologies Review

About System Plus

Analyzed Devices


Antenna Tuner Cavendish 32CK417R Consumer

Antenna Tuner Wispry A2101 Consumer

Filter Broadcom BAW Filters Consumer

Filter Qorvo BAW & SAW Filters Consumer

Filter Murata SAW Filters Consumer

Filter Tayio Yuden SAW Filters Consumer

Oscillator SiTime Si1552 Consumer

Oscillator Microchip DSC6003 Consumer

• RF Sensors



Methodology

Technologies Review

About System Plus

The analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured

Die

•The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking

Comparison

•Innovations we can observe for each manufacturer, and differences between the main competitors

Executive Summary


TECHNOLOGIESR E V I E W


Overview / Introduction

Technologies Reviewo Environmental Sensor

o Pressure Sensoro TPMSo Humidity Sensoro Gas Sensoro Combo Sensor

o Inertial Sensoro Accelerometero Gyroscopeo Magnetometero Combo + Sensor

Hubo Microbolometero Micromirroro Microphoneo RF Components

o Antenna Tunero RF Filtero Oscillators

About System Plus

Pressure Sensor - Technology Summary

• 9 references from 4 companies of pressure sensor component manufacturer has been analyzed.








About System Plus

Infineon – DPS310 – Package View & Dimensions








About System Plus

Infineon – DPS310 – Package Cross-Section








About System Plus

Pressure Sensor - Comparison



Technologies Review

About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

MEMS & SENSORS• MEMS Packaging Market and Technology Trends 2017• Status of the MEMS industry 2017• Status of Advanced Packaging Industry 2017

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

MEMS & SENSORS

https://www.i-micronews.com/advanced-packaging-report/product/mems-packaging-2017.html

https://www.i-micronews.com/reports/mems-sensors-report.html

https://www.i-micronews.com/advanced-packaging-report/product/status-of-the-advanced-packaging-industry-2017.html

http://www.systemplus.fr/fr/reverse-costing-reports/invensense-icm20789-6-axis-motion-sensor-and-pressure-sensor-combo/

http://www.systemplus.fr/fr/reverse-costing-reports/invensense-icm20789-6-axis-motion-sensor-and-pressure-sensor-combo/

http://www.systemplus.fr/fr/reverse-costing-reports/bosch-bme680-environmental-sensor-with-integrated-gas-sensor/

http://www.systemplus.fr/fr/reverse-costing-reports/bosch-bme680-environmental-sensor-with-integrated-gas-sensor/

http://www.systemplus.fr/fr/reverse-costing-reports/mcube-mc3672-the-smallest-wlcsp-mems-accelerometer-for-wearables/

http://www.systemplus.fr/fr/reverse-costing-reports/mcube-mc3672-the-smallest-wlcsp-mems-accelerometer-for-wearables/

http://www.systemplus.fr/reverse-costing-reports/vesper-vm1000-piezoelectric-microphone/

http://www.systemplus.fr/reverse-costing-reports/vesper-vm1000-piezoelectric-microphone/

http://www.systemplus.fr/fr/reverse-costing-reports/smartphone-rf-front-end-module-review/

http://www.systemplus.fr/fr/reverse-costing-reports/smartphone-rf-front-end-module-review/


COMPANYSERVICES



Technologies Review

About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

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