External Use

TM

MEMS Integration challenges in a

Semiconductor EnvironmentFrom self driving cars, to smart homes, and wearables

S e p t e m b e r . 2 3 . 2 0 1 5

Michelle Kelsey | Sensor Solutions Division

Freescale Semiconductor

TM

External Use 1

Quick Introduction

• Freescale Semiconductor

− Product Line Manager Sensor Solutions Division

− >15 years experience driving Sensors products to

market, providing sensor strategy to the engineering

teams for definition, design, and test for NPIs as well as

roadmap strategy, value proposition, and go to market

plans

− A former background in Applications Engineering

supporting sensors in industrial, consumer, medical,

and appliance markets

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External Use 2

Agenda

• Key trends driving technology solutions for MEMS

• Smart, connected and contextually aware devices

• MEMS Integration - Motion, temperature and pressure

data transmitted wirelessly

• MEMS test

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External Use 3

MEMS has seen continuous growth

• MEMS saw continuous

growth since first

commercialization

• Consecutive growth engines:

driving increasing challenges

− Cost and reliability

− Integration for size and power

− Increasing intelligence and

connectivity

… all with improving

performance

Global SEMI and MEMS (Component) Markets

1975 1980 2020201520101985 1990 1995 2000 2005

$B

illi

on

SEMI

MEMS

Source: Tsensors, 2014

A u t o

C o n s u m e r

Connected

Intelligence

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External Use 4

MEMS Sensors in Today’s Home

• Barometer

• Relative humidity

• Smart thermostat

• Smart meter

• Smart appliance

• Room occupancy

• Door/window security

Next Gen Requirements

Longevity: Product refresh rate of eight to 15 years

Self-configuring: Sensors assign themselves

identification, recognize their neighboring sensors and

establish communication paths

Self-maintaining and self-healing: Reroute in case of

new obstacles, reduce the cost of maintenance

Self-calibrating: Maintain their own calibration reliably

throughout lifetimes, reduce cost of field technician

Very low-power or self-powered: Battery that lasts

many years or harvest power from the ambient

environment, reduce cost of field technician changing

battery

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MEMS Sensors in Today's Environment

• Self-configuring: Sensors assign themselves identification, recognize their neighboring sensors and establish communication paths

• Self-maintaining and self-healing: Reroute in case of new obstacles, reduce the cost of maintenance

• Self-calibrating: Maintain their own calibration reliably throughout lifetimes, reduce cost of field technician

• Very low-power or self-powered: Battery that lasts many years or harvest power from the ambient environment, reduce cost of field technician changing battery

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External Use 6

IoT is More Than M2M

The Internet of Things is about

Machine to Entity (M2E):

• Machine to Human:

− Automatic health monitoring for people: Connected wearables with monitoring services, or

disease management via implantable electronics

• Machine to Infrastructure:

− Automatic bridge monitoring: Sensing and monitoring the structural integrity of a bridge in case of

flooding

• Machine to Nature/Environment:

− Early detection of earthquakes: Distributed sensors to detect early tremors in specific places

• Machine to Machine:

− Automatic diagnostics for cars: Automatic information collection from your car’s engine

management system and sending real-time alerts to drivers or service centers

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MEMS Sensors in Today’s Wearable Devices

Lowest Power: for Always on Applications

Higher embedded functions: for Context

Awareness

Algorithms: Development and testing for

Motion Intelligence

Robustness: future with ultrasonic welding

and flexible PCBs

Step Counting

Pedometer

Activity Monitor

Sleep Patterns

Motion detection

Athletic form

Health monitoring

Ubiquitous monitoring

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External Use 8

Wearables…A Diverse Market

Vertical Categories

Fitness &

Wellness

Sports & Heart Rate Monitors

Pedometers, Activity Monitors

Smart Sport Glasses

Smart Clothing

Sleep Monitors

Emotional Measurements

Healthcare &

Medical

CGM (Continuous Glucose Monitoring)

ECG Monitoring

Pulse Oximetry

Blood Pressure Monitors

Drug Delivery (Insulin Pumps)

Wearable Patches (ECG, HRM, SpO2)

Infotainment

Smart Watches

Augmented Reality Headsets

Smart Glasses

Wearable Imaging Devices

Industrial &

Military

Hand-worn Terminals

Augmented Reality Headsets

Smart Clothing

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External Use 9

Market Challenges

• Sensors are being integrated into a wider variety of “intelligent” devices

• The Internet of Things is creating challenges for transmitting, securing, and analyzing sensor data in new ways

− New architectures

− New protocols

− New security requirements

• Not all of our customers have the resources to develop sensor applications from the ground up

• Multitude of MCU and sensor solutions requires constant investigation and learning to stay up to date

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MEMS Sensors in Today's Car

• The next generation of automated driving requires leading edge compute intelligence to exchange and evaluate all the data of the systems involved.

• This level of compute power may not reside in a controller specifically designed for automotive.

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MEMS Sensors in Today's Car – Discussion Topics

1. What does it take to support the different Automotive market

requirements (Safety Critical to Infotainment )? What are the

barriers which will need to be overcome?

2. If we align requirements upfront is it possible to implement

changes real time once requirements are met?

3. Others?

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Scale: From 1BU in 5 years to 1BU or more per year

Mix: sensor type, sensitivity, range, bandwidth

Product Life Cycle: < 2 years (consumer) to 15+ (automotive)

Technology challengesProcess technology

Design efficiency

System in package

Test platforms

EcosystemsConnectivity

Software frameworks

Algorithms and sensor data analytics

Sensor Trends

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Sensor Process Technologies

MEMS Processes

×Voltage tolerance

Low Leakage current

Operating temperature

Feature geometry

12+ process combinations in production

0

0

0INERTIAL

PRESSURE

MAGNETICS

Over-damped

Vacuum

Piezo-Resistive

Transducer

Capacitive pressure cell

Hall effect

Magneto-resistive

ASIC Processes

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Design Efficiency

Design reuse driven by

• Level of integration

• Shortening product life cycle

• Proven record for functional safety

Monolithic

Block Diagram

Dual-Die Block Diagram

Triple-Die with MCU Block Diagram

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MEMS Testing

• Environmental considerations

− Temperature

− Voltage

− Pressure

− Mechanical shock

• Physical stimulus

− Acceleration

− Rotation

• SIP complexities

− RF performance

− Magnetic interference

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Freescale FXTH87xx Integration

Tire implementationVehicle

implementation

QFN 7x7 Cross section

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External Use 17

System in Package: TPMS Example

Industry Smallest Tire Pressure

Monitoring Sensor

• MEMS capacitive pressure cell

• MEMS 2-axis accelerometer

• CMOS ASIC with

− Microcontroller with 16 kB flash, 512 B

SRAM

− Temperature sensor and thermal restart

− 1-channel LF detector and decoder

− Integrated RF transmitter: 315/434 MHz

• 7 x 7mm2 Film Assisted molded QFN

package

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Ecosystems for connectivity and layered intelligence

• Connected, smart sensors

• Fragmented data interchange frameworks

• Integrating sensor data with Big Data

• Sensor data analytics

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External Use 19

Use Case: Rapid Prototype Using ISF R2.1 on FRDM Platforms

Gyro

I2C/SPI

PC with IDE

and

customizable

GUIs

Freescale

Freedom Board

Sensor

Development Kit

Serial Comms

via

USB/OpenSDA

Embedded middleware

(ISF) and application

target the Kinetis

processor family

Multi-B

10DOF

Advantage:

Get something to evaluate fast

Identify and eliminate as many risk areas as possible

Expansion

connectors to

interface to

prototype

hardware

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External Use 20

ISF 2.1 Software Architecture “Layer Cake”

Applications

MXQLite

RTOS

Power

Manager

Bus

Manager

UART Protocol

Adapter

Device Messaging

HDLC Protocol

Host

Communications

SPI Protocol

Adapter

I2C Protocol

Adapter

SPI Sensor

Adapter

I2C Sensor

Adapter

Sensor Manager

I2C

SDK

PEx

I2C

LDD

Shim

PEx

I2C

LDD

SPI

SDK

PEx

SPI

LDD

Shim

PEx

SPI

LDD

UART

SDK

PEx

UART

LDD

Shim

PEx

UART

LDD

PIT

SDK

Pex

PIT

LDD

Shim

PEx

PIT

LDD

SMC

SDK

PEx

LDD

Set

Operation

Functions

System

Tick

LDD

Kinetis Microcontroller and Remote Intelligent Sensors

Application

ISF Core

Services

Drivers

Hardware

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External Use 21

Pro

ce

sso

r E

xp

ert

ISF

Ba

se

d E

mb

ed

de

d A

pp

lica

tio

n

ISF_Emb_App

Main

Settings

Subscription

List

Host

Interface

Config

ISF_Core

Core

Services

Sensor

Config

Comm

Channels

I2C LDD

UART

LDDMMA8652

MAG3110

Bus

Manager

Protocol

Adapter

Embedded Application

Task

ISF

Library

Sensor

Adapters

Protocol

Adapters

Ge

ne

rate

s

Ge

ne

rate

s

Ge

ne

rate

s

Ge

ne

rate

s

DSA

Direct API

Bus

Manager

Command

Interface

Power

Manager

MMA8652

Accelerometer

MAG3110

Magnetometer

DS

A

Dire

ct A

PI

I2C

UART

Sensor

State

Machine

CI Callback

DSA

Direct API

Bus

Manager

Command

Interface

Power

Manager

App Data Processing

Code

App Initialization

Code

App Shutdown Code

App Host Command

Handing Code

Primary Component Properties Linked Component

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External Use 22

Summary

• System-in-package, high level of integration

• Wide selection of sensors: absolute

pressure sensors, acceleration sensors,

temperature sensors, battery voltage sensors

• MCU with embeddable firmware and

software services

• Low power RF link

• Ultra low-power system wakes up on

specific physical event detection

P-cell

g-cell

8-bit MCU + RF/LF

Wireless Sensor

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External Use 23

Summary

Expanding applications and accelerated adoption

brings challenges scale, mix and life cycles

Improvements in process design, test and packaging

methodologies are needed

Ecosystem for connectivity and layered intelligence

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© 2014 Freescale Semiconductor, Inc. | External Use

www.Freescale.com