Memory and CPU Sockets

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Market Environment CPU/Logic Sockets• Standards driven by Intel and AMD• Markets include server, desktop and notebook• Primarily designed in the US• Consumed in Asia/Pacific• Multiple competitors and commodity pricing• Custom ASICs drive lower volume and

higher mix

AMD is a trademark of Advanced Micro Devices, Inc.Intel is a trademark of Intel Corporation.

TE Products for Intel Socket B – LGA 1366

System of LGA1366 socket

• Server socket (replaces Socket J – LGA 771)• Tyco Electronics’ provides three components for LGA1366socket system– Socket: 1981837-1(15au), 1981837-2(30au)– ILM: 1939738-1(U Lever), 1-1939738-2 (Straight Lever)– Stiffener plate: 1939739-1(DT); 1981467-1(SVR)

Intel is a trademark of Intel Corporation.

CPU Socket Roadmap for (Intel & AMD)2008 2009

Server

Socket TW (1248)

Socket J (771)

Socket 700

Socket G34

Socket H1 (1156)Socket 775

DesktopAM2 940

μPGA 479 rPGA989, rPGA988A

Notebook

μPGA 638 Socket FS1 (722)

AM3 941

2010 2011 2013

Socket 1207

Socket R (2011)

New AMD FM1 934

Socket LS (1567)

Socket 604

rPGA988B

Socket H2 (1155)

Micro Contact Socket

2012

Socket B1/B2 (1356)

rPGA988C rPGA II

Socket B (1366)

AMD is a trademark of Advanced Micro Devices, Inc.Intel is a trademark of Intel Corporation.

TE Products for Intel Socket H – LGA 1160

• Next generation Intel desktop CPU• Replaces Socket T LGA 775• Tyco Electronics’ provides three components for LGA1366

socket system– Socket: 2040540-1

– ILM: 2013882-1

– Stiffener Plate: 2013883-1

Intel is a trademark of Intel Corporation.

TE Products for Socket G – rPGA 989

• Mobile socket (replaces mPGA 479)• Part number 2013620-1

TE Products for AMD Socket G34 – LGA 1944

• Next generation AMD server CPU• Replaces Socket F LGA 1207• Tyco Electronics’ provides two components for LGA 1944 socket

system– Socket: 2069189-1 – ILM: 2069190-1

AMD is a trademark of Advanced Micro Devices, Inc.

Memory Sockets

Market Environment Main Memory Sockets• Main Memory module designs are

driven by JEDEC standards body.

• Major memory module makers and computer OEMs are key participants insetting module designs.

• Tyco Electronic’s product focus resides in DDR3

•

DDR3 DIMM LLCR Vertical Through Hole

• 240 position• Retention barb aids during soldering• Low level contact resistance• Three solder tail lengths available• Accepts memory module per JEDEC MO-269• Used in servers and communications equipment

Part NumberContact Plating

Housing Color

Extractor Color

Tail Length Packaging

1932031-1 Gold Flash Natural Natural 2.67 mm Tray1932031-2 Gold Flash Natural Natural 3.18 mm Tray1932031-3 Gold Flash Natural Natural 4.00 mm Tray1932031-4 Gold (15) Natural Natural 2.67 mm Tray1932031-5 Gold (15) Natural Natural 3.18 mm Tray1932031-6 Gold (15) Natural Natural 4.00 mm Tray1932031-7 Gold Flash Black Natural 2.67 mm Tray1932031-8 1932031-9

Gold Flash Gold Flash

Black Black

Natural Natural

3.18 mm 4.00 mm

Tray Tray

1-1932031-0 Gold (15) Black Natural 2.67 mm Tray1-1932031-1 Gold (15) Black Natural 3.18 mm Tray1-1932031-2 Gold (15) Black Natural 4.00 mm Tray1-1932031-3 Gold Flash Black Black 2.67 mm Tray1-1932031-4 Gold Flash Black Black 3.18 mm Tray1-1932031-5 Gold Flash Black Black 4.00 mm Tray1-1932031-6 Gold (15) Black Black 2.67 mm Tray1-1932031-7 Gold (15) Black Black 3.18 mm Tray1-1932031-8 Gold (15) Black Black 4.00 mm Tray1-1932031-9 Gold Flash Orange Natural 2.67 mm Tray2-1932031-0 Gold Flash Orange Natural 3.18 mm Tray

DDR3 DIMM Vertical Surface Mount• 240 position• Retention barb aids during soldering• Accepts memory module per JEDEC MO-269•Used in servers and communications equipment

Part NumberContact Plating

Housing Color

Extractor Color Packaging

2040727-1 Gold Flash Black Natural Tray2040727-4 Gold (15) Black Natural Tray2040727-5 Gold (30) Natural Natural Tray2040727-6 Gold (30) Black Black Tray2040727-7 Gold (30) Black Natural Tray

DDR3 SODIMM Right Angle Surface Mount• 204 position• Reverse and Standard module orientation options • Available in 4.0 mm and 5.2 mm heights• Accepts memory module per JEDEC MO-268• Small form factor enables development of

smaller, lighter notebook PCs

Part Number Std Keying

Part Number Rvs Keying

Contact Plating

Housing Color Boss Packaging

2013022-1 2013287-1 Gold flash Black With Tray2013022-2 2013287-2 Gold (6) Black With Tray2013022-3 2013287-3 Gold (30) Black With Tray1-2013022-4 1-2013287-4 Gold flash Gray Without Tray1-2013022-5 1-2013287-5 Gold (6) Gray Without Tray1-2013022-6 1-2013287-6 Gold (30) Gray Without Tray2-2013022-1 2-2013287-1 Gold flash Black With Reel2-2013022-2 2-2013287-2 Gold (6) Black With Reel2-2013022-3 2-2013287-3 Gold (30) Black With Reel3-2013022-4 3-2013287-4 Gold flash Gray Without Reel3-2013022-5 3-2013287-5 Gold (6) Gray Without Reel3-2013022-6 3-2013287-6 Gold (30) Gray Without Reel

4.0 mm Height

Part Number Std Keying

Part Number Rvs Keying

Contact Plating

Housing Color Boss Packaging

2013289-1 2013290-1 Gold flash Black With Tray2013289-2 2013290-2 Gold (6) Black With Tray2013289-3 2013290-3 Gold (30) Black With Tray1-2013289-4 1-2013290-4 Gold flash Gray Without Tray1-2013289-5 1-2013290-5 Gold (6) Gray Without Tray1-2013289-6 1-2013290-6 Gold (30) Gray Without Tray2-2013289-1 2-2013290-1 Gold flash Black With Reel2-2013289-2 2-2013290-2 Gold (6) Black With Reel2-2013289-3 2-2013290-3 Gold (30) Black With Reel3-2013289-4 3-2013290-4 Gold flash Gray Without Reel3-2013289-5 3-2013290-5 Gold (6) Gray Without Reel3-2013289-6 3-2013290-6 Gold (30) Gray Without Reel

5.2 mm Height

Mini DIMM Right Angle Surface Mount

• 244 position• Reverse and Standard module orientation options• Accepts 1.0 mm thick memory module per JEDEC

MO-244 • Used in servers and communications equipment

that require multiple small modules

Part Number KeyingContact Plating Height

Housing Color Packaging

1735438-2 Reverse Gold (30) 9.79 mm Black Tray1735438-4 Standard Gold (30) 9.79 mm Black Tray1-1735438-2 Reverse Gold (15) 9.79 mm Black Tray1-1735438-4 Standard Gold (15) 9.79 mm Black Tray

Memory and CPU SocketsMarket Environment �CPU/Logic SocketsTE Products for Intel Socket B – LGA 1366CPU Socket Roadmap for (Intel & AMD)Slide Number 5TE Products for Socket G – rPGA 989TE Products for AMD Socket G34 – LGA 1944Memory SocketsMarket Environment�Main Memory SocketsDDR3 DIMM LLCR Vertical Through HoleDDR3 DIMM Vertical Surface MountDDR3 SODIMM Right Angle Surface Mount�Mini DIMM Right Angle Surface Mount