RADIEL FFOONNDAM

RADIEL FONDAM

SOFT SOLDER

RADDIIEELL FONDAM

PRODUCTS AND TECHNICAL SUPPORTIN SOLDERING TECHNOLOGY

Solder wires Fluidel 5®

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VLMP (Very low melting point) solder for juxtaposed joints on printed circuit cards or parts that are thermally sensitive.

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5LEDIULF

Sn 95.5 Ag 3.8 Cu 0.7Sn 96.5 Ag 3.5Sn 100Sn 97 CuSn 99.3 Cu 0.7Sn 96.5 Ag 3 Cu 0.5Sn 99 Ag 0.3 Cu 0.7Sn99 Cu SP

217° C221° C232° C227° C227° C217° C217° C227° C

Lead-free solders in compliance with the food industry, plumbing, and lead-free electronic assembly. Highermechanical strength with low electrical resistance for high quality solder joints.

EutecticEutecticmelting320° C

Eutectic219° C228° C

Eutectic

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nS09bPPb 93.5 Sn Ag 1.5

C0°72C6°92

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ROSIN-BASED(*)=Halide free

R)nisoReruP( *PR

RMA(Rosin Mildly Activated)

RA(Rosin Activated)

EL*F45-CT2-RL

RJ5

CHV - CR - RDRJ 10

WATER-WASHABLE

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SYNTHETIC(Rosin free)

NO CLEAN(Halide free)

NO CLEAN

S45V - SWO - SWX

R45-AO-R1-RT15

A11

Technical data sheets for each product are available on request. Fluidel 5® wire may be solid or coredwith flux types : Rosinous, Hydrosoluble or Synthetic.Sizes Ø : from 0,2 to 6 mmSupplied on : spools from 100 g to 20 kg.

drums : 20 to 50 kg.

Incorporated flux

Table of standard alloys

Consult us for special requirements

Anodes

Machine alloys

M.B.O. alloys are :�Manufactured using the highest purity base metals, only virgin materials are used.� Produce in a rigorously controlled process to ensure the lowest oxide levels.� Every bar and carton is marked with a traceable lot number.� Impurities are well below international standards, insuring the quality of solder joints and the reliabilityof the assembled product.

� Chemical analysis of solder pot's content is available to quantity users.

ALLOYS :- Sn 100- Sn Pb

Forms :- elliptical- rectangular

- specific : on request.

- Dimensions : on request.

RANGE INCLUDES ALLOYS FOR :� All flow solder processes� Solder Pots� Automatic dipping machines

Alloy forms :- Bars- Sticks- Granules- Ingots

STANDARD ALLOYS� EXTRALLOY : Sn 63 Pb - Sn 60 Pb - Sn 62 Pb Ag 2Sn 50 Pb Bi 3 .

� NITRALLOY : Sn 63 Pb - Sn 63 G2 - Sn 60 Pb Bi� CLEANALLOY : Sn 63 Pb - Sn 63 G2 - Sn 60 Pb Bi� Sn 60 HT - Sn 60 HTS� LEAD_FREE ALLOYS : Sn 99.3 Cu 0.7 - Sn 96.5 Ag 3.5

Sn 95.5 Ag 3.8 Cu 0.7Sn 96.5 Ag 3 Cu 0.5Sn 99 Ag 0.3 Cu 0.7Sn 99 Cu SP

� LEAD_FREE ALLOYS : “LOW COST” - HIGH QUALITYSn 99.3 Cu SP

Flux pen

Flux and ThinnersMBO offers a wide range of liquid fluxes.These fluxes are formulated to suit many different processes in the use of soft solder in electronic,electrical, industrial and hobbyist applications.

Developed for manual soldering applicationsand rework.- Fine pitch application- No-clean.- Flux types EXEL 314, FXL 248

ROSIN/RESIN BASED

R, RMA, RA.BC 156BC 310BC 310-15BC 310-35BC 310-45BC 340FR 601FR 601-15CMS 2020

NO-CLEAN TYPELOW-RESIDUE FLUX

�ALCOHOL BASEDRESINOUSBCX5MFXL-248

SYNTHETIC ROSIN FREEMBO 45 D40 S2A40 S2S50 S2ALF 50SMTSEXEL-600FXL-880PBEXEL-112S0EXEL314EXEL LF7

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WATER BASEDWBF 01DSWBF 02TWBF 03T

HYDREXEL 302LFHYDREXEL 103LF

WATER WASHABLEH 32 MH 35 MH 325 MH 350 M

THINNERSD 305D 40SD 45

AQUEOUSPR 102PR 1022PR 202PR 303

TC 320TC 325

All MBO fluxes are compatiblewith RoHS directives and with

lead-free alloys.

Solder Paste

Flux gel

A complete range of solder creams formulated to meet thecritical demands of micro-electronics production and all prin-ted circuit applications.

Suitable for use with Soldering and Rework of SurfaceMount Components as well as other similar applications.� MOB 39A gelatinous flux, application specific for BGA (Ball GridArray) components but offering benefit in rework applicationswhere sufficient solder is already present on the component.Spread thinly at approximately 3 µm thick it will effectivelyflux any tinned surface without the problem of droplet vo-lume control and with the added advantage leaving a mini-mal non-corrosive residue.Supplied in syringes of 5g and 10g, in jars of 200g, 400g & 1kg.� Adhesive FLUX ABOHE - AAOHE - ACOHE - FLT 396

ALLOYS� Spherical alloy particles� Totally oxide free� Accurately controlled granular sizes� Particles class 2 (45 – 75 µm) to class 6 (5 – 15 µm)�Melting point from 98°C to 300°C� Lead free alloys

PNEUMATIC DEPOSITIONTYPE 721-ORION 410 Di-SIRIUS 1 Di� Deposit by syringe� No clean residue� Syringes 20 g to 100 g� Cartridges 500 g - 1 kg� RA version available

Available in awide range ofalloys, particlesizes, viscosityand flux form-ulations to

meet any typeof fine electro-

nicsand industrialapplication.

NO-CLEAN, MINIMAL RESIDUES, EXCELLENTACTIVITY, MEETS THE IPC STANDARDSTYPES SIRIUS 1 - SIRIUS 1LF - ORION 410� High printing performance� Clear residues

TYPE SIRIUS 1LFP� Fine pitch - pin testable� High grade (up to class 6)

STANDARD RMA

Type 495� Can be reflowed in air or nitrogen

STANDARD RA

Type SIRIUS 1RA� Active no clean formulation� Can be reflowed in air or nitrogen

HMP Type TITAN HT-12 / HT - 10� “Active” formulation� Can be reflowed in air or nitrogen� Temperature resistant

WATER-WASHABLE

CASCADE 1LF–C� Low voids – easy to cleanTYPE BLOWPIPE� Plumbing application

SUPPLIED IN CONTAINERS� Jars of 500 g to 1000 g� Cartridges from 500 g to 1 kg� Refill container of 2,5 kg� Proflow® system cartridge

F lux ge l MOB 39 i scompat ib le wi th RoHS

d i rec t i ves

PreformsM.B.O. offers a wide range of preformed solder shapes for low cost automated assembly.

Preforms are available in many varieties :� washers� discs� squares� hexagons� rectangles� balls

Produced in all alloys with or without flux.Flux can be incorporated within or on the sur-face of the preform.Preforms are best used for assemblies producedin quantity or in applications difficult to accesswith soldering ironsor reflow soldering techniques.Our technical department will calculate and re-commend the best preform options for yourspecific application.

Areas of application where preforms can be of benefit :� Connector pins and receptacles� Condensers� Fuses� Springs to a fixed base

Our preform department willrecommend and calculate foryour best option.

Services

Peelable Mask

All our products can be suppliedwith Analysis or Certificate

of Conformity

DEVELOPMENT OF SPECIFIC PRODUCTSIn order to allow you to reach your development objectives, MBO team offers you :- its know-how- its availability- its technical assistance- its research laboratory

ANALYSIS� A full analysis service is available for de-termining the quality and content of cus-tomer's solder baths/reserviors.

� Measurements supplied in terms of :- metals by X-ray spectrography- chemicals by potentiometry, chroma-tography, spectroscopy and spectrometry

Suitable for use when maskingcomponent areas of the PCBAwhere “non wettable” or “Tempera-ture Sensitive” devices need to beassembled after the solderingprocess

Chips, trails...MSP 75MSP 75 neutralMSP 75 opaqueMSP R93-BAvailable in bottles of 250ml or indrums of 5 kg.

MBO qualityM.B.O. PRODUCTS meet the following standards :

� Alloys :EN 29 453 - ISO 9453 - QQS 571 E

� Fluxes :EN 29 454 - ISO 9454

� J-Std specifications

VERSION 2008

Production control is in accordancewith the internationally recognized

standard ISO 9001:2008

MBO FRANCE MÉTAUX BLANCS OUVRÉS4, Rue de la Fonderie – CS 3004921806 CHEVIGNY-SAINT-SAUVEUR CEDEXTel : 03 80 46 12 58 - Fax : 03 80 46 66 59Web site : http://www.mbosolder.com

MBO U.K. MBO UK LIMITEDMill End - Standon - Ware - Herts - SG11 1 LRTel. : 01920 823999 - Fax : 01920 823631Web site : http://www.mbouk.co.uk

MBO CHINA MBO DOUBLINK SOLDERS CO. LTDN° 9, Jingsheng North First Street,Golden Bridge Technology Industry Base,Beijing Tongzhou Area Zhong Guan Cun Technology Zone (Tongzhou)Code 101102Tel. : 86 10 52331800 or 86 10 60595310Fax : 86 10 52331800 or 86 10 52331819Web site : dbgwmbo.com

MBO POLAND MBO Hutmen jvUl.Grabiszynska 241 - 53-234 Wroclaw - PolandTél. : (+48) 713 348 634 - Fax : (+48) 71 33 48 837Site internet : www.mbohutmen.com.pl

RADIEL FONDAM