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MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 1
1 DESCRIPTION
The MT5815 is a System on Chip (SoC) for
magnetic induction based wireless power
transmitter solutions. It is fully compliant with the
latest Wireless Power Consortium (WPC) Qi
v1.2.4 specification, with support of both
Baseline Power Profile (BPP) and Extended
Power Profile (EPP).
The MT5815 provides powerful, flexible, feature
rich yet compact wireless power transmitter
solutions. It integrates everything except power
MOSFET’s and a few passive components.
These include high voltage Buck, LDO’s, three
pairs of N-MOSFET’s drivers (to support two
coils applications), multiple channels of unique
Analog Front End (AFE) for ASK demodulation,
FOD and Q factor detection, powerful and unique
DSP for demodulation and FOD, generic 12 bit
ADC and DAC, current sensing and Over
Voltage, Over Current and Under Voltage
Protection (OVP, OCP, UVP), oscillators and PLL
with support of external crystal for high accuracy
clock and extremely low power deep sleep mode,
plenty of channels of PWM for individual control
of each power MOSFET’s for flexible dead time
control and phase shift generation, power
adaptor interface detection and control with
support of QC 2.0/3.0, USB PD, SCP, FCP and
AFC, etc. As the control and configuration center
as well as data processor, MT5815 integrates an
ARM Cortex M0 processor with a spacious
64KByte eFlash memory and 4KByte SRAM, as
well as various serial interfaces (I2C, UART,
GPIO’s, etc.), offering powerful processing
capabilities and customized features. With a
single MT5815, one can implement any single
coil or dual coil transmitters defined in WPC
specification; by adding one tiny companion
driver chip (MT5812), one can implement a 4 coil
transmitter or two independent transmitters.
2 FEATURES
Wide input voltage, ranging from 3.5V to
20V, and up to 40W of power transfer
Compliant with latest WPC Qi specification
v1.2.4 and beyond, supporting proprietary
protocols.
Embedded 32-bit ARM M0 processor with
64KB eFlash and 4 KB SRAM
Supports fast charging power adaptors of
different protocols, including USB PD,
QC2.0/3.0, FCP and SCP, and AFC
Integrated three pairs of N-MOSFET drivers
for single and dual coil applications
Integrated Buck convertor and LDO’s for
internal power supplies
Integrated current sensing function for
current measurement and current mode
demodulation
Multiple channels of AFE+DSP for ASK
demodulation in voltage and current modes
Low operating current and extremely low
standby current in deep sleeping mode
Internal 32K and 60M oscillators and PLL
with support of external crystal for Apple
mode fixed frequency operation
Supports SWD, I2C, UART and JLink
Interface with plenty of GPIO’s
Dual VDD_IO pins for flexible I/O levels
Over-voltage/current/temperature protection
Input under voltage detection and lockout
function
Available in 6mm x 6mm QFN48 package
3 APPLICATIONS
WPC compliant wireless power transmitters
for smart phones and wearable devices
Medical, home appliance and industrial
applications
Car and other vehicle accessories
Other wireless power applications
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 2
4 TYPICAL APPLICATION CIRCUIT
Single Coil Application
MT5815
VIN_SNSISH ISL
DEMOD1 DEMOD0
SW_B
GND
VDD5V
LDO3P3
ISNS_O
GPIO
BST1
DRV1H
SW1
DRV1L
BST2
DRV2H
SW2
DRV2L
BST3
DRV3H
SW3
DRV3L
Coil
Functional Modules (including Indicator LED,
Buzzer, Sensing, Protections, etc.)
PGATE
OCP_
VREF
GND
VIN-
VIN+
VIN
GPIO-E0/XIN XOUT
Optional
LDO1P5
GPIO
Fast Charging Adapter Interface (including USB
PD, QC2.0/3.0, FCP, SCP, etc.)
GND
Optional
VIN5V
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 3
5 PIN CONFIGURATIONS AND FUNCTION
5.1 Pin Configurations
1VIN5V
2GPIOA0
3GPIOA1
4
5GPIOA4
6GPIOA6
7LDO1P5
8GND
9
10XOUT
11GPIOA7
12VDDIOA
GPIO-E0/XIN
MT5815YYWWXX
XXXX
36 GND
35 BST1
34 DRV1H
33 SW1
32 DRV1L
31 BST3
30 DRV3H
29 SW3
28
27 BST2
26 DRV2H
25 SW2
DRV3L
48
ISH
47
ISL
46
ISN
S_O
45
DE
MO
D1
44
DE
MO
D0
43
OC
P_V
RE
F
42
LD
O3P
3
41
VD
D5V
40
39
PG
ATE
38
VIN
37
SW
_B
VIN
_S
NS
GPIOA3
GND
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 4
5.2 Pin Functions
Pin Name Pin No. Type Default
Function Description
VIN5V 1 PWR VIN5V +5V input voltage pin, connect 4.7uF capacitor.
VDD5V 41 PWR VDD5V BUCK converter’s output, 100mA souring capability, connect 10uF and
0.1uF capacitor to GND.
LDO1P5 7 PWR LDO1P5 Internal 1.5V LDO’s output, connect 1uF capacitor to GND.
VDDIOA 12 PWR VDDIOA Power supply for GPIO group A, connect 1.8V/3.3V/5V power, and
connect 1uF capacitor to GND.
VDDIOB 13 PWR VDDIOB Power supply for GPIO group B, connect 1.8V/3.3V/5V power, and
connect 1uF capacitor to GND.
VIN 38 PWR VIN Power Supply Input.
LDO3P3 42 PWR LDO3P3 Internal 3.3V LDO’s output, connect 1uF capacitor to GND.
GPIOA0 2 I/O CCID Can be configured as GPIO/TRXD/CCID/FCP/DAC/ADC1
GPIOA1 3 I/O DM Can be configured as GPIO/SWCK/SDA/TXD/DM/FCP/DAC/ADC2
GPIOA3 4 I/O DP Can be configured as GPIO/SWDIO/SCL/TRXD/DP/DAC/ADC4
GPIOA4 5 I/O Vin_sns Can be configured as GPIO/SCL2/TRXD2/ADC5
GPIOA6 6 I/O ISNS_O Can be configured as GPIO/SDA2/TXD2/ADC7
GPIOA7 11 I/O Vbrg_sns Can be configured as GPIO/SDA2/TXD2/ADC9
GPIOB0 14 I/O SCL Can be configured as GPIO/SCL3/TRXD3/PWM/ADC12
GPIOB1 15 I/O SDA Can be configured as GPIO/SDA3/TXD3/PWM/ADC13
GPIOB2 16 I/O Vcoil_sns Can be configured as GPIO/SCS/PWM/ADC14
GPIOB3 17 I/O OTP Can be configured as GPIO/MOSI/SCL3/ADC15
GPIOB4 18 I/O Buzzer Can be configured as GPIO/SCP/PWM/ADC16
GPIOB5 19 I/O Q_factor Can be configured as GPIO/MISO/SDA3/ADC17
GPIOB8 20 I/O GPIO Can be configured as GPIO/PWM
GPIOB6 21 I/O LED1 Can be configured as GPIO/LED/SCS/PWM
GPIOB7 22 I/O LED2 Can be configured as GPIO/LED/SCP/PWM
GPIOC0 23 I/O GPIO GPIO
GPIO-E0/XIN 9 I/O XIN Clock input pin, can be configured as external XTAL OSC(8~24MHz)
/GPIO
XOUT 10 I/O XOUT Clock output pin, can be configured as external XTAL OSC(8~24MHz)
/GPIO
DRV2L 24 PWM DRV2L Output-Drive pin for low side power MOSFET in the 2nd switch pair.
SW2 25 PWM SW2 Switching node in the 2nd switch pair.
DRV2H 26 PWM DRV2H Output-Drive pin for high side power MOSFET in the 2nd switch pair.
BST2 27 ANA BST2 Bootstrap cap in the 2nd switch pair, connect 10nF capacitor to SW2.
DRV3L 28 PWM DRV3L Output-Drive pin for low side power MOSFET in the 3rd switch pair.
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 5
Pin Name Pin No. Type Default
Function Description
SW3 29 PWM SW3 Switching node in the 3rd switch pair.
DRV3H 30 PWM DRV3H Output-Drive pin for high side power MOSFET in the 3rd switch pair.
BST3 31 ANA BST3 Bootstrap cap in the 3rd switch pair, connect 10nF capacitor to SW3.
DRV1L 32 PWM DRV1L Output-Drive pin for low side power MOSFET in the 1st switch pair.
SW1 33 PWM SW1 Switching node in the 1st switch pair.
DRV1H 34 PWM DRV1H Output-Drive pin for high side power MOSFET in the 1st switch pair.
BST1 35 ANA BST1 Bootstrap cap in the 1st switch pair, connect 10nF capacitor to SW1.
SW_B 37 ANA SW_B Switching node of internal BUCK converter.
PGATE 39 ANA PGATE Gate control signal for external Over Voltage Protection P-MOSFET.
VIN_SNS 40 ANA VIN_SNS Input Voltage Sense.
OCP_VREF 43 ANA OCP_VREF Setting coil current OCP triggering threshold.
DEMOD0 44 ANA DEMOD0 Demodulation channel 0 input pin.
DEMOD1 45 ANA DEMOD1 Demodulation channel 1 input pin.
ISNS_O 46 ANA ISNS_O Input current sense voltage output.
ISL 47 ANA ISL Negative input of current sense
ISH 48 ANA ISH Positive input of current sense
GND 8, 36, GND GND GND Power Ground.
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 6
6. SPECIFICATIONS
6.1 Absolute Maximum Ratings
VIN_SNS, PGATE 30V
VIN, SW_B, SW1, SW2, SW3 24V
BST1, DRV1H SW1+6V
BST2, DRV2H SW2+6V
BST3, DRV3H SW3+6V
VDD5V, VIN5V, VDDIOA, VDDIOB, GPIO_groupA, GPIO_groupB,
GPIOC0, GPIO-E0/XIN, XOUT, DRV1L, DRV2L, DRV3L,
OCP_VREF, DEMOD0, DEMOD1, ISNS_O
6V
LDO3P3 3.9V
LDO1P5 1.8V
ISL, ISH, GND ±0.3V
Storage Temperature -55°C to 150°C
Operating Junction Temperature Range, TJ -40°C to 125°C
Maximum Soldering Temperature (Reflow, Pb-Free, soldering, 10s) 260°C
6.2 ESD Ratings
Test Model Pins Ratings
HBM All pins ±2000V
CDM All pins ±500V
6.3 Recommended Operating Conditions
Operating Voltage (Vin) 3.5V ~ 20V
Operating Current (Iin) 0 ~ 2A
Operating Temperature (Environment) -40°C ~ 85°C
6.4 Thermal Information (Package Thermal Data)
Junction to ambient (RθJA) 36°C/W
Notes:
(1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these or any other conditions beyond
those indicated under “Recommended Operating Conditions” is not implied. Exposure to
absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard. 6.1 Absolute Maximum
Ratings.
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 7
6.5 Electrical Characteristics
(Test conditions: VIN=5.5V, TA=25°C unless otherwise stated.)
Symbol Parameter Conditions Min Typ Max Unit
Power Supply
Vin Input power supply 3.5 5 20 V
UVLO Under voltage lockout 2.5 V
UVLO_HYS Under Voltage Lockout
Hysteresis 0.3 V
Idc DC operation input current TBD mA
Iq Quiescent input current 1 mA
Isleep Sleep mode input current TBD uA
LDO
LDO3P3_Vout Output voltage Cout=1uF; VIN=5V
3.25 3.3 3.35 V
LDO3P3_Iout Load current 150 mA
LDO1P5 1.5V LDO Regulator Cout=1uF; VIN=5V 1.42 1.5 1.57 V
BUCK Convertor
Vout Output voltage Cout=10uF; L=4.7uH
4.95 5 5.05 V
Iout Load current 100 mA
Current Sense Programming Ability
Vsns_offset Current sense output offset
programming step
ISL=ISH,
Measure ISNS_O PIN
1.6/1.2/
0.9/0.6 V
Gain Current sense gain
programming step
20/30/40/
50
DEMOD
Vdem_cm
Demodulation input
common mode voltage
programming step
Programmable.
Default=0.6V
0.6/0.9
/1.2 V
ADC
Vin_adc ADC input range 0~2.4 V
N_adc Number of bits of ADC 12 bit
N_ch Number of input channels 16 N
DNL ±1 LSB
S_adc ADC sampling rate 100 KSPS
DAC
Vdac DAC output range 0~2.4 V
N_dac Number of bits of DAC 10 bit
S_dac DAC code update speed 2 MSPS
CLOCK
F_osc32k Low speed oscillator 32 KHz
F_osc60M 60M oscillator 60 MHz
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 8
Symbol Parameter Conditions Min Typ Max Unit
MOSFET Drivers
Tl_on_off Low-side Gate Driver Rise
and Fall Times
CLOAD= 3nF; 10% to
90%, 90% to 10% 50 ns
Th_on_off High-side Gate Driver Rise
and Fall Times
CLOAD= 3nF; 10% to
90%, 90% to 10% 50 ns
GPIO
VIH Input high voltage 0.7*
VDDIO V
VIL Input low voltage
0.3*
VDDIO V
VOH Output high voltage I=8mA 0.8*
VDDIO V
VOL Output low voltage I=8mA
0.2*
VDDIO V
I_lkg leakage current 1 uA
DP and DM
VDPsrc Voltage source on DP 0.6 V
VDP3p3 3.3V source on DP 3.3 V
IDPsrc DP current source 10 uA
IDPsink DP sink current 100 uA
IDMsink DM sink current 100 uA
RDMdown DM pull down resistor 20 KΩ
IDPlkg DP leakage current DP/DM open 1 uA
IDMlkg DM leakage current DP/DM open 1 uA
Thermal Shut Down
T_thermal_r Thermal shut down rising
threshold
140 °C
T_thermal_f Thermal shut down falling
threshold
120 °C
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 9
6.6 Typical Operating Characteristics
The following performance characteristics were taken using MT5815 wireless power transmitter and
MT5715 wireless power receiver at TA=25°C, unless otherwise noted.
404550556065707580859095
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
Effi
cie
ncy
(%)
Output Current(A)
Efficiency vs. Output LoadTest Condition: Vin=5.5V, Vout=5V
404550556065707580859095
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
Effi
cie
ncy
(%)
Output Current(A)
Efficiency vs. Output LoadTest Condition: Vin=9V, Vout=9V
404550556065707580859095
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
Effi
cie
ncy
(%)
Output Current(A)
Efficiency vs. Output LoadTest Condition: Vin=9V, Vout=12V
404550556065707580859095
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
Effi
cie
ncy
(%)
Output Current(A)
Efficiency vs. Output LoadTest Condition: Vin=12V, Vout=15V
404550556065707580859095
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
Effi
cie
ncy
(%)
Output Current(A)
Efficiency vs. Output LoadTest Condition: Vin=15V, Vout=18V
404550556065707580859095
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
Effi
cie
ncy
(%)
Output Current(A)
Efficiency vs. Output LoadTest Condition: Vin=15V, Vout=20V
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 10
7 DETAILED DESCRIPTIONS
7.1 Overview
MT5815 is an SoC for wireless power transmitter solutions. It integrates all major functional blocks
of any WPC single coil or dual coil, BPP or EPP transmitters. These include DC to AC inverter
block (clock oscillator, PLL, PWM generators, MOSFET drivers), communication block (ASK
demodulation AFE and DSP, FSK modulation and 8 MHz to 24 MHz crystal support (for accurate
operating and modulated frequencies), fast charging power adaptor detection and control block
(Quick Charge 2.0/3.0, USB Power Deliver, FCP and SCP, AFC and other proprietary protocols),
internal power supply block (high input voltage buck and analog, I/O and core LDO’s), Q factor
detection and FOD block, miscellaneous function block (band gap and bias, temperature sensing,
ADC, DAC, current sensing, low frequency oscillator, CRC, encryption, etc.), exceptional condition
protection block (input over voltage protection, input over current protection, input under voltage
protection, coil over current protection, over temperature protection, etc.), serial interface block
(UART, I2C master and slave, SWD, JLink, GPIO’s), and an embedded processor block (32 bit
ARM Cortex M0, 64Kbyte eFlash, 4Kbyte SRAM, fully programmable operating clock, AHB and
APB, DMA’s and peripherals, advanced timers and watchdog timers, etc.). With the abundant
hardware functional blocks and the powerful M0 and the spacious eFlash memory, we allow our
customers to implement differentiated functions and features on their own, based on the basic
building blocks and libraries provided by us. MT5815 represents the state of art wireless power
transmitter SoC solution and set an industry bench mark for high integration, rich feature set,
extraordinary performance, extreme flexibility and low cost.
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 11
7.2 Functional Block Diagram
MT5815
MOSDriver
OVPLDO 1.5V
12bit ADC
PLL
I/O Interface
10bit DAC
HV BUCK
Low Side Current Sense
ISNS_O
60M OSC
Demodulation
BST1
DRV1H
SW1
DRV1L
BST3
DRV3H
SW3
DRV3L
BST2
DRV2H
SW2
DRV2L
Biasing
ISLISH
DEMOD0
DEMOD1
GPIO-E0/XIN
XOUT
LDO1P5 VIN VIN_SNS PGATE
GPIO
(LED, Buzzer, etc.)VDDIOA VDDIOB
VDD5V
LDO 3.3V
USB PD, QC 2.0/3.0 Sensing
LDO3P3
GPIO(ADC)
1.5V
3.3V
GND
GND
SW_B
GPIO
(USB PD, FCP,
SCP, QC2.0/3.0)
OCP_VREF
GPIO(DAC)32K OSC
FOD & Q Factor Detection
Core
PWM Generator and FSK Modulator
VIN5V
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 12
7.3 Theory of Operation
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 13
8 APPLICATIONS AND IMPLEMENTIONS
8.1 Reference schematic
8.2 BOM
# Reference Value Description Footprint Quantity
1 C6, C23, C9, C15 10uF/16V CAP.CERAM.SMD,±10%,X7
R
0805 4
2 C11 4.7uF/10V CAP.CERAM.SMD,±10%,X7
R
0603 1
3 C2, C26, C28, C20 1uF/10V CAP.CERAM.SMD,±10%,X7
R
0402 4
4 C10, C16, C36, C37, C24, C7, C14 0.1uF/16V CAP.CERAM.SMD,±10%,X7
R
0402 7
5 C13, C17, C18, C21 100nF/50V CAP.CERAM.SMD,±10%,NP
O
1206 4
6 C12, C27, C31, C32, C8 22nF/16V CAP.CERAM.SMD,±10%,X7
R
0402 5
7 C19, C25 10nF/16V CAP.CERAM.SMD,±10%,X7
R
0402 2
8 C32, C33, C35, C39 6.8nF/10V CAP.CERAM.SMD,±10%,X7
R
0402 4
9 C34 3.3nF/10V CAP.CERAM.SMD,±10%,X7
R
0402 1
10 C1 100PF/10V CAP.CERAM.SMD,±10%,X7
R
0402 1
11 R8 20mΩ RES.SMD ±1% 1/4W 1206 1
12 R1, R2 4.7Ω RES.SMD ±5%,1/16W 0402 2
13 R3, R5, R9, R13, R23 10Ω RES.SMD ±5%, 1/16W 0402 5
Qfact
Q5AO3406
C32
22nF C35
6.8nF
LED1GREEN
LE
D2
Vin_sns
Vin
C36
0.1uF
VDD3P3SWCLKSWDIO
1234
J1
D1
BAV21WS
C21100nF
C6
10uF
C7
0.1uF
C12
22nF
C23
10uF
C24
0.1uF
C27
22nF
C18100nF
C17100nF
C13100nF
Vin
Vin
DRV3H
SW3
DRV3L
DRV2H
SW2
DRV2L
LE
D1
LE
D2
Vin_sns
Qfa
ct
SWDIO
SWCLK
SC
L
OT
P
SD
A
CC1ID
DM
DP
GPA4
GPA6
Buzz
er
DRV2H
SW3
SW2
BST1
DRV1H
DRV1L
BST3
DRV3H
DRV3L
BST2
SW1
DR
V2L
VD
D5V
4.7uH
L1
LD
O3P3
ISH
ISL
Vco
il_sn
s
GPA0
GPA1
GPA3
GPA7
LDO1P5
GP
B0
GP
B1
GP
B2
GP
B3
GP
B4
GP
B5
GP
B6
GP
B7L
DO
3P3
Vin5V1
GPIOA02
GPIOA13
GPIOA34
GPIOA45
GPIOA66
LDO1P57
GND8
GPIO-EO/XIN9
XOUT10
GPIOA711
VDDIOA12
VD
DIO
B13
GPIO
B0
14
GPIO
B1
15
GPIO
B2
16
GPIO
B3
17
GPIO
B4
18
GPIO
B5
19
GPIO
B8
20
GPIO
B6
21
GPIO
B7
22
GPIO
C0
23
DR
V2L
24
SW225
DRV2H26
BST227
DRV3L28
SW329
DRV3H30
BST331
DRV1L32
SW133
DRV1H34
BST135
GND36S
W_B
37
VIN
38
PG
AT
E39
VIN
_SN
S40
VD
D5V
41
LD
O3P3
42
OC
P_V
RE
F43
DE
MO
D0
44
DE
MO
D1
45
ISN
S0
46
ISL
47
ISH
48
MT5815-QFN48
U1
C281uF
C26
1uF
C20 1uF
C100.1uF
C910uF
C11 4.7uF
VDD5V
20mohm
R8
10
R3
10
R5
10
R9
10
R13
Vin
PG
AT
E
C2
1uF
4.7
R1
4.7
R2
C8
22nF
C1
100pF
VD
D5V
C1910nF
C2510nF
5.1KR26
VDD5V
51K_1%R17
5.1K_1%
R28
OTP
LD
O3P3
C37
0.1uF
10KR18
Vco
il
C39
6.8nF
499KR16
20KR27
Vcoil_sns10R23
SW2
5.1K
R22
200KR24
Vcoil
5.1RR15
ISN
S_O
C31
22nF
ISNS_O
T
Vin
Vin
T
GND_Vin
T
GND_pwr
T
GND_sig
T
SW3
SW
3
T
SW2
SW
2
Vcoil_ac
T
Demod0
Dem
od0
T
ISNS_O
ISN
S_O
T
Demod1
Dem
od1
T
OTP
OT
P
T
Vcoil_sns
Vco
il_sn
s
VDD5V
Type C or Micro USB input circurt
MT5815 Peripheral Circuit
OC
P_V
RE
F
OCP_VREF
LD
O3P3
10KR19
NCR30
Full-bridge Resonant Circuit
Demodulation FilteringSensing Circuit
Test Points
LN
LP
Q2B
VS3622DE
Q2A
VS3622DE
Q1B
VS3622DE
Q1A
VS3622DE
Demod1 Demod0
Dem
od0
Dem
od1
t? RT1
DMDPID
VBUSD-D+ID
VSS
6
USBUSB
C16
0.1
uF
X116M
C1112pF
C1212pF
R42M
option
C343.3nF
GNDSSRXP2SSRXN2VBUSSBU1DN1DP1CC1VBUSSSTXN1SSTXP1GND GND
SSTXP2SSTXN2
VBUSCC2DP2DN2
SBU2VBUS
SSRXN1SSRXP1
GND
TYPEC
5.1KR35
VinCC1 CC1
Vin
DMDP
DMDP
VinVin
Vin
C14
0.1uF
C15
10uF
Vin
10K
R22C33
6.8nF
000RR6000RR7
SCLSDA
GP
B8
GP
C0
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 14
# Reference Value Description Footprint Quantity
14 R15 5.1Ω RES.SMD ±5% 1/8W 0805 1
15 R22, R28, R26, R35 5.1K RES.SMD ±1% 1/16W 0402 4
16 R18, R19, R22 10K RES.SMD ±5% 1/16W 0402 3
17 R27 20K RES.SMD ±5% 1/16W 0402 1
18 R17 51K RES.SMD ±1% 1/16W 0402 1
19 R24 200K RES.SMD ±5% 1/16W 0402 1
20 R16 499K RES.SMD ±1% 1/16W 0402 1
21 L1 4.7uH IDC.SMD ±10% 100mA 0603 1
22 D1 BAV21WS Diode.SMD 250V,250mA SOT-323 1
23 LED1 LED GREEN SOD-523 1
24 Q1, Q2, VS3622DE Dual FET
Rdson=14mΩ@Vgs=4.5V DFN33 2
25 Q5 AO3406 Vds=30V, ID=3.6A SOT-23-SM
T
1
26 Micro USB or Type C USB 1
27 U1 MT5815 QFN48-4M
M
1
Total 60
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 15
9 DETAILED PACKAGING INFORMATIONS
QFN48 Package Outline and Dimensions
SYMBOL MILLIMETER
MIN NOM MAX
A 0.70 0.75 0.80
A1 - 0.02 0.05
b 0.15 0.20 0.25
c 0.18 0.20 0.23
D 5.90 6.00 6.10
D2 4.10 4.20 4.30
e 0.40BSC
Ne 4.40BSC
Nd 4.40BSC
E 5.90 6.00 6.102.7
E2 4.10 4.20 4.30
L 0.35 0.40 0.45
b1 0.69 0.79
h 0.30 0.35 0.40
MT5815
Maximizing IC Performance A High Efficiency Wireless Power Transmitter
Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation Page 16
10 ORDERING INFORMATION
Part No. Package
Type Package Information
Package
Quantity
Ambient
Temperature Chip Mark
MT5815Q QFN48 6 x 6 mm QFN48 3000 -40°C~+85°C
MT5815
YYWWXX
XXXX
11 REVISION HISTORY
Revision Date Description
0.5 2018-12-17 Initial release.
Important Notice
Maxic Technology Corporation (Maxic) reserve the right to make correction, modifications,
enhancements, improvements and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant
information before placing orders and should verify that such information is current and complete.
All products are sold subject to Maxic’s terms and conditions of sale supplied at the time of order
acknowledgement.
Reproduction, copying, transferring, reprinting this paper without Maxic’s written permission is
prohibited.
Maxic assumes no liability for applications assistance or the design of customers’ products. Maxic
warrants the performance of its products to the specifications applicable at the time of sale.
Customers are responsible for their products and applications using Maxic components. To
minimize the risks associated with customers’ products and applications, customers should
provide adequate design and operating safeguards.