IPC 1752

Form Type * Distribute

Sectionals * Material Info Subsectionals * Manufacturing Info

Company Name * STMicroelectronics Response Date *

Contact Name * Refer to " Supplier Comment" section Contact Title

Contact Phone * Refer to " Supplier Comment" section Contact Email *

Authorized Representative * Giovanni Giacopello Representative Title

Representative Phone * Refer to " Supplier Comment" section Representative Email *

Supplier Comment

Uncertainty Statement

Supplier Acceptance * true Legal Declaration *

Legal Statement

Refer to " Supplier Comment" section

Refer to " Supplier Comment" section

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express

or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility

and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Materials Declaration Form

A-D

Supplier Information

2013-10-30

Version 2

* : Required Field

AMS & IPD Materials Declaration Champion

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier

acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in

completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by

others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification

in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty

rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier’s liability and the Company’s remedies for issues that arise regarding information the

Supplier provides in this form.

Refer to " Supplier Comment" section

Legal Statement

Online Technical Support - STMicroelectronics : http://www.st.com/internet/com/support/online_tech_support.jsp

Standard

Mfr Item Number Mfr Item Name Version Mfr Site Date

HBBC*BT2C143 A MICROTEL 2013-10-30

Amount UoM Unit type ST ECOPACK Grade

1.63 mg Each ECOPACK® 2

J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles

3 245 3 after 168 hrs of floor life, may be done a baking at 70°C for 48 hrs

bulk Solder Termination Terminal Plating Terminal Base Alloy Comment

Not Applicable ; if coating is used or other bulk termaination : add in commentsNickel/Gold (Ni/Au)

Package Designator Size Nbr of instances Shape

Comment

Manufacturing information

Product

QueryList : ROHS directive 2011/65/EU _ July 2011

Response

true

false

false

false

false

false

Exemption Id.

Response

false

CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application ppm in product

Product(s) meets EU RoHS requirement without any exemptions

Query

Product(s) is obsolete, no information is available

Product(s) does not meet EU RoHS requirements and is not under exemptions

Product(s) meets EU RoHS requirements by application of the selected exemption(s)

Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)

Description

The product does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

Query

QueryList :REACH-20th June 2013

Product(s) is unknown, no information is available

Mfr Item Name 1628 12000001 1000004

Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in

homogeneous

material (ppm)

Concentration in

product (ppm)

E-STLC2690WTR 9.459 mg supplier die Silicon (Si) 7440-21-3 7.377 mg 558821 4531

E-STLC2690WTR supplier metallisation Aluminium (Al) 7429-90-5 0.024 mg 1818 15

E-STLC2690WTR supplier metallisation Copper (Cu) 7440-50-8 0.143 mg 10833 88

E-STLC2690WTR supplier metallisation Tantalum (Ta) 7440-25-7 0.024 mg 1818 15

E-STLC2690WTR supplier metallisation Titanium (Ti) 7440-32-6 0.012 mg 909 7

E-STLC2690WTR supplier metallisation Tungsten (W) 7440-33-7 0.001 mg 76 1

E-STLC2690WTR supplier metallisation Nickel (Ni) 7440-02-0 0.001 mg 76 1

E-STLC2690WTR supplier passivation Silicon Nitride (SiN) 68034-42-4 0.032 mg 2424 20

E-STLC2690WTR supplier passivation Silicon Oxide 7631-86-9 0.111 mg 8408 68

E-STLC2690WTR supplier PBO polymer coating polyamide 9080-59-5 0.072 mg 5454 44

E-STLC2690WTR supplier PBO polymer coating Gama-Butyrolactone 96-48-0 0.103 mg 7802 63

E-STLC2690WTR supplier PBO polymer coating Propylene glycol monomethyl ether acetate 108-65-6 0.01 mg 758 6

E-STLC2690WTR supplier PBO polymer coating Organosilan compound proprietary 0.004 mg 303 2

E-STLC2690WTR supplier PBO polymer coating Propretary ingredients proprietary 0.007 mg 530 4

E-STLC2690WTR supplier PBO polymer coating Flurorinated polymer 7782-41-4 0.009 mg 682 6

E-STLC2690WTR supplier UBM Aluminium (Al) 7429-90-5 0.148 mg 11211 91

E-STLC2690WTR supplier UBM Copper (Cu) 7440-50-8 0.983 mg 74464 604

E-STLC2690WTR supplier UBM Nickel (Ni) 7440-02-0 0.37 mg 28028 227

E-STLC2690WTR supplier UBM Vanadium (V) 7440-62-2 0.028 mg 2121 17

E-STLC2690WTR 3.742 mg supplier solder alloy Tin (Sn) 7440-31-5 3.578 mg 271040 2198

E-STLC2690WTR supplier solder alloy Silver (Ag) 7440-22-4 0.142 mg 10757 87

E-STLC2690WTR supplier solder alloy Copper (Cu) 7440-50-8 0.022 mg 1667 14

STM32F103RCY6TR 16.565 mg supplier Silicon Die Silicon (Si) 7440-21-3 16.565 mg 710091 10175

STM32F103RCY6TR 0.118 mg supplier Polymer 2-Hydroxyethyl Methacrylate 868-77-9 0.007 mg 300 4

STM32F103RCY6TR supplier Polymer Proprietary PD-9 Resin proprietary 0.081 mg 3472 50

STM32F103RCY6TR supplier Polymer Proprietary Trifluoroacetic Anhydride 407-25-0 0.007 mg 300 4

STM32F103RCY6TR supplier Polymer Tetraethylene Glycol Dimethacrylate 109-17-1 0.017 mg 729 10

STM32F103RCY6TR supplier Polymer 4.4'-Oxydiphthalic Anhydride 1823-59-2 0.006 mg 257 4

STM32F103RCY6TR 6.645 mg supplier Alloy Aluminum, metal 7429-90-5 0.079 mg 3386 49

STM32F103RCY6TR mg supplier Alloy Vanadium, metal 7440-62-2 0.006 mg 257 4

STM32F103RCY6TR supplier Alloy Nickel (Ni) 7440-02-0 0.061 mg 2615 37

STM32F103RCY6TR mg supplier Alloy Copper (Cu) 7440-50-8 0.177 mg 7587 109

STM32F103RCY6TR mg supplier Alloy Titanium, metal 7440-32-6 0.009 mg 386 6

STM32F103RCY6TR mg supplier Alloy Tin (Sn) 7440-31-5 6.059 mg 259731 3722

STM32F103RCY6TR supplier Alloy Silver (Ag) 7440-22-4 0.254 mg 10888 156

AS1374-BWLT1821 1.247 mg supplier Silicon Silicon (Si) 7440-21-3 1.247 mg 727538 766

AS1374-BWLT1821 0.371 mg supplier Solder Balls Tin (Sn) 7440-31-5 0.36 mg 210035 221

AS1374-BWLT1821 supplier Solder Balls Silver (Ag) 7440-22-4 0.009 mg 5251 6

AS1374-BWLT1821 supplier Solder Balls Copper (Cu) 7440-50-8 0.002 mg 1167 1

AS1374-BWLT1821 0.086 mg supplier Laminate Polymer proprietary 0.086 mg 50175 53

AS1374-BWLT1821 0.01 mg supplier Spheron Polymeric resin 68139-70-8 0.01 mg 5834 6

Capacitor 1 18.122 mg supplier Ceramic Barium oxide 1304-28-5 10.863 mg 399126 6673

Capacitor 1 supplier Ceramic Titanium dioxide 13463-67-7 5.44 mg 199875 3342

Capacitor 1 supplier Ceramic Misc proprietary 1.819 mg 66833 1117

Capacitor 1 4.743 mg supplier Nickel/Other Nickel alloy Nickel (Ni) 7440-02-0 4.743 mg 174266 2913

Capacitor 1 2.924 mg supplier Copper alloy Copper (Cu) 7440-50-8 2.924 mg 107433 1796

Capacitor 1 0.323 mg supplier Glass Silicon dioxide 7631-86-9 0.255 mg 9369 157

Capacitor 1 supplier Glass diboron trioxide; boric oxide 1303-86-2 0.068 mg 2498 42

Capacitor 1 0.306 mg supplier Electrolytic Nickel Plating Nickel (Ni) 7440-02-0 0.306 mg 11243 188

Capacitor 1 0.799 mg supplier Electrolytic Tin Plating Tin (Sn) 7440-31-5 0.799 mg 29357 491

Capacitor 2 11.903 mg supplier Ceramic Barium oxide 1304-28-5 7.142 mg 420142 4387

Capacitor 2 supplier Ceramic Titanium dioxide 13463-67-7 3.571 mg 210071 2193

Capacitor 2 supplier Ceramic Misc proprietary 1.19 mg 70004 731

Capacitor 2 1.909 mg supplier Copper alloy Copper (Cu) 7440-50-8 1.909 mg 112301 1173

Capacitor 2 0.212 mg supplier Glass diboron trioxide 1303-86-2 0.042 mg 2471 26

Capacitor 2 supplier Glass Silicon dioxide 7631-86-9 0.17 mg 10001 104

Capacitor 2 2.975 mg supplier Nickel/Nickel Plating Nickel (Ni) 7440-02-0 2.744 mg 161421 1686

Capacitor 2 supplier Tin plating Tin (Sn) 7440-31-5 0.231 mg 13589 142

Resistors 0.485 mg supplier Substrate Al2O3 1344-28-1 0.467 mg 763072 287

HBBC*BT2C143Material Composition Declaration

Resistors supplier Substrate SiO2 7631-86-9 0.009 mg 14706 6

Resistors supplier Substrate MgO 1309-48-4 0.009 mg 14706 6

Resistors 0.01 mg supplier Inner electrode (C1) Silver (Ag) 7440-22-4 0.01 mg 16340 6

Resistors 0.005 mg supplier Inner electrode (C2) Silver (Ag) 7440-22-4 0.005 mg 8170 3

Resistors 0.006 mg supplier Resistive layer Silver (Ag) 7440-22-4 0.001 mg 1634 1

Resistors supplier Resistive layer RuO2 12036-10-1 0.005 mg 8170 3

Resistors 0.056 mg supplier Termination (barrier) Nickel (Ni) 7440-02-0 0.056 mg 91503 34

Resistors 0.03 mg supplier Termination (finish) Tin (Sn) 7440-31-5 0.03 mg 49020 18

Resistors 0.007 mg supplier Primary glass Boron 19287-88-8 0.007 mg 11438 4

Resistors 0.013 mg supplier Overcoat II Epoxy resin 25068-38-6 0.013 mg 21242 8

Solder paste 18.258 mg supplier solder Tin (Sn) 7440-31-5 17.345 mg 949995 10654

Solder paste supplier solder Antimony (Sb) 7440-36-0 0.913 mg 50005 561

Monolithic filter 22.9 mg supplier Ceramic element assembly TiO2+BaO+Nd2O3 proprietary 21.67 mg 866800 13311

Monolithic filter supplier Ceramic element assembly other proprietary 1.23 mg 49200 756

Monolithic filter 1.46 mg supplier Inner conductor Silver (Ag) 7440-22-4 1.46 mg 58400 897

Monolithic filter 0.64 mg supplier Terminal surface plating Tin (Sn) 7440-31-5 0.38 mg 15200 233

Monolithic filter supplier Terminal surface plating Copper (Cu) 7440-50-8 0.13 mg 5200 80

Monolithic filter supplier Terminal surface plating Nickel (Ni) 7440-02-0 0.13 mg 5200 80

Crystal 0.667 mg supplier Blank Quartz 14808-60-7 0.65 mg 58978 399

Crystal supplier Electrode Gold (Au) 7440-57-5 0.017 mg 1543 10

Crystal 2.835 mg supplier Kovar Iron 7439-89-6 1.3 mg 117957 799

Crystal supplier Kovar Nickel (Ni) 7440-02-0 0.94 mg 85292 577

Crystal supplier Kovar Cobalt 7440-48-4 0.41 mg 37202 252

Crystal supplier Kovar Manganese 7439-96-5 0.01 mg 907 6

Crystal supplier Ni Plating Nickel (Ni) 7440-02-0 0.175 mg 15879 107

Crystal 7.442 mg supplier Ceramic Aluminium Oxide 1344-28-1 3.5 mg 317576 2150

Crystal supplier Ceramic Iron 7439-89-6 0.96 mg 87106 590

Crystal supplier Ceramic Nickel (Ni) 7440-02-0 0.82 mg 74403 504

Crystal supplier Ceramic Tungsten 7440-33-7 0.81 mg 73496 498

Crystal supplier Ceramic Silver (Ag) 7440-22-4 0.33 mg 29943 203

Crystal supplier Ceramic Cobalt 7440-48-4 0.32 mg 29035 197

Crystal supplier Metalization Chromium(III) Oxide 1308-38-9 0.21 mg 19055 129

Crystal supplier Metalization Copper (Cu) 7440-50-8 0.13 mg 11796 80

Crystal supplier Brazing Material Quartz 14808-60-7 0.12 mg 10888 74

Crystal supplier Brazing Material Gold (Au) 7440-57-5 0.055 mg 4990 34

Crystal supplier Seal ring(Kovar) Molybdenum 7439-98-7 0.025 mg 2268 15

Crystal supplier Seal ring(Kovar) Titanium(IV) Oxide 13463-67-7 0.021 mg 1905 13

Crystal supplier Seal ring(Kovar) Magnesium Oxide 1309-48-4 0.02 mg 1815 12

Crystal supplier Seal ring(Kovar) Calcium Oxide 1305-78-8 0.02 mg 1815 12

Crystal supplier Ni Plating Cobalt 7440-48-4 0.066 mg 5989 41

Crystal supplier Au Plating Gold (Au) 7440-57-5 0.035 mg 3176 21

Crystal 0.077 mg supplier Silver Paste Silver (Ag) 7440-22-4 0.025 mg 2268 15

Crystal supplier Silver Paste Silicon Resin proprietary 0.052 mg 4718 32

Antenna 18.72 mg supplier glass Glass Cloth 65997-17-3 11.232 mg 589081 6899

Antenna supplier Termination Copper (Cu) 7440-50-8 2.808 mg 147270 1725

Antenna supplier resin Epoxy 26265-8-7 4.68 mg 245450 2875

Antenna 0.16 mg supplier ink Epoxy Acrylate Oligomer proprietary 0.048 mg 2517 29

Antenna supplier ink Epoxy Resin proprietary 0.016 mg 839 10

Antenna supplier ink Acrylate Resin proprietary 0.008 mg 420 5

Antenna supplier ink Pigment 147-14-8 0.002 mg 105 1

Antenna supplier ink Inoganic Fillers 7727-43-7 0.046 mg 2413 28

Antenna supplier ink Ether glycol Solvent 112-15-2 0.024 mg 1259 15

Antenna supplier ink Solvent Naphta 8030-30-6 0.016 mg 839 10

Antenna 0.187 mg supplier Tin New Jersey(#9099) proprietary 0.029 mg 1521 18

Antenna supplier Tin Water 7732-18-5 0.132 mg 6923 81

Antenna supplier Tin Methanesulfonic Acid 75-75-2 0.026 mg 1364 16

Shield 0.199 mg supplier Shiled Copper (Cu) 7440-50-8 0.126 mg 633166 77

Shield supplier Shiled Zn 7440-66-6 0.039 mg 195980 24

Shield supplier glue or tape Nickel (Ni) 7440-02-0 0.034 mg 170854 21

PCB 331.086 mg supplier Copper (metallic) Copper (Cu) 7440-50-8 331.086 mg 225017 203370

PCB 920.496 mg supplier EP (Epoxy resin) Epoxy resin proprietary 452.398 mg 307464 277886

PCB supplier Glass Glass fiber 65997-17-3 468.098 mg 318134 287529

PCB 218.776 mg supplier Painted resin Baruim sulfate 7727-43-7 65.632 mg 44606 40314

PCB supplier Painted resin Acrylic resin proprietary 153.144 mg 104082 94069

PCB 0.473 mg supplier Painted resin Silica, Crystalline 14808-60-7 0.081 mg 55 50

PCB supplier Painted resin Talc 14807-96-6 0.071 mg 48 44

PCB supplier Painted resin Acrylic resin proprietary 0.321 mg 218 197

PCB 0.158 mg supplier Coating (Other compounds) Imidazole derivatives proprietary 0.142 mg 97 87

PCB supplier Coating (Other compounds) Copper (Cu) 7440-50-8 0.016 mg 11 10

PCB 0.236 mg supplier Nickel and Nickel alloys Nickel (Ni) 7440-02-0 0.236 mg 160 145

PCB 0.159 mg supplier Gold Gold (Au) 7440-57-5 0.159 mg 108 98