march 5 - testconx – connecting electronic test ...€¦ · powering the in-vehicle infotainment...
TRANSCRIPT
BiTS 2017 Poster Session
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Archive – Poster
March 5 - 8, 2017
Hilton Phoenix / Mesa Hotel
Mesa, Arizona
© 2017 BiTS Workshop – Image: tonda / iStock
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Copyright Notice
The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2017 BiTS Workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2017 BiTS Workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2017 BiTS Workshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by BiTS Workshop or the workshop’s sponsors. There is NO copyright protection claimed on the presentation/poster content by BiTS Workshop. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies. The BiTS logo and ‘Burn-in & Test Strategies Workshop’ are trademarks of BiTS Workshop. All rights reserved.
BiTS 2017 Poster Session
Burn-in & Test Strategies Workshop
www.bitsworkshop.org March 5-8, 2017
Enabling Temperature Margining Solutions for
Validating Automotive Electronics in Lab
Automation Environment
Ying-feng Pang, Hagai Wertheim, Rahima Mohammed, Amy Xia
Intel Corporation
Introduction
The growth of automotive electronics due to its wide use in automotive for
powering the in-vehicle infotainment system (IVI), navigation system,
autonomous driving platform, and advanced driver assistance systems
(ADAS) has inherently increased the need for automotive electronics to
be designed and tested to meet more stringent industrial specs.
Consequently, the need for new and reliable testing strategies are critical
to accommodate the lab automation environment for meeting industrial
temperature spec from -40°C to 130°C.
Challenges & Proposed Solution
• Thermal margining solution that can enable localized temperature
control on the device under test (DUT) from -40°C to 130°C
Solution: A multi-stage thermoelectric module (TEC) as part of
the liquid-cooled thermal solution with resistance temperature
detector (RTD) sensor embedded on the pedestal served as the
temperature feedback to the thermal controller
• Condensation management solution inside the automation cell
Solution: A purge chamber where dry air is pumped into the
automation cell to control the humidity level around the DUT and
thermal solution
• Leak detection solutions
Solution: Customized flex circuit film and leak detection wire for
detecting condensation and leak around DUT in the automation cell
BiTS 2017 Poster Session
Burn-in & Test Strategies Workshop
www.bitsworkshop.org March 5-8, 2017
• Innovative pedestal and gimbaling mechanism design to ensure good
alignment of thermal solution on DUT, thermal conduction and electrical
contact.
Solution: a gimbaling design to compensate on parallelism
mismatch with DUT to ensure good electrical and thermal contact
and a plate with mounting holes to fit onto the existing mounting
hardware inside the automation cell
Solution: A pedestal with floating X-Y plane compensation
mechanism to compensate the parallelism mismatch with DUT
Impact of Ionizer & Dry Air Purge on Thermal Performance
BiTS 2017 Enabling Temperature Margining Solutions for Validating Automotive Electronics in Lab Automation Environment 2
-60
-40
-20
0
20
40
60
0 10 20 30 40 50 60Power [W]
Thermal Performance (Tcoolant 13°C)
Ion on, 6[l/m] Purge, Bare Die
Ion Off, 6[l/m] purge, Bare Die
Ion Off, 3[l/m] purge, Bare Die
Ion Off, 3[l/m] purge, W/ VcTIM
Tca
se
[ºC
]
Flex circuit leak detector thru I2C sensor
communication with thermal controller
Gimbaling design with parallelism
compensation with DUT
Challenges & Proposed Solution
Ionizer is used to prevent electro-static discharge (ESD) in the automation cell
-40ºC at boot can be achieved with the proposed thermal solution
Minimum of 3 [l/m] dry air purge is required to prevent condensation during test
Higher dry air purge flow rate would reduce the thermal performance, but can
be improved with having the ionizer on
Ionizer reduces thermal performance at cold temperatures, but can improve
thermal performance at higher temperatures
BiTS 2017 Poster Session
Burn-in & Test Strategies Workshop
www.bitsworkshop.org March 5-8, 2017
BiTS 2017 Enabling Temperature Margining Solutions for Validating Automotive Electronics in Lab Automation Environment 3
Liquid detector resistance on different wetness condition was tested
Resistance value is measured high when the condition is dry (no
droplet/water detected)
Resistance value is measured the lowest when water is detected
System can be turned off and notified users when leak is detected during
test
Pressure Paper Test
• Uniformity of pressure
on DUT
Socket Contact Resistance Measurement (CRES)
• Shows good resistance of ~0.5 per pin on daisy
chain boards
Thermal Interface Contact and Socket CRES
Verification of Leak Detection
A combination of innovative mechanical and thermal designs is required for
achieving a solution that can meet industrial spec temperature testing in a lab
automation environment
Thermal performance, leak detection verification, thermal interface contact, and
socket contact were evaluated and verified for the lab automation environment
Summary
0
2000
4000
6000
8000
10000
12000
14000
16000
1 2 3 4 5 6 7 8 9 10 11 12 13 14
Test Sequence
Heat from -5°C
& -40°C to 20°C
DRY
WET
DROPLET
Water evaporated
after 45 second
@ -40°C: no purge, water
frozen and no droplet
@ 3°C: no purge
@ -40°C: with purge
@ -5°C (heating from
-40°C): ice melted
Wetn
es
s D
ete
cti
on
Me
asu
rem
en
t
Location Per Pin
TOP-RIGHT 0.45
TOP-LEFT 0.55
TOP1 0.25
LEFT2 0.05
CEN 0.05
BOT-LEFT 0.55