BiTS 2017 Poster Session

March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org

Archive – Poster

March 5 - 8, 2017

Hilton Phoenix / Mesa Hotel

Mesa, Arizona

© 2017 BiTS Workshop – Image: tonda / iStock

BiTS 2017

March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org

Copyright Notice

The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2017 BiTS Workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2017 BiTS Workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2017 BiTS Workshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by BiTS Workshop or the workshop’s sponsors. There is NO copyright protection claimed on the presentation/poster content by BiTS Workshop. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies. The BiTS logo and ‘Burn-in & Test Strategies Workshop’ are trademarks of BiTS Workshop. All rights reserved.

BiTS 2017 Poster Session

Burn-in & Test Strategies Workshop

www.bitsworkshop.org March 5-8, 2017

Air Cooled Thermal Tool for System Level

High Volume Manufacturing Testing

Rahima Mohammed, Ridvan Sahan, Ying-feng Pang,

Amy Xia, Hagai Wertheim

Intel Corporation

Thermal Margining tools are used to:

Air-cooled thermal tools (ACTT) remove the liquid detection, harness management issues, and lab infrastructure needs

Design a new low cost high volume manufacturing (HVM) ACTT

solution for System level testing automation environment for Client

Multi-dies with Central Processing Unit (CPU) and Peripheral

Component Hub (PCH) for 2 in 1’s, laptop etc.

Thermal Design Target : CPU Cold Plate Temp (Tcp ) 40 °C @ 30 W

CPU Tcp 60 °C to 85 °C @ 65 W

Keep Out Zone (KOZ) of the ACTT: Active Heatsink (HS) Keep out volume

(KOV) of 45 mm x 60 mm x 26 mm, Single-staged Thermoelectric cooler

(TEC) and the pedestal Kit

Accelerate Fault Detection Identify Bugs

Test and Validate Silicon Thermal Design Power Extraction

Reduce Escapes Cooling and Margining capability

INTRODUCTION

Goal

Active HS design with 2 central heat pipes (HP) (CFD Model (left), actual

design (right)) 2 Fans

Pushing

2 Fans

Pulling

BiTS 2017 Poster Session

Burn-in & Test Strategies Workshop

www.bitsworkshop.org March 5-8, 2017

BiTS 2017 Air Cooled Thermal Tool for System Level High Volume Manufacturing Testing 2

CPU PCH

Final Design for TDP = 30 W with 1 30x30 mm TEC, 2 of 5 mm heatpipe,

Fan Size: 30 x 30 x 15 mm (Sun Tai 24 V) 2 PUSH 2 PULL (QUAD FAN)

CPU PCH

Temperature

Profile for

65 W TDP

Temperature

Profile for

30 W TDP

17.1 14.9

0

5

10

15

20

25

No Heatpipe Y (2 5mmDiagonal)

Y (2 of 5mmCenter)

Y (2 of 5mmCenter)

Y (2 of 5mmCenter)

Y (2 of 5mmCenter)

ICoolPSC30x30x15(4) Push

Pull

ICoolPSC30x30x15(4) Push

Pull

ICoolPSC30x30x15(4) Push

Pull

IcoolPSC40x40x28

(1)

Sun Tai30x30x15(2) Push

Pull

Sun Tai30x30x15(4) Push

Pull

I II III IV V VI

CPU Tcp (°C) PCH Tcp (°C)

Uniform TDP (W) Tcp (°C)

CPU PCH CPU PCH

58 7 52.9 47.9

Same Finalized Design

HVM Air Cooled Thermal

Tool for 65 W also meets

the requirements

Lowest Temp of CPU (TDP=26.8 W) and PCH (TDP = 3.2 W)

BiTS 2017 Poster Session

Burn-in & Test Strategies Workshop

www.bitsworkshop.org March 5-8, 2017

BiTS 2017 3

New HVM ACTT meets all the design requirements removing the liquid detection, harness management issues and lab infrastructure needs

• Reduces the cost by 80% compared to the existing liquid cooled thermal tools

• Next step is to collect the field testing data at HVM

Air Cooled Thermal Tool for System Level High Volume Manufacturing Testing

74.9 mm Gimbaling Mechanism for HVM Automation Environment

Active HS design

New Pedestal Kit design

Actual Prototypes of HVM Client ACTT Received, Functional Testing and Characterization Complete

Uniform TDP (W) Tcp (°C)

CPU PCH CPU PCH

26.8 3.2 15.4 13.7

58 7 49.3 45.3

Finalized Mechanical Design and Actual Prototype

Performance of HVM ACTT latest design w/ updated cold

plate/pedestal and all TIM layers w/ 30 x 30 x 15 mm fan

w/pedestal

Summary