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March 3 - 6, 2019 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive

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March 3 - 6, 2019

Hilton Phoenix / Mesa Hotel Mesa, Arizona

Archive

COPYRIGHT NOTICEThe presentation(s)/poster(s) in this publication comprise the proceedings of the 2019 TestConX workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2019 TestConX workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2019 TestConXworkshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by TestConX or the workshop’s sponsors.

There is NO copyright protection claimed on the presentation/poster content by TestConX. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies.

“TestConX” and the TestConX logo are trademarks of TestConX. All rights reserved.

www.testconx.org

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Copper Laminate andSkew Mitigation

Megan TetaInsulectro

Mesa, Arizona ● March 3 - 6, 2019

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Overview• Fiber Weave Effect

– What is Skew?

• Copper Roughness and the Effect on Loss

Copper Laminate and Skew Mitigation 2

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

PCB Materials: The Basics

Copper Laminate and Skew Mitigation 3

Heat&

Pressure

• Start with rigid copper clad core.• Circuits are formed in the copper.• The PrePreg is the “glue” to stack these layers (AKA: B-Stage).• Copper foil is used on the outer most layers.• Everything is aligned and then laminated with heat and pressure.

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Reinforced vs Unreinforced Laminates

Copper Laminate and Skew Mitigation 4

• Glass Reinforced

Thick (200 um) - Niche-Excellent performance/reliability-Expensive to manufacture

Thick (200 um) - Common-Excellent performance/reliability-Less expensive to manufacture

Thin (50 um) - Common-Excellent performance/reliability-Less expensive to manufacture

Thin (50 um) – Less Common-Less performance/reliabilityCAF; Pad Cratering; Etch Defects-Same or more expensive to manufacture

• Unreinforced

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Why Glass Fabric?

Copper Laminate and Skew Mitigation 5

106

1080

7628

• In Fabrication• Supports B-Stage (prepreg)• Controls spacing• Cost

• In Use• Strength• Cost

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Skew• Skew is the misalignment of two signal edges of a

differential pair as they arrive at the terminals of the differential receiver.

Copper Laminate and Skew Mitigation 6

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Spread Glass for Differential Pairs

Copper Laminate and Skew Mitigation 7

• Reduces micro Dk effects• Reduces signal skew• Much better for cost and fabrication than rotating board on panel.

Differential Stripline

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Fiber Glass Square Weave

Copper Laminate and Skew Mitigation 88

• About 2.0 mils• Great for fill of

heavy coppers. • Not stable

106

• About 2.5 mils• Good for fill.

• 3.0 to 3.5 mils• Some fill

properties• Good stability

• 7.0 to 8.0 mils• Good for building

thickness.• Very Stable

1080 2113 7628

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Fiber Glass Square Weave

Copper Laminate and Skew Mitigation 99

• About 2.0 mils• Low skew

1067

• About 3.0 mils• Good for drilling

• 3.0 to 3.5 mils• Low Skew

• 7.0 to 8.0 mils• Low Skew

1086 3113 1652

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Example Dk/Df Charts

Copper Laminate and Skew Mitigation 10

Glass Style

% Resin

Thick-ness(inch)

Dk Df

1x106

71.0 .0020 3.81 0.024

1x1080

58.0 .0025 4.04 0.021

1x2113

54.0 .0035 4.11 0.020

2x1080

55.0 .0040 4.1 0.020

1x7628

46.0 .0080 4.28 0.021

Glass Style

% Resin

Thick-ness(inch)

Dk Df

1x1067

66.5 .0020 3.05 0.0017

1x1078

66.0 .0030 3.09 0.0018

1x3313

58.5 .0040 3.07 0.0017

2x1078

60.0 .0050 3.19 0.0021

2x3313

58.5 .0080 3.24 0.0022

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Test PCB Skew Data

Copper Laminate and Skew Mitigation 11

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Signal Integrity and Copper Roughness

Copper Laminate and Skew Mitigation 12

Clad

0

+0

2

4

6

8

0.1 1 10 20 40 80

Skin

Dep

th (u

m)

Frequency (GHz)

Skin Depth

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Types of Copper Foil• Electrodeposited (ED)

– Drumside Treated Foil (DSTF) – Reverse Treat Foil (RTF)– Very Low Profile (VLP)

• Rolled Annealed (RA)

Copper Laminate and Skew Mitigation 13

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Copper Roughness

Copper Type RzStandard 10 micronsRTF 7 micronsVLP 5 micronVLP-2 2 micronRa ~2 micron

Copper Laminate and Skew Mitigation 14

Std 1oz Foil

VLP-2 1oz Foil

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Core Surface treatments

Copper Laminate and Skew Mitigation 15

Oxide 1 Oxide 2

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Loss and Copper Foil Types

Copper Laminate and Skew Mitigation 16

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Copper Roughness and Loss

Copper Laminate and Skew Mitigation 17

4.213.86

1.8

1.09

0.29-8.75

-8.12

-7.88

-7.35-7.25

-9-8.8-8.6-8.4-8.2-8-7.8-7.6-7.4-7.2-7

00.5

11.5

22.5

33.5

44.5

RTF MWG-VSP HS-VSP HS1-VSp NP-VSP

Loss [dB]R

z [u

m]

Copper Foil Types

Material Differences - PCB MaterialsTestConX 2019Session 6B Presentation 3

March 3-6, 2019TestConX Workshop www.testconx.org

Conclusion

• Glass reinforced dielectrics can be used in higher frequency applications if utilizing spread weaves.

• Copper roughness should be considered when considering frequencies >2 GHz.

Copper Laminate and Skew Mitigation 18