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Making business with E-printing

Erik Teunissen BERENSCHOT

The transfer of new technologies to the market consumes more time

and effort than we think off. The main issues to be successful and to

accelerated the business development in this arena will be discussed

concerning the mutual coherence between technologies, ecosystem,

applications and business cases.

Cooperation will help us to:

Accelerate the Time to Market

Reduce costs and increase profit

Increase product and supply chain quality

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SRWC

Abstract

• Technology

• Applications

• Business case

• Ecosystem

• Cooperation

• Examples

• Join the workshops

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SRWC

Agenda

Introduction

• Berenschot

• 75 years

• 350 consultants

• Roots in the industry

• Erik Teunissen

• Sector Manager Industry

• Cluster programs

• Philips Seminconductors

• Detron, Emtec, EM Technologies

• HB Inventure, Berenschot

• Organisation of clusters

− Memphis: Fotonica en Semiconductors

− BIPV: Building Integrated PV

− PV-Integratie

− SRWC: Short Range Wireless Communications

− HTSM Photonics & SMART Photonics

− AMT 3D printen

− Health@Innovations

− Photon Delta

− EU: Direct Spare, EU: Custom Fit, EU: MANSys

Organisation of eco-systems

− High Tech Campus Eindhoven

− BeA2: Mechatronica campus

− Midpoint Brabant

− Innovatiecluster Drachten

− Chemelot

− Amsterdam Innovatie Motor

− Utrecht innovatie

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Berenschot network in High Tech Systems

• Roadmaps:

− PV Solar

− Wireless Communications

− Photonics Devices

− Precisietechnologie

− Technology Investment roadmap HTSM

− 3D printen

− Energie

− Chemie

− Milieu routekaarten

− Aerospace

− BIPV

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Berenschot network in High Tech Systems

Berenschot & 3D Printing

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TechnologyNew technology for E-printing…or …Printing-E?

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Disruptive technologies changing the world!

Many have interaction with E-printing!

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3D Printing Hype cycle: E-printing?

What is Digital Fabrication?

Vision for Digital Fabrication

Within the next 10-20 years, Digital Fabrication will increasingly transform the nature of

global manufacturing, with an increasing influence on many aspects of our everyday

lives. It will evelve towards a global distribution of digital design and specification files

that will form the basis of local production.

Background

Digital Fabrication

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Applications are built up based on several technologies

Applications

E-Printing

Electronics

Mechanics

Embedded software

SRWC

Processing

ICT

More, more,….

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Which technologies are available for 2D Digital Fabrication

Source: Innovation for digital fabrication: roadmap for digital fabrication

Classification Principle Known Process

Inkjet, drop on demand Only drops targeted on the substrate are generated

(drop on demand). Drop formation by transducer.

Piezoelectric jetting, electrostatic

jetting and thermal jetting

Inkjet, continuous jet Drops are generated at high frequency and the

wanted/unwanted drops are deflected and collected

from the drop stream by a control signal from the

printing system.

Binary deflection jetting and

multideflection Jetting

Electrophotography Toner transfer from the photoconductor surface onto

the substrate where it is fused.

Aerosol jettingry toner

electrophotography

and Liquid toner electrophotography

Aerosoljet The material stream is aerodynamically focused using

a flow guidance deposition head, which creates an

annular flow of sheath gas to collimate the aerosol.

Aerosol jetting

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Which technologies are available for 3D Digital Fabrication

Source: Innovation for digital fabrication: roadmap for digital fabrication

Classification Principle Known Process

Power Bed Fusion Uses directed thermal energy such as high-

temperature laser or electron beam to melt and fuse

together metal, thermoplastic or ceramic powder

deposited in a powder bed

Selective Laser Sintering (SLS),

Selective Laser Melting (SLM)

and Electron Beam Melting

(EBM)

Direct Energy Deposition The feedstock material is melted by a directed energy

source, such as a laser or an electron beam, to add

material to a pool of melted material on the substrate’s

surface for cladding and repair

Laser Engineered Net Shaping

(LENS), Direct Material Deposition

(DMD) and Construction Laser

Additive Direct (CLAD)

Material Jetting Using inkjet or other digital methods to deposit droplets

of build material on predetermined positions

PolyJet and Thermojet

Binder Jetting Using inkjet or similar digital printing method to deposit

a binder onto a powder bed

3D Printing (3DP)

Material Extrustion Extrusion of material through a heated,

moving nozzle to deposit it in the desired pattern on

the build tray

Fused Deposition Modelling

(FDM)

Vat photopolymerisation A liquid photo polymer is selectively cured by exposure

to a light source, such as an UV-laser or a lamp with a

photo mask

e.g. StereoLithography

(SL or ”SLA” for the apparatus)

Sheet lamination The applied layers are subsequently cut from sheet

material and bonded together to form the object

Laminated Object

Manufacturing (LOM) and

Ultrasonic Consolidation (UC)

• Process implementation and economics

• Core process technology

• Design systems

• Supporting processes

• Supply chain support

• Education, legal and political agenda

• Improvement of material properties

• Material recyclability

• Biomaterials

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Key technologies challanges and bearriers

Source: Innovation for digital fabrication: roadmap for digital fabrication

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Complex supply chains: impact for E-printing

Components Packaged Subsyseem Equipment Service provider

Assembly

Front-end

Material

Design

Assembly

Electronics

Component

Design

Assembly

Software

Subsystem

Design

Services

Center

Equipment

Design

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Complex supply chains: impact for E-printing

Components Packaged Subsyseem Equipment Service provider

Assembly

Front-end

Material

Design

Assembly

Electronics

Component

Design

Assembly

Software

Subsystem

Design

Services

Center

Equipment

Design

He

tero

ge

ne

ous

inte

gra

tio

n

Heterogeneous integration

Hybrid integration

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ApplicationsDrivers for new business

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Application area’s

Source: Organic end Printed Electronics Associotion

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Applications for end-markets

Applications

Health care

Energie

HTSM

Water

Agriculture

Logistics

ICT

Horticulture

• Digital Graphical Printing

• Digital textiles

• Functional end-use parts and products

• Additively manufactured objects with

embedded intelligence

• OLED lighting and displays

• Electrochromic Printed Electronics

prototypes

• Printed Sensors

• Personalised Diagnostics & Drug

Delivery

• Medical Microfactories

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Application area’s

Source: Diginova Innovation for Digital Fabrication, Roadmap for Digital Fabrication

From ink to new printable materials:

from 2D through 2½D to 3D (and back)

3D Printing / Additive Manufacturing Eletronics (PCB’s), OLED, Solar, Displays

Application area comparison 3D and E-printing

High Product

Complexity

High Mix

Product variety

Low

Product volume

Low Product

Complexity

Low - High Mix

Product variety

Low - high

Product volume

3D printing E-printing

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To the market: Business caseUsing the Canvas model

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Market size

Introduction: Business Model Canvas

• Source: Alexander Osterwalder

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Example: IPC 3D-printing

Example: IPC 3D-printing

Example: IPC 3D-printing

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EcosystemThe cluster innovation circle

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Berenschot Cluster Innovation circle

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CooperationThe advantages of cooperation

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Advantages cooperation

• Acceleration of innovation (time-to-market)

• Lower cost by use of expertise of consortium partners

• Access to new knowledge

• Additional competences

• Risc sharing (financial and technological)

• Efficiency advantages

• Access to new market segments

• Supply chain innovation (using scm’s of partners)

• Talent sharing Results:

• Cost reduction (1/2)

• Lead time reduction (1/2)

• Quality improvement (2)

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ExamplesTrack record Berenschot

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Erik Teunissen

Bart Verbeek

Hans van der Vlekkert

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Berenschot and the IoE: Create an ecosystem in NL

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The SRWC-program

• Free publicity on www.srwc.nl

• Cost price reduction on consultancy

• Five years submission for 2500 euro

1x /week:

Subject of

interest

1x /month:

News letter

1x /quarter:

Knowledge

meeting

1x half year:

EBR-session

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Workshops

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Health care

March 2015

Berenschot Utrecht

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Workshops! Holst InstituteBrabantse Ontwikkelings MaatschappijBerenschot

Smart Packaging

March 2015

Berenschot Utrecht

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‘Berenschot E-boardroom’

Computer support in the sessions

• Anonymous

• Fast: +30% more output

• Structured

• Vote, combine, etc.

• Direct output

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Group impressions

Irma van Roest

i.vanroest@berenschot.nl

M: 06 239 16 751

Amir Sabirovic

a.sabirovic@berenschot.nl

M: 06 450 76 374

Erik Teunissen

e.teunissen@berenschot.nl

M: 06 535 14 901

srwc@berenschot.com

www.srwc.nl

Meet us at the booth

8 Do you have questions?