m40 & m46 - 千住金属工業株式会社 · sac305 3000cyc.ssac305 3000cyc.ac305 3000cyc....
TRANSCRIPT
Sh-Semi12-05E
Sh-Semi12-05E
Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp
□ Quality equivalent to that of the M705 series, ensuring high quality with low silver content
□ Approx. 30% reduction in production tact time achieved by the SP series
Production efficiency is increased by shorteningthe reflow time.
M40 & M46
M40 & M46 SP series that enables maximum cost reduction
Achieves high quality with low silver contentAchieves quality characteristics equivalent to those of the M705 series by using lower amounts of precious metals, which are rising in price
Does not require profile changesRealizes packaging under the same conditions as those of the M705 series by lowering the melting point, significantly reducing production costs
Enables high-speed printingRealizes solder paste that withstands high-speed printing through the application of ourexpertise in rheology, making a large contribution to the improvement of production efficiency
Enables short time reflow solderingRealizes short reflow time through our outstanding organic synthesis technology, contributing to a significant improvement of production efficiency
Stable production yieldAchieves high quality through our long-accumulated comprehensive technical capabilities, ensuring a constant high production yield
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M40 & M46 SP series that enables maximum cost reductionM40 & M46 SP series that enables maximum cost reduction
Achieves high quality with low silver contentAchieves quality characteristics equivalent to those of the M705 series by using loweramounts of precious metals, which are rising in price
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Features
□Quality equivalent to that of the M705 series, ensuring high quality with low silver content
y qy q
Stable production yieldAchieves high quality through our long-accumulated comprehensive technical capabilities, ensuring a constant high productionyield
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Specifications
External stress
External stress
M40&M46
90
80
70
60
50
40
30
20
10
00 100 200 300 400 500 600 700 800 900
1Ag M401Ag M401Ag M40
0.3Ag M460.3Ag M460.3Ag M46
3Ag M7053Ag M7053Ag M705
0.3Ag SAC03050.3Ag SAC03050.3Ag SAC0305
Temperature cycle condition: -40 - + 85°C Hold time: 30 minSubstrate surface treatment: Cu + OSP Mounted component: 3216 chip resistor
Temperature cycle (cyc)
Shear strength (N)
Comparison of thermal fatigue resistance of each alloy
□ Achieves high quality through solid solution strengthening
Compensation is made for strength degradation due to decreased Ag by the effect of solid solution strengthening from the addition of Bi and In.
Pure metal (Sn)Defect
Dislocation, deformation
Solid solution strengthening
Suppresses deformationby incorporating foreign atoms
Transfer condition after high speed printing (150 mm/s)
Ensure high quality,even with a short reflow time
Approx. 45% reduction
Conventional product(Print failure is observed in some dots)
SP series(No print failure is observed)
0.4 mm Pitch BGA Opening 200 um/Mask thickness 100 um
Fine powder Printing condition at 150 mm/s
0.4 mm Pitch BGA Opening 200 um/Mask thickness 100 um
High level rheology technology and fine sphericalpowder has enabled high speed printing.
□ The SP series solder paste capable of high speed printing
□ The SP series solder paste capable of short-time reflow solderingRealizes short reflow time through our outstanding
organic synthesis technology
Conventional Pb-free solderProfile for the SP series
Temperature
Time
Chip component Shield case
Ensures sufficient solderability
Ensures sufficient joint performance
Formation of an interface alloy layerProduction tact time (sec)
0 50 100 150 200 250 300 350 400 450
Currentproduct
M40-SPseries
Printing
Mount Reflow
Mount Reflow
Printing tact timeMounting tact time Reflow tact time
Approx. 30%reduction
Sh-Semi12-06E
Sh-Semi12-06E
Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp
□ PoP Packaging using NSV300
NSV300
Transfer paste for 3D PoP (Package of Package)packaging M705- NSV300
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Possesses excellent transferability and significantly reduces contact non-wet failures in ball-to-ball stackingAccommodates PoP and TMV packaging and realizes excellent solderabilityRobust against warping, achieves higher performance than that of conventional products while being halogen-free
Transfer paste for 3D PoP (Package of Package)Transfer paste for 3D PoP (Package of Package)packaging M705- NSV300packaging M705 NSV300
● Possesses excellent transferability and significantly reduces
Features
● Robust against warping, achieves higher performance than that of conventional products while being halogen-free
Specifications
Solves contact non-wet failures in ball-to-ball stacking
□ NSV300 provides excellent solder transfer in specific amounts
□ Realizes 0% contact non-wet failure rate through the intervention of NSV300
Solder paste
Flux
Heating
Heating
Joint with flux intervention Contact non-wet failure rate = 2%
Joint with NSV intervention Contact non-wet failure rate = 0%
Transfer1 Transfer2 Transfer3
Transfer1 Transfer2 Transfer3 Mount JointPrint
Mount JointPrint
Insufficient solder amount
Conventionalproduct
Contact non-wetfailures are observed
NSV300Contact non-wet
failures are ignificantly reduced
NSV300intervention
Fluxintervention
Solder printing paste lacking transferability
NSV300 with excellent transferability
Sufficient solder amount
Contact non-wet pastContact non-wet pastContact non-wet past
Sh-Semi12-07E
Sh-Semi12-07E
Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp
□ Automatically mounts chip solder, which melts simultaneously with solder paste
□ For reinforcement of reflow solder joints of through-hole components
□ For joint reinforcement of large components
Air enters when the suction ace is curved,weakening the suction force.
No air enters when the suctionface is flat and the suction face is strong.
Printing Joint with an insufficientamount of solder
Chip solder
"Chip solder" for lands where a lack of solder is anticipatedChip solder for lands where a lack of solder is anticipated"Chip solder" for lands where a lack of solder is anticipated
Features
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They come in tape and reel packaging which allows simultaneous automatic placement on surface mount devices.Melts in tandem with solder paste, requiring no additional solderingProvides an appropriate amount of solder to ensure high connection reliability
□ Automatically mounts chip solder, which melts simultaneously with solder paste
y py □ For joint reinforcement of large components
● Provides an appropriate amount of solder to ensure high connection reliability
Specifications
y
Solder pasteprinting
Componentmounting
Reflow Chip solder
Chip soldermounting
Solder pasteprinting
Componentmounting
Reflow
Componentmounting
Land Solder paste
Solder pasteprinting
LargeLargecomponentcomponentLarge
component
Chip solder
Solderingcomplete
Solder is supplemented with chip solder Solder is supplemented with chip solder
□ For joint reinforcement of shield cases
l
±0.05
±0.05
±0.1
±0.1
±0.1
0402
05025
0603
1005
1608
±0.05
±0.05
±0.1
±0.1
±0.1
w
±0.05
±0.05
±0.05
±0.05
±0.05
t
□ Improves mounting precision by smoothing the suction face
Chip solder
Air Air
Chip solder witha smoothsuction face
Smoothing of thesuction face
Improvement ofmounting precision
* Smooth suction face design is available in sizes smaller than the 0603-size type* Patent pending
□ Chip solder dimension tolerance(unit: mm)
Conventional methodJoint with an insufficientamount of solder
Solder
Shield case
Solderpaste
Printing + mounting Joint with a sufficientamount of solder
SolderChipsolder
Shield caseJoint with a sufficientamount of solder
Conventional method
Solder paste Inserted component
Printing ReflowPrinting Joint with an insufficient amount of solder
Joint with aninsufficient amount
of solder
Chip solder Solder paste Inserted component
Printing + mountingSolder paste
Printing + mounting Reflow Joint with a sufficientamount of solder
Joint with a sufficientamount of solder
Reflow
Reflow
Solderpaste
The 0402 size type is available for those devices where minimal solder connection is expected.
Sh-Semi12-01E
Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp
Sh-Semi12-01E
M53
□ Ensures strength even on a small surface
Surface area (mm2)
□ Comparison of thermal fatigue resistance using a chip capacitorShear strength (N)
□ Comparison of cross sectional photographs
3000cyc
Chip
ChipChip
3000cyc
Chip
□ Comparison of thermal fatigue resistance using a chip resistor Using a 3216 chip resistor and a large-sized pattern Using a 3216 chip resistor and a medium-sized pattern
Using a 3216 chip resistor and small-, medium- and large-sized patterns
M53 series solder paste that is capable of being applied tosmall-sized and lightweight on-board products
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Features
Exhibits superior thermal fatigue resistance and maintains high bond strength even under severe environmentsPrevents crack propagation due to thermal fatigue and maintains electrical conductivity after long term useEnsures high quality even in products with small-sized and lightweight designs having small land areas
Shear strength (N)
□ Comparison of thermal fatigue resistance using a chip capacitor□ Comparison of thermal fatigue resistance using a chip resistorUsing a 3216 chip resistor and a large-sized pattern Using a 3216 chip resistor and a medium-sized pattern
● Ensures high quality even in products with small-sized and lightweight designs having small land areas
Specifications
Larger structurecompared to that of
SAC305
Shear strength (N)
Temperature cycle (cyc.)M53 containing Bi and In exhibits a much lower decrease in
strength compared to SAC305
90
80
70
60
50
40
30
20
10
0
M53M53M53
TCT;-40/+124℃(30min)
450040003500300025002000150010005000
SAC305SAC305SAC305
Temperature cycle (cyc.)M53 containing Bi and In maintains superior shear strength
compared to SAC305
TCT;-40/+124℃(30min)
3500300025002000150010005000
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0
M53M53M53
SAC305SAC305SAC305
1
L M S
TCT;-40/+125℃(30min)15225335
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
M53 InM53 InM53 In
M53 3000cyc.M53 3000cyc.M53 3000cyc.
SAC305 3000cyc.SAC305 3000cyc.
SAC305 InSAC305 InSAC305 In
SAC305 3000cyc.SAC305 3000cyc.SAC305 3000cyc.
SAC305 M53
Initial stage
Temperaturecycle
Crack has grownduring soldering
Solder alloy with greater strength and stress relaxation properties
Temperaturecycle
No cracks
Initialstage
Sh-Semi12-04E
Sh-Semi12-04E
Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp
□ Cracks on flux become the cause of migration
Ion migration
Crack
Water passage in cracksor breakage
Migration
Migration
Short circuit dueto migration
Water passage is formedin cracks or breakage
Water
Voltageapplication
Dewcondensation
Flux residueTemperature
cycle
Cracks or breaking occur
Occurrence of cracksor breakage
Solder
Soldering
Features
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● No cracking of flux residue occurs even under environment with rapid temperature changes, such as in on-board equipment.Flux residue with high adhesiveness and water repellency prevents the occurrence of migration.Excellent for laser soldering, prevents flux spattering peculiar to laser soldering
MACROS
"MACROS" that prevents migration
□ Cracks on flux become the cause of migration
Water passage in cracksFl id
● Excellent for laser soldering, prevents flux spattering peculiar to laser soldering
Specifications
Flux scattering is preventedby viscosity suppression.
Ion migrationIon migrationIon migration
CrackCrackCrackFlux residueFlux residueFlux residue
When condensed water remains,ion migration easily occurs.
1.00E+04
1.00E+06
1.00E+08
1.00E+10
1.00E+12
1.00E+14
0 2 4 6 8 10
MACROS
[Test condition]
Temperature: 121°C
Humidity: 100% RH
Atmospheric pressure: 2 atm
Applied voltage: 50 V
Measuring voltage: 100 V
Measurement time: every 0.5 h
Applied voltage mode: DC
MACROS
□ Comparison of flux scatteringin laser soldering
Insu
latio
n re
sist
ance
[Ω]
Time [h]
□ Provides good break-off, ensuring good drag soldering
MACROS
Conventional product
Substrate only (Blank)
Conventional product
Conventional product
Migration does not occur becausewater does not penetrate easily.
Migration occurs in a short periodof time because water penetrates easily.
MACROS MACROS
□ SMIC has developed MACROS, which prevents the occurrence of cracks in flux residue during temperature cycle tests.
JIS Grade A product
Temperature cycle test ; -30℃/110℃ 2000cyc.
No cracks
Cracks
Water drop test 5 V of voltage applied
JIS Grade A product
□ Ion migration did not occur during a water drop test with when using MACROS.
Ion migration occurs at cracks. No cracks or ion migration occur