lx ehs6-sm interface specification v1.2lx_ehs6-sm interface specification lx_ehs6-sm_interface...

LX_EHS6-SM

Version: 1.2 DocID: LX_EHS6-SM_Interface Specification_v1.2

Interface Specification

LX_EHS6-SM Interface Specification

LX_EHS6-SM_Interface Specification_v1.2 2 2016-03-09 Confidential/Released

Document Name LX_EHS6-SM Product Specification Description

Version 1.2

Date 2016/03/09

DocID LX_EHS6-SM_Interface Specification_v1.2

Status Confidential/Released

GENERAL NOTICE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH THE PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ABOUT INNOCOMM PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT INNOCOMM'S DISCRETION. INNOCOMM MOBILE TECHNOLOGY GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE CONFIDENTIALLITY REGARDING ANY INFORMATION AND DATA PROVIDED TO THEM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO TAIWAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright © 2014, InnoComm Mobile Technology Corp. Trademark Notice Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.



Revision History

Revision Released Date Comments/Remark Author

1.0 2014/9/9 Initial release Ken Wu

1.1 2015/11/23 Remove wake up function from mini-PCIe Ken Wu

1.2 2016/3/9 Update 2.1 Key Features table Ken Wu



Contents

1. INTRODUCTION ......................................................................................... 7

1.1. SUPPORTED PRODUCTS........................................................................... 7

1.2. TERMS AND ABBREVIATIONS..................................................................... 7

1.3. PRODUCT DESCRIPTION ........................................................................... 9

2. PRODUCT OVERVIEW ............................................................................ 10

2.1. KEY FEATURES ..................................................................................... 10

2.2. BLOCK DIAGRAM ................................................................................... 12

3. HARDWARE INTERFACE ....................................................................... 13

3.1. PIN DEFINITION ..................................................................................... 13

3.2. LED_WWAN# INTERFACE .................................................................... 15

3.3. PCM INTERFACE ................................................................................... 16

3.4. UICC/SIM(MICRO SIM)/USIM INTERFACE ............................................. 17

3.5. ANTENNA INTERFACE ............................................................................. 18

4. MECHANICAL DRAWING ....................................................................... 20

4.1. DIMENSION ........................................................................................... 20

4.2. SYSTEM CONNECTOR ............................................................................ 21

4.3. ANTENNA CONNECTOR .......................................................................... 21

5. SOFTWARE PORTING ............................................................................ 23

5.1. USB DEVICE EMULATION ....................................................................... 23

5.2. CONNECTION MANAGER UNDER WINDOWS.............................................. 23

5.3. PORTING UNDER LINUX OS .................................................................... 24

5.4. CONNECT TO INTERNET VIA PPP ............................................................ 24

VI. TEST YOUR INTERNET CONNECTION, FOR EXAMPLE USING PING. ................. 25



Tables

Table 1 Product Specification ................................................................................ 9

Table 2 Pin Definition .......................................................................................... 13

Table 3 Recommend index of Antenna Performance .......................................... 18



Figures

Figure 1 Block Diagram ....................................................................................... 12

Figure 2 LED_WWAN# interface ......................................................................... 15

Figure 3 SIM ESD Interface ................................................................................. 17

Figure 4 Antenna Interface Connector ................................................................. 18

Figure 5 Module Dimension ................................................................................. 20

Figure 6 System Connector Dimension ............................................................... 21

Figure 7 Antenna Connector Dimension .............................................................. 21

Figure 8 Antenna Mating Connector Dimension .................................................. 22

Figure 9 Connection Manager Snapshot ............................................................. 23



1. Introduction

The new generation of Lena_X (LX_) series cards are designed for M2M applications in partnership with Gemalto M2M, the worldwide leading supplier of Cinterion wireless modules for the cellular machine-to-machine (M2M) communication market. This series of devices are based on the miniPCI Express Mini Card standard with a USB 2.0 interface. With a variety of advanced air interfaces supported, Lena series enables any mobile computing device to become an outstanding communication tool LX_EHS6-SM is a powerful mini PCIe card integrating the embedded Cinterion EHS6 LGA module This document describes the hardware, mechanical and software elements of the LX_EHS6-SM card. It helps you quickly retrieve interface specifications; electrical, mechanical and software details and information on the requirements to be considered for integrating further components into the sub-system.

1.1. Supported Products

This document applies to the following InnoComm miniPICE products: • LX_EHS6-SM module

1.2. Terms and Abbreviations

Abbreviation Description

CS Coding Scheme

CS Circuit Switched

CSD Circuit Switched Data

DL Download

EDGE Enhanced Data rates for GSM Evolution

EGSM Extended GSM

EMC Electromagnetic Compatibility

ESD Electrostatic Discharge

ETS European Telecommunication Standard

ETSI European Telecommunications Standards Institute

FDD Frequency Division Duplex

GPRS General Packet Radio Service

GSM Global Standard for Mobile Communications

HSPA High Speed Packet Access



Abbreviation Description

HSDPA High Speed Downlink Packet Access

I/O Input/Output

IMEI International Mobile Equipment Identity

kbps kbits per second

LTE Long term evolution

Mbps Mbits per second

MCS Modulation and Coding Scheme

MIMO Multiple Input Multiple Output

MO Mobile Originated

MS Mobile Station, also referred to as TE

MT Mobile Terminated

PBCCH Packet Switched Broadcast Control Channel

PCL Power Control Level

PCS Personal Communication System, also referred to as GSM 1900

PDU Protocol Data Unit

PS Packet Switched

PSK Phase Shift Keying

QAM Quadrature Amplitude Modulation

R&TTE Radio and Telecommunication Terminal Equipment

RF Radio Frequency

SIM Subscriber Identification Module

SMS Short Message Service

TE Terminal Equipment

TS TS Technical Specification



1.3. Product Description

Table 1 Product Specification

miniPCI Express Data Card

Product Name LX_EHS6-SM

Air Interface HSPA

Data Speed DL: 7.2 Mbps UL: 5.76 Mbps

GSM/GPRS/EDGE 850/900/1800/1900 GPRS/EDGE Class12

HSPA+/UMTS 800/850/900/1900/2100

Antenna Connector 50 Ohms U.FL connector

Audio (option) PCM

Operation Temperature -30 to +85 (board temperature)℃ ℃

Power supply 3.0 ~ 3.6V (Typ. 3.3V)

Dimension 51.0 mm (L) × 30.0 mm (W) × 4.75 mm (H)

Control options AT command

OS compatibility Windows®8, Windows®7, Windows EC, Linux, Android



2. Product Overview

2.1. Key Features

Feature Implementation

General

Form Factor Conforms to PCI Express Mini Card Electromechanical Specification. Dimension : 51.0 mm (L) × 30.0 mm (W) × 4.75 mm (H)

Frequency bands GSM/GPRS/EDGE: Quad band 850/900/1800/1900MHz UMTS/HSPA+: Five band 800/850/900/1900/2100MHz

GSM class Small MS

Output power

Class 4 (+33dBm ±2dB) for EGSM850 Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900 Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Class 3 (+24dBm +1/-3dB) for UMTS 800, WCDMA FDD BdVI

Power supply 3.0V ~ 3.6V

Operating temperature (board temperature)

Normal operation: -30°C to +85°C

RoHS All hardware components fully compliant with EU RoHS Directive

HSPA features

3GPP Release 6, 7

EV-DO Rev.A data rates: FL max. 3.1Mbps, RL max. 1.8Mbps 1xRTT Advanced data rates: FL max. 307.2kbps, RL max. 307.2kbps

UMTS features

3GPP Release 4

DL 7.2Mbps, UL 5.7Mbps HSDPA .8 / HSUPA Cat.6 data rates Compressed mode (CM) supported according to 3GPP TS25.212



Feature Implementation

GSM / GPRS / EGPRS features

Data transfer

GPRS: • Multislot Class 12 • Full PBCCH support • Mobile Station Class B • Coding Scheme 1 – 4 EGPRS: • Multislot Class 12 • EDGE E2 power class for 8 PSK • Downlink coding schemes – CS 1-4, MCS 1-9 • Uplink coding schemes – CS 1-4, MCS 1-9 • SRB loopback and test mode B • 8-bit, 11-bit RACH • PBCCH support • 1 phase/2 phase access procedures • Link adaptation and IR • NACC, extended UL TBF • Mobile Station Class B CSD: • V.110, RLP, non-transparent • 9.6kbps • USSD

SMS

Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment

Software

OS Support Windows®8, Windows®7, Windows EC, Linux, Android

AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M AT commands for RIL compatibility

Firmware update Generic update from host application over ASC0 or USB

Interfaces

Module interface

Antenna 50Ohms.

UICC interface Supported chip cards: UICC/SIM/USIM 3V, 1.8V

Power on/off, Reset

Power on/off Switch-on by hardware signal AUTO_ON and ON Switch-off by AT command Switch off by hardware signal FST_SHDN instead of AT command



Feature Implementation Automatic switch-off in case of critical temperature and voltage conditions

Reset Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST

2.2. Block Diagram

Figure 1 Block Diagram



3. Hardware Interface

3.1. Pin Definition

Table 2 Pin Definition

Pin No. Signal Function description Direction from Module Voltage

1 NC Not Connected NC NC

2 +3.3V_aux Power Supply Input 3.3 ± 0.3V


4 GND Ground Ground 0




8 UIM_PWR SIM power supply Output 1.8 / 2.85V


10 UIM_DATA SIM Data Input / Output 1.8 / 2.85V


12 UIM_CLK SIM Clock Output 1.8 / 2.85V


14 UIM_RESET SIM Reset Output 1.8 / 2.85V








22 PERST# 1.Active low (>10ms) to reset Module 2.Active high to restart Module

Input 1.V(high)>2.0V 2.V(low)<0.7V





Pin No. Signal Function description Direction from Module Voltage












36 USB_D- USB_D- High Speed Input / Output 3.3 ± 0.3V


38 USB_D+ USB_D+ High Speed Input / Output 3.3 ± 0.3V




42 LED_WWAN# Active low to show device registered to home network. Output

Refer to recommended circuit



45 PCM_CLK Digital audio interface (Clock) Output 1.8V


47 PCM_OUT Digital audio interface (Tx) Output 1.8V


49 PCM_IN Digital audio interface (Rx) Input 1.8V


51 PCM_SYNC Digital audio interface (SYNC) Output 1.8V




3.2. LED_WWAN# interface

The mini PCIe provides a status indication line over the 52-pin application connector specified in pin define list. The line can be configured to drive a status LED which indicates different operating modes of the module. To take advantage of this function an LED may be connected to the LED_WWAN# as shown below recommended circuit.

Figure 2 LED_WWAN# interface

The LED indicates the operating states which can be controlled by AT command. AT^SLED controls the LED function provided by the STATUS pin, which acts as an output and can be used to control a connected LED. The LED indicates the operating states listed below: AT^SLED=<mode>[, <flash>] <mode>=1 <mode>=2

<flash>= default <mode>=2

<flash>= user defined

Voice Permanently on 10 ms on 990 ms off

<flash> ms on 990 ms off

Data transfer Permanently on 10 ms on 1990 ms off

<flash> ms on 1990 ms off

UE registered to a network. No call, no data transfer Permanently on 10 ms on

3990 ms off <flash> ms on 3990 ms off

Not registered, searching for network

500ms on 500 ms off

500ms on 500 ms off

500ms on 500 ms off



3.3. PCM Interface

The PCM functionality allows for the use of an external codec like the W681360. The PCM interface supports a 256kHz, long frame synchronization master mode with the following features:

• 16 Bit linear • 8kHz sample rate • The most significant bit MSB is transferred first • 125μs frame duration • Common frame sync signal for transmit and receive

Below table lists the available PCM interface signals.

Signal name Input / Output Description

PCM_OUT O PCM Data from EHS6 to external codec

PCM_IN I PCM Data from external codec to EHS6

PCM_SYNC O Frame synchronization signal to external codec: Long frame @ 256kHz

PCM_CLK O Bit clock to external codec: 256kHz

Below figure shows the PCM timing for the master mode available with EHS6



3.4. UICC/SIM(Micro SIM)/USIM Interface

LX_EHS6-SM has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder.

1. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.

2. The total cable length between the SIM pads on Lena and the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.

3. To avoid possible cross-talk from the UIM_CLK signal to the UIM_DATA signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the UIM_DATA line from the UIM_CLK line.

4. According to the 3GPP specification TS 51.010-1 V70 (2006-01), section 27.17.2 Electrical Tests on each ME contact, the load capacitance on the SIM_CLK, SIM_DATA, SIM_RST no larger than 30pF.

5. To reduce the noise from the host board, add decoupling capacitor on SIM_VCC and close to the

SIM card holder, also need to check the equivalent capacitance of ESD component exceeds 30pF limit.

6. To optimize ESD protection for the SIM interface it is possible to add ESD diodes to the SIM

interface lines as shown in the below example. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: ± 4kV, air discharge: ± 8kV.

Figure 3 SIM ESD Interface



3.5. Antenna Interface

The LX_EHS6-SM has a U.FL-R-SMT antenna connector interface. This antenna interface has an impedance of 50 ohm The external antenna must be matched properly to achieve the best performance regarding radiated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the LX_EHS6-SM and should be placed in the host application side if the antenna does not have an impendence of 50 ohm. Recommended antenna performance in the active band is detailed below.

Table 3 Recommend index of Antenna Performance Impedance 50 ohm

VSWR < 2.5

Peak gain > 0 dBi

Antenna efficiency > 50%

Polarization Linear polarization

Pattern Omni-directional

The position of antenna interface connector is shown in the Figure below.

Figure 4 Antenna Interface Connector

Antenna location may affect RF performance, Although the module is shielded to prevent interference in most applications. The placement of the antenna is still very important if the host device is not shielded sufficiently. High levels of broadband or spurious noise can degrade the module’s performance. Antenna cables should be routed, if possible away from noise sources (LCD, CPU, Audio circuit, switching power supply, parallel bus, etc.) If the cables are near the noise sources, the noise may be coupled into the RF cable and the module. The antenna should be located as far as possible from the interference sources and other wireless antenna. Recommend isolation between two antennas is 25dB’s Increase separation distance or polarity separation on diversity antenna for gaining 10db minimum isolation, otherwise, the diversity antenna picks up too much power radiated from the main antenna. To determine a suitable location for antenna on the host device, consider the following:

1. Any harmonics, sub-harmonics, or cross products of signals generated by wireless devices that fall in the module’s Rx frequency range, resulting in decreased Rx sensitivity.

Antenna



2. The Tx power and corresponding broadband noise of other wireless devices may increase the noise floor of the module’s receiver, resulting in Rx de-sense.

3. Shield the interference sources on the host device. It’s necessary to employ shielding on the components of the host device, such as the main processor and parallel bus that have the highest RF emissions.

4. Filter out unwanted high-order harmonics by using discrete filtering on low frequency lines.

5. Avoid any metallic components near the antenna area to prevent antenna frequency offset and antenna performance degradation

6. Build shielding layers around high-speed clock traces by using multi-layer PCB.



4. Mechanical Drawing

4.1. Dimension

51mm (length) x 30 mm (width) x 4.75 mm (height).

Figure 5 Module Dimension



4.2. System Connector

LX_EHS6-SM follows the PCI Express Mini Card PCB design layout and provides a 52-pin edge type connector. Figure 4 shows the reference PCI Express Mini Card System Connector dimensions.

Figure 6 System Connector Dimension

4.3. Antenna Connector

Lena_M provides a U.FL RF Connector for connecting to an external antenna. The KAE antenna connector, MHC-230B, dimension is shown in Figure 5.

Figure 7 Antenna Connector Dimension



The recommended antenna mating connector type shown as follows (take KAE MHC-231B as example). Other antenna mating connector for U.FL RF connector, like Hirose could also be used.

Figure 8 Antenna Mating Connector Dimension



5. Software Porting

To effectively speed up the development cycle, InnoComm will provide a application package include the Connection Manager and USB Device Driver for Microsoft® Windows XP™, Microsoft®

Windows Vista® and Microsoft® Windows 7 and Microsoft® Windows 8 as reference. However, to use generic USB host drivers on hosts running under other operating systems, specific porting needs to be taken into account depending on the operating system. This chapter is to provide a general guideline for the porting, which mainly cover - USB device emulation - Driver porting on non-window hosts - PPP connection examples

5.1. USB Device Emulation

LX_EHS6-SM enumerates, i.e., registers with the USB host, as a CDC-ACM Composite USB device supporting eight separate interfaces. This USB device implements a Modem port (a virtual USB Modem port) plus six further communication ports as well as a reserved port. The Modem port as well as the ports enumerated as port 3 to 5 are AT command interfaces, i.e., these ports are accessible by AT command and may be used as control and data interfaces.

5.2. Connection Manager under Windows

InnoComm will provide a application package include the Connection Manager and USB Device Driver for Microsoft® Windows XP™, Microsoft® Windows Vista® and Microsoft® Windows 7 and Microsoft® Windows 8 as reference. Figure below please find the snapshot of connection manager home screen.

Figure 9 Connection Manager Snapshot



5.3. Porting under Linux OS

Some Linux systems will automatically detect and enumerate the USB device: If LX_EHS6-SM is powered on, following ports will be created

/dev/ttyACM0 --> Modem port /dev/ttyACM1 --> USB port /dev/ttyACM2 --> USB port /dev/ttyACM3 --> USB port /dev/ttyACM4 --> USB port /dev/ttyACM5 --> USB port /dev/ttyACM6 --> USB port

With other Linux systems the USB device may not automatically be detected and enumerated. For these systems a possible USB host driver “cdc_acm“ compiled as loadable module may be loaded to create the ports. Please note that the command to load such a driver module may vary for different Linux distributions.

5.4. Connect to internet via PPP

Below are the steps to setup the connection via dial tool “vwdial”.

I. Prepare file Create configure file at same folder

File name: innocomm.conf File content [Dialer Defaults] Phone = *99# Username = None Password = None Stupid Mode=1 Dial Command = ATDT Modem Type=Analog Modem [Dialer innocomm] Modem=/dev/ttyACM0 Baud=921600 Init1=ATZ Init2=ATQ0 &F &D2 &C1 S0=0 Init3=AT+CGDCONT=1,"IP","internet" ISDN=0 In the line of “Init3”, the “internet” shall be indicated as APN.



II. Install appcation “vwdial” sudo apt-get install vwdial

III. Modify Configuration File for Modem Port

- Modem=/dev/ttyACM0

IV. Dial and Connect sudo wvdial -C innocomm.conf innocomm

V. Disconnect sudo killall wvdial

VI. Test your internet connection, for example using Ping.

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