lt a6sg - osram€¦ · lt a6sg 1 version 1.4 | 2019-07-16 discontinued produktdatenblatt | version...
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LT A6SG
1 Version 1.4 | 2019-07-16
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dProduktdatenblatt | Version 1.1 www.osram-os.com
Applications
LT A6SG
SIDELED®
— Cluster, Button Backlighting
— Electronic Equipment
— Interior Illumination (e.g. Ambient Map)
Features: — Package: white SMT package, colorless clear silicone resin
— Chip technology: ThinGaN
— Typ. Radiation: 120° (Lambertian emitter)
— Color: λdom = 528 nm (● true green)
— Corrosion Robustness Class: 1B
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
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Ordering Information
Type Luminous Intensity 1) Ordering CodeIF = 20 mAIv
LT A6SG-V1AB-36 710 ... 1800 mcd Q65110A6030
LT A6SG-V2AB-35 900 ... 1800 mcd Q65110A7884
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Maximum RatingsParameter Symbol Values
Operating Temperature Top min. max.
-40 °C110 °C
Storage Temperature Tstg min. max.
-40 °C110 °C
Junction Temperature Tj max. 125 °C
Forward current TS = 25 °C
IF min. max.
5 mA50 mA
Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IFS max. 300 mA
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD 2 kV
Reverse current 2) IR max. 20 mA
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CharacteristicsIF = 20 mA; TS = 25 °C
Parameter Symbol Values
Peak Wavelength λpeak typ. 523 nm
Dominant Wavelength 3) IF = 20 mA
λdom min. typ. max.
519 nm528 nm543 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 33 nm
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) IF = 20 mA
VF min. typ. max.
2.80 V3.20 V3.70 V
Reverse voltage (ESD device) VR ESD min. 12 V
Reverse voltage 2) IR = 20 mA
VR max. 2.3 V
Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C
TCλpeak typ. 0.04 nm / K
Temperature Coefficient of Dominant Wavelength -10°C ≤ T ≤ 100°C
TCλdom typ. 0.03 nm / K
Real thermal resistance junction/ambient 5)6) RthJA real max. 380 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 220 K / W
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Brightness Groups
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 20 mA IF = 20 mA IF = 20 mAmin. max. typ.Iv Iv ΦV
V1 710 mcd 900 mcd 2420 mlm
V2 900 mcd 1120 mcd 3030 mlm
AA 1120 mcd 1400 mcd 3780 mlm
AB 1400 mcd 1800 mcd 4800 mlm
Wavelength Groups
Group Dominant Wavelength 3) Dominant Wavelength 3)
IF = 20 mA IF = 20 mAmin. max.λdom λdom
3 519 nm 525 nm
4 525 nm 531 nm
5 531 nm 537 nm
6 537 nm 543 nm
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Group Name on Label Example: AA-3Brightness Wavelength
AA 3
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Relative Spectral Emission 7)
Irel = f (λ); IF = 20 mA; TS = 25 °C
0400
true green
550450 500 600 650 nmλ
700
OHL00192
I
20
40
60
80
%
100
rel
blue
λV
Radiation Characteristics 7)
Irel = f (ϕ); TS = 25 °C
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚ OHL01660
50˚
60˚
70˚
80˚
90˚
100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
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Forward current 7), 8)
IF = f(VF); TS = 25 °C
2.5
110
102
5
OHL02359
100
3 3.5 4 4.5 V 5
5
mA
VF
FI
Relative Luminous Intensity 7), 8)
Iv/Iv(20 mA) = f(IF); TS = 25 °C
V (20 mA)IIV
IF
10 0 10 1 10 2mA10-1
010
101
5
5
OHL02386
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Forward Voltage 7)
ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA
-60-0.3
-0.2
-0.1
0
-40 -20 0 20
0.1
0.2
0.3
0.4
˚C6040Tj
100
OHL02912
VFV∆
true greenblue
Relative Luminous Intensity 7)
Iv/Iv(25 °C) = f(Tj); IF = 20 mA
-600
-40 -20 0 20
V (25 ˚C)IIV
˚C6040Tj
100
OHL02913
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1.1
true greenblue
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Max. Permissible Forward CurrentIF = f(T)
OHL01370
00
ImA
F
˚CT
20 40 60 80 100 120
temp. ambienttemp. solder point
TTS
A
AT TS
10
20
30
40
50
60
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 25 °C
0
0.05
0.10
0.15
-5
0.20
0.25
FI
0.35
A tP=D T
tp
s
0.20.5
0.05
1
0.1
OHL01536
0.02
0.0050.01
=D
T
tP
IF
-410 -310 -210 -110 010 110 21010
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 85 °C
0
0.05
0.10
0.15
-5
0.20
0.25
FI
0.35
A tP=D T
tp
s
0.20.5
0.05
1
0.1
OHL01585
0.02
0.0050.01
=D
T
tP
IF
-410 -310 -210 -110 010 110 21010
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Dimensional Drawing 9)
GPLY6136
(R1)
Cathode marking
Cathode Anode
(2.4 (0.094))
2.8
(0.1
10)
2.4
(0.0
94)
4.2
(0.1
65)
3.8
(0.1
50)
0.9 (0.035)
1.1 (0.043)
spacing2.54 (0.100)
0.7
(0.0
28)
(2.85 (0.112))
(1.4 (0.055))
(0.3
(0.0
12))
3.4
(0.1
34)
3.8
(0.1
50)
3.8 (0.150)4.2 (0.165)
(2.9
(0.1
14))
AC
ESD Protection Diode
A C
Further Information
Approximate Weight: 67.0 mg
Corrosion test: Class: 1B Test condition: 25°C / 75 % RH / 200ppb SO2, 200ppb NO2, 10ppb H2S, 10ppb Cl2 / 21 days (EN 60068-2-60 (Method 4))
ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.
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Recommended Solder Pad 9)
3.7 (0.146)
1.2 (0.047)
3.0
(0.1
18)
Cu-area > 16 mmCu-Fläche > 16 mm
Paddesignfor improvedheat dissipation
Wärmeableitungfür verbessertePadgeometrie
LötstopplackSolder resist
OHLPY965
2
2
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.
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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 250 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 4 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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Taping 9)
OHAY2273
1.5 (0.059)
4 (0.157)
2 (0.079)
8 (0.315)4.25 (0.167)
3.95
(0.1
56)
5.5
(0.2
17)
1.75
(0.0
69)
12 (0
.472
)
Cathode/Collector Marking
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Tape and Reel 10)
Reel DimensionsA W Nmin W1 W2 max Pieces per PU
330 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 2000
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Barcode-Product-Label (BPL)
Dry Packing Process and Materials 9)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
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Schematic Transportation Box 9)
OHA02044
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or e
quivale
nt pro
cessing (p
eak package
2. Afte
r th
is b
ag is o
pened,
devices th
at will
be s
ubjecte
d to in
frare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body te
mp.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD-0
33 for bake p
rocedure
.
Floor
time s
ee belo
w
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Floor
time
1 Y
ear
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICONDUCTO
RS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Barcode label
Dimensions of Transportation BoxWidth Length Height
349 ± 5 mm 349 ± 5 mm 33 ± 5 mm
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Chip Technology: 3: standard InGaN 6: Standard InGalP B: HOP 2000 C: ATON F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire) K: InGaAlP low current
´
Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion
(resin encapsulation) S: Silicone (with or without diffuser)
Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: A: 617 nm amber W: white S: 633 nm super red UW: ultra white T: 528 nm true green CB: color on demand blue Y: 587 nm yellow CG: color on demand green O: 606 nm orange CL: color on demand lagune G: 570 nm green P: 560 nm pure green R: 625 nm red B: 470 nm blue H: 645 nm hyper-red V: 505 nm verde green L: Light emitting diode
Package Type A: SIDELED
Lead / Package Properties 6: folded leads
Type Designation System
L A A 6 7 6
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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
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Disclaimer
Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.
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Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-tion is not allowed.
3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).
4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).
5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.
9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.
10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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Revision HistoryVersion Date Change
1.4 2019-07-16 Discontinued
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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.