low silver filled conductive adhesive - heraeus · pdf filethe pc4000 series of conductive...
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Low Silver Filled Conductive Adhesive
The PC4000 series of conductive adhesives provides a good thermal performance and provides a high reliability, which complies with electronics assembly requirements.
Combined with a low silver content in PC4000 series, it is the adhesive of choice for cost reduction initiatives. PC4000 series are lead free & RoHS conform.
Key Features:
§ Attractive cost proposition § Good thermal & electrical conductivity§ High reliability§ Lead-free (green environment)§ Good and stable workability
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16-1Standard Product Specifi cation
PC4000 PC4001
Ag Content ~ 40% ~ 40%
Key Properties Standard curing Standard curing
Application Print Dispense
Curing Conditions 10 min / 150°C 10 min / 150°C
20 min / 120°C 20 min / 120°C
Elect. Vol. Resistivity ~ 0.17 mΩ ·cm 0.3 mΩ ·cm
Thermal Conductivity min. 3.9 W/mK n.a.
Adhesion (DIN1465) min. 8 N/mm2 min. 8 N/mm2
E-Modulus 3600 MPa 1500 MPa
Elongation ~ 0.8% ~ 1.2%
Floor Life (Processing Time) 8h -
Low Silver Filled Conductive Adhesive
Fields of Application:
Die and SMD component attach on PCB, LTCC substrates & hybrid circuits for automotive electronics applications:§ Motor management§ Safety equipment§ Sensors§ GPS
Die attach applications for consumer electronics industry (Non-MSL):§ Die attach on lead frame substrates§ Die attach on fl ex substrates§ Smart, RFID & MicroSD cards§ Cameral modules§ LEDs§ PV cell connection
Good thermal & electrical conductivity§ High reliability § Lead-free (green environment)Lead-free (green environment)§ Good and stable workability
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The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.