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Trusted Partnership Henkel is Fourstar’s primary overmolding materials partner. With Henkel’s permission, we’re offering this downloadable PDF that includes some informative details on low-pressure molding and Technomelt applications. Explore: • What low-pressure molding is • Total cost reduction • Types of low-pressure molding materials • Common molding applications and product groups

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Trusted Partnership

Henkel is Fourstar’s primary

overmolding materials partner.

With Henkel’s permission, we’re

o�ering this downloadable PDF

that includes some informative

details on low-pressure molding

and Technomelt applications.

Explore:

• What low-pressure molding is• Total cost reduction • Types of low-pressure molding materials• Common molding applications and product groups

LowPressure MoldingOverview

HenkelElectronics

2

Agenda

Technology1

Process2

Solutions3

3

AgendaTECHNOMELT– LowPressureMolding

• OverviewofTechnology• Definition• ValueProposition• Applications

• Processing• Equipment• Moldsets• Parameters

• Productsoverview• General• SpecialtyProducts

4

TECHNOMELTSolutionBriefDescription

Low Pressure Molding

Benefits

• Hotmeltpolyamidematerialdesignedforelectroniccomponents

• Itslowpressureandhighspeedsaresuitableforsensitiveelectroniccomponentsinmanufacturingenvironments

• ThetechnologyallowsforuniquedesignbeyondtheForm-Fit-Functionoftraditionalmaterials.

• Completewatertightencapsulation• Temperatureandsolventresistantmaterials• UL94-V0rated• Shortcycletime• “Green”technology– NoVOCandminimalwaste• SignificantlyLowersTCOO

5

WhatisTECHNOMELTMolding?

• TECHNOMELTMolding=LowPressureInjectionMoldingofAdhesives

• Anenvironmentally-friendlyprocesspositionedbetweenpottingandinjectionmoldingtechnologies

• Aprocesstooverorpartiallymoldcomponentspre-insertedinamoldset,likePCBs,sensors,switches,batteries,connectors,etc.

• Toprotectthemfromenvironmentalissueslikemoisture,temperature,chemicals,etc.

InjectionMolding

Potting

TECHNOMELTMolding

Pressure

Cycletime

6

ASustainableSolution

ü Highperformancepolyamidehotmelts

ü Solventfree,nosafetylabels

ü 80%ofrawmaterialsarebasedonrenewables(vegetableoils)

ü Noharmfulfumesfromthemoldingprocess

ü Longshelflife(2+years)

ü RoHSandREACHcomplaint

7

LowPressureMoldingTechnologyValueProposition

ElectricalInsulation

Contact

StrainRelief

Vibration

Corrosion

Waterproof

EnvironmentalInfluences

8

LPMtypicalApplications

Encapsulating,sealing&protectingelectronic

assembly

Switches,automotiveelectronicandmedical

sensors

Sealingconnectorsandprovidingstrainrelief LEDLighting

9

Agenda

Technology1

Process2

Solutions3

10

ApplicationDevelopmentTECHNOMELTSolution

PartnershipswithEquipmentVendorstoSupportDevelopment

ApplicationEngineering

• ProductDesignInput

• MaterialExperience

• ProcessOptimization

MoldDesign

• LessWeight

• SmallerFootprint

• DesignFlexibility

• Prototyping

• Form,Fit&Function

Equipment

• LowCapital

• FastCycletime

• MinimalFootprint

• Versatility

• Sustainable

TECHNOMELT

• Waterproof

• ChemicalResistant

• Impact&Vibration

• StrainRelief

• Versatile

• Reliable

1 2 3 4

11

LowPressureMoldingProcess

InsertElectronics Readytohandle&testOver-mold30– 45sec

12

Equipment Partners

Customer

Hotmelt Adhesives Technical Support

Molding Machines Mold Sets

Melting Unit Supplier

SupplyMoldingProduct

SupplySystem

SupplyMeltingUnit

13

ExamplesofAutomatedMoldingMachines

ProcessFlowofApplicationsareDeveloped

14

MoldTools

Material

• Usuallyaluminum

• Easytomill, drillandetch

• Goodreleaseofthemoldedpieces

Steelinsertsrecommendedincontactareaswithhardermetalparts

Lifetime

• Verylong,asTECHNOMELTisnotabrasivenorcorrosive

Lowermold-half

Uppermold-halfCavityRunner&Gate

15

ProcessConditionsPressure&Temperature

Engineering PA: PA6, PA66, PA11

0

100

200

300

400

0 200 400 600 800 1000 1200 1400Inje

ctio

n te

mpe

ratu

re (D

eg C

)

Low Pressure Molding Injection Pressure (bar)

Traditional Plastic Injection Molding

16

ProcessConditionsTemperature&InjectionTime

DegreesF

0

100

200

300

400

10 20 30 40 50 60 70 80 90 100 110 120

Seconds

TemperatureProfileduringInjection,Typical

Injectiontemperature:425°F,mold-settemperature:70°FCylindricalovermoldofPCB:0.5”diaby2.5”long

176°C

135°C112.8°C

48.9°C

27.0°C

79.5°C

WorkpieceFilled(sizedependencyex.USBstick)TemperatureonPCB Temperature1mmfromsurface

OvermoldingwithTECHNOMELTshowsnoadverseaffectsinsolderjointreliability

Un-encapsulated

EncapsulatedinTECHNOMELT

17

ProcessOverview&Comparisons

MoldPlasticHousing PartstoAssembly InsertElectronics PartsPreheating

OvenCureVacuumorSettlePottingDispense PartsforTest

InsertParts OverMold(LPM) PartsreadyforTest

TraditionalPottingProcessFlow

LowPressureMoldingProcess

18

CostSavingsCalculatorApplicationCaseHistory

PottedWaterSensor:• Cylindericalpartwithmountingtabsandexitingcables• Dimensions~35mm,height~15mm

TotalSavings>25%materialcostsavingsPerYEAR

Potting• PCBinhousing• Dispense• Cure• Lidattach• Securelid

LPM• Insertintomoldsetand

mold

ProcessSteps MaterialConsumption Throughput CostSavings

Potting• Density=1.06g/cc• 58ccemptyspace• 65grams pottingmaterial

required

LPM• 11grams/shot

Potting• Oneshift capacity

(5daysx8hours)=300,000pts/yr

LPM• Oneshiftcapacity=

405,000 pts/yr

Potting• Costofpottedpart=

$0.97/pt

LPM• Costofmoldedpart=

$0.78/pt

19

Low Pressure MoldingBenefits

CostSavings

• Molds

• Skylining

• Nocure

TimeSavings

• Fastcycletimes

• Simpleandcleanprocess

• Minimalmaintenance

ProductionSpaceSavings

• Decreasedequipmentfootprint

20

Colors

Henkel’sstandardcolorsareamberorblack

Via colored master batches you can achieve almost every color you need

21

Printing

It’spossibletoprintamarkingdirectlyontothemoldedassembly

• Padprinting

• Laserprinting

22

Agenda

Technology1

Solutions3

Process2

23

MaterialPropertiesTECHNOMELTMolding

• Temperatureresistance,shorttermexposure<=185°C

• Flexibility,Elongationatrupture<=800%

• Coldflexibility>=-50°C

• Goodchemicalresistancerelatedtoautomotivefluids,shorttermexposure.

• Goodchemicalresistanceregardingnon-polarliquidslikeoil,longtermexposure.

• Waterabsorption0.2to2.0%,24hat22°C

• FlameretardantpropertiesUL-listing,mainlyUL94V-0andRTIcertified

24

• Performancetemperaturesfrom-40°Cto170°C

• Excellentadhesivepropertiestovarietyofsubstrates

• Amber,Black,WhiteandTransparentmaterialsolutions

TechnologyOverviewMoldingResins

• Thermoplasticmaterials,UL94V-0• Naturallyoccurringrawmaterials• Notoxicfumesduetocure• Applicationviscosityfrom

1,000– 10,000cps• ApplicationPressurefrom20to500psi

25

Subgroupintomarketareas.• LED/light(PA668,PA648,AS4226)• IndustrialComponents– UVexposure(PA

6208BLACK,PA648,PA649,PA6344)• Automotive/Sensors(PA341,PA658,PA

2384,PA2692

TECHNOMELT Product ReviewProduct PA 633/638 PA 641/646 PA 652/657 PA 673/678 PA 6208/6208 BLACK

Key Property Generalist product High Strength & hardness

High Adhesion & cold flexibility High working Temp Outdoor performance

(f2)

Working Temp. -40 to 130 oC -40 to 130 oC -40 to 100 oC -40 to 140 oC -40 to 100 oC

Hardness A 90 A 92 A 77 A 88 78 A

Strength 5.2 N/mm2 11 N/mm2 2.7 N/mm2 5.7 N/mm2 3.4 N/mm2

Specialtyproducts:• PA648:ImprovedUVresistance• PA341:BlazeorangecolorforElectricvehicles• PA658:Hydrolysisresistantforimproved85/85performance• PA2384:Increasedhardnessandimprovedalcoholresistance• PA668:UVStabilizedWhiteforLEDapplications.• PA2692:HighTemperature,150°C

26

HenkelInnovationsWhitePolyamide– TECHNOMELTPA668

TECHNOMELTPA668whiteProperties

• UVstabilised

• Goodmechanicalproperties

• SuitableforLEDapplications

• -40upto105°C

• UVresistance,doesnotyellowovertime

27

HenkelInnovationsSolvent/Chemicalresistant– TECHNOMELTPA2384

PA2384isasolventandchemicallyresistantmaterial• Polarsolventandhydrocarbonresistant• Highhardness• Highoperatingtemperature

PA6208vsPA2384mechanicalsbeforeandafterIPAexposure

7DaySubmersionTest 8WeekSubmersionTest

IPAtreated

Nottreated Nottreated

Treated

13.61g

28

ThermallyConductiveUnderDevelopment– Q3/2015

• ProjectGoal:DevelophigherThermalConductiveTECHNOMELT

• StandardTECHNOMELTresinisinsulatingwith~0.2W/mK

• TCTMtoallowheattransferthroughmoldedencapsulate

• Targetingformulaswith>0.5W/mK,>0.7W/mK,and>1W/mKperformance

Allowsforheatdissipationthroughthe

moldedencapsulantlayer

30

TECHNOMELTProductsLowPressureMoldingforCBP

LowPressureMolding

IncreasedHardness

AdhesiontoPlastics

SolventResistant

UVResistant

HighTemperatureResistance

AmberBlazeOrange BlackAmber Black Amber BlackWhiteAmber Black

TECHNOMELTPA646

TECHNOMELTPA341

TECHNOMELTPA641

TECHNOMELTPA638

TECHNOMELTPA633

TECHNOMELTPA2384

TECHNOMELTPA6344

TECHNOMELTPA668

TECHNOMELTPA673

TECHNOMELTPA678

TECHNOMELTPA652

TECHNOMELTPA687

TECHNOMELTPA682

TECHNOMELTPA657

TECHNOMELTPA6208

TECHNOMELTPA6208BLACK

TECHNOMELTPA2692

With over 30 years of industry knowledge and interconnect expertise, Fourstar Connections is a trusted advisor to companies across a range of industries. We partner with you to “find a better way” for time to market, new product introduction, and design for manufacturing initiatives.

How can we find a better way for you? Contact Fourstar to incorporate safe, water-resistant molded product into your portfolio.

CLICK HERE