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Instruction Guide

Aspects of Lead free for Service repairs

Philips Euroservice TSG Reiner Buderath, 29.03.2005, ASPECTS OF LEAD FREE FOR SERICE REPAIRS 2

INSTRUCTION GUIDE

Contents (1/1)

1. Introduction

2. Identifying differences

3. Issues for Service

4. Mistakes in relation to lead-free soldering

5. Summary

6. Literature


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1. Introduction (1/5)

a. Lead will be eliminated worldwide

b. Legal situation (Europe and Philips)

c. Eco Policy (Worldwide, Philips)

d. Summary of time table


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a. Lead be will eliminated worldwide Consumption of lead (annual) World wide total : 5 million tons

Lead Free Project in the WorldEurope: IDEALS (Improvement Design Life and Environmentally Aware

Manufacturing of Electronics Assembly by Lead Free Soldering)U.S.A.: NCMS (National Center for Manufacturing Sciences)

NEMI (National Electronics Manufacturing Initiative)Japan : JEIDA (New Energy & Industrial Technology Development Organization)

JWES (Japan Welding Engineering Society)EIAJ (Electronic Industries Association of Japan)

Expected PPM level is 1000 PPM and exemption list is not exactly known yet. For sure: lead has to be taken out of the current standard solder alloy.Lead Free Soldering (LFS) using lead-free alloy has to be introduced as an alternative

process to the current standard process.


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b. Legal situation (Europe and Philips)

In July 2006 a law will be launched (Regulation on Hazardous Substances), which forbids the application of lead in a many cases.

LEAD


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c. Eco Policy (Philips Worldwide)

• Philips Consumer Electronics has set the target, that newly launched products should be lead-free (Lead Free Soldered and Lead-Free Components) starting from January 2005 onwards. This is also applicable to finished goods purchased.

• Revised Banned Substance Declaration per 1st of June 2005 , to be signed by all suppliers of Philips, lead will be added as one of the banned substances. From this moment onward all the old long running products must also be lead-free.

• All suppliers have been requested to submit an implementation plan outlining the transition to Lead-Free Soldering (availability date and release reports).


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d. Summary of time table

2003 … competitors started to produce lead-free2004 … Philips CE started with the first lead-free sets2005 … Philips CE is producing lead-free from 01.01.2005 onward01.07.2006 all products have to be lead-free

End of Leaded

First Competitors changed to lead free

2003 2004 2005 30.06.2005

In 2004 PHILIPS started with the lead free process01.01.2005 PHILIPS all sets are lead free


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2. Identifying differences (1/10)

a. Solder Temperature (Profile)

b. Identification of sets

c. Identification of PCB

d. Identification of replacement parts (BGA)

e. Combinations of lead-related and lead-free on PCB


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a. Solder Temperature (Profile)New alloys are needed and in general the melting point is increasing.


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a. Solder Temperature (Profile)Mainly Tin (Sn) -Copper (Cu) (227°C), Tin - Silver (Ag)(221°C) or Tin -

Silver - Copper (217°C) are used.

The emphasis is on the Tin-Silver-Copper (SAC) alloy. Most popular SAC solders are Sn96.5Ag3Cu0.5 (standard for wave within PCE) and Sn95.5Ag4Cu0.5 (standard for reflow within PCE). Both alloys are near eutectic and have only a very small melting range. The eutectic composition is Sn95.5Ag3.8Cu0.7. S0, SAC 405 contains more silver than the eutectic composition and SAC305 contains less silver compared to the eutectic composition.

The requirements for lead-free solder joints are not similar to those of lead-content joints but some typical differences can be distinguished.


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a. Solder Temperature (Profile)

The alloy of the target joint contains about 95% tin, which causes a different crystallization of the alloy compared to the regular lead-content alloy that contains about 50 (volume)% of tin.

The higher soldering temperature also affect the appearance of the joint.

Lead content joint on the left and Lead-free joint on the right.

The discoloration is especially noticeable on resistors and appears to vary from supplier to supplier.

Ag atomic percent (rest Sn)12345

220

225

230

240

3.8

232

Temp.

221


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b. Identification of sets At present a 14-digit S/N can be found on the bottom line of type plate. Digit 5 & 6 is the year, digit 7 & 8 is the week number, so in this case 1991 wk 18 (= lead-content)

So from 1 Jan 2005 onwards = 0501 onwards (= lead-free)


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c. Identification of PCB Different of Logos (sticker) for Lead-free are found on a PCB:

• PhilipsOur logo cannot always be found on the PCBs !

• JVC

• Panasonic

• Sony


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2. Identifying the differences (7/10)

c. Identification of replacement parts (BGA)

Lead-content BGA on the left and Lead-free BGA on the right


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d. Combinations of lead-related and lead-free on PCBSets with the same PCB but different BGAs

Type: DVDR630VR - Digi-Board - IC: 101 BGA: DMN-8602 BOProduction date of both: 07.06.2004


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Type: DVDR630VR - Digi-Board - IC: 101 BGA: DMN-8602 BOBe careful when using known (de)solder profiles from the list.BOARD:• In the case of a lead-related board the bottom heating temperature is

lower than when a lead-free board is introduced.BGA:• If a lead-related BGA is integrated the solder temperature will be lower

than when a lead-free BGA is integrated.

At the moment four (de)solder profiles we are still available. With a lead-free board, there will be six (de)solder profiles in this example.


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BGA-type: No. of balls

lead free

PACE-profile desoldering

PACE-profile soldering

PACE- Stamp No. 4028 -

Introduction in year /week:

Set Chassis Name of Board Remarks/ Component IC > 12NC

EP1K30 F256 no 16 17 5011 2001 x2FD994x/01 FM2x, FTV2x SCAVIO IC 7656 9322 165 40671JAGASM-A4 388 no 14 15 5003 2003 xxPF9936/9945 LC03 SCALER IC 7402 9322 190 01671PW 181 302 no 12 13 WK03.33 TV EM7E Pixelworks IC --PW 194 no 5022 2001 x2FD994x/01 FM2x, FTV2x SCAVIO IC 7605 9322 158 73671PNX 1300 EH 292 no 10 11 5001 Audio MCI 6000 IC PNX 1302 EH 292 no 10 11 5002 Audio MCI 6000 IC PNX 3002/N 388 no 14 15 5003 WK0339 TV A02 SSB IC 7300 9352 735 54557PNX 8525 456 no -- -- WK03.33 Digital TV A10 IDTV Digi-Board IC --PNX 7100 EH 388 no 16 17 5003 WK03.40 DVD-R 70/75/77 CHRY 2.1 Digi-Board IC 7400 9352 725 55557SAA 7118 E 156 no 16 17 5005 WK03.15 LCD-TV LC03 Digi-Board IC 7302 9352 673 95518STI 5512 256 no -- -- 2002 TV MG4.1/A10 IDTV IC 9322 166 25671PNX 8550 564 yes 5012 2004 TV FTL 3.1E SSB, leadfree ! IC 7V00 9352 760 31557XCF 5248 VF 160 no 16 17 5015 2003 CDR820/00 Mozartmodule IC 9322 158 29671PNX7850E no 16 17 5002 DVDR drive VAD8031 (Centaurus) 7500 9352 730 44557EP1C12F256 256 no 16 17 5025 2004 FLAT-TV FTP 2.2 SSB-Board IC 7V01 932220014671

no 16 17yes 22 23DMN-8602 B0 5001 2004 9965 000 25922DVDR630VR Digi-Board

non Lead free IC 101308

NEW 31-03-2005


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3. Issues for Service (1/5)

a. Solder Equipment requirements

b. Solder Alloy, Service Codes

c. Mix of material within repair

d. Repair Instructions


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a. Solder Equipment requirementBGA/SMD Solder Machine PACE TF 700

TF 700 is fully lead-free compliable.Philips supports all BGA-profiles for this machine via the web. Solder flux is offered by PACE

Solder Hand-ToolAdjustable in temperature heightTemperature should be held constanttips on Flexibility

Corrosion of Tool-Spikes can be avoided by using SAC305 and a temperature of less than 400oC


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b. Solder Alloy, Service CodesUse only lead-free Solder Alloy SAC305

(0622 149 00106)


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c. Mix of material within repairAvoid “mixed regimes” means, • Clean carefully the solder alloy from solder joint before

re-soldering.• Use original spare parts listed in the manual

(exception: consumables)

Component, produced- with Pb or- without Pb

PCBPCB

contact-wire

printed wireon PCBsolder

alloyskin of contact

wire


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d. Repair Instruction – Use only adequate solder tools

– applicable for lead-free soldering-tin and variable solder-tips– Reach at least a solder temperature of 400oC

– Clean solder joint carefully before re-soldering– Heating time must not exceed appr. 4 sec.– Avoid temperatures above 400oC (best is 360oC … 380oC)– Take care with BGA-IC’s

– Use lead-free IC’s when PCB has a lead-free sign– Open dry-pack only when IC will be used directly after– Use adequate solder profile for each BGA-IC;

solder profiles for PACE TF700 can be retrieved from AYS webside

Complete Instruction can be found in the Service Manual or downloaded from the web-side www.atyourservice.ce.Philips.com


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4. Mistakes in relation to lead-free soldering (1/16)

a. Tomb-stoning

b. Open circuits

c. solder wicking

d. solder bridging

e. pad lifting

f. solder lifting

g. Joint appearance


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a. Tomb-stoningTomb-stoning is a well-knownphenomenon in reflow soldering. Obviously this phenomenon is strongly related to the surface tension of the liquid solder. The solder on the left side in the figure lifts the component up in its attempt to achieve a minimum surface area.


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b. Open circuitsThis phenomenon occurs mainly on large QFPs with a small stand-off in combination with thin boards or asymmetric boards, asymmetric in terms of copper partitioning.


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c. solder wickingSolder wicking is a phenomenon whereby the solder moves for the major part into the component lead and leaving an open circuit. A small non-coplanarity between the leads is necessary to initiate this phenomenon. In practice, there will always be a non-coplanarity for components with more than 3 leads. Wicking appears especially when there is a temperature gradient between the lead and the corresponding solder land, with the lead having the higher temperature.


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d. solder bridgingIn almost every case, solder bridging is caused in the solder paste phase. Paste bridges can be formed by the stencil printing process, by placement of the component or by slump of the solder paste. These paste bridges will form a short circuit as soon as the solder is molten. These liquid solder bridges can spring open or they can remain. It depends on the minimum free energy of the final state. If the minimum free energy is smaller in the case of two normal solder joints compared to the solder joint with the bridge, then it will spring open and the short circuit disappears. If the minimum free energy is lower in case of the solder bridge, it will remain.


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e. pad liftingPad lifting has been noticed during lead-free soldering of wired components (Kolsters & Otte 2004). Due to the shrinkage of the solder, after solidification, a considerable tension can be applied on the rim of the solder land. The rim can be lifted from the board as is shown


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f. solder liftingSolder lifting is a well-known phenomenon and appears sometimes at soldered wired components, especially in the case of usage of non-eutectic solder. During solidification of the solder, if the last amount of the liquid solder is in a kind of pasty state, the solder can lose contactwith the solder lands because of the forces and volume contraction as mentioned in the previous chapter.

A typical example is shown


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g. Joint appearanceLead-free joints have a different appearance compared to lead content

joints. The joints appear to have a dull surface and give the impression of a joint that was formed at a too low temperature.

In fact, the dull appearance is formed by the completely different microstructure that is formed during solidification. The appearance varies because of different cooling speeds. These differences can be caused by the different component construction and component mass but also by the processing in the reflow oven or wave soldering machine.

So a dull appearance is acceptable but that does not imply that visual inspection becomes superfluous. Not every dull appearance can beclassified as a correct solder joint.

In this chapter, a number of solder joints with a large variety of appearances will be shown and assessed. Furthermore the origin of the appearance will be elucidated by means of a number of cross sections.


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g. Joint appearance

Regular lead-free reflow solder joint. Small contact angle


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g. Joint appearance

Regular lead-free solder joint. Small contact angle, elongated structure in solder surface, solder land not completely wetted. Note the striation marks on the solder surface.

Regular lead-free reflow solder joint. Irregular surface of the solder. Wetting on the cutting edge of the lead tip is not required


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g. Joint appearanceGood BGA joint. Coarse surface. Balls completely collapsed andhave merged with the solder from the paste


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g. Joint appearanceLead-free wave soldered joint with coarse grain, surface, more typical of larger small components

HSOP-20 soldered with SAC. Good filling of the heel


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g. Joint appearanceSoldered J-lead. Good fillet on both sides of the curved lead

“Secondary unintended”reflow during wave soldering (after a first reflow step). Liquid cracking due to board warpage


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g. Joint appearancePlastic snaps melt during wave soldering. Adhesion of large solder balls on molten snaps

Dewetting over a large area of the solder land. Unacceptable!


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g. Joint appearance

Bad joint, no meniscus at the heel of the lead.

Bad joint. Solder paste particles not melted together


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g. Joint appearance

Bad joint. Excessive leaching of component metallisation

Out-gassing of component metallisation. Mostly caused by moisture inclusion during component manufacturing


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5. Summary (1/3)

Due to lead-free technology certain rules have to be respected by the workshop during a repair:

• Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106.If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle.

• Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able

– To reach at least a solder-temperature of 400°C, – To stabilize the adjusted temperature at the solder-tip – To exchange solder-tips for different applications.

• Adjust your solder tool so that a temperature around 360°C – 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.


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5. Summary (2/3)

• Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).

• Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies.

• Special information for BGA-ICs:- always use the 12nc-recognizable soldering temperature profile of the specific BGA (in case of doubt for de-soldering always use the lead-free temperature profile,) - lead free BGA-ICs will be delivered in so-called ‘dry-packaging’ (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.


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5. Summary (3/3)

• Do not re-use BGAs at all.

• For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.

On our website www.atyourservice.ce.Philips.comyou find more information to:

BGA-de-/soldering (+ baking instructions)Heating-profiles of BGAs and other ICs used in Philips-sets.

You will find this and more technical information within the “magazine”, chapter “workshop news”.


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6. Literature (1/1)

• Directive 2002/95/EC of the European Parliament of 27. January 2003• PHILIPS CE, General LF- info v1.6• PHILIPS CE, INFORMATION SHEET UAT-D1809/60• PHILIPS CFT, Centre for Industrial Technology• PHILIPS CE, Lead Free update V300903• ZVEI, Zentralverband Elektrotechnik-und Elektronikindustrie e.V.

http://www.zvei.de• ERSA GmbH, Requirement of Rework Equipment• KOKI, Lead-Free Presentation (Japan)

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