lg p925 thrill 4g service manual
DESCRIPTION
service manualTRANSCRIPT
Internal Use Only
Service ManualLG-P925
Date: November, 2011 / Issue 1.0
- � - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION ..................................................................... 3
1.1 Purpose ........................................................................................................3
1.� Regulatory Information .........................................................................3
1.3 Abbreviations.............................................................................................5
2. PERFORMANCE ...................................................................... 7
�.1 Product Name ............................................................................................7
�.� Supporting Standard ..............................................................................7
�.3 Main Parts : GSM Solution .....................................................................7
�.4 HW Features ...............................................................................................8
�.5 SW Features ............................................................................................. 10
�.6 HW SPEC. ................................................................................................. 13
�.7 P9�5 Figures ............................................................................................ �3
3. TECHNICAL BRIEF ................................................................ 24
3.1 Radio Part General ................................................................................ �5
3.� Radio Part Rx Section ........................................................................... �6
3.3 Radio Part Tx Section ........................................................................... �7
3.4 Radio Part Interfaces ............................................................................ �8
3.5 Digital Baseband (OMAP4430) ........................................................ �9
3.6 Hardware Architecture ........................................................................ 31
3.7 Subsystem (PMB9811_X-GOLDTM6�6) ....................................... 3�
3.8 Power Block ............................................................................................. 45
3.9 External memory interface ................................................................ 5�
3.10 Audio and sound ................................................................................ 53
3.11 Main (5M pixels) & Sub (VGA) Camera ....................................... 58
3.1� Display ..................................................................................................... 60
3.13 Vibrators.................................................................................................. 64
3.14 HDMI ........................................................................................................ 65
3.15 Compass Sensor .................................................................................. 66
3.16 Motion Sensor ...................................................................................... 67
3.17 Gyro Sensor ........................................................................................... 68
3.18 Ambient Light & Proximity Sensor .............................................. 69
3.19 Touch Module ...................................................................................... 70
3.�0 Main Features ....................................................................................... 71
4. TROUBLE SHOOTING .......................................................... 72
4.1 RF Component ....................................................................................... 7�
4.� SIGNAL PATH ........................................................................................... 73
4.3 Checking TCXO Block ........................................................................... 76
4.4 Checking WCDMA Block .................................................................... 78
4.5 Checking GSM Block ............................................................................ 85
4.6 GPS/WIFI/BT RF components ........................................................... 9�
4.7 GPS/WIFI/BT SIGNAL PATH ................................................................ 94
4.8 Power ON Troubleshooting ............................................................... 96
4.9 Charger Troubleshooting .................................................................101
4.10 USB Trouble shooting .....................................................................104
4.11 Audio trouble .....................................................................................107
4.1� Camera trouble(5M/VGA) ..............................................................118
4.13 Main LCD trouble ..............................................................................1��
4.14 SIM detect Trouble shooting ........................................................1�7
4.15 Vibrator Troubleshooting ..............................................................1�9
4.16 HDMI Troubleshooting ...................................................................13�
4.17 Motion Sensor on/off trouble ......................................................134
4.18 Gyro/Compass sensor troubleshooting ..................................137
4.19 Proximity Sensor on/off trouble .................................................140
4.�0 Ambient Light Sensor on/off trouble .......................................14�
4.�1 Touch trouble .....................................................................................144
5. DOWNLOAD ....................................................................... 148
6. BLOCK DIAGRAM ............................................................... 170
7. CIRCUIT DIAGRAM ............................................................ 174
8. BGA PIN MAP .................................................................... 191
9. PCB LAYOUT ....................................................................... 200
10. CALIBRATION ................................................................... 213
10.1 Configuration of Tachyon ..............................................................�13
10.� How to use Tachyon .........................................................................�15
11. HIDDEN MENU ................................................................. 218
12. DISASSEMBLE GUIDE .................................................... 240
13. EXPLODED VIEW & REPLACEMENT PART LIST ............. 243
13.1 EXPLODED VIEW ................................................................................�43
13.� Replacement Parts ...........................................................................�44
13.3 Accessory .............................................................................................�78
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1. INTRODUCTION
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1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory InformationA. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION1. INTRODUCTION
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1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION
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1. INTRODUCTION
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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION
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1. INTRODUCTION
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Wireless Application ProtocolWAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION
2. PERFORMANCE
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2.1 Product Name
LG-P925 : WCDMA 850/1900/2100+GSM850/EGSM/DCS/PCS
(HSUPA 5.8Mbps(cat6)/HSDPA 14.4Mbps(cat10)/GPRS Class10/EDGE Class10)
2.2 Supporting Standard
Item Feature Comment
Supporting Standard WCDMA(FDD1,2,8)/EGSM/GSM850/DCS1800/PCS1900 with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, C-E
Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHz WCDMA(FDD1) RX : 2110 – 2170 MHz WCDMA(FDD2) TX : 1850 – 1910 MHz WCDMA(FDD2) RX : 1930 – 1990 MHz WCDMA(FDD5) RX : 824 – 849 MHz WCDMA(FDD5) TX : 869 – 894 MHz EGSM TX : 880 – 915 MHz EGSM RX : 925 – 960 MHz GSM850 TX : 824 – 849 MHz GSM850 RX : 869 – 894 MHz DCS1800 TX : 1710 – 1785 MHz DCS1800 RX : 1805 – 1880 MHz PCS1900 TX : 1850 – 1910 MHz PCS1900 RX : 1930 – 1990 MHz
Application Standard
2.3 Main Parts : GSM Solution
Item Part Name Comment AP Chip OMAP4430 : TI CP Chip XMM6260 : IMC
2. PERFORMANCE
2. PERFORMANCE
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2.4 HW Features
Item Feature Comment
Form Factor DOP type
1) Capacity Standard : Li-Ion Polymer, 1500mAh
Battery
2) Packing Type : Soft Pack
Size Standard : 128.8 x 68 x 11.9mm
Weight 162g With Battery
PCB Full Layer type, 10 Layers , 0.75t
Stand by time 2G Up to 330 hrs 3G Up to 330 hrs
@ Paging Period 5 (2G) @ DRX 7 (3G)
Charging time 3 hrs @ Power Off / 1500mAh
Talk time 2G Up to 260 min 3G Up to 300 min
@ Tx=Max(2G) @ Tx = 12dBm (3G)
RX sensitivity WCDMA(FDD1) : -106.7 dBm WCDMA(FDD2) : -106.7 dBm WCDMA(FDD5) : -106.7 dBm EGSM : -105 dBm GSM850 : -105 dBm DCS 1800 : -105 dBm PCS 1900 : -105 dBm
TX output power WCDMA/ GSM/ GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBm EGSM : 33dBm GSM850 : 33 dBm DCS 1800 : 30 dBm PCS 1900 : 30 dBm
EDGE GSM 900 : 27 dBm DCS 1800 : 26 dBm PCS 1900 : 26 dBm
Class3(WCDMA) Class4 (EGSM) Class4 (GSM850) Class1 (PCS) Class1 (DCS)
GPRS compatibility
GPRS Class 10
E2 (GSM900) E2 (PCS) E2 (DCS)
EDGE compatibility EDGE Class 10
SIM card type Plug-In SIM 2.85V /1.8V
2. PERFORMANCE
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Display Main LCD (WVGA) TFT Main LCD(4.3”, 480X800)
Built-in Camera 3D Camera, VGA secondary 5M AF CMOS CAM 2EA
Status Indicator No
Keypad Function Key : 4 Side Key : 4
Function Key: Home,Back, menu, serach Side Key : Volume up,down, power key, 3D key
ANT Main : LDS(Laser Direct Structure) type Sub : DPA type(Directed Print Antenna)
System connector 5 Pin Micro USB 2.0 HS
Ear Phone Jack 3.5Phi, 4 Pole, Stereo
PC synchronization Yes
Memory(AP) eMMC : 8GB LP-DDR2 : 512MB
Speech coding FR, EFR, HR, AMR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
BlueTooth V2.1 + EDR
MIDI(for Buzzer Function)
72 Poly, MP3 Ringtone
Music Player MP3/ WMA/AAC/AAC+/WAV/AC3
Video Player MPEG4, H.263, H.264 @ Full HD 30fps/ Divx HD
Camcorder MPEG4, H.264, H.263 @ 3D : 720p 2D : 1080p 30pfs
Voice Recording Yes
Speaker Phone mode Support
Yes
Travel Adapter Yes
CDROM Yes
Stereo Headset No
Data Cable Yes
T-Flash (External Memory)
Yes Upto 32GB
2. PERFORMANCE
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2.5 SW Features
Item Feature Comment
RSSI 0 ~ 5 Levels
Battery Charging 0 ~ 6 Levels
Key Volume 0 ~ 7 Level
Audio Volume 1 ~ 15 Level
Time / Date Display Yes
Multi-Language Yes English, Espanol, Franch, Korean, Chinese
Quick Access Mode Phone / Contacts / Messaging / Menu
PC Sync Yes
Speed Dial Yes Voice mail center -> 1 key
Profile Yes not same with feature phone setting
CLIP / CLIR Yes
Phone Book Name / Number / Email / Chat Id / Website / Postal addresses / Organizations / Groups / BirthdayNotes / Ringtone
There is no limitation on the number of items. It depends on available memory amount.
Last Dial Number Yes There is no limitation on the number of items. It depends on available memory amount.
Last Received Number
Yes There is no limitation on the number of items. It depends on available memory amount.
Last Missed Number Yes There is no limitation on the number of items. It depends on available memory amount.
Search by Number / Name
Name / N
Group Yes There is no limitation on the number of items. It depends on available memory amount.
Fixed Dial Number Yes
Service Dial Number No
Own Number Yes Read only
No
Name / Number
2. PERFORMANCE
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(add/edit/delete are not supported)
Voice Memo Yes Support voice recorder
Call Reminder Yes Missed call popup
Network Selection Automatic
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge (AoC) Yes
Call Duration Yes
SMS (EMS) There is no limitation on the number of items. It depends on available memory amount.
EMS does not support.
SMS Over GPRS No
EMS Melody / Picture Send / Receive / Save
No No
MMS MPEG4 Send / Receive / Save
Yes Yes
Long Message MAX 1000 characters SMS 10 concatenated
Cell Broadcast Yes
Download Over the Web
Game Yes
Calendar Yes
Memo Yes There is no limitation on the number of items. It depends on available memory amount.
World Clock Yes
Unit Convert No
Stop Watch Yes
Wall Paper Yes
WAP Browser No WAP stack and wml are not supported.
Download Melody / Wallpaper
Yes Over web browser
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1, 2, 3, C, D
MMS Yes
EONS Yes
CPHS Yes V4.2
ENS Yes
No
No
No
MAX 765 characters SMS 5 concatenated
No
No
2. PERFORMANCE
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Camera Yes 5M AF / Digital Zoom : x8
JAVA No Android do not support JAVA
Voice Dial No
IrDa No
Bluetooth Yes Ver. 2.1+EDR (GAP, A2DP, AVRCP, DUN, FTP, GAVDP, GOEP, HFP, HSP, OPP, SDAP, SPP)
FM radio Yes
GPRS Yes Class 10
EDGE Yes Class 10
Hold / Retrieve Yes
Conference Call Yes Max. 6
DTMF Yes
Memo pad Yes Rich Note
TTY No
AMR Yes
SyncML Yes
IM Yes Gtalk
Email Yes
Yes
No
Max. 7
Yes
2. PERFORMANCE
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2.6 HW SPEC. 1) GSM transceiver specification
Item Specification
Phase Error Rms : 5° Peak : 20 °
Frequency Error GSM : 0.1 ppm DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission Disturbance)
GSM/DCS : < -28dBm
Transmitter Output power GSM850, EGSM : 5dBm ~ 33dBm ± 3dB DCS/PCS : 0dBm ~ 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out to less than 1800kHz offset
200kHz : -36dBm 600kHz : -51dBm/-56dBm
Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band
GSM850, EGSM : 1800-3000kHz :< -63dBc(-46dBm) 3000kHz-6000kHz : <-65dBc(-46dBm) 6000kHz < : < -71dBc(-46dBm) DCS, PCS : 1800-3000kHz :< -65dBc(-51dBm) 6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm 600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection – Speech channels
± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)
AM Suppression GSM : -31dBm
- DCS : -29dBm -98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
2. PERFORMANCE
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2) WCDMA transmitter specification
Item Specification
Transmit Frequency BD1: 1920MHz ~ 1980 MHz BD2: 1850~1910 MHz BD5: 824 MHz ~849 MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPM
Open Loop Power Control Normal Conditions : within ±9 dB, Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage Power Ratio (ACLR)
> 33 dB @ ±5 MHz, > 43 dB @ ±10 MHz
Spurious Emissions |f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz
< -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MHz
< -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MHz
< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
Peak Code Domain Error < -15 dB at Pout -20 dBm
2. PERFORMANCE
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3) WCDMA receiver specification
Item Specification
Receive Frequency BD1: 2110 MHz ~2170 MHz BD2: 1850~1910 MHz BD5: 869 MHz ~ 894 MHz
Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz Band2 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz Band5 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity (ACS)
ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84 MHz & Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -44 dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz & Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz & Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz < -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
Inner Loop Power Control In Uplink
Adjust output(TPC command) cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -1 -0.5/-1.5 -1/-3 -1.5/-4 group(10equal command group) +1 +8/+12 +16/+24
2. PERFORMANCE
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4) HSDPA transmitter specification
Item Specification
Transmit Frequency BD1: 1920MHz ~ 1980 MHz BD2: 1850~1910 MHz BD5: 824 MHz ~ 849 MHz
Maximum Output Power
Sub-Test 1=2/15, 25.7~20.3dBm / 3.84 MHz 2=12/15 25.7~20.3dBm / 3.84 MHz 3=15/8 25.7~19.8dBm / 3.84 MHz 4=15/4 25.7~19.8dBm / 3.84 MHz
Spectrum Emission Mask
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
Frequency offset from carrier f
Minimum requirement Measurement Bandwidth
2.5 ~ 3.5 MHz -35-15×( f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1×( f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10×( f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Leakage Power Ratio (ACLR)
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4 > 33 dB @ ±5 MHz > 43 dB @ ±10 MHz
Error Vector Magnitude
< 17.5 %, when Pout ≥ -20 dBm
2. PERFORMANCE
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5) HSDPA receiver specification
Item Specification
Receive Frequency
BD1: 2110 MHz ~2170 MHz BD2: 1850~1910 MHz BD5: 869 MHz ~ 894 MHz
Maximum Input Level (BLER or R), 16QAM Only
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4 BLER < 10% or R >= 700kbps
6) HSUPA Tx, Rx specification
Item Specification
Maximum Output Power
Sub-Test 1=11/15 25.7~17.3dBm / 3.84 MHz 2=6/15 25.7~16.8dBm / 3.84 MHz 3=15/9 25.7~17.8dBm / 3.84 MHz 4=2/15 25.7~16.8dBm / 3.84 MHz 5=15/15 25.7~20.3dBm / 3.84 MHz
Spectrum Emission Mask
Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15
Frequency offset from carrier f
Minimum requirement Measurement Bandwidth
2.5 ~ 3.5 MHz -35-15×( f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1×( f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10×( f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Leakage Power Ratio (ACLR)
Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15 > 33 dB @ ±5 MHz > 43 dB @ ±10 MHz
2. PERFORMANCE
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7) WLAN 802.11b transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock Frequency Tolerance
within ±25 PPM
Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz ≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dB
Modulation Accuracy (Peak EVM)
≤ 35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Adjacent Channel Rejection
≥ 35dB @FER ≤ 8%, interference input signal -70dBm@fc±25MHz(11Mbps)
2. PERFORMANCE
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8) WLAN 802.11g transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock Frequency Tolerance
within ±25 PPM
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz) ≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz) ≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error (rms EVM)
≤ -5dB@6Mbps, ≤ -8dB@9Mbps, ≤ -10dB@12Mbps, ≤ -13dB@18Mbps, ≤ -16dB@24Mbps, ≤ -19dB@36Mbps, ≤ -22dB@48Mbps, ≤ -25dB@54Mbps
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10% -82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps -77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps -66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
Rx Adjacent Channel Rejection
PER ≤ 10%, ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent sensitivity specified in min input sensitivity
2. PERFORMANCE
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9) WLAN 802.11n transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock Frequency Tolerance
within ±25 PPM
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz) ≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz) ≤ -45 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error (rms EVM)
≤ [email protected], ≤ -10dB@13Mbps, ≤ [email protected], ≤ -16dB@26Mbps, ≤ -19dB@39Mbps, ≤ -22dB@52Mbps, ≤ [email protected], ≤ -28dB@65Mbps
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10% [email protected], -79dBm@13Mbps, [email protected] -74dBm@26Mbps, -70dBm@39Mbps, -66dBm@52Mbps [email protected], -64dBm@65Mbps
Rx Max input Sensitivity ≥ -20dBm(6.5,13,19.5,26,39,52,58.5,65Mbps) @ PER ≤ 10%
Rx Adjacent Channel Rejection
PER ≤ 10%, ACR ≥ [email protected], ACR ≥ 13dB@13Mbps, ACR ≥ [email protected], ACR ≥ 8dB@26Mbps, ACR ≥ 4dB@39Mbps, ACR ≥ 0dB@52Mbps ACR ≥ [email protected], ACR ≥ -2dB@65Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent Sensitivity specified in min input sensitivity
2. PERFORMANCE
- �1 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10) GPS receiver specification
Item Specification Receive Frequency 1574.42 MHz ~ 1576.42 MHz Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
11) Current consumption
Stand by
Bluetooth Off Bluetooth Connected
Voice Call
VT
WCDMA Only
4.5 mA under (DRX=1.28)
6 mA under (DRX=1.28)
270 mA under (Tx=12dBm)
NA
GSM Only
4.5 mA under (Paging=5 period)
6 mA under (Paging=5 period)
340 mA under (Tx=Max)
** Test condition for Standby current consumption should be as below.
: Measurement time 1hr, with Agilent & CMT JIG
12) Battery life time
Stand by Voice Call VT
WCDMA 330 hours over (DRX = 1.28)
330 min over (TX = 12dBm, Low Pwr mode)
NA
GSM 330 hours over (Paging Period = 5)
260 min over (TX Level = Max)
13) Charging hour
3.5hour under (1500mAh battery, 1A TA)
2. PERFORMANCE
- �� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12) Battery life time
Stand by Voice Call VT
WCDMA 330 hours over (DRX = 1.28)
330 min over (TX = 12dBm, Low Pwr mode)
NA
GSM 330 hours over (Paging Period = 5)
260 min over (TX Level = Max)
13) Charging hour
3.5hour under (1500mAh battery, 1A TA)
14) RSSI indicator (Based on Cell power)
BAR WCDMA GSM/DCS/PCS
5 > -74 dBm > -78 dBm
5 4 -76 ±2dBm -80 ±2dBm
4 3 -86 ±2dBm -89 ±2dBm
3 2 -96 ±2dBm -98 ±2dBm
2 1 -102 ±2dBm -104 ±2dBm
0 < -110 dBm < -110 dBm
15) Battery indicator
Battery Bar Specification
BAR 6 (Full) 90% over
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up 0% ~ 3% : Every Level change popup (No call)
POWER OFF 0%
remain%
2. PERFORMANCE
- �3 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
14) RSSI indicator (Based on Cell power)
BAR WCDMA GSM/DCS/PCS
5 > -74 dBm > -78 dBm
5 4 -76 ±2dBm -80 ±2dBm
4 3 -86 ±2dBm -89 ±2dBm
3 2 -96 ±2dBm -98 ±2dBm
2 1 -102 ±2dBm -104 ±2dBm
0 < -110 dBm < -110 dBm
15) Battery indicator
Battery Bar Specification
BAR 6 (Full) 90% over
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up 0% ~ 3% : Every Level change popup (No call)
POWER OFF 0%
remain%
2.7 P925 Figures
3. TECHNICAL BRIEF
- �4 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
The LG-P920 supports UMTS-900, UMTS-1900, UMTS-2100, GSM-850, GSM-900, GSM-1800, and GSM-1900 based
GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radio One Zero-IF architecture to
eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM
transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop that translates the
GMSK-modulated or 8-PSK-modulated signal to RF.
[Figure 3-1] Total Block diagram of RF part
3. TECHNICAL BRIEF
PMU
RD_HRD HX
VCTCXO26MHz
AFC DACXO VCONT
PMURF6590
1V2 1V8 2V852V65
FilterB9469
GPS IN
DiplexerRD_HX AFC_DACXO VCONT
PAM DCDC
RF6560VOUT FB
9
PM L
GSM_LB_TX
GSM_HB_TX
B8 TXAnt B8
CP_OUT
VOUT_FB
B7953TRX4
VCC
MMMB
RF6260
TransceiverPMB5712
PM_L
PM_H
B8_TX
B5_TX
B2_TX
B1_TX
B4 TX
Ant_B8
Ant_B5
Ant_B2
Ant_B1
Ant B4
B7953B8 DPX
B7671B5 DPX
B7955B2 DPX
B7696B1 DPXTRX2
TRX3
TRX4
TRX5
XMM6260
ST8T
BGSF18D
RX_L1XRX_L1RX_L2XRX_L2
SYS_CLK
B4_TXAnt_B4
Ant_B3
B7959B4 DPX
DCSSAW filter
SYS_CLK_EN
REF_CLK_EN
TRX1
TRX6
SYS_CLK
SYSCLKEN
REF_CLK_ENBGSF18D _
RX_M2XRX_M2RX_H2XRX_H2
RX_H1XRX_H1RX M1X
DI3_TX_DATDI3_TX_DATX
DI3_RX_DATDI3_RX_DATX
Di3_TX_DATDi3_TX_DATX
Di3_RX_DATDi3_RX_DATX
_MRX_M1
The LG-P9�5 supports UMTS-850, UMTS-1900, UMTS-�100, GSM-850, GSM-900, GSM-1800, and GSM-1900 based
3. TECHNICAL BRIEF
- �5 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.1 Radio Part General
SMARTi™ UE2 is a highly integrated UMTS/GSM-transceiver, with all necessary features to enable multi mode,
multi band mobile cellular devices. It incorporates a fully integrated dual mode receiver with main and diversity
chains, 2 multi band TX outputs, control, Digitally controlled crystal support, a measurement interface,
DigRFV3.09 compliant high speed data and control interface, a multi mode timer unit and all necessary front end
signals for the complete RF Engine control. Overall the IC directly supports RF engines with up to 4 GSM bands
and typical 4 UMTS (can be less or more depending on engine setup) bands without additional discrete RF path
switches.
[Figure 3-2] SMARTi UE2 main feature
-. 3GPP release 7 (HSPA+)
-. Up to 5 UMTS-FDD / 4 EDGE Bands
* Band I ~ VI, VIII ~ X * EGPRS MSC 33 / 34
* 28Mbps DL / 11.5Mbps UL (HSPA+ 64 / 16QAM)
* 14.4Mbps HSDPA / 5.76Mbps HSUPA (cat 10 / 6)
-. Standard DigRF V3.09 interface to Digital BB
-. Multi-Mode / Multi-Band Single-Chain Tx Concept
PowerControl
DiversityReceiver
PMU
W1
GW�
GW5
GW6
Xtal
DigRF 3GV3_09
Data&
Control
MainReceiver
W1
GW�
G1300
GW5
GW6
DigitalModulator
Lo band
Hi band
FE CTRL(GPO/SPI)
Ctrl
Det
Ctrl DC/DC
3. TECHNICAL BRIEF
- �6 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.2 Radio Part Rx Section
For the RX section the IC features 6 RX inputs, 4 of those might be used for multi mode receive, this means they
can be used for GSM and UMTS (the IC can be reconfigured to achieve in spec performance) operation. The
highband input are for UMTS operation only. The multi mode inputs include first LNA (for GSM and UMTS)
without and additional external LNA and inter-stage filter. The receiver structure is optimized for compressed
mode operation, thus only a single base band chain is used, saving area and optimizes power consumption. The
receiver AGC can be aligned to the UMTS frame structure.
Additionally to the normal receiver the IC contains a diversity receiver part, enabling up to 4 band Rx diversity for
GSM and UMTS mode without external LNA’s and inter-stage filters.
[Figure 3-3] 2G / 3G Rx Block Diagram
RD_L1
RD_L1X
RD_L�
RD_L�X
RD_M
RD_MX
RD_H
RD_HX
RX_L1
RX_L1X
RX_L�
RX_L�X
RX_M1
RX_M1X
RX_M�
RX_M�X
RX_H1
RX_H1X
RX_H�
RX_H�X
0/90°
LPF
LPF
ADC
ADC
MUX MUX
S&H
S&H
HPF
HPF
�G Mode
3G Mode
FIR
FIR
DigRFRX synthesizer
0/90°
LPFADC
LPFADC
MUX MUX
S&H
S&H
HPF
HPF
�G Mode
3G Mode
FIR
FIR
3. TECHNICAL BRIEF
- �7 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.3 Radio Part Tx Section
The TX features 2 RF outputs, which are directly matched to 50 impedance for easy connection to external
power amplifiers, which reduces significantly external component count. Those 2 outputs are high power, small
signal polar modulated outputs for the GSM and UMTS system, with low sensitivity to PA harmonics. They are
capable to perform GMSK or 8-PSK as well as UMTS modulation signals with excellent noise performance, thus
no inter-stage filter in between transceiver and PA is required. The transmitter outputs are broadband, one
covers all low bands (Band V, VI, and VII), the higher band output covers all GSM and UMTS bands Band I, II, III, IV,
IX and X. The output driver is capable to support high output powers to enable low cost single chain PA’s.
The IC features additionally closed loop power control for GSM and for UMTS, thus supporting TRP requirements
in cooperation with the power amplifier and the antenna design. There is one input ball for the power detector
voltage coming from the PA, and one input ball for the RF signal fed back to the TRX. The complete loop circuits
are implemented in the digital domain, which enables a high reliability of the loop performance for both
standards.
[Figure 3-4] Single Chain PA’s Tx Architecture
DIG RF3G
1C HIP
FIFO
I/Q-C
hain1� bit
sign
0C HIP
1� bitsign
I/Q to
R/P
hi AM-Path
PM-Path
TX-Disruptor
AM-Path
PM-PathI/Q to
R/P
hi
I/Q-C
hain
�GM
odul
ator
Feedback RX
Detector ADC
to signalchain
Feed
back
Sifn
alPr
oces
sing
3. TECHNICAL BRIEF
- �8 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.4 Radio Part Interfaces
The base band is connected via a DigRF V3.09 high speed data interface with a maximum clock frequency of 312
MHz. The pure digital interface enables the digital baseband to shrink efficiently, as all the analog functionality is
within the RFIC. All data and control traffic is multiplexed via the RX and TX interface lines. The IC features a high
level programming model enabling the complete compressed mode operation of the device in an RF engine
environment. It handles RX and TX power control, also incorporating the calibration data.
The complete timing is optimized for compressed mode operation of the transceiver, it controls the front end
components of the engine (PA´s, switches, Antenna switches etc…). Additionally a SPI control bus for front end
component control is available on the IC, which also enables the read back of data from external components,
thus the handling of functions like PA saturation, mismatch detection, overheating (incorporated in the closed
loop power control) can be adopted.
[Figure 3-5] DigRF Architecture
Table 3-1. DigRF I/F path’s Data Rates
DigitalBaseband IC
DI3_RX_DAT
DI3_RX_DATX
SYS_CLK
SYS_CLK_EN
DI3_TX_DAT
DI3_TX_DATX
RLVDSDriver
SysClkDriver
PLL31� MHz
RLVDSReceiver
PhaseCorrelator
RetimedData
RetimedData
S/PConverter Deframer
Control
Data
Control
Data
P/SConverter Framer
RF IC
3. TECHNICAL BRIEF
- �9 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.5 Digital Baseband (OMAP4430)
The OMAP4430 high-performance multimedia application device is based on enhanced OMAPTM architecture
and used 45-nm technology. The device is associated with power and audio integrated circuits(ICs) that is called
TWL6030 and TWL6040.
OMAP4430 Block Diagram (Typical Connections Shown)
TVout
OMAP4430
2 or 4xLPDDR2SDRAM
eMMC(JC64)
SD/MMC
Main isplayd Sub isplaydTouch creens Secondarycamera
Primarycamera
TWL6030
DVFS Ctrl
NFC
I2C Ctrl
Finger rintp/ Slide pad
Other flashmemory
(Nor, Nand,OneNand, ...)
Micro USB
HDMI companion(LS+ESD+StepUp)
NVM LPDDR 2memory
S/PDIF
TWL6040
Audio
Headset
Micro
Handsetmicrophones x2
Earspeaker
I2C Ctrl
Headset
I2C4
SDMMC 1
LPDDR21
LPDDR22
Keypad
1 2 3
4 5 6
7 8 9
* 0 #
Vibrator/ctuator
x2a
WL1283 BT/FM/GPS/WLAN
AChargerc
BQ24156
USBcharger
Chargerinterface
Power
Mainbattery
Gasgauge
Backupbattery
Buck-oostb
BoostSpeakers
Vbat
HF speakersx2
Handsa
-freemplifier
Vibrators
3G
Mobile TV
HSI
M SPIC 4
M BSP2C
SDMMC2 GPMC
SR I2C1 MCPDM DMICM ASPC
USBA0-OTG
KEYBOARD SDMMC5SLIMBUS1
UART2
M BSPC 1M BSPC 2 M SPIC 2
IrDA
I2C3
CCP2CVIDEO
CSI2-A CSI2-BHDMIDSI2DSI1M SPIC 1
C2C
RFBI
M SPIC
intro-002
NFC
PicoDLP®
DISPC2 DISPC2
I2C2
Touch creens
I2C2
RFBI
M BSPC 2
M SPIC 3
UART3
USBB1-ULPI/HSIC
I2C2
UART3
SDMMC4
Public Version
www.ti.com Environment
1.2 EnvironmentThis section provides an overview of the OMAP environment. The device is associated with power andaudio integrated circuits (ICs). TI provides a global solution with the TWL6030/TWL6040 devices.
Figure 1-1 is an overview of a nonexhaustive environment for the high-tier OMAP4430 device.
Figure 1-1. OMAP4430 High-Tier Environment
257SWPU231M–July 2010–Revised November 2010 Introduction
Copyright © 2010, Texas Instruments Incorporated
PREL
IMIN
ARY
3. TECHNICAL BRIEF
- 30 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Cortex-A9 MPU Subsystem
Two ARM Coretex-A9 MPCore
IVA-HD Subsystem
The IVA-HD subsystem is a set of video encoder/decoder hardware accelerators. It supports up to 1080p x 30 fps,
slow-motion camcorder, triple play (HD and SD capture and JPEG capture), real-time transcoding of up to 720p,
and video conferencing up to 720p.
The IVA-HD supports:
MPEG-1/2/4, Divx 5.02, H.263 P0 (encode/decode) and P3 (decode), H.264 Annex G (scalable baseline profile up
to 720p), H.264 BL/MP/HP, H.264 Annex H(partial), Stereoscopic video, JPEG(encode/decode), VC-1 SP/MP/AP,
AVS-1.0, RealVideo 8/9/10 (decode only), On2 VP6.2/VP7 (decode only)
Display Subsystem
Display controller
: Three video pipelines, one graphic pipelines, and write-back pipeline.
Two LCD outputs, One TV output.
Remote frame buffer interface (RFBI) module
Two MIPI display serial interface (DSIs)
High-definition multimedia interface (HDMI) encoder
: HDMI 1.3, HDCP 1.2, and DVI 1.0 compliant
Deep-color mode support (10-bit for up to 1080p and up to 12-bit for 1080i/720p)
NTSC/PAL video encoder
ABE (Audio Back End) Subsystem
The ABE subsystem handles audio processing for the application. It manages the audio and voice streams
between the Cortex-A9 MPU subsystem and/or DSP, and the physical interfaces.
Imaging Subsystem (ISS)
The ISS processes data coming from the image, memory, and IVA-HD subsystem. The ISS is responsible for
multimedia applications such as : camera viewfinder, video record with up to 1080p at 30 fps with digital zoom
and still image processing, such as image capture up to 16 Mp with digital zoom and rotation. The ISS supports a
pixel throughput of up to 200Mp/s. It assures good performance with sensors up to 16 Mp and more (higher
resolution can be achieved through multiple passes).
2D/3D Graphics Accelerator
The 2D/3D graphics accelerator subsystem in based on POWERVR SGX540 core from Imagination
Technologies. The SGX can process different data types simultaneously.
In addition to its processing elements, an extensive set of peripheral interfaces enables communication with all
necessary external devices.
3. TECHNICAL BRIEF
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LGE Internal Use Only
LCD 4.3”4.3” TFT 3D
EARO EAR_PIECE(RCV)FM_ANT
SDIO5
McPDMI2C2
DSI
I2C2
McBSP1(PCM)
UART2 TWL6040BT/WLAN/FM
(WL1271)LED
Backlight Driver IC
Touch
4.3 TFT 3DLCD
(480x800)
PDM
AUXLR
3.5 pi Ear MIC(Ear_Jack)
SPKMIC1MIC1
SPK
HS_MICHSOLR
FM_L/R
HiFi & PCM Voice
McBSP3(I2S)
MIC2MIC2
FM
OMAP4430
SDMMC2
SDRC
I2C4
I2C1TCXO Driver
38.4MHZProximity
Light Sensor
Motor
2Gb-2chLPDDR2
eMMC (8Gb)
CompassDriver IC3.5 pi Ear_Jack
HSOLRMCLK
POP
I2C4
FM_ANT
3D CAMERA
GPIO_25DMTIMER8_PWM_EV
TSDMMC2 I2C1
PMB5712A-GPS
VT0.3MMIPI
5M AFMIPI(P)
5M AFMIPI(S)
eMMC (8Gb)
CSI1
CSI2HDMI
LNAFEM
UART3
Fuel gauge
3D CAMERA T
GPIO
UART1
SDMMC1
McSPI4
GPIO_120XMM6260
5M CAM Flash
HDMI
I2C2USIF3
GPIO_35I2S2
Keypad
KB_COL/ROW
MCSPI2(PCM)
1GbNAND512MbDDR
NAND
DDR
MCPDigRF
MIPI_HSIMIPI_HSI
IPC_SRDYGPIO_119 GPIO_34IPC_MRDY
I2C1I2C3
USBUART4
JTAG
Key LEDGyro
JTAGJTAG
USB
JTAGUSIF1
USIM1Accelerometer
I2C
I2C4GPIO_82
PMIC_AP(TWL6030)
32.768KHz
Charger
I2C32.768KHz
PWR-ON KEYVCHG
VBATCoin cell
BatteryMUIC
3.6 Hardware Architecture
<System HW Block>
Figure. Block Diagram
3. TECHNICAL BRIEF
- 3� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.7 Subsystem (PMB9811_X-GOLDTM626)
The X-GOLD™ 626 is a 3GPP Release 7 dual-mode baseband modem which is expected to connect to an
application processor in order to create a high-end smartphone solution. It can be used to create a data-card
solution as well. This section provides a high-level view of the chip architecture. More details can be found in the
sections that follow.
The X-GOLD™ 626 can be broken into 6 major subsystems: Backbone, Connectivity, Audio, 2GL1, 3GL1, and PMU.
Each of these subsystems play important roles for operation of the modem.
Fig.3.7 Architecture Block Diagram of X-GOLD™ 626
X-GOLD™ 626PMB 9811
X-GOLD™ 626 Architecture ConceptsCONFIDENTIAL ci
Preliminary Product Overview 57 Revision 1.0, 2010-04-26 ARC__Overview.fm EDD 3.4
010203040506070809101112131415161718192021222324252627282930313233343536373839404142
Figure 6 Architecture Block Diagram of the X-GOLD™ 626
4.1.2 Architectural CharacteristicsThe X-GOLD™ 626 comes along with the following architecture units.
BackboneAudio
DigRF 3.09
2GL1
2G DSP1
RF IF
3GL1
RakeRake
3G DSP
HSDPAHSIRXHSORX SYNC_TX
TxBitProcTxModDPE
SearcherOLP
MRAM
USI
CPU XBAR
LMUROM
LMURAM
COMRAM
Bridge Peripheral XBAR
Connectivity
3 (+2)
2
6
Audio DSP1
I2S2
I2S1 6
6
BB_ArchitectureOverview.vsd
1
L2 Cache256kB
8
Audio DSP2
PMUSD1
(VDDCore)SD2
(VDDIO)
VPLL
VSIM
VPMU VRTC
VUSBVANA
MeasurementTSMU
POR
VMIPI
2G DSP2
RTC
EBU
ARM1132kB I-Cache32kB D-Cache
8kB I-TCM8kB D-TCMET
M11
DMA1 8-ch
FCDP
USIM
SharedMem
ICU
STM
DMA2 2-ch
USIF2
USIF3
CEU
USB-FS
USB-HS
USB-HSIC
ABW
MIPI HSI
SD-MMC1
SPCU
CGU
SCU
I2C1
MIPI PTI
GPTU1
GPTU0
CAPCOM1
CAPCOM0
PCL/GPIO
USIF1
DAP
Shared Mem
GUCIPH
GSI62
(+4)
5
2
(+5)
7
2
7 (+7)
2 (+10)
5
7
GSM Timer
ChannelDecoder
EqualizerAccelerator
IRMemory
GSMCipher
SSC
Control Unit
31
DSPTimer
DSPInterrupt
DSPTimer
DSPInterrupt
MACPHYDL-MACPHYUL-MACPHY
ORXR99ORX
MCUARM7ETM7ICU
USIF5
3GCU
Copy
for L
GE
Prov
ided
Unde
r NDA
3. TECHNICAL BRIEF
- 33 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.7.1 The Backbone Subsystem
The backbone subsystem contains elements which handle the main processing in the system. The protocol stack
is expected to execute here. The ARM™1176 acts as the main CPU, it is connected via the CPU XBAR with the
internal memories (RAM, ROM), the external bus interface, and the 8-channel DMA (DMA1). There is level 1 cache
and tightly-coupled memory incorporated within the ARM which help with the performance of the CPU. A level
2 cache is also added to this which helps even further with the system performance. Given that the modem is
expected to support high data rates for HSDPA (category 14) and HSUPA (category 7), these additional elements
are necessary. The ARM™1176 also has the capability of controlling the peripherals in the device that are
connected to the Peripheral XBAR via a bus bridge. This 32-bit multi master AHB bus is connected to all
peripherals.
The Clock and System Control Unit (CSC) consists of the system control unit (SCU), system power control unit
(SPCU) and the clock generation unit (CGU). These units are responsible for the reset handling, the clock
multiplexing and switching and the power control of the device.
3.7.2 The Connectivity Subsystem
There are a rich set of peripherals included in the connectivity subsystem which allow interfacing to external
devices. It is required that we have connectivity for inter-process communications (IPC) with the AP, SIM card
support, external interrupts, external memory cards, trace and debug, external device control (A-GPS), and
general purpose I/O. For IPC there are 3 generic interfaces: USB HSIC, MIPI HSI, and USIF3 (which provides UART
and SPI operation). SIM and FS-USB interfaces are dedicated to the SIM-Card. External interrupts are included for
waking the modem from low power modes. There is a SD-MMC interface for utilizing memory cards in datacards
applications. The USB-HS, USIF1, and MIPI PTI interfaces can be used for tracing purposes. NAND flash can be
connected to the FCDP interface for supporting memory accesses. External devices can be controlled by the
baseband through the I2C interface. There are also generic input/output pins that can be used to connect the
baseband to external components in the system. These peripherals occupy a different number of pins as
indicated in Fig.3.7. The number in parentheses refer to additional signals which are available only as alternate
functions behind other functions.
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.7.3 2GL1 Subsystem
While the upper layers of the modem software stack run on the main CPU, physical layer processing takes place
in the layer-1 subsystems. The 2GL1 subsystem contains 2 DSPs, which help with layer-1 processing in 2G modes.
The added DSP helps with higher performance use cases such as receive diversity and multi-slot classes. It
contains a set of dedicated HW peripherals (equalizer, etc) and connects to the digital RF interface.
3.7.4 3GL1 Subsystem
While in 3G modes, assistance is required from the 3GL1 subsystem. An ARM™7 CPU deals with the
communication of the 3G subsystem with the stack SW running on the ARM™1176 and handles the scheduling
of the different activities between the 3G HW peripherals (RAKE, DPE, Searcher, HSDPA Inner Receiver, Rel99-
and HSDPA-Outer Receiver). The signal processing tasks are handled by the 3G DSP. The up-link and downlink
data will be buffered in the COMRAM which connects to the ARM™1176 system via the MACPHY peripherals.
Connection to the RF is managed by the DigRF peripheral.
3.7.5 The Integrated PMU Subsystem
The integrated PMU subsystem contains all of the supplies necessary for powering the baseband in the platform.
There are two step down converters for the digital core voltage (SD1) and digital IO voltage (SD2). Seven linear
voltage regulators provide the supply voltages for various internal and external components.
3. TECHNICAL BRIEF
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3.7.6 Audio Subsystem
An overview of the Audio Subsystem hardware architecture can be found in Figure 3.7.6.
The three main entities relevant for the audio processing are
• ARM™1176 Embedded Microcontroller Unit core (ARM™1176)
• Embedded Digital Signal Processor cores (DSPs)
• 3rd Party IP CODEC
Fig.3.7.6 Audio Subsystem Block Diagram
3. TECHNICAL BRIEF
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ABE Overview
The audio back end (ABE) module is a subsystem that manages various audio and voice uplink and downlink
streams between the initiator (the Cortex™-A9 microprocessor unit [MPU], digital signal processor [DSP], or
direct memory access [DMA] controller) and the peripheral physical interfaces (multichannel buffered serial port
[McBSP], SLIMbus®, digital microcontroller [DMIC], multichannel pulse density modulation [McPDM], and
multichannel audio serial port [McASP]).
The ABE module handles the audio processing for the applications. It receives voice or audio samples from the
initiator or the external audio chip (TWL6040 or other) and sends them to the peripheral interfaces or memories
after processing. The ABE can perform buffering of audio samples, mix audio with a voice down stream and/or a
microphone up stream (sidetone), and can apply some post-processing.
The ABE integrates the following modules:
• Peripheral physical interfaces:
– Three McBSP modules
– One McASP module
– One mobile industry processor interface (MIPI) SLIMbus interface
– One DMIC module to support up to six mono and up to three stereo digital microphones
– One McPDM module to support interconnect with an external audio chip.
• Audio engine (AE):
– Performs real-time signal processing like sample rate conversion, filtering, equalizing, and side-tone
– Audio traffic controller (ATC):
• Performs data move in the ABE
• Generates interrupt requests to the DSP and Cortex-A9 interrupt controllers
– On-chip memory:
• 64KB of RAM; 32-bit data memory (DMEM)
• 6KB for coefficient memory RAM (CMEM)
• 18KB for sample memory RAM (SMEM)
• 8KB for program memory RAM (PMEM)
• Local L4 interconnect (L4_ABE) to:
– L3 interconnect
– Cortex-A9 MPU
– DSP
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The Cortex-A9 MPU and the DSP have private access to the L4_ABE interconnect. All other initiators (sDMA) can
access the L4_ABE only through the L3 interconnect.
• Timers:
– Four general-purpose (GP) timers
– One watchdog timer
• Clock and reset management: Receives clock and reset signals from the device PRCM module. The audio
engine operates from the DPLL_ABE, which is in the PRCM module. The ABE modules can be supplied with clock
signals from the DPLL_ABE or the DPLL_PER. The ABE has its own hardware reset domain (AUDIO_RST).
• Power management: The ABE module is power-independent. It has its own dedicated power domain (PD_ABE)
and can execute audio processing with the rest of the device in retention or in off mode.
• Each peripheral in the ABE can be accessed directly by the initiator when the AE is bypassed (legacy mode, for
old software compatability).
Figure 3.7.6.1 is a high-level overview of the ABE.
Fig.3.7.6.1 Audio Back End
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AE Subsystem
The AE is the core of the ABE subsystem. It performs the real-time audio processing within the ABE:
mixing, muxing, volume control, smooth muting, sampling rate conversion, and side-tone equalization. The AE
subsystem also processes and executes all data transfers. To optimize the global processing, the ATC moves the
data. An IRQ/DMA controller controls system IRQ and DMA requests. Input DMA requests come from the ABE
peripherals, and output DMA requests and IRQ are generated and sent to the system (Cortex-A9 MPU interrupt
controller, DSP interrupt controller, system DMA [sDMA], and the DSP enhanced direct memory access controller
[eDMA]).
The AE subsystem contains:
• AE: processes and executes the micro code with its own RAMs:
– SMEM
– CMEM
– PMEM
• DMEM contains the audio buffer and communication circular buffer.
• ATC: Transfers data between all modules in the ABE
• IRQ DMA controller
For more information about the audio engine, see the Audio Back-End (ABE) and Hardware Abstraction Layer
(HAL) Addendum.
Multichannel Audio Serial Port
The multichannel audio serial port (McASP) is a GP audio serial port. It is useful for intercomponent (DIT)
transmission. The McASP is intended to be flexible enough so that it may connect gluelessly to audio A/D, D/A,
CODEC and SPDIF transmit physical layer components.
McASP has the following features:
• 2-interconnect slave interface supports:
– One interconnect configuration slave interface
– One interconnect DMA slave interface
– 32-bit data bus width
– 16- and 32-bit access
– 10-bit address bus width
– Burst not supported
– WNP
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• Supports idle request/acknowledge protocol
• Buffers for transmit/receive operations
• DMA requests (one per direction) link with the 32-bit register
• Up to four transmit channels
• Four serializers implemented
• Support of disconnect protocol
Multichannel Buffered Serial Port
There are three McBSP instantiations: McBSP1 through McBSP3. They provide a full-duplex direct serial interface
between the ABE and external devices, such as other modems, BT chips, or codecs. Because of its versatility, a
McBSP can accommodate a wide range of peripherals and clocked frame-oriented protocols (I2S, PCM, TDM).
List of recommended usage per McBSP:
• MCBSP1: BT voice/audio data
• MCBSP2: Digital baseband (DBB) voice data
• MCBSP3: MIDI FM data
The McBSP has the following features:
• Interconnect slave interface (internal interconnect) supports:
– 32-bit data bus width
– 8-, 16-, and 32- bit access
– 10-bit address bus width
– Burst not supported
– WNP
• Buffers for transmit/receive operations: 128/128 32-bit words (McBSP1, 2, 3)
• Interrupts configurable in legacy mode (two requests) or PRCM-compliant (one request)
• DMA requests (one per direction) triggered with programmable FIFO thresholds
• Multidrop support
• Serial interface description
• Four-pin configuration (McBSP1, 2, 3)
• Full-duplex communication
• Multichannel selection modes
• Support to enable or block transfers in each channel
• Up to 128 channels for transmission and for reception
• Supported protocols
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• Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially connected A/D
and D/A devices:
– I2S-compliant devices
– TDM bus devices
– PCM devices
• A wide selection of data sizes: 8, 12, 16, 20, 24, and 32 bits
• Supports idle request/acknowledge protocol
• Clock generation support:
– Independent clocking and framing for reception and for transmission up to 48 MHz
– Support for external generation of clock signals and frame-synchronization (frame-sync) signals
– A programmable sample rate generator for internal generation and control of clock signals and
frame-sync signals
• Support of disconnect protocol
Multichannel Pulse Density Modulation Module
The McPDM is a proprietary interface based on multichannel pulse density modulation. The module consists of
five downlinks and three uplinks. Two other uplink channels are reserved for status communication.
The McPDM has the following features:
• Interconnect slave interface (L4_ABE internal interconnect) supports:
– 32-bit data bus width
– 10-bit address bus width
– Burst not supported
– WNP
• Full-duplex communication:
– Five audio downstream channels
– three audio upstream channels
• RX/TX FIFO operations: 32-bit words per channels
• Complies with PRCM interrupts:
– One to the MPU subsystem
– One to the DSP subsystem
• DMA requests (one per direction) triggered with programmable FIFO thresholds; depending on the FIFO
implementation, one per channel or one per direction
• Decimation filter for embedded uplink paths (five paths if two status paths)
3. TECHNICAL BRIEF
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• Oversampling for embedded uplinks (five paths)
• Sigma delta for embedded downlinks (three paths)
• Deserializers for the two status upstream channels
• Support of disconnect protocol
Interface
Phoenix audio comprehend 3 different interfaces:
1. I2C interface for the information with non-critical latency.
2. PDM interface for the audio signal and the register associated with audio path (gain, control)
3. GPO for audio IC interacting with Phoenix audio (drivers, power provider)
Some “dual access” registers (addresses 0x0A to 0x1B) can be accessed by both I2C and PDM.
By default, the concurrent access is disabled and only the PDM
interface can write in these registers. The R/W access can be switched to I2C only by setting bit
I2CSEL. A concurrent access by both I2C and PDM interfaces is also possible by setting bit
PDMI2CSEL. In this last case, Phoenix audio will not provide arbitration of simultaneous accesses and
the functionality of the system will not be guaranteed if this happens. In this mode, the software must ensure
that access by one interface is complete before using the other one, in order to avoid any
collision
3. TECHNICAL BRIEF
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PDM Interface
The PDM interface is the over-sampled serial interface used for communication between Phoenix audio and the
application processor companion chip.
PDM_CLK is 19.2 MHz or 17.64 MHz and data rate represented by PDM_FRAME is respectively 1.92 MHz or 1.764
MHz. Words of data can be transmitted from OMAP to ABB chip using PDM_DN line (downlink path) but words
of data can also be transmitted from ABB chip to OMAP using PDM_UP line (uplink path).
Both chips are synchronized through PDM_FRAME line. By default OMAP is the owner of PDM_FRAME but
during transmission, ABB chip can send back to OMAP some low-latency data by using frame line. This will be
detailed later in this chapter.
Phoenix audio PDM interface consists of three different modes, Normal mode, Command mode and Test mode.
Normal mode and Command mode are intended to use with OMAP McPDM. Test mode is designed for
evaluation and production test.
Fig.3.7.6.2 PDM Interface connectivity between Phoenix and OMAP4 McPDM
3. TECHNICAL BRIEF
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3.7.7 Vocoder Subsystem
FR, HR, EFR speech channels (TCH/FS, TCH/HS, TCH/EFS)
• NAMR/WAMR speech channels over GMSK and 8PSK
• Mandatory sub-functions for speech channels:
– Discontinous transmission (DTX)
– Voice activity detection (VAD)
– Background noise calculation
• Fullrate and halfrate data channels (F14.4, F9.6, F4.8, F2.4, H4.8, H2.4)
3.7.8 Memory Subsystem The X-GOLD™626 can use the general term SDRAM as a shortcut for Mobile DDR SDRAM.
A total of up to four external memories is supported, chip selects can be dynamically allocated to one of the two
external memory controllers of X-GOLD™626. Only two memory devices can be connected to the SDRAM
controller if DDR support is required.
3.7.9 Battery Management – Hardware Configurations The X-GOLD™626 chip has an internal PMU that will provide power supply for the chip itself, memory and the
attached RF. The X-GOLD also holds a measurement unit that can perform all necessary battery measurements
through external HW. This is sufficient for a modem only design where charging is controlled by another chip.
3.7.10 Clocking The clocking system is based on 2 different clocks, a 26 MHz reference clock generated within the RF Engine and
a 32 kHz real-time clock (RTC) generated in the baseband. The 26 MHz clock provided by the RF engine is the
main reference clock for the RF circuit and the X-GOLD™626. Also other system components may be supplied
with 26 MHz reference clocks. A 32 kHz oscillator located at the X-GOLD™626 supplies the RTC with the reference
clock for the real time clock application, as well as provides a low power standby clock for system sleep mode
operation. This clock is available
also for other system components like GPS.
.
3. TECHNICAL BRIEF
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3.7.11 USB
The XMM™6260 platform provides two USB interfaces compliant to the USB2.0 standard:
• High speed interface (480 Mbps) for communication with external devices acting both as host or device
• Full speed interface (12 Mbps) for communication with the UICC using the IC-USB standard acting as host
The USB solution is based on USB controller hardware IP, which is integrated in the X-GOLD™626 baseband chip
including both USB transceivers for high and full speed and the USB Stack software that implements the
different USB device classes and features.
The HS USB component supports the following features:
• Modem connection for Dial Up Networking and AT command interface (CDC-ACM)
• Tracing over USB (CDC-ACM)
• File System Access (Mass Storage Device)
• Audio over USB
• Suspend/Resume and Remote Wakeup and selective suspend (for power saving)
• Software download
The IC-USB component supports the following features:
• UICC-Terminal USB interface according to ETSI TS 102 600 (ICCD / Mass Storage / CDC-EEM)
• Suspend/Resume and Remote Wakeup (for power saving)
The USB HSIC component supports the following features:
• Modem connection for DialUp Networking and AT command interface (CDC-ACM)
• Tracing over USB (CDC-ACM)
• Suspend/Resume and Remote Wakeup, device triggered suspend (for power saving)
• LPM according to "USB 2.0 Link Power Management Addendum", Remote Wakeup (for power saving)
• Wake-up by sideband signals (optional for optimized power consumption)
• Software download, flashless boot
The USB HSIC component supports the following features:
• Modem connection for DialUp Networking and AT command interface (CDC-ACM)
• Tracing over USB (CDC-ACM)
• Suspend/Resume and Remote Wakeup, device triggered suspend (for power saving)
• LPM according to “USB 2.0 Link Power Management Addendum”, Remote Wakeup (for power saving)
• Wake-up by sideband signals (optional for optimized power consumption)
• Software download, flashless boot
3. TECHNICAL BRIEF
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3.8 Power Block
3.8.1 General
Since P920 uses two individual chips, XMM6260 (IFX Modem) uses integrated PMIC and OMAP4430 uses
TWL6030 as a main PMIC.
3.8.2 XMM6260 (IFX Modem)
X-GOLD™ 626 is a GSM/UMTS/GPRS/EDGE/HSDPA/HSUPA Baseband Controller with integrated modem power
management unit. This system on chip is designed with the latest low power CMOS process technologies which
provides significant performance to meet the ever increasing demands of the cellular subscriber market for
feature rich terminals at lowest power consumption and a very competitive cost position.
Figure. LGP920 Modem Power Block Diagram
X-GOLD™ 626PMU Sub-System
General OverviewConfidential
Product Specification 9 Revision 2.22, 2010-05-10Hardware Description
1.1 PMU Block diagram
Figure 1 PMU Overview
LRTC
Bandgap
Digital Control
POR
LUSB_PD
LUSB_ANA
LPMU
LUSB_IO
SD1
SD2
LPLL
SSC
OSC
MU
SD1_FB
SD1_SW
VDD_VBAT_SD1
VSS_SD1
SD2_FB
SD2_SW
VDD_VBAT_SD2
VSS_SD2
VUSB_ANA
VPLL
VUSB_IO
VRTC
VPMU
VSIM
VREF
AGND
LSIM
VDD_VSD2
ANAMONANAMON
RESET_PWRDWN_N
ON
2_N
ON
1
VSS_
PMU
VDD_
VBA
T_PM
U
B
B
Battery
XGOLD626 PMU
M1
M2
M3
M4
Ball
RES
ET_B
B_N
VUSB_PD
LIO_12
FSS eFuses
VIO_12
CVSIM
CVPMU
CVRTC_BUF CVRTC
CVUSB_IO
CVPLL
CVUSB_ANA
CVUSB_PD
CVREF
CVIO_12
LSD1
LSD2
CVSD1
CVSD2 CVDD_SD2
CVDD_SD1
V
V
CVDD_VBAT
2x
2x
TRIG
_B
REF
_CLK
_EN
TM_E
N
Battery Supervision
DCDCSupervision
P9�5
P925
3. TECHNICAL BRIEF
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3.8.3 TWL6030
The TWL6030 is an integrated Power Management IC for applications powered by a rechargeable battery. The
device provides 7 configurable step-down converters with up to 1.5A capability for Memory, Processor Core, IO,
auxiliary, pre-regulation for LDOs, etc. It contains also 11 LDO regulators which can be supplied either from
battery or from pre-regulated supply. Power up / power down controller is configurable and can support any
Power up / down sequences (EPROM based).
The Real Time clock (RTC) provides 32KHz output buffer, seconds, minutes, hours, day, month, and year
information as well as Alarm wake up. The TWL6030 supports 32KHz clock generation based on crystal oscillator.
The device integrates also a Switch mode charger allowing faster battery charge, higher efficiency & less power
dissipation.
The TWL6030 generates power supplies for OMAP4 and operates together with TWL6040 which includes all
audio and related detection features. For audio IC parameters, see TWL6040 Datasheet. In addition TWL6030 can
be used as PMIC for several other processors, thanks to the programmable startup/shutdown controller and
default supply voltage levels. The TWL6030 is available in an nFBGA package 7.0mm x 7.0mm with 0.4mm ball
pitch.
3. TECHNICAL BRIEF
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PR
OD
UC
T�P
RE
VIE
W
SWCS045-001
VCORE1
VCORE2
VCORE3
VMEM
V1V8
V 2V1
V1V29
Power control
VANA
VRTC
Interrupt handler
Extcharger
ctl
OSC3 MHz
I2C to OCP
RTC
Control, data,and
test logic
Events bus
Card detectand
PWM
Xtal32K
RC32K
RC24M
USB SRP
I2C control
I2C SmartReflex
Events detect
SR bus
SRI2C_SDA
SRI2C_SCL
ID
CTLI2C_SDA
CTLI2C_SCL
SIM
MMCBATREMOVAL
PWM1
BOOT0BOOT1BOOT2BOOT3
RESPWRONNRESWARM
PWRONRPWRON
PREQ1PREQ2A
PREQ3INT
SYSENREGEN1REGEN2
MSECURE
CLK32KGCLK32KAO
CLK32KAUDIO
OSC32KOUT
OSC32KIN
VAC
CHRG_CSIN
CHRG_CSOUT
CHRG_EXTCHRG_ENZ
CHRG_EXTCHRG_STATZ
USBcharger
andVBUSOTG
CHRG_PMID
CHRG_SW
VBUS
CHRG_AUXPWR
CHRG_GND
VANA
VANA_IN
VRTC_IN
VRTC
V1V29_SW
V1V29_IN
V1V29_FDBK
V1V29_GND
V2V1_SW
V1V2_IN
V2V1_FDBK
V2V1_GND
V1V8_SW
V1V8_IN
V1V8_FDBK
V1V8_GND
VMEM_SW
VMEM_IN
VMEM_FDBK
VMEM_GND
VCORE3_SW
VCORE3_IN
VCORE3_FDBK
VCORE3_GND
VCORE2_SW
VCORE2_IN
VCORE2_FDBK
VCORE2_GND
VCORE1_SW
VCORE1_IN
VCORE1_FDBK
VCORE1_GND
REFS
TESTEN
TESTV
PWM2
10-bitADC
GPADC_IN0GPADC_IN1
GPADC_VREF1GPADC_IN2GPADC_IN3GPADC_IN4
GPADC_VREF4GPADC_IN5GPADC_IN6
GPADC_START
Digitalfilter
13-bit
ADC��GGAUGE_RESP
GGAUGE_RESN
PWMFORCE
OCP bus
PREQ2BPREQ2C
OSC32KCAP
GND_DIG_VRTC
VBAT
VD
D_B
4V
DD
_B
2V
DD
_B
1G
ND
_A
NA
_B
7G
ND
_A
NA
_B
6G
ND
_A
NA
_B
5G
ND
_A
NA
_B
4G
ND
_A
NA
_B
3G
ND
_A
NA
_B
2G
ND
_A
NA
_B
1
VA
UX
3_IN
VA
UX
3
VC
XIO
_IN
VC
XIO
VD
AC
_IN
VD
AC
CH
RG
_P
MID
VD
D_B
3
VU
SB
CH
RG
_LE
D_IN
CH
RG
_LE
D_T
ES
T
CH
RG
_V
RE
F
CH
RG
_D
ET
_N
RE
FG
ND
IRE
F
VB
G
VA
UX
2
VA
UX
2_IN
VA
UX
1
VA
UX
1_IN
VU
SIM
_IN
2: spare
input
VU
SIM
_IN
2V
US
IM_IN
1
VM
MC
_IN
2: spare
input
VM
MC
_IN
2V
MM
C_IN
1
VP
P
VP
P_IN
VIO
GN
D_D
IG_V
IOC
ontr
ol O
ls
VP
P
VM
MC
VU
SIM
VA
UX
1
VA
UX
2V
AU
X3
VC
XIO
VD
AC
VU
SB
MU
X
Scale
rsA
uto
calib
TI Confidential — NDA Restrictions
TWL6030
www.ti.com SWCS045 –JANUARY 2010
DEVICE INFORMATION
Figure 1. TWL6030 Block Diagram
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TWL6030
Figure. TWL6030 functional block diagram
3. TECHNICAL BRIEF
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3.8.3.1 Charging control
P920 uses individual Charger IC which is RT9524.
Features
30V Maximum Rating for DC Adapter
Internal Integrated Power MOSFETs
Support 4.2V/2.3A Factory Mode
50mA Low Dropout Voltage Regulator
Status Pin Indicator
Programmed Charging Current
Under Voltage Lockout
Over Voltage Protection
Thermal Feedback Optimized Charge Rate
RoHS Compliant and Halogen Free
Typical Application Circuit
Functional Pin Description
P9�5
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3.3.8.2 Constant Current Charging Battery Pre-Charge Current
During a charge cycle, if the battery voltage is below the pre-charge threshold, the RT9524 enters the pre-charge
mode. This feature revives deeply discharged cells and protects battery. Under USB100 Mode, the pre-charge
current is internally set to 95mA. When the RT9524 is under USB500 and ISET Mode, the pre-charge current is
20% of fast-charge current set by external resistor RISET.
Battery Fast-Charge Current ISET Mode
The RT9524 offers ISET pin to program the charge current. The resistor RISET is connected to ISET and GND. The
parameter KISET is specified in the specification table.
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Battery Voltage Regulation (CV Mode)
The battery voltage regulation feedback is through BATT pin. The RT9524 monitors the battery voltage between
BATT and GND pins. When the battery voltage closes to battery regulation voltage threshold, the voltage
regulation phase begins and the charging current begins to taper down. When the charging current falls below
the programmed end-of-charge current threshold, the CHG_S pin goes high to indicate the termination of
charge cycle. The end-of-charge current threshold is set by the IEOC pin. The resistor RIEOC is connected to IEOC
and GND. The parameters KIEOC and IEOC are specified in the specification table.
The current threshold of IEOC (%) is defined as the percentage of fast-charge current set by RISET. After the
CHGSB pin pulled to high, the RT9524 still monitors the battery voltage. Charge current is resumed when the
battery voltage goes to lower than the battery regulation voltage threshold.
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3.8.3.3 Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected around 240mA from Travel adaptor.
3.8.3.4 LGP920 Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 948mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 248mA
3.8.3.5 LGP920 battery bar icon display
Battery Bar Number Specification
BAR 6 (Full) 90% over
Remain %
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup
Critical Low Battery Pop-up 0% ~ 3% : Popup at every level change
POWER OFF 0%
Table. LGP920 battery bar specification
P925
P925
P925
3. TECHNICAL BRIEF
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3.9 External memory interface
3.9.1 Introduction
Since LG-P920 contains communication and application processor, memory is dedicated only for each processor.
XMM6260 (IFX modem) uses MCP (Multi Chip Package) 1Gb Nand / 512Mb LPDDR1 and OMAP4430 uses POP
(Package on Package) 512MB LPDDR2 and 8GB eMMC Nand memory.
3.9.2 LG-P920 XMM6260 (IFX Modem) memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package -512Mbit Mobile DDR SDRAM / 1Gbit NAND Flash
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
H8BCS0QG0MMR-
46M
NAND Hynix 1.8V 45ns
SDRAM 1.8V 166MHz
3.9.3 LG-P920 OMAP4430 memory Interface
- Package on Package on OMAP4430: DDR2 SDRAM - 8GB eMMC 4.41 version
LPDDR2
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
K3PE4E400M-XGC1 SDRAM Samsung 1.8V/1.2/1.2/1.2 DDR2 800 (400MHz)
8GB NAND
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
SDIN5C2-8G-974D NAND Sandisk 2.8V 15MB/s for read9MB/s for write
3.9.4 External SD card memory Interface
OMAP4430 supports external SD card which supports up to 32GB (SDHC compatible)
P9�5
P925
P925
3. TECHNICAL BRIEF
- 53 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10 Audio and sound
3.10.1 Overview of Audio path
Figure. Block diagram of Audio & Sound path
OMAP I2C1 SDAI2C1 SDA TWL6040SPK
HFRP1AUD_SPK_PAUD SPK N
4430PDMDNPDMUP
PDMCLK
SDASCL
PDM_DL_DATAPDM_UL_DATA
ABE_CLKSPDM CLK
I2C1_SDAI2C1_SCL
ABE_PDM_DL_DATAABE_PDM_UL_DATA
ABE_CLKS
I2C1_SDA
I2C1_SCLTWL6040(Audio Codec)
AUD RCV PRCV
HFRN1AUD_SPK_N
HFRP2HFRN2
HBIASHS MICBIAS
PDMCLKLBPDMFRAME
AUDPWRONNRESPWRON
NAUDINT
PDM_CLKPDM_FRAME
AUD_PWRONSYS_nRESPWRON
SYS_nIRQ2
ABE_PDM_LB_CLKABE_PDM_FRAME
HDQ_SIO
SYS NIRQ2SYS_NRESPWRON
EARPEARN
AUD_RCV_PAUD_RCV_N
BT / WiFi / FMHBIAS
HS_MICHSLHSR
3.5_
HS_MICEAR_LEAR_RHOOK_ADC
ACCONN
NAUDINT
AFMLAFMR
FM_AUDIO_R
FM_AUDIO_L
SYS_NIRQ2
FM_I2S_FSYNC
FM_I2S_DIFM I2S CLK
FM_I2S_FSYNC
FM_I2S_CLK
FM_I2S_DO
ABE McBSP3 CLKXABE_McBSP3_DX
ABE_McBSP3_FSX
Analog
MIC1
MBIASFM_I2S_CLK
FM_I2S_DOBT_PCM_SYNCBT_PCM_DOUTBT_PCM_DIN
BT PCM CLK
PCM_AUD_FSYNC
PCM_AUD_INPCM_AUD_OUTPCM AUD CLK
FM_I2S_DIABE_McBSP3_CLKX
ABE_McBSP3_DR
ABE M BSP1 CLKXABE_McBSP1_DR
ABE_McBSP1_DXABE_McBSP1_FSX MMICN
MMICP
Analog
MIC2
SBIAS
SMICNSMICP
FM_ANT
_ _ PCM_AUD_CLKABE_McBSP1_CLKX SMICN
FM_ANTEAR_SENSE
EAR_SENSEDPM EMU10
HCI_CTSHCI_RTSHCI_TXHCI_RX
BT_UART_RTS/BT_UART_CTS/BT_UART_RXDBT_UART_TXD
UART2_RTS/UART2_CTS/
UART2_RXUART2_TX
XMM6260IPC_I2S_DIN
IPC_I2S_DOUT
IPC_I2S_CLKABE_McBSP2_CLKX
ABE_McBSP2_DR
ABE M BSP2 DX
I2S2_CLK0
I2S2_TX
I2S2 RX
DPM_EMU10
_ _ABE_McBSP2_DX
ABE_McBSP2_FSXIPC_I2S_SYNC
I2S2_RXI2S2_WA0
3. TECHNICAL BRIEF
- 54 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.2 TWL6040 (Audio Codec)
The TWL6040 is an audio codec with a high level of integration providing analog audio codec functions for
portable applications, as shown in Figure 3.10.2. It contains multiple audio analog inputs and outputs, as well as
microphone biases and accessory detection. It is connected to the OMAP4 host processor through a proprietary
PDM interface for audio data communication enabling partitioning with optimized power consumption and
performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL).
The OMAP4 device provides a TWL6040 with five PDM audio-input channels (DL0–DL4). Channels DL0–DL3 are
connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL,HFR),
and earpiece (EAR) or stereo line outputs (AUXL, AUXR).
The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable over 100
hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input
and DAC path high-performance (HP) mode. Headphone drivers provide a 1-Vrms output and are ground
centered for capless connection to headphone, thus enabling system size and cost reduction. The earpiece
driver is a differential class-AB driver with 2 Vrms capability to a typical 16Ohm or 32 Ohm load.
Stereo speaker path has filterless class-D outputs with 1.5W capability per channel. For output power
maximization supply connection to an external boost is supported. Speaker drivers support also hearing aid coil
loads. For vibrator and haptic feedback support TWL6040 has two PWM channels with independent input
signals from DL4 or I2C. Vibra drivers are differential H-bridge outputs, enabling fast acceleration and
deceleration of vibra motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage
can be connected to line outputs.
The TWL6040 supports three differential microphone inputs (MMIC, HMIC, SMIC) and a stereo line-input (AFML,
AFMR) multiplexed to two parallel analog-to-digital converters (ADCs). The PDM output from the ADCs is
transmitted to the OMAP4 through UL0 and UL1. Two LDOs provide a voltage of 2.1 V to bias analog
microphones (MBIAS and HBIAS). The maximum output current is 2 mA for each analog bias, allowing up to 2
microphones on one bias. Two LDOs provide a voltage of 1.8 V/1.85 V to bias digital microphones (DBIAS1 and
DBIAS2). One bias generator can bias up several digital microphones at the same time, with a total maximum
output current of 10 mA.
3. TECHNICAL BRIEF
- 55 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
The TWL6040 has an integrated negative charge pump and two LDOs (HS LDO and LS LDO) for high PSRR.
The only external supply needed is 2.1 V, which is available from the TWL6040 PMIC in the OMAP4 system. All
other supply inputs can be directly connected to battery or system 1.8-V I/O.
Two integrated phase-locked loops (PLLs) enable operatation from a 12-/19.2-/26738.4-MHz system clock
(MCLK) or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s
audio data rate for all channels, and host processor uses sample-rate converters to interface with different
sample rates (e.g., 44.1 kHz). In the specific case of low-power audio playback, the 44.1-kS/s and 48-kS/s rates are
supported by the TWL6040. Transitions between sample rates or input clocks are seamless.
Accessory plug and unplug detections are supported (PLUGDET). Some headsets have a manual switch for
submitting send/end signal to the terminal through the microphone input pin. This feature is supported by a
periodic accessory button press detection to minimize current consumption in sleep mode. Detection cycle
properties can be programmed according to system requirements.
Figure 3.10.2 shows a simplified block diagram of the device.
3. TECHNICAL BRIEF
- 56 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Figure 3.10.2. Simplified Block diagram
3. TECHNICAL BRIEF
- 57 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
470nC940
RF0518130SVCI
VA901
C934
2.2u
C926 0.47u
C902
4.7uC920 0.1u
0.1uC919
C922 0.1uC901
4.7u
TP901
0.1uC916
TP902
0R921
TP903
2.2u
C935
0.1uC917
TP904
C941
100n
1u
C923
C915 0.1u
C936
220n
2.2uC924
R919 0
C933
100n
VBAT
120FB941
FB913 120
U901TWL6040
8G
7G
8F
7E
6E
E5
D7
D6
D5
01D
11D
1D
2E
7L
9F
1G
01H
01C
9L
4K
2L
2B
2C
01A
7A
6A
3A
7J
9E
2G
01J
11B
5H
B1
A2
D3
C1
A8
A9
B5
B4
B8
B9
A5
A4
F4
G4
F3
G3
K11
J11
C11
B10
F1
F2
H2
H1
J3
H4
J4
J2
K1
K3
L4
J5
H7
K7
L11
A11
L1
A1
K2
E1
G5
L5
K6
L6
B7
B6
D4
E8
J9
D8
G6
H6
H8
K8
L10
L8
K9
F11
G11
G9
E11
E10
H11
K10
E4
F7
F6
F5
8J
2D
3B
6J
9C
8C
7C
6C
4C
5C
01G
01F
1J
9D
3E
3L
3H
9H
5K
FE
RDN
GSH
DN
GC
IMADNG
CIMDDNG
1OD
LDN
G2
OD
LDN
GMC
VD
NG
1PC
NDNG
2PC
NDN
G1LF
HDN
G2L
FHDNG
3LFHDNG
1RF
HDN
G2
RF
HDN
G3
RF
HD
NG
GI
DD
NG
RBIV
DN
GLBI
VDN
GOI
DN
G
PBKG1PBKG2PBKG3PBKG4PBKG5
VDDREGNCPNCPOUT1NCPOUT2NCPFBCFLYPCFLYN
PDMDNPDMUPPDMCLKPDMCLKLBPDMFRAME
SDASCL
AUDPWRONNRESPWRONNAUDINT
GPO1GPO2GPO3
REFNREFPREFPLUGDETACCONN
ATESTDTEST1DTEST2DTEST3PROG
MCLK
CLK32K
DBIAS1DBIAS2MBIASMMICPMMICNSMICPSMICN
HBIASHMICPHMICN
AFMRAFML
EARPEARN
HSLHSR
AUXLPAUXLNAUXRPAUXRN
HFLP1HFLN1HFRP1HFRN1HFLP2HFLN2HFRP2HFRN2
VIBLPVIBLNVIBRPVIBRN
FE
RV
DDV
RA
ED
DV
SH
DD
VL
UD
DV
LD
DD
VLL
PD
DV
1LF
HDD
V2LF
HDD
V1R
FH
DDV
2R
FH
DDV
LBI
VDD
VRB
IV
DD
VSA
IB
MAD
DV
SA
IB
MD
DDV
OIV
DDV
RAE
SSV
SH
SS
VLU
SS
VLD
SS
VL
LP
SSV
1V
2V
DDV
OD
LD
DV
NI
OD
LS
SV
ODL
SSV
NC1NC2NC3NC4
5C
N6CN
7C
N8C
N9C
N
VBAT VSEL_1.8V
C932
0.1u
VSEL_2.1V
C931
0.1u
C939
0.1u 0.1u
C930 C929
0.1u
0.1uC928
C938
0.1u 2.2u
C937
2.2uC927
4.7uC904
C905 4.7u
C903
4.7u
FB901 120
C925 0.1u
FB914 120
1n
C913
1n
C914
VSEL_2.1V
C921 0.1u
C918 0.1u
VA902ICVS0318150FR
ICVS0318150FRVA903
CLK32K_AUD
I2C1_SCLI2C1_SDA
SYS_nRESPWRON
MICBIAS
MMIC_P
AUD_SPK_NAUD_SPK_P
AUD_RCV_NAUD_RCV_P
HS_MICBIAS
EAR_LEAR_R
SMIC_PSMIC_N
HOOK_ADC
HS_MIC
EAR_SENSE
MMIC_N
FM_AUDIO_LFM_AUDIO_R
AUD_CLK_IN
PDM_DL_DATAPDM_UL_DATA
ABE_CLKSPDM_CLK
PDM_FRAME
AUD_PWRON
SYS_nIRQ2
Open/ground switch input
stereo headphone
stereo speaker
earpiecea differential class-AB driver
stereo line outputs
DOWNLINKUPLINK
filterless class-D outputs with 1.5W
with 2 Vrms capability to a typical 32Ohm
a stereo line-input
2.1V
2.1V
XX
Microphone input
Removed (Rev.C)
Added (P925 Rev.A)Added (P925 Rev.A)
Added (P925 Rev.A)
Removed (Rev.C)
C1175
0.1u 0.1u
C1176 R1176
10K
VSEL_1.8V
200KR1174
C1177
33p
C1179
10u
2.2K
R1178
470p
C1178
R1173 1M
1800FB1175
1800FB1176
FB1177 1800
FB1173
1800
R1172
DNI
Q1173
2SJ347
2
3
1G
DS
HS_MICBIASEAR_LEAR_R
HOOK_ADC
HS_MIC|HOOK_ADC
HS_MIC
EAR_SENSE
Changed (P925 Rev.B)
Changed (Rev.1.0)Added (925 Rev.D)
3. TECHNICAL BRIEF
- 58 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.11 Main (5M pixels) & Sub (VGA) Camera
LG-P920 supports two cameras. One is 5M pixels, main camera, the other is VGA, sub camera used VT & self camera scene.
Figure. Main 5M Camera Schematic
Figure. VGA Camera Schematic
FL1223
ICMEF214P101M01
9
84736251
P1 P5P2 P6P3 P7P4 P8
1G
2G
CN1221GB042-40S-H10-E3000
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
ICMEF214P101M
FL1222
01
9
84
73
62
51P1 P5P2 P6P3 P7P4 P8
1G
2G
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
5M_VANA_V2V7_P
1u
C1236
4.7u
C1235
5M_VCM_V2V8_P
5M_VCM_V2V8_S
FL1221ICMEF214P101M
01
9
8
7
6
5P1
1P5
P22
P6P3
3P7
P44
P8
1G
2G
G5TS0_5B9
DSE
4221DZ
G 5TS 0_5B9
DSE
5221DZ
0.1u
C1230C1228
4.7u
C1229
1u
0.1u
C1237
C1231
0.1u
0.1u
C1232
0.1u
C1234
C1233
0.1u
I2C3_SCLI2C3_SDA
I2C4_SDAI2C4_SCL
5M_MCLK
PRIMARY_5M_MIPI_DATA0_PPRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_CLK_PPRIMARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_PSECONDARY_5M_MIPI_DATA0_NSECONDARY_5M_MIPI_DATA0_P
SECONDARY_5M_RESET_N
SECONDARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_DATA1_PPRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_RESET_N
5M_MCLK_CAM
5M_MCLK_CAM
CN103
1110
129
138
147
156
165
174
183
192
201
0.1u
C103
TWL_LDO_1.8V
TWL_LDO_2.8V
0.1u
C104
FB101
VT_CAM_RESET/VT_CAM_PWDN
VT_0.3M_MIPI_CLK_NVT_0.3M_MIPI_CLK_P
VT_0.3M_MCLK
VT_0.3M_MIPI_DATA0_NVT_0.3M_MIPI_DATA0_P
I2C3_SDAI2C3_SCL
Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)
P9�5
3. TECHNICAL BRIEF
- 59 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
CAMERA
VT IO DVDD 1V8
VT_PCLK
VT_HSYNC
VT VSYNC
CAM_MCLK
EMI/ESD Filter
VT_IO_DVDD_1V8
VT_AVDD_2V8
`
1.3M Camera
VT_VSYNC
VT_DATA[7:0]
VT_RESET_N
VT CAM PWDNVT_CAM_PWDN
CAM_I2C_SCL
CAM_I2C_SDA CAM_SUBPM_EN
LP8720SUB PMIC
LP8720SUB PMIC
AP20
8M MIPI CLK NCAM_VDIG_1V2Common mode filter
8M
Camera
(LGIT)
8M_MIPI_CLK_N
8M_MIPI_DATA0_N
8M_MIPI_CLK_P
8M_MIPI_DATA0_P
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8 8M MIPI DATA1 N(LGIT) 8M_MIPI_DATA1_N
8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M CAM VCM EN8M_CAM_VCM_EN
CAM_VIO_1V8
C1212
10u
U1201LP8720TLX
1B
E1C2
B2
C1
E2
D3
C3
A1C4
B3
A3
D4
E3
D2
B4E4
2A
1D
4A
TTA
BV
2NI
V
1NI
V
VINB LDO1
FB
SW
GNDB
LDO2
IRQ_N
SDA LDO3
SCL
DVS
EN
LDO4
DEFSEL
IDSEL LDO5
DN
G
1u
C1204
C1211
2.2u
C1205
1u
C1209
2.2u2.2u
C1210
5M_VCM_V2V8_S
10u
C1201
5M_VCM_V2V8_P
5M_VANA_V2V7_P
VBAT
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
2.2u
L1201
1u
C1206 C1207
1u
C1208
1u
100KR1202
I2C3_SCLI2C3_SDA
CAM_SUBPM_EN
Added Res. (Rev.B)
4E o t esol
C
Changed (P925 Rev.A)
Figure. Camera Sub PMIC Schematic
Figure. Camera Block diagram
3. TECHNICAL BRIEF
- 60 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.12 Display
LCD module is connected to Main PCB with 30-pin connector.
The LCD is controlled by MIPI Interface in OMAP4430
Figure. Schematic of LCD connector (Main Board)
Table. Interface between LCD Module and MAIN Board
1uC1143
43
21
R1191 DNI
600FB1143
ICMEF214P101M
FL1142
01
9
84
73
62
51P1 P5P2 P6P3 P7P4 P8
1G
2G
2.8V_3D_LCD
2.8V_LCD_VCI
1.8V_LCD_IOVCC
12V_3D_LCD
FL1141
ICMEF214P101M 01
9
8 4
7 3
6 2
5 1P1P5P2P6P3P7P4P8
1G
2G
CN114124-5804-030-000-829+
16 15
17 14
18 13
19 12
20 11
21 10
22 9
23 8
24 7
25 6
26 5
27 4
28 3
29 2
30 1
2.8V_LCD_VCC
2011AV
RF0518130SVCI
4011AV
RF051 8130SVCI
C1141
1u
DNIR1190
I2C2_SCLI2C2_SDA
LCD_RESET_N
LED_C2LED_C1
LED_A
DSI2_LCD_MIPI_CLK_PDSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_PDSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_N
3D_LCD_BANK_SEL_1
Added (Rev.B)Removeed VA1101, VA1103 (Rev.C)
3. TECHNICAL BRIEF
- 61 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LG-P920 supports 3D LCD(Glassless)
The 3D LCD is controlled by 3D control IC(ISL24832)(3D Control IC is in LCD Module)
OMP4430 is supplying power for the 3D LCD, control signals are supplied.
Figure. Schematic of 3D PWR LDO(Main Board)
Figure. Schematic of 3D LCD Boost(VREF)(Main Board)
2.8V_3D_LCDU1106
BU28TD2WNVX
5
3 24 1
VOUTVINGNDSTBY
DN
GP C1107
1u
VBAT
C1106
1u
3D_LCD_EN
R1136
510K
51KR1133
12V_3D_LCD
VBAT
200K
R1134 C1134
0.1u
5311R
K22
0.1uC1132 C1138 0.1u
C1137
1u
4.7u
C1131TPS61093
U1131
11
10
9
4
7
3
5
2
8
6
1GND
SS
OUT
VIN
EN
CP2
FB
CP1
SW
VO
Exposed_GND
4.7uL1131
3D_BOOST_EN
Changed (Rev.B)
Changed (P925 Rev.A)
P925
3. TECHNICAL BRIEF
- 6� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3D Mode On Sequence : 3D PWR On VREF On BANK_SEL On
Figure. 3D Mode On Sequence
3D Mode Off Sequence : BANK_SEL Off VREF Off 3D PWR Off
Figure. 3D Mode Off Sequence
3. TECHNICAL BRIEF
- 63 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LCD Block Diagram
Figure. LG-P920 LCD Module Block Diagram
P925
3. TECHNICAL BRIEF
- 64 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.13 Vibrators The Linear motor, creates a certain kind of vibration controlled and defined uniquely by LG Electronics. The
followings are the certain examples of conditions that the users may feel the vibration from the phone:
Incoming Call (in Silence Mode), Google Keys Pressed, Turn-on / -off, Dialing, and Text Messaging.
Figure 1 Vibrator Schematic
Figure 2 Vibrator Block Digram
ISA1000
EUSY0238306
U981
90111
54
63
72
81EN VDP
PWM GND
MODE VDD
GAIN VDN
3C
N
2C
N
1C
N
TWL_LDO_3.0V
C987
2.2u
R982
DNI
L988 82n
L989 82n
R986 470K
0R987
TP905
R981100K
C986 3.9n
VIB_L_P
VIB_L_N
VIBE_PWMVIBE_EN
Added (P925 Rev.A)
Changed (P925 Rev.A)
Changed (P925 Rev.A)
3. TECHNICAL BRIEF
- 65 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.14 HDMI
When the users desire to output video signals onto the outer display, they are supposed to open the cap first
and connect the suitable cable, which has to be HDMI type-D compatible, to the socket placed at the upper
center of the phone. It will automatically display the video contents on the desired display
Figure 1 HDMI Type D Connector Schematic
Figure 2 HDMI Type D Connector Pin Assignments
C1271
100n
5V_HDMI
R1271100K
CN127178618-0001
25
24
23
22
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
21
20
HDMI_D1-
HDMI_D0-
HDMI_D0+
HDMI_D1+HDMI_D2-
HDMI_D2+
HDMI_CLK-
HDMI_CLK+
C_HDMI_CEC
C_HDMI_SCLC_HDMI_SDA
C_HDMI_HPD
Changed Con. (Rev.B)
Removed (Rev.1.0)
3. TECHNICAL BRIEF
- 66 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
C975
1uAMI306U975
10
95
4
63
72
81
DD
VA
YD
RD
DN
GL
CS
GE
RV
PP
V
INT
SDA ADDR
DVDD
SENSOR_3.0V
C978
1u
VSEL_1.8V
C976
10n
I2C4_SDAI2C4_SCL
COMPASS_INT
Added (Rev.1.0)
AMI304 Specifications (Preliminary)
3/36 Ver.B9100212
[ 1 ] Scope of Application This specification applies to the 3-axis magnetic sensor AMI304 provided to by Aichi Steel Corporation.
[ 2 ] General Description The AMI304 is a n intelligent electronic compass that integrates three Magneto-Impedance sensor
elements (MI-element) with their controller IC in a single small package.
The controller IC of the AMI304 consists of a circuit for detecting the magnetic signals from three
MI-sensor elements, an amplifier capable of compensating each sensors offset and setting appropriate
sensitivity values, a thermal sensor for measuring the ambient temperature, a 12bit AD converter, an I2C
serial interface circuit and a constant voltage circuit for power control.
[ 3 ] Block Diagram
1.0µF
X-axis
MI-sensor Circuit for
MI-Sensors
Data
12bit AD Converter
PGA
Logic circuit Serial I/F (I2C)
Thermal sensor
Y-axis
MI-sensor
Z-axis
MI-sensor
NCAVDD
Vpp
Zero pointVoltage
Adjustment
GNDA
NC
ADDR
GNDS
INT
DRDY
SCL
SDA
C2 0.01µF
C1 0.47µFDropout
Regulator
256 Bytes For Factory Calibration OTP-ROM
VDD
VID
VREG
DVDD
3.15 Compass Sensor
If customers are buy the application SW, The Sensor provides user with a Electric Compass function.
U975 (AMI306) IC is interfaced to U500 (OMAP4430) using I�C interface.
Figure. Compass Sensor Schematic
Figure. Compass Sensor Block Diagram
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.16 Motion Sensor
The motion sensor can sense gravity & accelerated motion. Therefore according to the direction of cell phone,
the phone screen is rotated automatically. And the motion sensor is connected with a gyro sensor to
supplement each data.
U971 : KXTF9 IC is interfaced to OMAP4430(U500) using I2C interface.
Figure. Motion Sensor Schematic
Figure. Motion Sensor Block Diagram
R973DNI
1u
C973
VSEL_1.8V
C972
0.1u
0.1u
C971 U971
KXTF9
4
3
2
1
501
6
7
8
9SCL
DNC4
INT
DNC3
AD
SD
DV
IO_VDD
DNC1
DNC2
GND
VSEL_1.8V
SENSOR_3.0V
MOTION_INT
IME_DA
IME_CL
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.17 Gyro Sensor
The gyro sensor(MPU3050) can sense angular velocity not gravity and accelerated motion. The gyro sensor
applied in LG- P920 can detect 3-axis rotation force sensing X,Y and Z angular velocity. And the gyro sensor data
is supplemented by the motion sensor data. It make possible user to development application SW using gyro
sensor data like that motion games.
U961: MPU3050 IC is interfaced to OMAP4430(U500) using I2C interface.
Figure. Gyro Sensor Schematic
Figure. Gyro Sensor Block Diagram
X Accel
Y Accel
Z Accel
ADC
ADC
ADC
Digital
I�C
X Gyro
Y Gyro
Z Gyro
ADC
ADC
ADC
ADCTemp
DigitalControl andProcessing
Sensor I�CInterface
PrimarySerial
Interface
R9021.5K
0.1u
C965
VSEL_1.8V
C962
0.1u
MPU3050AU961
25
21
20
22
19
23
24
81 71
9
8
10
7
11
6
12
5
31
4
41
3
51
2
61
1NI
KLC
7C
N
1C
N
6C
N
2C
N
5C
N
3C
N
DD
V
4C
N
INT
AD_
EMI
FSYNC
IME_CL
REGOUT
VLOGIC
AD0
8C
N
DN
G
SDA
SCL
RESV1
CLKOUT
CPOUT
RESV2
NC9
C961 2.2n
SENSOR_3.0V
0.1u
C963
R9011.5K
VSEL_1.8V
I2C4_SDAI2C4_SCL
GYRO_INT
AD
_E
MI
LC_
EM
I
Added (P925 Rev.A)
P9�5
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.18 Illumination & Proximity Sensor
Illumination Sensor adjusts LCD backlight current by detecting the surrounding brightness.
If user checks the automatic brightness menu, LCD backlight current adjusting is to be enable automatically.
When the call is connected and the object close to the proximity sensor,
LCD backlight and Touch screen are disable operation automatically.
U101 : APDS-9900 IC used I2C interface to OMAP4430
Figure. Illumination & Proximity Sensor Schematic
Figure. Illumination & Proximity Sensor Block Diagram
PROXI_3.0V
U101
54
63
72
81SDA VDD
INT SCL
LDR GND
LEDK LEDA
SENSOR_3.0V
1uC101C102
1u
PROX_INT
I2C3_SDA
I2C3_SCL
Rev.B(Pull Up Move to Main PCB)
3.18 Ambient Light & Proximity Sensor
3. TECHNICAL BRIEF
- 70 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.19 Touch Module
Touch module is connected to Main PCB with 10-pin connector.
The Touch module is controlled by I2C Interface in OMAP4430.
Figure. Schematic of Touch connector (Sub PCB side)
Pin Map
1 SCL
2 GND
3 SDA
4 VDD(3.3V)
5 INT
6 VBUS(1.8V)
7 Reset
8 GND
9 GND
10 GND
CN102
65
74
83
92
101
30 1AV
VSEL_1.8V
21 1R
K01TOUCH_3.3V
VSEL_1.8V
50 1DZ
C119
2.2u
101DZ
201DZ
3 01DZ
401DZ
601DZ
u1021
C
I2C2_SCL
I2C2_SDA
TOUCH_INT_N
TOUCH_RESET
Rev.F
Rev.E
Rev.F
Rev.FRev.F
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.20 Main Features
3.23.1 LG-P920 Main Features
- DOP Type design
- UMTS 2100 + UMTS 1900 + UMTS900+ GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS
- HSDPA 14.4Mbps, HSUPA 5.7Mbps
- Main LCD (WVGA)
TFT Main LCD (4.3”, 480X800), 3D LCD
- Capacitive/Electrostatic Touch Window
- 5M AF 3D Camera, 0.3M VT Camera
- 3.5Phi Stereo Headset & Speaker phone
- MP3/ WMA / AAC/AAC+/WAV/AC3 decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g, 802.11n)
- Supports FM Radio
- 1500 mAh (Li-Ion)
- 1500 mAh (Li-Ion)
P925
4. TROUBLE SHOOTING
- 7� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.1 RF Component
RF component (WCDMA / GSM)
X184TCXO(26MHz)
U241Tranceiver PMU
U181RFIC(Tranceive)
U121Duplexer(Bank)
U220PAM DCDC
U171PAM(MMMB)
FL111Filter(Seperator)
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.2 SIGNAL PATH
WCDMA 1,2,4,5,8 Band TX Signal PATH
A. WCDMA 2100 TX PATH B. WCDMA 1900 TX PATH
C. WCDMA 1700 TX PATH D. WCDMA 850 TX PATH
E. WCDMA 900 TX PATH F. COMMON TX/RX PATH\
4. TROUBLE SHOOTING
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LGE Internal Use Only
WCDMA 1,2,4,5,8 Band RX Signal PATH
A. WCDMA 2100 RX PATH B. WCDMA 1900 RX PATH
C. WCDMA 1700 RX PATH D. WCDMA 850 RX PATH
E. WCDMA 900 RX PATH F. COMMON TX/RX PATH\
4. TROUBLE SHOOTING
- 75 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
GSM 850,900,1800,1900 Band TX/RX Signal PATH
A. GSM 850 RX PATH B. GSM 900 RX PATH
C. GSM 1800 RX PATH D. GSM 1900 RX PATH
E. GSM 850,900 TX PATH F. GSM 1800,1900 TX PATH
G. COMMON TX/RX PATH
4. TROUBLE SHOOTING
- 76 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.3 Checking TCXO Block
The output frequency (26MHz) of TCXO (X184) is used as the reference one of PMB5712
Schematic of the Crystal Part (26MHz)
26MHz
1XXA26000FBAX1843
2
4
1VCONT
VCC
GND
OUT
C184
22n
C185
10n
TP�
Schematic of the Crystal Part (26MHz)
TP1
TP1
TP2
4. TROUBLE SHOOTING
- 77 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Check TP1VCC of TCXO
1.7V ≥ VCC ≥ 1.9V Check the PMB571�No
Yes
Check TP�
�6 MHz Signal Check soldering and components
No
Yes
TCXO is OK
4. TROUBLE SHOOTING
- 78 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.4 Checking WCDMA Block
START
Check TCXO Block
Check RF Switch (M/S)
Check TX/RX Level
Re-download & Cal
Change the Board
4. TROUBLE SHOOTING
- 79 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.4.1. Checking RF TX Level
Test Point (TX Level)
TP3
TP4
TP2 TP1
4. TROUBLE SHOOTING
- 80 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
100pC105
C115
10n
DNIL105
L102 2.2n
L1143n
C114
27p
DNIL143
C112 10p
L158 1.5n
DNI
L112
L111
DNI
C1231p
VBAT
DNIL169
1.5nL147
L159DNI
1.5nL168
L148DNI
L127 1n
L138DNI
L122 2.2n
L128DNI
L110 4.7n
33pC163
DNIL162
C109
1.8p
L113
10n
33pC151
L141DNI
B40761DY2045LU121
95
75
94
55
35
15
05
40
39
38
37
44
34
24
14
84
74
64
54
33
43
53
63
23
13
03
92
82
51
31
21
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1311
791d
na
B-x
T
2d
na
B-x
T
4dna
B-
xT
5dna
B-
xT
8d
na
B-x
T
Rx-GSM1800_1Rx-GSM1800_2
Rx-Band1_1Rx-Band1_2
Rx-Band2_1Rx-Band2_2
Rx-Band4_1Rx-Band4_2
Rx-Band5_1Rx-Band5_2
Rx-Band8_1Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1GND2GND3GND4GND5GND6
7D
NG
8DN
G9D
NG
01D
NG
11D
NG
21D
NG
31
DN
G4
1DN
G
81D
NG
71D
NG
61DN
G51D
NG
72DN
G82DNG
92DNG
03D
NG
32D
NG
42D
NG
52
DN
G6
2D
NG
GND19GND20GND21GND22
23D
NG
33D
NG
43D
NG
53DN
G
13D
NG
63DN
G73DNG
MS-156CSW102
4 3
2
1ANTCOMMON
G3G4
C133DNI
33pC121
C153 22p
100n
L104DNI
C101C103
DNI
FL111BGSF18DM20
12
20
51
19
01
18
61
8
11
79
6
521 4
3
31
2
41
1
71D
DV
TRX_3
LC
S
TRX_2
OID
S
TRX_1
1D
NG
6D
NG
2D
NG
HB_TX
4D
NG
3D
NG
TN
A
LB_TX
DD
VL
TRX_6
5D
NG
TRX_5
MRF
TRX_4
DN
GP
DNIL116
33pC116 33pC117
L131 1.2n
SW10120279-001E-01
G1
ANT G2
L142 2.2n
L161 2.2n
L15247n
1nL137
C132 33p
RX_B1_H2
RX_B2_M2
RX_B5_L2X
RX_B8_L1X
WRD
_IP
SS
S_
IPS
KLC
_I
PS
IPS
V
GSM_HB_TX
GSM_LB_TX
RX_GSM1800_M1RX_GSM1800_M1X
RX_B8_L1
RX_B5_L2
RX_B2_M2X
RX_B1_H2X
RX_B4_H1XRX_B4_H1B2/GSM1900
B4
B5/GSM850
B8/EGSM
GSM1800_RX
B1
Removed (Rev.B)
* Global : 2.2nH* AT&T, TMUS : 100pF
<L102>
Rev.1.1
0.1u
C173
RF6260U171
71
81
91
02
21
10
11
21
13
41
15
16
9
8
7
6
5
4
3
2
1B8_TX
B5_TX
GSM_LB_TX
B2_TX
B1_TX
GSM_HB_TX
B4_TX
HB_RFIN
SPI_SS
VCC
LB_RFIN
IPS
V
NC
DNG_IP
S
SPI_CLK
SPI_DRW
GND
SO
MCV
MA
_BF
TABV
TUO_F
R
C171
220n
C1751p
L179 1.8n
VBAT_PAM
VBAT
DNIL180
L176 2.7n
DNIC178
L177DNI
C172
0.1u
SPI_DRW
SPI_SS
SPI_CLK
IPSV
FR_
AP
TE
D_WO
P_
AP
TX_H
TX_L
GSM_HB_TX
GSM_LB_TX
TUO
_P
C
Removed (Rev.E)
TP1
TP�
TP�
TP�
TP�
TP�
TP3
TP3
TP3
TP3
TP3
TP4
TP4
Schematic of WCDMA Band1,2,4,5,8 Tx Block
4. TROUBLE SHOOTING
- 81 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Check Power Level
Check TP1 Over �1dBm? RF Tx Level is OKYes
No
Check PMB571�
Check TP� Over �1dBm? Check SeparatorYes
No
Check TP3 Over �1dBm? Check DuplexerYes
No
Check TP4 Over 6dBm? Check PAMYes
No
For testing, Max power output is needed.
4. TROUBLE SHOOTING
- 8� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.4.2. Checking RF Rx Level
Test Point (RF Rx Level)
TP2 TP1
4. TROUBLE SHOOTING
- 83 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
100pC105
C115
10n
DNIL105
L102 2.2n
L1143n
C114
27p
DNIL143
C112 10p
L158 1.5n
DNI
L112
L111
DNI
C1231p
VBAT
DNIL169
1.5nL147
L159DNI
1.5nL168
L148DNI
L127 1n
L138DNI
L122 2.2n
L128DNI
L110 4.7n
33pC163
DNIL162
C109
1.8p
L113
10n
33pC151
L141DNI
B40761DY2045LU121
95
75
94
55
35
15
05
40
39
38
37
44
34
24
14
84
74
64
54
33
43
53
63
23
13
03
92
82
51
31
21
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1311
791d
na
B-x
T
2d
na
B-xT
4dna
B-x
T
5dna
B-
xT
8d
na
B-x
T
Rx-GSM1800_1Rx-GSM1800_2
Rx-Band1_1Rx-Band1_2
Rx-Band2_1Rx-Band2_2
Rx-Band4_1Rx-Band4_2
Rx-Band5_1Rx-Band5_2
Rx-Band8_1Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1GND2GND3GND4GND5GND6
7DNG
8DN
G9DN
G0
1D
NG
11DN
G2
1DN
G3
1DN
G4
1DN
G
81DN
G7
1DN
G6
1DN
G51DNG
72
DN
G82
DNG
92
DNG
03D
NG
32D
NG
42D
NG
52
DN
G6
2D
NG
GND19GND20GND21GND22
23D
NG
33D
NG
43D
NG
53
DN
G
13D
NG
63
DN
G73
DNG
MS-156CSW102
4 3
2
1ANTCOMMON
G3G4
C133DNI
33pC121
C153 22p
100n
L104DNI
C101C103
DNI
FL111BGSF18DM20
12
20
51
19
01
18
61
8
11
79
6
521 4
3
31
2
41
1
71D
DV
TRX_3
LC
S
TRX_2
OID
S
TRX_1
1D
NG
6D
NG
2D
NG
HB_TX
4D
NG
3D
NG
TN
A
LB_TX
DD
VL
TRX_6
5D
NG
TRX_5
MRF
TRX_4
DN
GP
DNIL116
33pC116 33pC117
L131 1.2n
SW10120279-001E-01
G1
ANT G2
L142 2.2n
L161 2.2n
L15247n
1nL137
C132 33p
RX_B1_H2
RX_B2_M2
RX_B5_L2X
RX_B8_L1X
WRD
_IP
SS
S_
IPS
KLC
_I
PS
IPS
V
GSM_HB_TX
GSM_LB_TX
RX_GSM1800_M1RX_GSM1800_M1X
RX_B8_L1
RX_B5_L2
RX_B2_M2X
RX_B1_H2X
RX_B4_H1XRX_B4_H1B2/GSM1900
B4
B5/GSM850
B8/EGSM
GSM1800_RX
B1
Removed (Rev.B)
* Global : 2.2nH* AT&T, TMUS : 100pF
<L102>
Rev.1.1
TP1
TP�
TP�
TP�
TP�
TP�
Schematic of WCDMA Band1,2,4,5,8 Rx Block
4. TROUBLE SHOOTING
- 84 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Set the phone Rx is ON
Check TP1 Signal exist? Check RF Switch (M/S)No
Yes
Check Duplexer, PMB571�
Check TP� Signal exist? Check Separator
No
Yes
4. TROUBLE SHOOTING
- 85 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.4 Checking WCDMA Block
START
Check TCXO Block
Check RF Switch (M/S)
Check TX/RX Level
Re-download & Cal
Change the Board
4. TROUBLE SHOOTING
- 86 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.5.1 Checking RF Tx Block
TP3
TP1
TP2
4. TROUBLE SHOOTING
- 87 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
100pC105
C115
10n
DNIL105
L102 2.2n
L1143n
C114
27p
DNIL143
C112 10p
L158 1.5n
DNI
L112
L111
DNI
C1231p
VBAT
DNIL169
1.5nL147
L159DNI
1.5nL168
L148DNI
L127 1n
L138DNI
L122 2.2n
L128DNI
L110 4.7n
33pC163
DNIL162
C109
1.8p
L113
10n
33pC151
L141DNI
B40761DY2045LU121
95
75
94
55
35
15
05
40
39
38
37
44
34
24
14
84
74
64
54
33
43
53
63
23
13
03
92
82
51
31
21
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1311
791d
na
B-x
T
2d
na
B-xT
4dna
B-x
T
5dna
B-
xT
8d
na
B-x
T
Rx-GSM1800_1Rx-GSM1800_2
Rx-Band1_1Rx-Band1_2
Rx-Band2_1Rx-Band2_2
Rx-Band4_1Rx-Band4_2
Rx-Band5_1Rx-Band5_2
Rx-Band8_1Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1GND2GND3GND4GND5GND6
7DNG
8DN
G9DN
G0
1D
NG
11DN
G2
1DN
G3
1DN
G4
1DN
G
81DN
G7
1DN
G6
1DN
G51DNG
72
DN
G82
DNG
92
DNG
03D
NG
32D
NG
42D
NG
52
DN
G6
2D
NG
GND19GND20GND21GND22
23D
NG
33D
NG
43D
NG
53
DN
G
13D
NG
63
DN
G73
DNG
MS-156CSW102
4 3
2
1ANTCOMMON
G3G4
C133DNI
33pC121
C153 22p
100n
L104DNI
C101C103
DNI
FL111BGSF18DM20
12
20
51
19
01
18
61
8
11
79
6
521 4
3
31
2
41
1
71D
DV
TRX_3
LC
S
TRX_2
OID
S
TRX_1
1D
NG
6D
NG
2D
NG
HB_TX
4D
NG
3D
NG
TN
A
LB_TX
DD
VL
TRX_6
5D
NG
TRX_5
MRF
TRX_4
DN
GP
DNIL116
33pC116 33pC117
L131 1.2n
SW10120279-001E-01
G1
ANT G2
L142 2.2n
L161 2.2n
L15247n
1nL137
C132 33p
RX_B1_H2
RX_B2_M2
RX_B5_L2X
RX_B8_L1X
WRD
_IP
SS
S_
IPS
KLC
_I
PS
IPS
V
GSM_HB_TX
GSM_LB_TX
RX_GSM1800_M1RX_GSM1800_M1X
RX_B8_L1
RX_B5_L2
RX_B2_M2X
RX_B1_H2X
RX_B4_H1XRX_B4_H1B2/GSM1900
B4
B5/GSM850
B8/EGSM
GSM1800_RX
B1
Removed (Rev.B)
* Global : 2.2nH* AT&T, TMUS : 100pF
<L102>
Rev.1.1
0.1u
C173
RF6260U171
71
81
91
02
21
10
11
21
13
41
15
16
9
8
7
6
5
4
3
2
1B8_TX
B5_TX
GSM_LB_TX
B2_TX
B1_TX
GSM_HB_TX
B4_TX
HB_RFIN
SPI_SS
VCC
LB_RFIN
IPS
V
NC
DNG_IP
S
SPI_CLK
SPI_DRW
GND
SO
MCV
MA
_BF
TABV
TUO_F
R
C171
220n
C1751p
L179 1.8n
VBAT_PAM
VBAT
DNIL180
L176 2.7n
DNIC178
L177DNI
C172
0.1u
SPI_DRW
SPI_SS
SPI_CLK
IPSV
FR_
AP
TE
D_WO
P_
AP
TX_H
TX_L
GSM_HB_TX
GSM_LB_TX
TUO
_P
C
Removed (Rev.E)
TP1
TP�
TP3
TP3
Schematic of GSM850/EGSM/DCS/PCS Tx Block
TP�
4. TROUBLE SHOOTING
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LGE Internal Use Only
For testing, Max power output is needed
Chenck Power Level
Check TP1Over 31 dBm(GSM850, EGSM)
Over �8 dBm(DCS, PCS)RF TX Level is OK
Yes
No
Check PMB571�
Check TP�Over 31 dBm(GSM850, EGSM)
Over �8 dBm(DCS, PCS)Check Separator
Yes
No
Check TP3Over 1� dBm Check PAM
Yes
No
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.5.2 Checking RF Rx Block
TP2 TP1
4. TROUBLE SHOOTING
- 90 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
100pC105
C115
10n
DNIL105
L102 2.2n
L1143n
C114
27p
DNIL143
C112 10p
L158 1.5n
DNI
L112
L111
DNI
C1231p
VBAT
DNIL169
1.5nL147
L159DNI
1.5nL168
L148DNI
L127 1n
L138DNI
L122 2.2n
L128DNI
L110 4.7n
33pC163
DNIL162
C109
1.8p
L113
10n
33pC151
L141DNI
B40761DY2045LU121
95
75
94
55
35
15
05
40
39
38
37
44
34
24
14
84
74
64
54
33
43
53
63
23
13
03
92
82
51
31
21
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1311
791d
na
B-x
T
2d
na
B-xT
4dna
B-x
T
5dna
B-
xT
8d
na
B-x
T
Rx-GSM1800_1Rx-GSM1800_2
Rx-Band1_1Rx-Band1_2
Rx-Band2_1Rx-Band2_2
Rx-Band4_1Rx-Band4_2
Rx-Band5_1Rx-Band5_2
Rx-Band8_1Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1GND2GND3GND4GND5GND6
7DNG
8DN
G9DN
G0
1D
NG
11DN
G2
1DN
G3
1DN
G4
1DN
G
81DN
G7
1DN
G6
1DN
G51DNG
72
DN
G82
DNG
92
DNG
03D
NG
32D
NG
42D
NG
52
DN
G6
2D
NG
GND19GND20GND21GND22
23D
NG
33D
NG
43D
NG
53
DN
G
13D
NG
63
DN
G73
DNG
MS-156CSW102
4 3
2
1ANTCOMMON
G3G4
C133DNI
33pC121
C153 22p
100n
L104DNI
C101C103
DNI
FL111BGSF18DM20
12
20
51
19
01
18
61
8
11
79
6
521 4
3
31
2
41
1
71D
DV
TRX_3
LC
S
TRX_2
OID
S
TRX_1
1D
NG
6D
NG
2D
NG
HB_TX
4D
NG
3D
NG
TN
A
LB_TX
DD
VL
TRX_6
5D
NG
TRX_5
MRF
TRX_4
DN
GP
DNIL116
33pC116 33pC117
L131 1.2n
SW10120279-001E-01
G1
ANT G2
L142 2.2n
L161 2.2n
L15247n
1nL137
C132 33p
RX_B1_H2
RX_B2_M2
RX_B5_L2X
RX_B8_L1X
WRD
_IP
SS
S_
IPS
KLC
_I
PS
IPS
V
GSM_HB_TX
GSM_LB_TX
RX_GSM1800_M1RX_GSM1800_M1X
RX_B8_L1
RX_B5_L2
RX_B2_M2X
RX_B1_H2X
RX_B4_H1XRX_B4_H1B2/GSM1900
B4
B5/GSM850
B8/EGSM
GSM1800_RX
B1
Removed (Rev.B)
* Global : 2.2nH* AT&T, TMUS : 100pF
<L102>
Rev.1.1
TP1
TP�
TP�
TP�
TP�
TP�
Schematic of GSM850/EGSM/DCS/PCS Rx Block
4. TROUBLE SHOOTING
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LGE Internal Use Only
Set the phone Rx is On
Check TP1 Signal exist? Check RF Switch (M/S)No
Yes
Check Duplexer, PMB571�
Check TP� Signal exist? Check SeparatorNo
Yes
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.6. GPS/WIFI/BT RF components
4.6.1 GPS Module
GPS chip is made by Broadcom and name is BCM4751
U1831GPS LDO
U1801GPS LNA
FL1801Separator
X1821GPS TCXO
U1811GPS IC
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.6.2 Wifi/BT/FM Module
FL1901Filter
U1902RF3482
U1901WL1271
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.7 GPS/WIFI/BT SIGNAL PATH
4.7.1 GPS Signal Path
ANT
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.7.2 Wifi/BT/FM Signal Path
ANT
Wifi Signal
BT Signal
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.9 Power ON Troubleshooting
The main power source of LGP920 is provided by 2 chips which are TWL6030 and XMM6260 (Communication
processor). Since XMM6260 only powers up normally when OMAP4430 is properly powered therefore, TWL6030
is the actual one to take look at.
Power ON sequence of LGP920 is,
PWR key press PM_ON_SW goes low (R1195, TWL6030 PWRON_ pin(L5)) TWL6030 Power Up
SENSOR_3.0V VSEL_1.8V (L803) VSEL_VMEM (L806) VSEL_2.1V (L804) VSEL_1.29V (L805)
VPMIC_VCXIO VSEL_VCORE3 (L802) VCORE1_OMAP_MPU (L800)
VCORE2_OMAP_IVAUD (L801) goes high
(if network connected VSD1_1.3V VSD2_1.8V)
TWL6030 Power on sequence
Externalperipherals
Phoenix PowerDevice OMAP4430
External Power IC: Enable
LPDDR�: VDD1CDC3S04: VDD_DIGAll peripherals: 1.8v lOs and cores
LPDDR�: VDD�
External Power IC: Enable
Phoenix Audio: TBD
LPPDDR�: VDDCA, VDDQAll peripherals: 1.�v lOs and cores
CDC3S04: IOs
Phoenix Power IC tum on time up to
REGEN1/�
V1V8
VMEM @ 1.35V or 1.�V wrt boot mode
SYSTEM
V�V1
V�V�9@ 1.�V
VCXIO
VCORE3
VCORE1
VCORE�
VDDS_1P8VDDS_DV_xxx@ 1.8vVDDA_BG_VBB, VDD_LDO_SRAM
VDDCA_LPDDR�VDDQ_LPDDR�VDD_LDO_EMU_WKUPVDDS_1P�VDDS_DV_xxx@1.�V
VDDS_DPLL, VDDA_DSI1/�
VDDA_CSI�1/�, VDDA_UNI1,VDDA_USB1OTG_1P8V,VDDS_1P8_FREF
VDD_COREVDD_DLL0/1_LPDDR�1/�
VDD_MPU
VDD_IVA_AUDIO
Power On Event: battery plug, power on button, remote power on, RTC wakeup, battery Voltage > Vbatmin thresold during charge
7ms(after debounce) - Phoenix intermal power up sequence
VBAT
1.8V500us
500us1.35V if Phoenix BOOT1=0or1.�V if BOOT1=1
500us 1.8V
500us �.1V
500us1.�V
500us
1
�
3
4
5
6
7
�’
3’ 8
9
4.8
P9�5
P9�5
4. TROUBLE SHOOTING
- 97 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
X-GOLD™ 626PMU Sub-System
PMU BehaviorConfidential
Product Specification 13 Revision 2.22, 2010-05-10Hardware Description
Figure 4 PMU Start-up / Shut-down Timing
2.1 PAD Timing
Figure 5 PAD Control Timing
2.2 PMU controlThe PMU can be fully controlled by software using a serial interface (SPI). For timing critical configurations thePMU additionally offers a parallel interface to the baseband for real-time control of features like voltage scaling,DCDC mode control and stand-by.
Shut-down
VBAT
LPBG
LPMU
LRTC
ON event ON event detected
High Precition Bandgap
Step-Down 1
REF_CLK_EN
BaseBand reset
20µs
Step-Down 2
LUSB_PD
LUSB_ANA
LUSB_IO
LIO_12
Reset
XX
XX
[email protected]@1.1V
LPLL
2180µs 2560µs 1500µs 1520µs 200µs200µs
200µs200µs
20µs 16ms 20µs20µs
20µs
Start-upBattery insertion
LPMU
LRTC
Power on Reset
ON1_i
ON2_N_i
RESET_BB_N_i
TRIG_B_i
RESET_PWRDWN
VSD2
TM_EN
REF_CLK_EN_o
BaseBand reset_n
pad active
pad active
pad active
pad active
pad active
pad active
pad active
pad active
SYSTEM OFF SYSTEM ON PMU ISO Mode Battery removal
VRTC
Sup
plie
d Pa
dsP
MU
inpu
tsPM
U o
utpu
ts
VRTC
Sup
plie
d Pa
ds
undefinedPOR enables VRTC pads
POR enables RESET pad
self enabling pad
XMM6260 PMU Power on sequence
4. TROUBLE SHOOTING
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LGE Internal Use Only
START
Battery voltage higher than 3.5V? Change or charging the BatteryNo
Yes
Change the main board
Press PWR Key Check TP1 high to low? Check the Power Key
No
Yes
Power Key is damaged? Change the Power KeyNo
Yes
Check TP9 Clock ≈3�.768KhzClock Range is O.K?
Change the TCXO and X-talNo
Yes
Check TP voltage0.6V < TP�, 3, 4 < 1.3V
TP5 ≈ 1.8VTP6 ≈ �.1V
TP7, 8 ≈ 1.�VVoltage Range is O.K?
Change the Main board
Yes
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
TOP view of LGP925
Power Key of LGP925
TP1 (R1195),PWR_ON_SW
TP9 (X800), CLOCK
TP6 (L804), VSEL_2.1V
TP7 (L805), VSEL1.29V
TP5 (L803), VSEL_1.8V
TP3 (L801), VCORE2_OMAP_IVAUD TP8 (L806), VSEL_VMEM
TP2 (L800),VCORE1_OMAP_MPU
TP4 (L802),VSEL_VCORE3
4. TROUBLE SHOOTING
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LGE Internal Use Only
R1195
1K
G5TS0_5B9
DSE
5911D Z
CN1195
2
1PWR_ON_SW
Added (Rev.E)
TP1
10uC813
R12
T12
R11
T11
R13
R10
T10
H15
H16
J15
J16
G16
K15
K16
E15
E16
D15
D16
F16
C15
C16
M15
L16
M16
P15
P16
N16
L15
R14
T14
T13
H2
H1
J2
J1
G1
K2
K1
R5
T5
R6
T6
R4
R7
T7
M2
L1
M1
P2
P1
N1
L2
R3
T3
T4VCORE1_IN_B1VCORE1_IN_B2VCORE1_IN_B3VCORE1_FDBK
VCORE1_SW_B1VCORE1_SW_B2VCORE1_SW_B3
VCORE1_GND_B1VCORE1_GND_B2VCORE1_GND_B3
VCORE2_IN_B1VCORE2_IN_B2VCORE2_FDBK
VCORE2_SW_B1VCORE2_SW_B2
VCORE2_GND_B1VCORE2_GND_B2
VCORE3_IN_B1VCORE3_IN_B2VCORE3_FDBK
VCORE3_SW_B1VCORE3_SW_B2
VCORE3_GND_B1VCORE3_GND_B2
V1V8_IN_B1V1V8_IN_B2V1V8_IN_B3V1V8_FDBKV1V8_SW_B1V1V8_SW_B2V1V8_SW_B3
V1V8_GND_B1V1V8_GND_B2V1V8_GND_B3
V2V1_IN_B1V2V1_IN_B2V2V1_FDBKV2V1_SW_B1V2V1_SW_B2
V2V1_GND_B1V2V1_GND_B2
V1V29_IN_B1V1V29_IN_B2V1V29_FDBK
V1V29_SW_B1V1V29_SW_B2
V1V29_GND_B1V1V29_GND_B2
VMEM_IN_B1VMEM_IN_B2VMEM_FDBKVMEM_SW_B1VMEM_SW_B2
VMEM_GND_B1VMEM_GND_B2
FB803 220
120FB805
VSEL_1.8V
220FB800
C817
4.7u
L804 0.47u
L806 0.47u
L800 0.68u
0.47uL801
L802 0.47u
L805 0.47u
L803 0.68u
VCORE1_OMAP_MPU
C831 10u
6 28C
u7 .4
C828 10u
4.7u
C824
120FB801
VSEL_VMEM
C825 10u
4.7u
C819
120FB804
VSEL_1.29V
C821 10u
VSEL_2.1V
928C
u7.4
10uC818
C814
4.7u
120FB802
VCORE2_OMAP_IVAUD
VSEL_VCORE3
C815 10u
C808
4.7u
FB806 120
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
TP�
TP3
TP4
TP5
TP6
TP7
TP8
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.10 Charger Troubleshooting
LGP920 micro USB is located at the side of the terminal set, charging current flows from external micro USB
Connector directly to the battery. The charger IC maximum charging current is set around 945mA
Charging Procedure - Connect TA or u-USB Cable - Control the charging current by RT9524 IC
- Charging current flows into the battery
Troubleshooting Check Point - Connection of TA or USB Cable - Charging current path (RT9524)
- Battery
During charging operation test point signal goes low and when stop charging goes high.
4.9
P9�5
4. TROUBLE SHOOTING
- 10� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Check the Connectionof uUSB and battery
Connection OK?No
Yes
Is the uUSB Cablevoltage 4.8V (or 5.0V)
No
Yes
Is it charging properlyAfter turning on?
START
Change I/O connector
Change TA (or u-USB cable)
ENDYes
No
TP Signal is correct? ENDYes
No
Change the Main Board
4. TROUBLE SHOOTING
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LGE Internal Use Only
During charging operation test point signal goes low and when stop charging goes high.
TP809, CHG_EN_SET/
VCHGUSB_VBUS VBAT
)%1(
828R
smho
K2
(0603)10KR821
1uC811
C809
1u
728R
)%1(
065
VSEL_1.8V
U801RT9524
65
74
83
92
101
11PGND
VIN BATT
ISET PGB
GND1 CHGSB
LDO GND2
IEOC EN_SET
TP809
1uC810
CHG_STATUS/
CHG_EN_SET/
USB_VBUSVCHG 1mm1mm0.15mm
(Rev.C)Removed Res.
TP809 : Charging Enable Signal
4. TROUBLE SHOOTING
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LGE Internal Use Only
Cable is inserted? Insert cableNo
Yes
Change the mainboard
TP1 is 5V? Check MUIC or Charger ICNo
Yes
USB_D+is 3.3V? Check U811No
Yes
START
4.11 USB Trouble shooting
The sequence of LGP920USB is,
USB connected to LGP920 USB_VBUS(C816) goes to 5V USB_D+ go to 3.3V USB_DATA is triggered
USB work
Block Diagram of USB & UART connection is shown below
Check MUIC or
Charger IC
Insert
NO C816 is 5V?
YES
YES
Cable is inserted?NO
Check
Change the Main board
NO USB_D+ is 3.3V?
YES
Start
4.10
P9�5
P9�5
4. TROUBLE SHOOTING
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LGE Internal Use Only
ZD801
PSD12-LF
VSEL_1.8VESD9B5_0ST5G
ZD802
CN801
GU077-5P-SD-E1500
11
10
9
5
4
3
2
1
8
7
6
VBUSD-
D+
ID
GND
NFM18PC104R1C3FL800
IN OUT
GND1 GND2
56KR850
C827
1u
2.2KR848
C822
0.1u
C823
1u C820
100n
R8541.5K
U811MAX14526EEWP+TCC6
2B
1C
2C
C3 A2
C4
D3
D1 D4
A1
B1
A3
B4 B3
B5 A5
C5 A4
D5 D2BATVB
DN1COMN1
DP2COMP2
U1UID
U2
RES
MIC
AUD1CAP
AUD2
GND
ISETIC LC
S
AD
S
TNI
R8531.5K
VBAT
I2C3_SCLI2C3_SDA
VCHG
MUIC_INT/
USB_DM_OMAP
USB_DP_OMAP
UART_RX
UART_TX
USB_IDUSB_DPUSB_DM
Added (Rev.B)
1mm
90ohm matching !!90ohm matching !!
Changed (Rev.C)
Added (P925 Rev.A)
Changed (P925 Rev.A)Changed (Rev.E,1.1)
C3
B5
B4USBA0_OTG_DM/UART3_TX_IRTX/UART2_TX/GPIO_180/SAFE_MODEUSBA0_OTG_DP/UART3_RX_IRRX/UART2_RX/GPIO_179/SAFE_MODE
USBA0_OTG_CE
USB_DM_OMAPUSB_DP_OMAP USB
MUIC
TP1 (USB_VBUS)
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1 (USB_VBUS)
U811 (MUIC – MAXIM14526)
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.11 Audio trouble
4.11.1 Speaker troubleshooting
Speaker control signals are generated by OMAP4430 (U500) and Power is supplied byTWL6040(U901).
Is speaker sound OK? ENDYes
No
Change the mainboard
Change the main ANT module.Is speaker sound OK? END
Yes
No
Change the RF key PCB.Is speaker sound OK? END
Yes
No
Change the TWL6040(U901)Is speaker sound OK? END
Yes
No
START
Check the speaker sound andreconnect the main ANT module
4. TROUBLE SHOOTING
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LGE Internal Use Only
RF Key PCB
TWL6040
TWL6040
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.11.2 Receiver troubleshooting
Receiver control signals are generated by OMAP4430 (U500) and Power is supplied byTWL6040(U901).
Is receiver sound OK? ENDYes
No
Change the mainboard
Change upper module (receiver + Top FPCB) END
Yes
No
Change theTWL6040(U901) Is speaker sound OK? END
Yes
No
START
Check the receiver sound (loop back mode).
And reconnect Top FPCB connector on main-board.
4. TROUBLE SHOOTING
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LGE Internal Use Only
TWL6040
Upper module :
Receiver + Top FPCB
Top_FPCB BTB
connector
Top_FPCB BTBconnector
TWL6040
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.11.3 Main MIC troubleshooting
Main MIC signal is generate by MEMS MIC on RF-key PCB
Check the MIC hole to make clear the voice signal path.
Is vioce signal OK?END
Yes
No
Change the mainboard
Change the RF-key PCB.And check the voice siganl.
Is voice signal OK?END
Yes
No
Change the TWL6040(U901)Is the voice siganl OK? END
Yes
No
START
Check the MIC signal by loop-back testor voice recorder
4. TROUBLE SHOOTING
- 11� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
RF Key PCB
TWL6040
TWL6040
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.11.4 SUB MIC troubleshooting
Sub MIC signal is generate by MEMS MIC on Top FPCB
Check the MIC hole to make clear the voice signal path.
Is vioce signal OK?END
Yes
No
Change the mainboard
Change the Top FPCB. Is voice signal OK END
Yes
No
Change the TWL(U901)Is the voice signal OK? END
Yes
No
START
Check the MIC signal by loop-back testor voice recorder
4. TROUBLE SHOOTING
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LGE Internal Use Only
TWL6040
Top FPCB
TWL6040
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.11.5 Ear-MIC troubleshooting
Ear MIC control signal is generate by TWL6040 and OMAP4430.
- Disable to recognize headset insert
Check the 3.5pi headest FPCB BtoB connector or change that FPCB
to new one.
No
Yes
START
Check the left signal and detectionline became short when
headset inserted
No
END
Check the top FPCB BtoB Connector or change that FPCB to
new one.
YesEND
Change the P-channel MOCFET
No
Detecting headset insert well?
Change the TWL6040.Detecting headset insert well?
No
Change the mainboard
ENDYes
ENDYes
Yes
No
4. TROUBLE SHOOTING
- 116 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
C1175
0.1u 0.1u
C1176 R1176
10K
G5TS0_5B9
DSE
ZD1172
VSEL_1.8V
200KR1174
C1177
33p
VSMF05LCCD1175
43
52
61 R1173 1M
1800FB1175
1800FB1176
FB1177 1800
FB1173
1800
L1172
DNI
C1171 1n
18 17
19 16
20 15
21 14
22 13
23 12
24 11
25 10
26 9
27 8
R1172
DNI
C1172
DNI
Q1173
2SJ347
2
3
1G
DS
FM_ANT
AUD_RCV_NAUD_RCV_P
EAR_LEAR_R
EAR_SENSE
Added (Rev.E)
Changed (Rev.1.0)Added (925 Rev.D)
Check the left signal and detection line became short when headset inserted
TP2, FB1176TP1, FB1173
TP1
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
Check the MIC hole to make clear the voice signal path.
Is vioce signal OK?END
Yes
No
Change the mainboard
Change the Top FPCB. Is voice signal OK END
Yes
No
Change the TWL(U901)Is the voice signal OK? END
Yes
No
START
- Disable to using headset MIC or headset receiver when voice call
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.12 Camera trouble(5M/VGA)4.12.1 Main 5M AF Camera troubleshooting
5M camera control signals are generated by OMAP4430(U500), and Power is supplied by LP87�0(U1�01)
Check the camera conn. and revonnect thr camera
Camera is OK?
No
ENDYes
START
Yes
Check the camera signals MCLK(TP4), MIPI_CLK(TP5), MIPI_DATA(TP6)
Yes
Change the camera
Change the main boardNo
Check IOVDD(TP1),DVDD(TP�), AVDD(TP3)
Camera is OK? ENDYes
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
C1212
10u
U1201LP8720TLX
1B
E1C2
B2
C1
E2
D3
C3
A1C4
B3
A3
D4
E3
D2
B4E4
2A
1D
4A
TTA
BV
2NI
V
1NI
V
VINB LDO1
FB
SW
GNDB
LDO2
IRQ_N
SDA LDO3
SCL
DVS
EN
LDO4
DEFSEL
IDSEL LDO5
DN
G
1u
C1204
C1211
2.2u
C1205
1u
C1209
2.2u2.2u
C1210
5M_VCM_V2V8_S
10u
C1201
5M_VCM_V2V8_P
5M_VANA_V2V7_P
VBAT
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
2.2u
L1201
1u
C1206 C1207
1u
C1208
1u
100KR1202
I2C3_SCLI2C3_SDA
CAM_SUBPM_EN
Added Res. (Rev.B)
4E o t esol
C
Changed (P925 Rev.A)
FL1223
ICMEF214P101M01
9
84736251
P1 P5P2 P6P3 P7P4 P8
1G
2G
CN1221GB042-40S-H10-E3000
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
ICMEF214P101M
FL1222
01
9
84
73
62
51P1 P5P2 P6P3 P7P4 P8
1G
2G
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
5M_VANA_V2V7_P
1u
C1236
4.7u
C1235
5M_VCM_V2V8_P
5M_VCM_V2V8_S
FL1221ICMEF214P101M
01
9
8
7
6
5P1
1P5
P22
P6P3
3P7
P44
P8
1G
2G
G5TS0_5B9
DSE
4221DZ
G 5TS 0_5B9
DSE
5221DZ
0.1u
C1230C1228
4.7u
C1229
1u
0.1u
C1237
C1231
0.1u
0.1u
C1232
0.1u
C1234
C1233
0.1u
I2C3_SCLI2C3_SDA
I2C4_SDAI2C4_SCL
5M_MCLK
PRIMARY_5M_MIPI_DATA0_PPRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_CLK_PPRIMARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_PSECONDARY_5M_MIPI_DATA0_NSECONDARY_5M_MIPI_DATA0_P
SECONDARY_5M_RESET_N
SECONDARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_DATA1_PPRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_RESET_N
5M_MCLK_CAM
5M_MCLK_CAM
AVDD : TP3
IOVDD : TP1
DVDD : TP�
MCLK: TP4
MIPI_CLK: TP5
MIPI_DATA: TP6
4. TROUBLE SHOOTING
- 1�0 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
DVDD : TP2(L1201)
AVDD : TP3(C1204)
MIPI_CLK: TP5(FL1222)
MCLK: TP4(FL1222)
MIPI_DATA: TP6(FL1223)
IOVDD : TP1(C1207)
4. TROUBLE SHOOTING
- 1�1 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
CN103
1110
129
138
147
156
165
174
183
192
201
0.1u
C103
TWL_LDO_1.8V
TWL_LDO_2.8V
0.1u
C104
FB101
VT_CAM_RESET/VT_CAM_PWDN
VT_0.3M_MIPI_CLK_NVT_0.3M_MIPI_CLK_P
VT_0.3M_MCLK
VT_0.3M_MIPI_DATA0_NVT_0.3M_MIPI_DATA0_P
I2C3_SDAI2C3_SCL
Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)
IOVDD & DVDD : TP1(FB101)
AVDD : TP�(C103)
4.12.2 Sub VAG Camera troubleshooting
VGA camera control signals are generated by OMAP4430(U500), and Power is supplied by LP87�0(U1�01)
IOVDD & DVDD : TP1(FB101)
AVDD : TP2(C103)
4. TROUBLE SHOOTING
- 1�� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Press PWR key turn the power On
Is the circuit powered?
Yes
END
Follow the Power ON trouble shooting
No
LCD display OK?
START
No
Check LCD Power TP1, TP�, TP3
LCD BL Boost outputTP4
No
Change the Main board
Disconnect and reconnect LCD connector(CN1141)
Change the LCD module
The LCD works
Yes
Yes
Yes
4.13 Main LCD trouble
4.13.1 2D LCD Display trouble
Main LCD control signals are generated by OMAP4430. Those signal’s path are : OMAP4430 -> LCD Module
4. TROUBLE SHOOTING
- 1�3 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
1uC1143
43
21
R1191 DNI
600FB1143
ICMEF214P101M
FL1142
01
9
84
73
62
51P1 P5P2 P6P3 P7P4 P8
1G
2G
2.8V_3D_LCD
2.8V_LCD_VCI
1.8V_LCD_IOVCC
12V_3D_LCD
FL1141
ICMEF214P101M 01
9
8 4
7 3
6 2
5 1P1P5P2P6P3P7P4P8
1G
2G
CN114124-5804-030-000-829+
16 15
17 14
18 13
19 12
20 11
21 10
22 9
23 8
24 7
25 6
26 5
27 4
28 3
29 2
30 1
2.8V_LCD_VCC
2011AV
RF0518130SVCI
4011AV
RF051 8130SVCI
C1141
1u
DNIR1190
I2C2_SCLI2C2_SDA
LCD_RESET_N
LED_C2LED_C1
LED_A
DSI2_LCD_MIPI_CLK_PDSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_PDSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_N
3D_LCD_BANK_SEL_1
Added (Rev.B)Removeed VA1101, VA1103 (Rev.C)
TP1
TP�TP3
100KR1126
10uL1121
R11021.5K
VSEL_1.8V VBAT
1u
C1122
LM3528U1121
B2
D1
C3
A2
3D
C2
A3
2D
B3
A1
C1
B1GPIO1
HWEN/PGEN/GPIO
OVP
SET
WS
SUB/FB
SDA
DN
G
MAIN
IN
VIO
SCL
C1121
1u
12KR1125
D1122
R11031.5K
I2C2_SCLI2C2_SDA
LED_C2LED_C1
LED_A
LCD_CP_EN
Rev.B
Added Res. (Rev.B)
Changed (P925 Rev.A)
TP4
TP1
TP2,3TP4
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.13.2 3D LCD Display trouble
3D LCD enables by OMAP4430. Those signal’s path are : OMAP4430 -> LCD Module
Press PWR key turn the power On
Is the circuit powered?
Yes
END
Follow the Power ON trouble shooting
No
3D display OK?(Dedplay another color)
START
No
Check LCD Power TP1, TP�
Check 3D LCD conttol signalTP3
No
Change the Main board
Disconnect and reconnect LCD connector(CN1141)
Change the LCD module
The 3D LCD works
Yes
Yes
Yes
Enter the device test (S3D LCD test)
4. TROUBLE SHOOTING
- 1�5 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2.8V_3D_LCDU1106
BU28TD2WNVX
5
3 24 1
VOUTVINGNDSTBY
DN
GP C1107
1u
VBAT
C1106
1u
3D_LCD_EN
R1136
510K
51KR1133
12V_3D_LCD
VBAT
200K
R1134 C1134
0.1u
5311R
K22
0.1uC1132 C1138 0.1u
C1137
1u
4.7u
C1131TPS61093
U1131
11
10
9
4
7
3
5
2
8
6
1GND
SS
OUT
VIN
EN
CP2
FB
CP1
SW
VO
Exposed_GND
4.7uL1131
3D_BOOST_EN
Changed (Rev.B)
Changed (P925 Rev.A)
R1191 DNI
16 15
17 14
18 13
19 12
20 11
21 10
22 9
23 8
24 7
25 6
26 5
27 4
28 3
4011AV
RF 0518 130SVCI
DNIR1190
I2C2_SCLI2C2_SDA
LED_C2LED_C1
LED_A
3D_LCD_BANK_SEL_1
TP1
TP�
TP3
4. TROUBLE SHOOTING
- 1�6 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Figure. 3D LCD operating trouble
TP1
TP3
TP2
TP1
TP3
TP2
4. TROUBLE SHOOTING
- 1�7 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Re-insert the SIM card
Work well? ENDYes
No
Change Main
�.9V_SIM(C103)runs? Change the main boardNo
Yes
Work well? ENDYes
START
Change SUB
Work well? ENDYes
No
Change SIM card
No
4.15 SIM detect Trouble shooting
The sequence of detecting LG-P920 SIM is,
SIM inserted to LG-P920 2.85V_SIM(C207) goes to 2.85V Triggers SIM clock, reset and data.
Block Diagram of USB & UART connection is shown below
I_O RST CLK
USIM
USIM_CLKK
USIM_RESET
USIM_DATA
MP-EHM
XMM6260 CC_IO
CC_CLKCC_RST
Start
Re-insert the SIM card
Work well? End Yes
NoNO
Change the main
board
2.9V_SIM (C103) runs?
YES
Change SUB
Work well? End Yes
No
Change SIM card
Yes
No
End Work well?
Change Main
4.14
P9�5
P9�5
4. TROUBLE SHOOTING
- 1�8 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
C101
10pC104
10p0.1u
C103
J101
87
63
52
41VCC GND
RST VPP
CLK I_O
GND1 GND2
K7.4
1 01R
VSIM_2.9VVSIM_2.9V
C102
DNI
USIM_RESET/USIM_CLK USIM_DATA
* layout note : CLK and IO must be seperated
Rev 1.0 value change
Rev 1.0 value change
VSIM_�.9V : TP1(C103)
VSIM_2.9V : TP1(C103)
P925 SUB RFPCB
Check if SUB RFPCB is damaged
4. TROUBLE SHOOTING
- 1�9 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.15 Vibrator TroubleshootingCheck out the setting menu on the phone. If not, check Test points shown on the pictures.
Turn on the phone
Is the circuit powered?
Yes
Follow the power-on trouble shooting
No
START
Check TP1, �, 3
No
Change the main board
Change the vibratorYes
Vibration OK?
Vibrator works
END
Yes
Check haltic feedback on the setting menu
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
ISA1000
EUSY0238306
U981
90111
54
63
72
81EN VDP
PWM GND
MODE VDD
GAIN VDN
3C
N
2C
N
1C
N
TWL_LDO_3.0V
C987
2.2u
R982
DNI
L988 82n
L989 82n
R986 470K
0R987
TP905
R981100K
C986 3.9n
VIB_L_P
VIB_L_N
VIBE_PWMVIBE_EN
Added (P925 Rev.A)
Changed (P925 Rev.A)
Changed (P925 Rev.A)
TP1
TP�
TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1
4. TROUBLE SHOOTING
- 13� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.16 HDMI TroubleshootingCheck out the setting menu on the phone and then set the proper resolution for the outer display as shown below
Turn on the phone
Is the circuit powered?
Yes
Follow the power-on trouble shooting
No
START
Check the setting on menu
No
Change the main board
Set the resolution suitable for the display
Yes
Video ouput OK?
HDMI woeks
END
Yes
Connect the HDMI cable
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. TROUBLE SHOOTING
- 134 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.17 Motion Sensor on/off trouble
When the motion sensor does not work, the reason is chip problem. If the motion sensor IC is damaged, it will do not
work even thought power is supplied and OMAP4430 controls normally. Therefore if the motion sensor is damaged,
change the motion sensor IC or main board.
Check the gyro & motion sensor function
Function is OK?
No
ENDYes
START
Change the Gyro SensorIC(U961)
YesGyro-NG
Motion sensor-OK?
No
ENDYes
Change the motion sensorIC(U971)
Gyro & motionfunction is OK?
No
ENDYes
Change the main board
Function is OK? ENDYes
No
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
R9021.5K
0.1u
C965
VSEL_1.8V
C962
0.1u
MPU3050AU961
25
21
20
22
19
23
24
81 71
9
8
10
7
11
6
12
5
31
4
41
3
51
2
61
1NI
KLC
7C
N
1C
N
6C
N
2C
N
5C
N
3C
N
DD
V
4C
N
INT
AD_
EMI
FSYNC
IME_CL
REGOUT
VLOGIC
AD08
CN
DN
G
SDA
SCL
RESV1
CLKOUT
CPOUT
RESV2
NC9
C961 2.2n
SENSOR_3.0V
0.1u
C963
R9011.5K
VSEL_1.8V
I2C4_SDAI2C4_SCL
GYRO_INT
AD
_E
MI
LC_
EM
I
Added (P925 Rev.A)
R973DNI
1u
C973
VSEL_1.8V
C972
0.1u
0.1u
C971 U971
KXTF9
4
3
2
1
501
6
7
8
9SCL
DNC4
INT
DNC3
AD
SD
DV
IO_VDD
DNC1
DNC2
GND
VSEL_1.8V
SENSOR_3.0V
MOTION_INT
IME_DA
IME_CL
4. TROUBLE SHOOTING
- 136 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Gyro SensorIC(U961)
Motion sensorIC(U971)
4. TROUBLE SHOOTING
- 137 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.18 Gyro/Compass sensor troubleshooting
The compass sensor is calibrated by the gyro sensor data using SW algorithm. Therefore Gyro sensor error makes the
compass sensor malfunction.
Check the gyro & compasssensor function
Function is OK?
No
ENDYes
START
Change the Gyro Sensor IC(U961)
YesGyro-NG?
Compass-OK?
No
ENDYes
Change the Compass Sensor IC(U975)
Compass Sensorfunction is OK?
No
ENDYes
Change the main board
Gyro & compassFunction is OK? END
Yes
No
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
R9021.5K
0.1u
C965
VSEL_1.8V
C962
0.1u
MPU3050AU961
25
21
20
22
19
23
24
81 71
9
8
10
7
11
6
12
5
31
4
41
3
51
2
61
1NI
KLC
7C
N
1C
N
6C
N
2C
N
5C
N
3C
N
DD
V
4C
N
INT
AD_
EMI
FSYNC
IME_CL
REGOUT
VLOGIC
AD08
CN
DN
G
SDA
SCL
RESV1
CLKOUT
CPOUT
RESV2
NC9
C961 2.2n
SENSOR_3.0V
0.1u
C963
R9011.5K
VSEL_1.8V
I2C4_SDAI2C4_SCL
GYRO_INT
AD
_E
MI
LC_
EM
I
Added (P925 Rev.A)
C975
1uAMI306U975
10
95
4
63
72
81
DD
VA
YD
RD
DN
GL
CS
GE
RV
PP
V
INT
SDA ADDR
DVDD
SENSOR_3.0V
C978
1u
VSEL_1.8V
C976
10n
I2C4_SDAI2C4_SCL
COMPASS_INT
Added (Rev.1.0)
4. TROUBLE SHOOTING
- 139 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Gyro SensorIC(U961)
4. TROUBLE SHOOTING
- 140 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.19 Proximity Sensor on/off trouble
Proximity Sensor is worked as below:
Send Key click -> Phone number click -> Call connected -> Object moved at the sensor -> Control the screen’s on/off
operation automatically
Send Key click & Phone number click& Call connected
START
Change the vt_cam fpcb LCD off? ENDYes
Check TP1 & I�C3_SDA & SCL& TP� Output
Output work well?
No
ENDYes
Change the main board
Function is OK? ENDYes
No
No
Object moved at theProximity sensor
4. TROUBLE SHOOTING
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LGE Internal Use Only
PROXI_3.0V
U101
54
63
72
81SDA VDD
INT SCL
LDR GND
LEDK LEDA
SENSOR_3.0V
1uC101C102
1u
PROX_INT
I2C3_SDA
I2C3_SCL
Rev.B(Pull Up Move to Main PCB)
TP1
TP�
Sensor_3.0V : TP1(C102) PROXI_3.0V : TP2(C101)
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.20 Ambient Light Sensor on/off trouble
Illumination Sensor is worked as below:
Menu Key click -> Settings click -> Display click -> Brightness click -> Automatic brightness click
Menu key click-> Settings click-> Display click
-> Brightness click-> Automatic brightness click
START
Change the vt_cam fpcb LCD brightness change? ENDYes
Check Sensor_3.0V(TP1)
Output work well?
No
ENDYes
Change the main board
Function is OK? ENDYes
No
No
Hide Illumination sensor by hand
4. TROUBLE SHOOTING
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LGE Internal Use Only
PROXI_3.0V
U101
54
63
72
81SDA VDD
INT SCL
LDR GND
LEDK LEDA
SENSOR_3.0V
1uC101C102
1u
PROX_INT
I2C3_SDA
I2C3_SCL
Rev.B(Pull Up Move to Main PCB)
TP1
Sensor_3.0V : TP1(C102)
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.21 Touch trouble
Touch control signals are generated by OMAP4430. Those signal’s path are : OMAP4430 -> Touch Module
START
Change the vt_cam fpcb Touch is OK? ENDYes
Check Touch_3.3V(TP1)& Touch_INT_N(TP�)
& I�C�_SDA(TP3) & SCL(TP4) Output
Output work well?
No
ENDYes
Change the Sub Rfpcb
Touch is OK? ENDYes
No
No
Reconnect the touch connector(CN10�)& sub BtB Connector(CN101)
Check the touch connector(CN10�)& sub BtB Connector(CN101)
No
Change the main board
Touch is OK? ENDYes
4. TROUBLE SHOOTING
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LGE Internal Use Only
CN102
65
74
83
92
101
30 1AV
VSEL_1.8V
21 1R
K01
TOUCH_3.3V
VSEL_1.8V
50 1DZ
C119
2.2u
101DZ
201DZ
3 01DZ
401DZ
601DZ
u1021
C
I2C2_SCL
I2C2_SDA
TOUCH_INT_N
TOUCH_RESET
Rev.F
Rev.E
Rev.F
Rev.FRev.F
I�C�_SCL: TP4(ZD103)
C115
1u
TOUCH_3.3VU102
5
3 24 1
VOUTVDDGNDCE
DN
GP
VBAT
SENSOR_3.0V
2ch -> 1ch (Rev.E)Remove 0 ohm (Rev.G)
I�C�_SDA: TP3(ZD10�)
Touch_INT_N: TP�(VA103)
Touch_3.3V : TP1(C119)
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. TROUBLE SHOOTING
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LGE Internal Use Only
I2C2_SDA: TP3(ZD102) I2C2_SCL: TP4(ZD103)
Touch_3.3V : TP1(C119)
Touch_INT_N: TP2(VA103)
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
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LGE Internal Use Only
LGP9�5
LGP9�5
LGP9�5
LGP9�5
5. DOWNLOAD
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LGE Internal Use Only
LGP9�5
5. DOWNLOAD
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LGE Internal Use Only
LGP9�5
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
P9�5
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
LGP9�5
LGP9�5
LGP9�5
5. DOWNLOAD
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LGE Internal Use Only
LGP9�5
LGP9�5
LGP9�5
LGP9�5
LGP9�5 LGP9�5
LGP9�5 LGP9�5
5. DOWNLOAD
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LGE Internal Use Only
LGP9�5
P925
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
LGP9�5
P925
5. DOWNLOAD
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LGE Internal Use Only
LGP9�5
P925
6. BLOCK DIAGRAM
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LGE Internal Use Only
6.BLOCK DIAGRAM
PMU
RD_HRD HX
VCTCXO26MHz
AFC DACXO VCONT
PMURF6590
1V2 1V8 2V852V65
FilterB9469
GPS IN
DiplexerRD_HX AFC_DACXO VCONT
PAM DCDC
RF6560VOUT FB
9
PM L
GSM_LB_TX
GSM_HB_TX
B8 TXAnt B8
CP_OUT
VOUT_FB
B7953TRX4
VCC
MMMB
RF6260
TransceiverPMB5712
PM_L
PM_H
B8_TX
B5_TX
B2_TX
B1_TX
B4 TX
Ant_B8
Ant_B5
Ant_B2
Ant_B1
Ant B4
B7953B8 DPX
B7671B5 DPX
B7955B2 DPX
B7696B1 DPXTRX2
TRX3
TRX4
TRX5
XMM6260
ST8T
BGSF18D
RX_L1XRX_L1RX_L2XRX_L2
SYS_CLK
B4_TXAnt_B4
Ant_B3
B7959B4 DPX
DCSSAW filter
SYS_CLK_EN
REF_CLK_EN
TRX1
TRX6
SYS_CLK
SYSCLKEN
REF_CLK_ENBGSF18D _
RX_M2XRX_M2RX_H2XRX_H2
RX_H1XRX_H1RX M1X
DI3_TX_DATDI3_TX_DATX
DI3_RX_DATDI3_RX_DATX
Di3_TX_DATDi3_TX_DATX
Di3_RX_DATDi3_RX_DATX
_MRX_M1
6. BLOCK DIAGRAM
- 171 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LCD 4.3”4.3” TFT 3D
EARO EAR_PIECE(RCV)FM_ANT
SDIO5
McPDMI2C2
DSI
I2C2
McBSP1(PCM)
UART2 TWL6040BT/WLAN/FM
(WL1271)LED
Backlight Driver IC
Touch
4.3 TFT 3DLCD
(480x800)
PDM
AUXLR
3.5 pi Ear MIC(Ear_Jack)
SPKMIC1MIC1
SPK
HS_MICHSOLR
FM_L/R
HiFi & PCM Voice
McBSP3(I2S)
MIC2MIC2
FM
OMAP4430
SDMMC2
SDRC
I2C4
I2C1TCXO Driver
38.4MHZProximity
Light Sensor
Motor
2Gb-2chLPDDR2
eMMC (8Gb)
CompassDriver IC3.5 pi Ear_Jack
HSOLRMCLK
POP
I2C4
FM_ANT
3D CAMERA
GPIO_25DMTIMER8_PWM_EV
TSDMMC2 I2C1
PMB5712A-GPS
VT0.3MMIPI
5M AFMIPI(P)
5M AFMIPI(S)
eMMC (8Gb)
CSI1
CSI2HDMI
LNAFEM
UART3
Fuel gauge
3D CAMERA T
GPIO
UART1
SDMMC1
McSPI4
GPIO_120XMM6260
5M CAM Flash
HDMI
I2C2USIF3
GPIO_35I2S2
Keypad
KB_COL/ROW
MCSPI2(PCM)
1GbNAND512MbDDR
NAND
DDR
MCPDigRF
MIPI_HSIMIPI_HSI
IPC_SRDYGPIO_119 GPIO_34IPC_MRDY
I2C1I2C3
USBUART4
JTAG
Key LEDGyro
JTAGJTAG
USB
JTAGUSIF1
USIM1Accelerometer
I2C
I2C4GPIO_82
PMIC_AP(TWL6030)
32.768KHz
Charger
I2C32.768KHz
PWR-ON KEYVCHG
VBATCoin cell
BatteryMUIC
6. BLOCK DIAGRAM
- 17� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
OMAP I2C1 SDAI2C1 SDA TWL6040SPK
HFRP1AUD_SPK_PAUD SPK N
4430PDMDNPDMUP
PDMCLK
SDASCL
PDM_DL_DATAPDM_UL_DATA
ABE_CLKSPDM CLK
I2C1_SDAI2C1_SCL
ABE_PDM_DL_DATAABE_PDM_UL_DATA
ABE_CLKS
I2C1_SDA
I2C1_SCLTWL6040(Audio Codec)
AUD RCV PRCV
HFRN1AUD_SPK_N
HFRP2HFRN2
HBIASHS MICBIAS
PDMCLKLBPDMFRAME
AUDPWRONNRESPWRON
NAUDINT
PDM_CLKPDM_FRAME
AUD_PWRONSYS_nRESPWRON
SYS_nIRQ2
ABE_PDM_LB_CLKABE_PDM_FRAME
HDQ_SIO
SYS NIRQ2SYS_NRESPWRON
EARPEARN
AUD_RCV_PAUD_RCV_N
BT / WiFi / FMHBIAS
HS_MICHSLHSR
3.5_
HS_MICEAR_LEAR_RHOOK_ADC
ACCONN
NAUDINT
AFMLAFMR
FM_AUDIO_R
FM_AUDIO_L
SYS_NIRQ2
FM_I2S_FSYNC
FM_I2S_DIFM I2S CLK
FM_I2S_FSYNC
FM_I2S_CLK
FM_I2S_DO
ABE McBSP3 CLKXABE_McBSP3_DX
ABE_McBSP3_FSX
Analog
MIC1
MBIASFM_I2S_CLK
FM_I2S_DOBT_PCM_SYNCBT_PCM_DOUTBT_PCM_DIN
BT PCM CLK
PCM_AUD_FSYNC
PCM_AUD_INPCM_AUD_OUTPCM AUD CLK
FM_I2S_DIABE_McBSP3_CLKX
ABE_McBSP3_DR
ABE M BSP1 CLKXABE_McBSP1_DR
ABE_McBSP1_DXABE_McBSP1_FSX MMICN
MMICP
Analog
MIC2
SBIAS
SMICNSMICP
FM_ANT
_ _ PCM_AUD_CLKABE_McBSP1_CLKX SMICN
FM_ANTEAR_SENSE
EAR_SENSEDPM EMU10
HCI_CTSHCI_RTSHCI_TXHCI_RX
BT_UART_RTS/BT_UART_CTS/BT_UART_RXDBT_UART_TXD
UART2_RTS/UART2_CTS/
UART2_RXUART2_TX
XMM6260IPC_I2S_DIN
IPC_I2S_DOUT
IPC_I2S_CLKABE_McBSP2_CLKX
ABE_McBSP2_DR
ABE M BSP2 DX
I2S2_CLK0
I2S2_TX
I2S2 RX
DPM_EMU10
_ _ABE_McBSP2_DX
ABE_McBSP2_FSXIPC_I2S_SYNC
I2S2_RXI2S2_WA0
6. BLOCK DIAGRAM
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LGE Internal Use Only
CAMERA
VT IO DVDD 1V8
VT_PCLK
VT_HSYNC
VT VSYNC
CAM_MCLK
EMI/ESD Filter
VT_IO_DVDD_1V8
VT_AVDD_2V8
`
1.3M Camera
VT_VSYNC
VT_DATA[7:0]
VT_RESET_N
VT CAM PWDNVT_CAM_PWDN
CAM_I2C_SCL
CAM_I2C_SDA CAM_SUBPM_EN
LP8720SUB PMIC
LP8720SUB PMIC
AP20
8M MIPI CLK NCAM_VDIG_1V2Common mode filter
8M
Camera
(LGIT)
8M_MIPI_CLK_N
8M_MIPI_DATA0_N
8M_MIPI_CLK_P
8M_MIPI_DATA0_P
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8 8M MIPI DATA1 N(LGIT) 8M_MIPI_DATA1_N
8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M CAM VCM EN8M_CAM_VCM_EN
CAM_VIO_1V8
- 174 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
DNI
C182 C183
DNI
0.1u
C173
C249
2.2u
C195
100n
100pC105
2.2uC231
DNI
C233
C209
2.2u
26MHz
1XXA26000FBAX1843
2
4
1VCONT
VCC
GND
OUT
VBAT_PAM
U220RF6560
B1
D3
C1
C5
3C
2C
2B
A4
C4A2
D2
B6
D4
D1
A3
D6
D5
B3
A6
A16
C
A5
B5
B4SDI_CLK
SDI_DATA
VOUT_FB
2D
NG
CB_P
VRAMP
CWELL
CP_OUT
VBATT2
CB_N
CA_P
CC_P
NC
VBATT1A
VBATT1B CC_N
VSDIB1
DN
G
1A1
DN
G
2A1
DN
G
SDI_EN
LOUTA
CA_N
LOUTB
2.2u
C226
1nC189
VBAT
C241
1u
10uC224
C242
4.7u
U241RF6590
B1
D3
C1
C3
C2
2B
A4
4C
A2
2D
4D
D1
3A
3B
A1
4B
SS_I
PS
VSNS_2V85
NO_
KLC
DN
GA
LX2
KLC_I
PS
DN
GP OUT3B
WR
D_IP
S
VANA
OI_D
DV
VSNS_1V8
VSNS_1V2
VPWR
LX1
LX3A
C223 10u
4.7uL249
1uL226
L247 4.7u
4.7uL244
100R187
VDD_2V65
C252
DNI
C115
10n
DNIL105
VDD_1V8
VDD_2V85
C253
DNI
1u
C250
DNI
C254
4.7u
C244
DNI
C255
15nL245
4.7u
C247
C193
1u4.7u
C192
L102 2.2n
VSD2_1.8V
L1143n
VBAT
0.1u
C251
4.7u
C243
C184
22n
L248 15n
RF6260U171
71
81
91
02
21
10
11
21
13
41
15
16
9
8
7
6
5
4
3
2
1B8_TX
B5_TX
GSM_LB_TX
B2_TX
B1_TX
GSM_HB_TX
B4_TX
HB_RFIN
SPI_SS
VCC
LB_RFIN
IP
SV
NC
DN
G_IPS
SPI_CLK
SPI_DRW
GND
SO
MCV
MA
_BF
TA
BV
TU
O_FR
VDD_1V2
U181PMB5712
9G
01
G
3H
4H
5H
6H
01
H
3J
6J
7J
9J
01J
5K
6K
01
K
3L
8L
11
L
21
L
2M
7M
J11
K11
M10
M9
M8
A5
B5
E7
D12
C12
D13
C13
E13
F12
F13
A10
H9
C4
D8
B1
E12
F9
B2
C2
A9
K9
L13
B13
C9
E8
D2
D5
A6
L9
G5
F7
L2
F3
B9
D10
L10
J8
C6
C5
J4
J5
8G
7G
6G
4G
3G
01F
8F
6F
5F
4F
6E
5E
1E
9D
11C
01C
8C
7C
3C
7A
3A
B8
A8
E9
M13
M1
A13
A1
J12
J13
H13
H12
G12
G13
K13
B12
B10
A11
A12
B11
J2
K2
K1
L1
H1
J1
G2
H2
F1
G1
E2
F2
L7
L6
M6
M5
L5
L4
M4
M3
K12
M11
M12
D4
E4
D3
E3
C1
D1
A2
A4PM_LPM_HPA_POW_DETPA_RFVSPISPI_CLKSPI_SSSPI_DRWPA_RAMPPA_BIASRESET_NRD_L2RDL2xRD_L1RD_L1xRD_MRD_MxRD_HRD_HxRX_L1XRX_L1RX_L2XRX_L2RX_M1XRX_M1RX_M2XRX_M2RX_H2XRX_H2RX_H1XRX_H1XO_SUPXOXXOAFC_DACXO_EXTCLK_ONFSYS1_ENFSYS1FSYS2_ENFSYS2FSYS3_ENFSYS3NC1NC2NC3NC4VDD_TESTMI1MI2
1DNG
2DNG
3DNG
4DNG
5DNG
6DN
G7
DNG
8DN
G9D
NG
01
DNG
11DNG
21DNG
31DNG
41DNG
51
DN
G61
DNG
71
DN
G8
1D
NG
91
DNG
02DNG
12DNG
VDD2V5_RCRFVD2V5_RCBB
VDD2V5_TXBIASVDD2V5_TXDCOVDD2V5_RXDCOVDD2V5_RFCVDD2V5_FSYS
D2B_OUTVDD1V8_RCBBVDD1V8_RCRFVDD1V8_RCMSVDD1V8_RCLOVDD1V8_RXDCOVDD1V8_TXDCOVDD1V8_TXLOVDD1V8_FBRVDD1V8_TXMSVDD1V8_DIGVDD1V8_SCUVDD1V8_RFC
VDD1V8_RXPLLVDDBAT
D2B_OUT_TXRFVDD_TXRF
VDD1V2_DIGVDD_IO
VDDBAT_TXRFCEXT_TXPLLCEXT_TXMS
CEXT_RXPLLCEXT_DCXOSYS_CLK
SYS_CLK_ENREF_CLK_ENDI3_RX_DATDI3_RX_DATXDI3_TX_DATDI3_TX_DATX
GPO1GPO2GPO3GPO4GPO5GPO6GPO7GPO8
24
DNG
14
DNG
04
DNG
93
DN
G83
DNG
73
DN
G63
DNG
53
DNG
43
DNG
33
DNG
23
DNG
13
DNG
03
DN
G92
DNG
82
DN
G72
DNG
62
DNG
52
DNG
42
DNG
32
DNG
22
DN
G
VDD_1V8
VBAT
C114
27p
C197
47n 47n
C198
47n
C199
C248
4.7u
C190 6.8n
C188 6.8n
4.7nC187
C232 220n
DNI
C181
VDD_1V8
DNIL143
VDD_2V85
VDD_2V65VDD_1V2
VSD2_1.8V
VBAT
C112 10p
TP102
L158 1.5n
DNI
L112
C171
220n
L111
DNI
C1231p
C221
10n
VBAT
DNIL169
1.5nL147
L159DNI
1.5nL168
L148DNI
L127 1n
L138DNI
L122 2.2n
L128DNI
L110 4.7n
33pC163
DNIL162
C109
1.8p
L113
10n
33pC151
L141DNI
B40761DY2045LU121
95
75
94
55
35
15
05
40
39
38
37
44
34
24
14
84
74
64
54
33
43
53
63
23
13
03
92
82
51
31
21
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1311
791d
naB
-x
T
2d
naB
-x
T
4d
naB
-x
T
5d
naB
-x
T
8d
naB
-x
T
Rx-GSM1800_1Rx-GSM1800_2
Rx-Band1_1Rx-Band1_2
Rx-Band2_1Rx-Band2_2
Rx-Band4_1Rx-Band4_2
Rx-Band5_1Rx-Band5_2
Rx-Band8_1Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1GND2GND3GND4GND5GND6
7DN
G8
DN
G9
DN
G01
DN
G11
DN
G21
DN
G31
DN
G41
DN
G
81
DN
G71
DN
G61
DN
G51
DN
G
72DNG
82DN
G9
2DN
G0
3DNG
32D
NG
42DN
G52
DN
G6
2D
NG
GND19GND20GND21GND22
23DN
G33DN
G4
3D
NG
53DNG
13DN
G
63DNG
73DN
G
MS-156CSW102
4 3
2
1ANTCOMMON
G3G4
C211
1.5p
C1751p
C133DNI
L179 1.8n
33pC121
C153 22p
100n
L104DNI
C101C103
DNI
VBAT_PAM
VBAT
FL111BGSF18DM20
12
20
51
19
01
18
61
8
11
79
6
521 4
3
31
2
41
1
71D
DV
TRX_3
LC
S
TRX_2
OID
S
TRX_1
1D
NG
6D
NG
2D
NG
HB_TX
4D
NG
3D
NG
TN
A
LB_TX
DD
VL
TRX_6
5D
NG
TRX_5
MRF
TRX_4
DN
GP
0.1u
C194
0.1u
C191
C204
0.1u0.1u
C203C202
0.1u0.1u
C201C200
0.1u
0.1u
C208
0.1u
C207
0.1u
C206C205
47n
DNIL116
33pC116 33pC117
4.7n
L215B9469
2140MHz
FL2114 5
1
3 2G1O1
ING2O2
L213 1n
C230 2.2u
DNIL180
L176 2.7n
DNIC178
L177DNI
L131 1.2n
R186100
FB201
220
C172
0.1u
C227
2.2u
L214
DNI
SW10120279-001E-01
G1
ANT G2
C228
2.2n
L142 2.2n
L161 2.2n
L227 20n
C185
10n
L15247n
1nL137
C245
1u
C225
1u
C222 100n
C132 33p
L211 2.7n
2.7nL212
26MHz_GPS_REF
RX_B1_H2
RX_B1_H2
RX_B2_M2
RX_B2_M2
RX_B5_L2X
RX_B5_L2X
RX_B8_L1X
RX_B8_L1X
RESET_N
PA_RAMP
PA_RAMP
SPI_DRW
WR
D_
IP
S
WRD
_IP
S
SPI_DRW
SPI_DRW
SPI_SS
SS_
IPS
SS
_IPS
SPI_SS
SPI_SS
SPI_CLK
KL
C_
IPS
KL
C_IPS
SPI_CLK
SPI_CLK
VSPI
IPS
V
IPS
V
VSPI
FR_A
P
PA_RF
TE
D_WO
P_A
P
PA_POW_DET
TX_H
TX_H
TX_L
TX_L
DI3_SYS_CLKDI3_SYS_CLK_ENDI3_REF_CLK_EN
DI3_RX_DAT
DI3_RX_DATX
GSM_HB_TX
GSM_HB_TX
GSM_LB_TX
GSM_LB_TX
NO
_K
LC
CLK_ON
CP_OUT
TU
O_P
C
RX_GSM1800_M1
RX_GSM1800_M1
RX_GSM1800_M1X
RX_GSM1800_M1X
DPX_IN
RD_B4_HX
RD_B4_HX
RD_B4_H
RD_B4_H
DI3_TX_DATX
RX_B8_L1
RX_B8_L1
RX_B5_L2
RX_B5_L2
RX_B2_M2X
RX_B2_M2X
RX_B1_H2X
RX_B1_H2X
GPS_PWR_ON
RX_B4_H1X
RX_B4_H1X
DI3_TX_DAT
RX_B4_H1
RX_B4_H1
B2/GSM1900
B4
PAM DCDC
B5/GSM850
B8/EGSM
GSM1800_RX
B4 RX Diversity
Tranceiver PMU
R113 must be close to PMB5712
R114 must be close to Baseband
B1
Removed (Rev.B)
Changed (P925 Rev.B)
Added (Rev.D)
Removed (Rev.E)
Removed (Rev.E)
Rev.E
Moved to CP (Rev1.0)
Removed(Rev.1.0)
Removed(Rev.1.0)
* Global : 2.2nH* AT&T, TMUS : 100pF
<L102>
Rev.1.1
Changed(Rev.1.1)
Changed(Rev.1.1)
7. CIRCUIT DIAGRAM
- 175 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
C336
100n
C325
0.22u
C318
0.22u
C316
0.22u
C324
0.1u
DNI
R384
n022803
C
Q301
NTJD4105CT1G
43
52
61 S1 D1
G1 G2
D2 S2
K7.4
243R
C313
10u
10u
C305
043R
K001
USB_VBUS
C358
2.2u
4.7K
R313
IFX_USB_VBUS
TP301
113C
n022
203C
u1.0u1303
C4.7K
R314
10u
C344
VSD2_1.8V
4.7K
R316
FC-13532.768KHz
X300
21
3.3uL303
C343
220n
VRTC_1.8V
VBAT
SU
BV_
BS
U_XFI
VSD2_1.8VVSD1_1.3V
R319
4.7K
VSD2_1.8V
0.1u
C356 C357
0.1u
2.2u
C351
VSD2_1.8V
V3.1_1D
SV
VBAT
0.1u
C317
0.1u
C315
VSD1_1.3V
0.1u
C355C354
0.1u
C323
0.1u
U301XMM6260
4R
71U
1U
71A
1A
1D
2A
2R
1R
2P
1P
2N
1N
3K
01
U
9T
9U
21P
8T
7T
8U
7U
6F
4D
4K
1J
3H
4E
2F
4C
1H
4B
3C
5A
1G
4F
2G
3F
4J
5J
6J
6H
8H
3E
2K
3J
2J
2H
2C
3A
3D
1E
1B
1F
4A
1C
F13
J12
D13
D12
D11
H10
A7
E11
D10
E9
E8
F9
D8
G9
G11
H11
B16
C16
D16
E16
G15
J15
H16
J16
H17
G17
F17
E17
D17
C17
B17
A16
C9
B9
C12
A8
A9
A10
A11
A13
M13
M15
L11
N12
P13
L13
M14
N13
R5
P3
N4
P10
N8
B6
P9
N10
K10
M8
M9
N17
M16
M17
L17
T10
P14
T15
N9
U15
R12
K16
R16
T12
L8
J17
K11
N11
F15
B11
K8
E12
R8
K9
E13
E10
H9
K14
N5
M6
M4
M2
M5
M3
L7
B14
A15
B15
A14
G16
B10
F16
A12
G13
G14
B7
E14
K17
B12
B13
G10
H13
H14
J13
J14
A6
B8
11T
11U
61P
61N
61T
71R
71T
71P
21U
31U
1T
2U
3U
2T
3T
7P
6R
5T
4T
6T
6U
5U
4U
31T
41T
41U
1K
5L
9L
5K
2L
4L
1L
1M
7K
41N
11P
9R
61U
41L
01L
9D
61L
11J
8P
8J
31K
8G
41D
41F
1_S
SV
2_S
SV
3_S
SV
4_S
SV
5_S
SV
6_S
SV
7_S
SV
8_S
SV
9_S
SV
01
_S
SV
11
_S
SV
21
_S
SV
FRG
ID
_S
SV
LLP
_S
SV
BSU
_S
SV
KL
CE
CA
RT
_1
1M
TE
0TK
PE
CA
RT
_1
1M
TE
1TK
PE
CA
RT
_1
1M
TE
2TK
PE
CA
RT
_1
1M
TE
3TK
PE
CA
RT
_1
1M
TE
4TK
PE
CA
RT
_1
1M
TE
5TK
PE
CA
RT
_1
1M
TE
6TK
PE
CA
RT
_1
1M
TE
7TK
PE
CA
RT
_1
1M
TE
KL
C_
CC
TS
R_
CC
OI_
CC
ODT
IDT
SMT
KCT
N_
TS
RT
NI_
GI
RT
1NO
M_
WH
2NO
M_
WH
RS
TM
_D
XT
_1
FI
SU
TS
RM
_D
XR
_1
FI
SU
N_S
TR
_1
FI
SU
N_S
TC
_1
FI
SU
KL
CS
_1
FI
SU
ATA
D_
BS
U_
CI
SH
BRT
S_
BS
U_
CI
SH
TS
ET
_B
SU
SUL
PD
_B
SU
SU
NI
MD
_B
SU
EN
UT
_B
SU
DI
_B
SU
SU
BV
SUL
PD
SU
NI
MD
FWP
FCDP_RBn
MEM_CS0_N
MEM_CS1_N
MEM_CS2_N
MEM_CS3_N
MEM_ADV_N
MEM_RD_N
MEM_WR_N
MEM_WAIT_N
MEM_RAS_N
MEM_CAS_N
MEM_BE0_N
MEM_BE1_N
MEM_BC0_N
MEM_BC1_N
MEM_BC2_N
MEM_BC3_N
MEM_SDCLKO
MEM_BFCLKO_0
MEM_BFCLKO_1
MEM_CKE
MMCI1_CMD
MMCI1_CLK
MMCI_DAT_0
MMCI1_DAT_1
MMCI1_DAT_2
MMCI1_DAT_3
MMCI1_CD
VDD_CORE_1
VDD_CORE_2
VDD_CORE_3
VDD_CORE_4
VDD_CORE_3G_1
VDD_CORE_3G_2
VDD_CORE_EBU
VDD_IO18_1
VDD_IO18_2
VDD_IO18_3
VDD_IO18_4
VDD_IO18_5
VDD_IO18_6
VDD_MMC
VDD_SIM
VDD_USBIO
VDD_MIPI
VDD_PLL
VDD_IO12
VPP
VDD_USB_PD
VDD_USB_ANA
VDD_DIGRF
F32K
OSC32K
VSS_RTC
VDD_RTC
EINT1
EINT2
EINT3
I2C1_SCL
I2C1_SDA
DSP_AUDIO_IN1
CLKOUT0
CLKOUT2
T_OUT0
T_OUT1
RESET2_N
MIPI_HSI_RX_DATA
MIPI_HSI_RX_FLG
MIPI_HSI_RX_RDY
MIPI_HSI_RX_WAKE
MIPI_HSI_TX_DATA
MIPI_HSI_TX_FLG
MIPI_HSI_TX_RDY
MIPI_HSI_TX_WAKE
MEM_A_0
MEM_A_1
MEM_A_2
MEM_A_3
MEM_A_4
MEM_A_5
MEM_A_6
MEM_A_7
MEM_A_8
MEM_A_9
MEM_A_10
MEM_A_11
MEM_A_12
MEM_A_13
MEM_A_14
MEM_A_15
MEM_A_16
MEM_A_17
MEM_A_18
MEM_A_19
MEM_A_20
MEM_A_21
MEM_A_22
MEM_A_23
MEM_AD_0
MEM_AD_1
MEM_AD_2
MEM_AD_3
MEM_AD_4
MEM_AD_5
MEM_AD_6
MEM_AD_7
MEM_AD_8
MEM_AD_9
MEM_AD_10
MEM_AD_11
MEM_AD_12
MEM_AD_13
MEM_AD_14
MEM_AD_15
1DS_T
ABV_
DDV
2DS
_TAB
V_DDV
1DS
_SSV
2DS
_SSV
2WS_1
DS
BF_1D
S
2WS_2
DS
BF_
2DS
1NO
N_2
NO
N_N
WDR
WP_
TESE
R
N_BB_
TESE
R
SSF
N_LLA
_TES
ER
1M
2M
3M
4M
UMP
_TA
BV_DDV
UMPV
CTRV
MISV
LLPV
2DSV_
DDV
21_
OIV
OI_
BSUV
DP_BSUV
ANA
_BS
UV
UMP_S
SV
DNGA
FERV
NE_MT
NOMAN
A
B_G
IRT
TAD
_XR_
3iD
XTA
D_X
R_3iD
TAD
_XT
_3iD
XTAD_
XT_3
iD
KLC_S
YS
NEKLC
SYS
N_T
ESER
X
N_T
RELA
NE_
KLC_
FER
0KL
C_2S
2I
1KL
C_2S
2I
XR_2S
2I
XT_2S
2I
0AW_2
S2I
1AW_2
S2I
1WS_2
DS
1WS_1DS
1CN
2CN
3CN
4CN
5CN
V8.1_2D
SV
C306
22u
VBAT
3.3uL304
C353
0.1u
0204
633R
0.1u
C352
VSD2_1.8V
4.7R337
VSIM_2.9V
0.1u
C327
VUSB_IO_3.1V
C328
0.1u
C329
0.1u
10u
C312
VSD2_1.8VVPLL_1.2V
C330
0.1u
VIO_1.2V
0.1u
C333
22u
C307
V3.1_U
MP
V
FB30160
TP310TP311
TP312TP313
4.7KR383
VSD2_1.8V
TP300
R382
DNI
H8BCS0QG0MMR-46MU350
B6
B3
B4
A4
A7
A3
A6
M8
L7
M7
N5
N4
M4
N3
N2
L8
M6
L6
N7
L5
M3
M2
M1
H7
D5
H8
D7
J1
G2
F2
H2
D3
F8
G8
B7
B8
C7
C8
C6
D8
C5
E6
J5
J7
K8
J8
K7
K6
K5
K4
J2
H3
E1
E2
J3
C4
D2
C3
D1
C2
B2
K3
K2
K1
J4
N9
N6
M10
L9
L2
K10
J10
H9
H1
G9
F10
E9
D10
C9
B10
B5
B1
A9
M5
A5
L4
L3
J6
H6
H5
H4
G7
G6
G5
G4
G3
F7
F6
F5
F4
F3
F1
E8
E7
E5
E4
E3
D6
D4
A2
M9
L10
K9
J9
H10
F9
E10
D9
C10
B9
N8
L1
G10
G1
C1
A8
01N
1N
01A
1A
1CN
62
CN
82
CN
92
CN
VDD1VDD2VDD3VDD5VDD4VDD6
VDDQ1VDDQ6VDDQ5VDDQ4VDDQ10VDDQ9VDDQ2VDDQ8VDDQ7VDDQ3
NC27NC20NC21NC9NC19NC8NC11NC12NC17NC18NC7NC16NC25NC6NC10NC5NC13NC14NC4NC2NC24NC22NC23NC15NC3
VCC1VCC2
VSS1VSS4VSS8VSSQ5VSSQ4VSSQ9VSSQ8VSSQ3VSS2VSS3VSSQ10VSSQ1VSSQ2VSS5VSSQ6VSSQ7VSS6VSS7
A0A1A2A3A4A5A6A7A8A9A10A11A12BA0BA1
DQ0DQ1DQ2DQ3DQ4DQ5DQ6DQ7DQ8DQ9
DQ10DQ11DQ12DQ13DQ14DQ15
/CKCKCKE/CS
/RAS/CAS/WEDUDQMLDQMUDQSLDQS
IO0IO1IO2IO3IO4IO5IO6IO7IO8IO9
IO10IO11IO12IO13IO14IO15
/CE/RE/WECLEALE/WPR/B
VUSB_PD_1.1V
C334
0.1u0.1u
C337
VUSB_ANA_1.8V
0.1u
C335
413C
n022
60FB302
V8.1_CT
RV
V9.2_MI
SV
V2.1_LLP
V
n022013
C
103TPK01
V8.1_2D
SV
V2.1_OI
VV1.3_
OI_B
SU
VV1.1_
DP_
BS
UV
V8.1_A
NA_
BS
UV
u1.0103
C
n022403
C
u1.0903
C
C342 10p
VSD2_1.8V
603R
IN
D
U303FSA2259UMX
6
5
7
4
8
3
9
2
01
1 VCC
1B2
1B1
A2
A1
2S
1S
2B0
0B1
GND
10pC341
RESET_N
DI3_SYS_CLKDI3_SYS_CLK_EN
DI3_REF_CLK_EN
DI3_RX_DATDI3_RX_DATX
DI3_TX_DATXDI3_TX_DAT
GSM_TXON_IND
WS_
XT_TR
AU
UART_RX_SW
XFI_-D_
BS
UXFI_+
D_B
SU
/TE
SE
R_MI
SU
KLC_
MIS
U
ATA
D_MI
SU
XFI_X
R_TR
AU
XFI_X
R_TR
AU
XFI_XT_T
RA
U
XFI_XT_T
RA
UC
PI_XT_1T
RA
U
UART1_RX_IPC
MIPI_HSI_AC_FLAG|McSPI4_SOMI
MIPI_HSI_AC_FLAG
McSPI4_SOMI
MIPI_HSI_AC_DATA
MIPI_HSI_AC_DATA|McSPI4_SIMO
McSPI4_SIMO
MIPI_HSI_CA_READY|McSPI4_CLK
MIPI_HSI_CA_READY
McSPI4_CLK
USIF1_SW
IPC_SRDYIPC_MRDY
MODEM_SEND
MEM_WR_N
MEM_WR_N
MEM_WR_N
MEM_RD_N
MEM_RD_N
MEM_ADV_N
MEM_ADV_N
MEM_BC0_N
MEM_BC0_N
DDR_RAS_N
DDR_RAS_N
DDR_DQS[0]
DDR_DQS[0]
DDR_DQS[1]
DDR_DQS[1]
DDR_CAS_N
DDR_CAS_N
MEM_BUSY/
MEM_BUSY/
MEM_WP
MEM_WP MEM_CS1_N
MEM_CS1_N
MEM_A[9]
MEM_A[9]
MEM_A[10]
MEM_A[10]
MEM_A[11]
MEM_A[11]
MEM_A[12]
MEM_A[12]
MEM_A[13]
MEM_A[13]
MEM_A[14]
MEM_A[14]
MEM_A[15]
MEM_A[15]
MEM_AD[0]
MEM_AD[0]
MEM_AD[0]
MEM_AD[1]
MEM_AD[1]
MEM_AD[1]
MEM_AD[2]
MEM_AD[2]
MEM_AD[2]
MEM_AD[3]
MEM_AD[3]
MEM_AD[3]
MEM_AD[4]
MEM_AD[4]
MEM_AD[4]
MEM_AD[5]
MEM_AD[5]
MEM_AD[5]
MEM_AD[6]
MEM_AD[6]
MEM_AD[6]
MEM_AD[7]
MEM_AD[7]
MEM_AD[7]
MEM_AD[8]
MEM_AD[8]
MEM_AD[8]
MEM_AD[9]
MEM_AD[9]
MEM_AD[9]
MEM_AD[10]
MEM_AD[10]
MEM_AD[10]
MEM_AD[11]
MEM_AD[11]
MEM_AD[11]
MEM_AD[12]
MEM_AD[12]
MEM_AD[12]
MEM_AD[13]
MEM_AD[13]
MEM_AD[14]
MEM_AD[14]
MEM_AD[14]
MEM_AD[15]
MEM_AD[15]
MEM_AD[15]
MEM_A[0]
MEM_A[0]
MEM_A[1]
MEM_A[1]
MEM_A[2]
MEM_A[2]
MEM_A[3]
MEM_A[3]
MEM_A[4]
MEM_A[4]
MEM_A[5]
MEM_A[5]
MEM_A[6]
MEM_A[6]
MEM_A[7]
MEM_A[7]
MEM_A[8]
MEM_A[8]
IFX_USB_VBUS_EN
MEM_BC1_N
MEM_BC1_N
N_U
MP_T
ES
ER
MEM_WAIT_N
MEM_WAIT_N
MON1
1N
OM
MON2
2N
OM
IFX_TRIG_IN
NI_GI
RT_XFI
DSP_AUDIO_IN1
DSP_AUDIO_IN1
OMAP_SEND
/W
S_N
O_R
WP_
XF I
MEM_CS0_N
MEM_CS0_N
IPC_I2S_CLK
IPC_I2S_DOUTIPC_I2S_SYNC
IPC_I2S_DIN
CP_CRASH_INT
MIPI_HSI_CA_WAKE
MIPI_HSI_CA_DATAMIPI_HSI_CA_FLAGMIPI_HSI_AC_READY
MIPI_HSI_AC_WAKE
MEM_SDCLKO
MEM_SDCLKO
MEM_BFCLKO
MEM_BFCLKODDR_CKE
DDR_CKE
OX
CT ot esolc 002TP
BB ot esolc 103
C
Rev.B
NAND MCP
Analog switch for USIF1
Rev.B
Rev.B
Removed (925 Rev.D)Added (Rev.B)
Boot Configuration
(Active high)
BASE BAND PROCESSOR
Changeed (Rev.C)
Rev.C
Added (P925 Rev.A)
Changed (Rev.E)
Changed (Rev.E)
Changed (Rev.E)
* C316, C318, C324 : L-W swapped Cap
Rev.1.0
Removed (Rev 1.0)
Removed(Rev.1.0)
Removed (Rev.1.0)
)0.1.veR( devomeR
- 176 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
R512DNI
R5101.5K
R592 51K
51KR593VSEL_1.8V
R514 2.7K
VSEL_1.8V2.7KR515
U500OMAP4430
B23
B26
D22
C23
B12
B11
D25
B22
C25
C22
D21
C21
B25
D20
C20
B21
A21
B20
B19
A19
B18
A18
B17
D19
C19
D18
C18
D17
C17
D16
C16
B16
A16
D15
C15
D13
C13
D12
C12
V4
V3
U4
U3
T4
T3
K4
K3
L4
L3
M4
M3
N4
N3
P4
P3
D7
C7
B7
V27
U27
T27
N25
N26
M25
M26
W25
W26
V25
V26
U25
U26
T25
T26
R25
R26
AF3
AG3
AF4
AE4
AF5
AE5
D11
C11
D8
C8
D9
C9
D10
C10
B8
A8
B10
B9
H3
H2
K1
J1
G2
J2
H4
AH19
AG20
AE20
AF21
AF20
AE21
G28
G27
F28
F27
AH23
AG23
AF23
AE23
AG22
AE22
AF22
AA26
AA25
AB27
AB26
G3
G4
F1
F3
F4
E1
E2
E4
E3
D2
AE14
AF14
AG16
AF16
AE16
AH17
AF17
AE17
AG18
AF18
AE19
AF19
AG19
AE18
AH24
AG24
AF24
AE24
AH26
AF26
AE25
AF25
AG25
AC27
AB25
AC25
AC26
AC28
AD25
AD26
AD27ABE_McBSP2_CLKX/McSPI2_CLK/ABE_MCASP_AHCLKX/GPIO_110/USBB2_MM_RXDM/SAFE_MODEABE_McBSP2_DR/McSPI2_SOMI/ABE_MCASP_AXR/GPIO_111/USBB2_MM_RXDP/SAFE_MODEABE_McBSP2_DX/McSPI2_SIMO/ABE_MCASP_AMUTE/GPIO_112/USBB2_MM_RXRCV/SAFE_MODEABE_McBSP2_FSX/McSPI2_CS0/ABE_MCASP_AFSX/GPIO_113/USBB2_MM_TXEN/SAFE_MODE
ABE_McBSP1_CLKX/ABE_SLIMBUS1_CLOCK/GPIO_114/SAFE_MODEABE_McBSP1_DR/ABE_SLIMBUS1_DATA/GPIO_115/SAFE_MODEABE_McBSP1_DX/SDMMC3_DAT2/ABE_MCASP_ACLKX/GPIO_116/SAFE_MODEABE_McBSP1_FSX/SDMMC3_DAT3/ABE_MCASP_AMUTEIN/GPIO_117/SAFE_MODE
ABE_PDM_UL_DATA/ABE_McBSP3_DR/SAFE_MODEABE_PDM_DL_DATA/ABE_McBSP3_DX/SAFE_MODEABE_PDM_FRAME/ABE_McBSP3_CLKX/SAFE_MODEABE_PDM_LB_CLK/ABE_McBSP3_FSX/SAFE_MODEABE_CLKS/GPIO_118/SAFE_MODE
ABE_DMIC_CLK1/GPIO_119/USBB2_MM_TXSE0/SAFE_MODEABE_DMIC_DIN1/GPIO_120/USBB2_MM_TXDAT/SAFE_MODEABE_DMIC_DIN2/SLIMBUS2_CLOCK/GPIO_121/SAFE_MODEABE_DMIC_DIN3/SLIMBUS2_DATA/ABE_DMIC_CLK2/GPIO_122/SAFE_MODE
USBB1_ULPITLL_CLK/HSI1_CAWAKE/GPIO_84/USBB1_ULPIPHY_CLK/ATTILA_HW_DBG20/SAFE_MODEUSBB1_ULPITLL_STP/HSI1_CADATA/McBSP4_CLKR/GPIO_85/USBB1_ULPIPHY_STP/USBB1_MM_RXDP/ATTILA_HW_DBG21/SAFE_MODEUSBB1_ULPITLL_DIR/HSI1_CAFLAG/McBSP4_FSR/GPIO_86/USBB1_ULPIPHY_DIR/ATTILA_HW_DBG22/SAFE_MODEUSBB1_ULPITLL_NXT/HSI1_ACREADY/McBSP4_FSX/GPIO_87/USBB1_ULPIPHY_NXT/USBB1_MM_RXDM/ATTILA_HW_DBG23/SAFE_MODEUSBB1_ULPITLL_DAT0/HSI1_ACWAKE/McBSP4_CLKX/GPIO_88/USBB1_ULPIPHY_DAT0/USBB1_MM_RXRCV/ATTILA_HW_DBG24/SAFE_MODEUSBB1_ULPITLL_DAT1/HSI1_ACDATA/McBSP4_DX/GPIO_89/USBB1_ULPIPHY_DAT1/USBB1_MM_TXSE0/ATTILA_HW_DBG25/SAFE_MODEUSBB1_ULPITLL_DAT2/HSI1_ACFLAG/McBSP4_DR/GPIO_90/USBB1_ULPIPHY_DAT2/USBB1_MM_TXDAT/ATTILA_HW_DBG26/SAFE_MODEUSBB1_ULPITLL_DAT3/HSI1_CAREADY/GPIO_91/USBB1_ULPIPHY_DAT3/USBB1_MM_TXEN/ATTILA_HW_DBG27/SAFE_MODEUSBB1_ULPITLL_DAT4/DMTIMER8_PWM_EVT/ABE_McBSP3_DR/GPIO_92/USBB1_ULPIPHY_DAT4/ATTILA_HW_DBG28/SAFE_MODEUSBB1_ULPITLL_DAT5/DMTIMER9_PWM_EVT/ABE_McBSP3_DX/GPIO_93/USBB1_ULPIPHY_DAT5/ATTILA_HW_DBG29/SAFE_MODEUSBB1_ULPITLL_DAT6/DMTIMER10_PWM_EVT/ABE_McBSP3_CLKX/GPIO_94/USBB1_ULPIPHY_DAT6/ABE_DMIC_DIN3/ATTILA_HW_DBG30/SAFE_MODEUSBB1_ULPITLL_DAT7/DMTIMER11_PWM_EVT/ABE_McBSP3_FSX/GPIO_95/USBB1_ULPIPHY_DAT7/ABE_DMIC_CLK3/ATTILA_HW_DBG31/SAFE_MODEUSBB1_HSIC_DATA/GPIO_96/SAFE_MODEUSBB1_HSIC_STROBE/GPIO_97/SAFE_MODE
SDMMC1_CLK/DPM_EMU19/GPIO_100/SAFE_MODESDMMC1_CMD/UART1_RX/GPIO_101/SAFE_MODESDMMC1_DAT0/DPM_EMU18/GPIO_102/SAFE_MODESDMMC1_DAT1/DPM_EMU17/GPIO_103/SAFE_MODESDMMC1_DAT2/DPM_EMU16/GPIO_104/JTAG_TMS_TMSC/SAFE_MODESDMMC1_DAT3/DPM_EMU15/GPIO_105/JTAG_TCK/SAFE_MODESDMMC1_DAT4/GPIO_106/SAFE_MODESDMMC1_DAT5/GPIO_107/SAFE_MODESDMMC1_DAT6/GPIO_108/SAFE_MODESDMMC1_DAT7/GPIO_109/SAFE_MODE
UART2_CTS/SDMMC3_CLK/GPIO_123/SAFE_MODEUART2_RTS/SDMMC3_CMD/GPIO_124/SAFE_MODEUART2_RX/SDMMC3_DAT0/GPIO_125/SAFE_MODEUART2_TX/SDMMC3_DAT1/GPIO_126/SAFE_MODE
McSPI1_CLK/GPIO_134/SAFE_MODEMcSPI1_SOMI/GPIO_135/SAFE_MODEMcSPI1_SIMO/GPIO_136/SAFE_MODEMcSPI1_CS0/GPIO_137/SAFE_MODEMcSPI1_CS1/UART1_RX/GPIO_138/SAFE_MODEMcSPI1_CS2/UART1_CTS/SLIMBUS2_CLOCK/GPIO_139/SAFE_MODEMcSPI1_CS3/UART1_RTS/SLIMBUS2_DATA/GPIO_140/SAFE_MODEUART3_CTS_RCTX/UART1_TX/GPIO_141/SAFE_MODEUART3_RTS_SD/GPIO_142/SAFE_MODEUART3_RX_IRRX/DMTIMER8_PWM_EVT/GPIO_143/SAFE_MODEUART3_TX_IRTX/DMTIMER9_PWM_EVT/GPIO_144/SAFE_MODE
McSPI4_CLK/SDMMC4_CLK/GPIO_151/SAFE_MODEMcSPI4_SIMO/SDMMC4_CMD/GPIO_152/SAFE_MODEMcSPI4_SOMI/SDMMC4_DAT0/GPIO_153/SAFE_MODEMcSPI4_CS0/SDMMC4_DAT3/GPIO_154/SAFE_MODEUART4_RX/SDMMC4_DAT2/GPIO_155/SAFE_MODEUART4_TX/SDMMC4_DAT1/GPIO_156/SAFE_MODE
SIM_IO/GPIO_WK0/SAFE_MODESIM_CLK/GPIO_WK1/SAFE_MODESIM_RESET/GPIO_WK2/SAFE_MODESIM_CD/GPIO_WK3/SAFE_MODESIM_PWR_CTRL/GPIO_WK4/SAFE_MODEUSBC1_ICUSB_DP/GPIO_98/SAFE_MODEUSBC1_ICUSB_DM/GPIO_99/SAFE_MODE
HDMI_HPD/GPIO_63/SAFE_MODEHDMI_CEC/GPIO_64/SAFE_MODEHDMI_DDC_SCL/GPIO_65/SAFE_MODEHDMI_DDC_SDA/GPIO_66/SAFE_MODEHDMI_DATA0XHDMI_DATA0YHDMI_DATA1XHDMI_DATA1YHDMI_DATA2XHDMI_DATA2YHDMI_CLOCKXHDMI_CLOCKY
SDMMC5_CLK/MCSPI2_CLK/USBC1_ICUSB_DP/GPIO_145/SAFE_MODESDMMC5_CMD/MCSPI2_SIMO/USBC1_ICUSB_DM/GPIO_146/SAFE_MODE
SDMMC5_DAT0/MCSPI2_SOMI/USBC1_ICUSB_RCV/GPIO_147/SAFE_MODESDMMC5_DAT1/USBC1_ICUSB_TXEN/GPIO_148/SAFE_MODE
SDMMC5_DAT2/MCSPI2_CS1/GPIO_149/SAFE_MODESDMMC5_DAT3/MCSPI2_CS0/GPIO_150/SAFE_MODE
CSI21_DX0/GPI_67/SAFE_MODECSI21_DY0/GPI_68/SAFE_MODECSI21_DX1/GPI_69/SAFE_MODECSI21_DY1/GPI_70/SAFE_MODECSI21_DX2/GPI_71/SAFE_MODECSI21_DY2/GPI_72/SAFE_MODECSI21_DX3/GPI_73/SAFE_MODECSI21_DY3/GPI_74/SAFE_MODECSI21_DX4/GPI_75/SAFE_MODECSI21_DY4/GPI_76/SAFE_MODE
CSI22_DX0/GPI_77/SAFE_MODECSI22_DY0/GPI_78/SAFE_MODECSI22_DX1/GPI_79/SAFE_MODECSI22_DY1/GPI_80/SAFE_MODE
CAM_SHUTTER/GPIO_81/SAFE_MODECAM_STROBE/GPIO_82/SAFE_MODE
CAM_GLOBALRESET/GPIO_83/SAFE_MODE
CVIDEO_TVOUTCVIDEO_VFBCVIDEO_RSET
DSI1_DX0DSI1_DY0DSI1_DX1DSI1_DY1DSI1_DX2DSI1_DY2DSI1_DX3DSI1_DY3DSI1_DX4DSI1_DY4
DSI2_DX0DSI2_DY0DSI2_DX1DSI2_DY1DSI2_DX2DSI2_DY2
GPMC_AD0/SDMMC2_DAT0GPMC_AD1/SDMMC2_DAT1GPMC_AD2/SDMMC2_DAT2GPMC_AD3/SDMMC2_DAT3
GPMC_AD4/SDMMC2_DAT4/SDMMC2_DIR_DAT0GPMC_AD5/SDMMC2_DAT5/SDMMC2_DIR_DAT1GPMC_AD6/SDMMC2_DAT6/SDMMC2_DIR_CMDGPMC_AD7/SDMMC2_DAT7/SDMMC2_CLK_FDBKGPMC_AD8/KPD_ROW0/C2C_DATA15/GPIO_32GPMC_AD9/KPD_ROW1/C2C_DATA14/GPIO_33GPMC_AD10/KPD_ROW2/C2C_DATA13/GPIO_34GPMC_AD11/KPD_ROW3/C2C_DATA12/GPIO_35GPMC_AD12/KPD_COL0/C2C_DATA11/GPIO_36GPMC_AD13/KPD_COL1/C2C_DATA10/GPIO_37GPMC_AD14/KPD_COL2/C2C_DATA9/GPIO38GPMC_AD15/KPD_COL3/C2C_DATA8/GPIO39
GPMC_A16/KPD_ROW4/C2C_DATAIN0/GPIO40/VENC_656_DATA0GPMC_A17/KPD_ROW5/C2C_DATAIN1/GPIO_41/VENC_656_DATA1/SAFE_MODEGPMC_A18/KPD_ROW6/C2C_DATAIN2/GPIO_42/VENC_656_DATA2/SAFE_MODEGPMC_A19/KPD_ROW7/C2C_DATAIN3/GPIO_43/VENC_656_DATA3/SAFE_MODEGPMC_A20/KPD_COL4/C2C_DATAIN4/GPIO_44/VENC_656_DATA4/SAFE_MODEGPMC_A21/KPD_COL5/C2C_DATAIN5/GPIO_45/VENC_656_DATA5/SAFE_MODEGPMC_A22/KPD_COL6/C2C_DATAIN6/GPIO_46/VENC_656_DATA6/SAFE_MODEGPMC_A23/KPD_COL7/C2C_DATAIN7/GPIO_47/VENC_656_DATA7/SAFE_MODE
GPMC_A24/C2C_CLKOUT0/GPIO_48/SAFE_MODEGPMC_A25/C2C_CLKOUT1/GPIO_49/SAFE_MODE
GPMC_nCS0/GPIO_50/SYS_NDMAREQ0GPMC_nCS1/C2C_DATAOUT6/GPIO_51/SAFE_MODEGPMC_nCS2/C2C_DATAOUT7/GPIO_52/SAFE_MODE
GPMC_nCS3/GPMC_DIR/C2C_DATAOUT4/GPIO_53/SAFE_MODEGPMC_nWP/DSI1_TE0/GPIO_54/SYS_NDMAREQ1
GPMC_CLK/GPIO_55/SYS_nDMAREQ2GPMC_nADV_ALE//DSI1_TE1/GPIO_56/SYS_NDMAREQ3
GPMC_nOE/SDMMC2_CLKGPMC_nWE/SDMMC2_CMD
GPMC_NBE0_CLE/DSI2_TE0/GPIO_59GPMC_nBE1/C2C_DATAOUT5/GPIO_60/SAFE_MODE
GPMC_WAIT0/DSI2_TE1/GPIO_61GPMC_WAIT1/C2C_DATAOUT2/GPIO_62/SAFE_MODE
K3.3885
R
695R
K3.3
VSEL_1.8V
K 3.3495
R
TP523
VSEL_1.8VVPMIC_VDAC
CDC3S04U502
B4
D2
B2
A1
A2
B3
C2
A4
C1
A3
D1
E4
D3
D4
E3
E2
C3
E1
C4
B1MCLK_IN
CLK3
VLDO
REQ3
VBAT
SDAH
ADR_A0
MCLK_REQ
SCLH
VDD_DIG
REQ1
REQ4
CLK1
CLK4
VDD_ANA
CLK2
REQ2
RESET
GND_DIG
GND_ANA
VCLKB_TCXO_VCC
VCLKB_TCXO_VCC
C501
2.2u
VBAT
C500
1u
R5111.5K
195R
K3.3
IN
D895
R
TP524TP525
C507 68p
68pC509
68pC508C502
1u
VSEL_1.8V
38.4MHz1XXB38400FAA
X5003
2
4
1GND1
VCC
GND2
OUT
685R
IN
D
485R
IN
D
TP511
IN
D185
R
TP512 TP513
1u
C503
G5TS0_5B9
DSE
195DZ
295DZ
G5TS0_5B9
DSE
G5TS0_5B9
DSE
395DZ
K3.3795
R
VBAT
UAT500
UART_TP
12
11
10
9
8
7
6
5
4
3
2
1GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G2.5G
VCHG
U500OMAP4430
C24
B24
A24
D23
D24
AE8
AF8
D27
D28
E25
E26
E27
F26
AD4
AD2
AC3
AC2
AD3
Y28
AA28
G26
G25
H26
H25
J27
H27
J26
J25
K26
K25
L27
K27
C3
B5
B4
AG12
AF12
AE12
AG13
AE11
AF11
AG11
AH11
AE10
AF10
AG10
AE9
AF13
AE13
A27
AC4
AB4
AB3
AB2
AA4
AA3
AA2
AA1
Y4
Y3
Y2
W4
W3
W2
W1
V2
V1
P2
N2
M2
AE3
AG1
AE1
AH1
AH2
AE2
AG7
AG6
AE7
AF7
AD1
AG8
AH5
AH6
AG5
AH7
AE6
AF6
AF9
AG9
AH22
AG21
Y27
W27
D26
C26
AE26
AE28
AA27HDQ_SIO/I2C3_SCCB/I2C2_SCCB/GPIO_127/SAFE_MODE
I2C1_SCLI2C1_SDA
I2C2_SCL/UART1_RX/GPIO_128/SAFE_MODEI2C2_SDA/UART1_TX/GPIO_129/SAFE_MODE
I2C3_SCL/GPIO_130/SAFE_MODEI2C3_SDA/GPIO_131/SAFE_MODE
I2C4_SCL/GPIO_132/SAFE_MODEI2C4_SDA/GPIO_133/SAFE_MODESR_SCLSR_SDA
SYS_NIRQ2/GPIO_183/SAFE_MODESYS_NIRQ1/SAFE_MODESYS_PWR_REQ
FREF_XTAL_VSSOSCFREF_XTAL_IN/C2C_WAKEREQINFREF_XTAL_OUTFREF_SLICER_IN/GPI_WK5/C2C_WAKEREQIN/SAFE_MODEFREF_CLK_IOREQ
SYS_NRESWARMSYS_NRESPWRONSYS_PWRON_RESET_OUT/GPIO_WK29SYS_32K
JTAG_TDOJTAG_nTRSTJTAG_TMS_TMSC/SAFE_MODEJTAG_TDIJTAG_TCK/SAFE_MODEJTAG_RTCK
DPM_EMU0/GPIO_11/ATTILA_HW_DBG0/SAFE_MODEDPM_EMU1/GPIO_12/ATTILA_HW_DBG1/SAFE_MODEDPM_EMU2/USBA0_ULPIPHY_CLK/GPIO_13/DISPC2_FID/ATTILA_HW_DBG2/RSVDDPM_EMU3/USBA0_ULPIPHY_STP/GPIO_14/DISPC2_DATA10/ATTILA_HW_DBG3/RSVDDPM_EMU4/USBA0_ULPIPHY_DIR/GPIO_15/DISPC2_DATA9/ATTILA_HW_DBG4/RSVDDPM_EMU5/USBA0_ULPIPHY_NXT/GPIO_16/RFBI_TE_VSYNC0/DISPC2_DATA16/ATTILA_HW_DBG5/RSVDDPM_EMU6/USBA0_ULPIPHY_DAT0/UART3_TX_IRTX/GPIO_17/RFBI_HSYNC0/DISPC2_DATA17/ATTILA_HW_DBG6/RSVDDPM_EMU7/USBA0_ULPIPHY_DAT1/UART3_RX_IRRX/GPIO_18/RFBI_CS0/DISPC2_HSYNC/ATTILA_HW_DBG7/RSVDDPM_EMU8/USBA0_ULPIPHY_DAT2/UART3_RTS_SD/GPIO_19/RFBI_RE/DISPC2_PCLK/ATTILA_HW_DBG8/RSVDDPM_EMU9/USBA0_ULPIPHY_DAT3/UART3_CTS_RCTX/GPIO_20/RFBI_WE/DISPC2_VSYNC/ATTILA_HW_DBG9/RSVDDPM_EMU10/USBA0_ULPIPHY_DAT4/GPIO_21/RFBI_A0/DISPC2_DE/ATTILA_HW_DBG10/RSVDDPM_EMU11/USBA0_ULPIPHY_DAT5/GPIO_22/RFBI_DATA8/DISPC2_DATA8/ATTILA_HW_DBG11/RSVDDPM_EMU12/USBA0_ULPIPHY_DAT6/GPIO_23/RFBI_DATA7/DISPC2_DATA7/ATTILA_HW_DBG12/RSVDDPM_EMU13/USBA0_ULPIPHY_DAT7/GPIO_24/RFBI_DATA6/DISPC2_DATA6/ATTILA_HW_DBG13/RSVDDPM_EMU14/SYS_DRM_MSECURE/UART1_RX/GPIO_25/RFBI_DATA5/DISPC2_DATA5/ATTILA_HW_DBG14/RSVDDPM_EMU15/SYS_SECURE_INDICATOR/GPIO_26/RFBI_DATA4/DISPC2_DATA4/ATTILA_HW_DBG15/RSVDDPM_EMU16/DMTIMER8_PWM_EVT/DSI1_TE0/GPIO_27/RFBI_DATA3/DISPC2_DATA3/ATTILA_HW_DBG16/RSVDDPM_EMU17/DMTIMER9_PWM_EVT/DSI1_TE1/GPIO_28/RFBI_DATA2/DISPC2_DATA2/ATTILA_HW_DBG17/RSVDDPM_EMU18/DMTIMER10_PWM_EVT/DSI2_TE0/GPIO_190/RFBI_DATA1/DISPC2_DATA1/ATTILA_HW_DBG18/RSVDDPM_EMU19/DMTIMER11_PWM_EVT/DSI2_TE1/GPIO_191/RFBI_DATA0/DISPC2_DATA0/ATTILA_HW_DBG19/RSVD
ATESTV
USBB2_HSIC_STROBE/GPIO_170/SAFE_MODEUSBB2_HSIC_DATA/GPIO_169/SAFE_MODE
USBB2_ULPITLL_DAT7/USBB2_ULPIPHY_DAT7/SDMMC3_CLK/GPIO_168/McSPI3_CLK/DISPC2_DATA11/RSVDUSBB2_ULPITLL_DAT6/USBB2_ULPIPHY_DAT6/SDMMC3_CMD/GPIO_167/McSPI3_SIMO/DISPC2_DATA12/RSVDUSBB2_ULPITLL_DAT5/USBB2_ULPIPHY_DAT5/SDMMC3_DAT3/GPIO_166/McSPI3_CS0/DISPC2_DATA13/RSVDUSBB2_ULPITLL_DAT4/USBB2_ULPIPHY_DAT4/SDMMC3_DAT0/GPIO_165/McSPI3_SOMI/DISPC2_DATA14/RSVDUSBB2_ULPITLL_DAT3/USBB2_ULPIPHY_DAT3/SDMMC3_DAT1/GPIO_164/HSI2_CAREADY/DISPC2_DATA15/RSVDUSBB2_ULPITLL_DAT2/USBB2_ULPIPHY_DAT2/SDMMC3_DAT2/GPIO_163/HSI2_ACFLAG/DISPC2_DATA18/RSVDUSBB2_ULPITLL_DAT1/USBB2_ULPIPHY_DAT1/SDMMC4_DAT3/GPIO_162/HSI2_ACDATA/DISPC2_DATA19/RSVDUSBB2_ULPITLL_DAT0/USBB2_ULPIPHY_DAT0/SDMMC4_DAT2/GPIO_161/HSI2_ACWAKE/DISPC2_DATA20/RSVDUSBB2_ULPITLL_NXT/USBB2_ULPIPHY_NXT/SDMMC4_DAT1/GPIO_160/HSI2_ACREADY/DISPC2_DATA21/RSVDUSBB2_ULPITLL_DIR/USBB2_ULPIPHY_DIR/SDMMC4_DAT0/GPIO_159/HSI2_CAFLAG/DISPC2_DATA22/RSVDUSBB2_ULPITLL_STP/USBB2_ULPIPHY_STP/SDMMC4_CLK/GPIO_158/HSI2_CADATA/DISPC2_DATA23/RSVD
USBB2_ULPITLL_CLK/USBB2_ULPIPHY_CLK/SDMMC4_CMD/GPIO_157/HSI2_CAWAKE/SAFE_MODE
USBA0_OTG_DM/UART3_TX_IRTX/UART2_TX/GPIO_180/SAFE_MODEUSBA0_OTG_DP/UART3_RX_IRRX/UART2_RX/GPIO_179/SAFE_MODE
USBA0_OTG_CE
UNIPRO_RY2/KPD_ROW5/GPI_3/SAFE_MODEUNIPRO_RX2/KPD_ROW4/GPI_2/SAFE_MODE
UNIPRO_RY1/KPD_ROW3/GPI_178/SAFE_MODEUNIPRO_RX1/KPD_ROW2/GPI_177/SAFE_MODEUNIPRO_RY0/KPD_ROW1/GPI_176/SAFE_MODEUNIPRO_RX0/KPD_ROW0/GPI_175/SAFE_MODE
UNIPRO_TY2/KPD_COL5/GPIO_1/SAFE_MODEUNIPRO_TX2/KPD_COL4/GPIO_0/SAFE_MODE
UNIPRO_TY1/KPD_COL3/GPIO_174/SAFE_MODEUNIPRO_TX1/KPD_COL2/GPIO_173/SAFE_MODEUNIPRO_TY0/KPD_COL1/GPIO_172/SAFE_MODEUNIPRO_TX0/KPD_COL0/GPIO_171/SAFE_MODE
FREF_CLK1_OUT/GPIO_181/SAFE_MODEFREF_CLK2_OUT/GPIO_182/SAFE_MODE
FREF_CLK3_REQ/FREF_CLK1_REQ/SYS_DRM_MSECURE/GPIO_WK30/C2C_WAKEREQIN/SAFE_MODEFREF_CLK4_REQ/FREF_CLK5_OUT/GPIO_WK7
FREF_CLK4_OUT/GPIO_WK8FREF_CLK0_OUT/FREF_CLK1_REQ/SYS_DRM_MSECURE/GPIO_WK6/SAFE_MODE
FREF_CLK3_OUT/FREF_CLK2_REQ/SYS_SECURE_INDICATOR/GPIO_WK31/C2C_WAKEREQOUT/SAFE_MODE
SYS_BOOT0/GPIO_184/SAFE_MODESYS_BOOT1/GPIO_185/SAFE_MODESYS_BOOT2/GPIO_186/SAFE_MODESYS_BOOT3/GPIO_187/SAFE_MODESYS_BOOT4/GPIO_188/SAFE_MODESYS_BOOT5/GPIO_189/SAFE_MODE
SYSBOOT6/DPM_EMU18/GPIO_WK9/C2C_WAKEREQOUT/SAFE_MODESYSBOOT7/DPM_EMU19/GPIO_WK10/SAFE_MODE
C2C_DATA15/DSI2_TE1/C2C_DATAOUT1/GPIO_104/SAFE_MODEC2C_DATA11/USBC1_ICUSB_TXEN/C2C_DATAOUT3/GPIO_100/SYS_NDMAREQ0/SAFE_MODE
C2C_DATA12/DSI1_TE0/C2C_CLKIN0/GPIO_101/SYS_NDMAREQ1/SAFE_MODEC2C_DATA13/DSI1_TE1/C2C_CLKIN1/GPIO_102/SYS_NDMAREQ2/SAFE_MODE
C2C_DATA14/DSI2_TE0/C2C_DATAOUT0/GPIO_103/SYS_NDMAREQ3/SAFE_MODE
R501 10
C505
0.1u
0.1uC504
VSEL_1.8V
R50010
2.7KR513
10K
R516
R521470K
R522470K
VSEL_1.8V
GPS_PWR_ON
SDMMC2_CMDSDMMC2_CLK
SYS_nRESWARM
SYS_nRESWARM
SDMMC2_DAT[0]SDMMC2_DAT[1]SDMMC2_DAT[2]SDMMC2_DAT[3]SDMMC2_DAT[4]SDMMC2_DAT[5]SDMMC2_DAT[6]SDMMC2_DAT[7]
CHG_STATUS/
I2C3_SCLI2C3_SDA
CHG_EN_SET/
MICROSD_DET/
CLK32K_MAIN
I2C1_SCL
I2C1_SCL
I2C1_SDA
I2C1_SDA
MUIC_INT/
USB_DM_OMAPUSB_DP_OMAP
SRI2C_SCLSRI2C_SDA
SYS_DRM_MSEC
UART4_RX_OMAPUART4_TX_OMAP
UART_SW1UART_SW2
SYS_nRESPWRON
SYS_nIRQ1SYS_PWRREQ
PWR_ON_SW
I2C2_SCL
MICROSD_CMDMICROSD_DAT0MICROSD_DAT1MICROSD_DAT2MICROSD_DAT3
MICROSD_CLK
FLASH_EN
I2C2_SDA
I2C4_SDAI2C4_SCL
VT_0.3M_MIPI_DATA0_PVT_0.3M_MIPI_DATA0_N
VT_0.3M_MCLK
VT_0.3M_MIPI_CLK_PVT_0.3M_MIPI_CLK_N
PROX_INT
VT_CAM_PWDNVT_CAM_RESET/
LCD_RESET_N
FRONT_KEY_LED_EN
DSI2_LCD_MIPI_CLK_PDSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_PDSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_N
MICROSD_COVER_DET/
LCD_CP_EN
TOUCH_INT_N
KEY_C[0]
KEY_R[0]KEY_R[1]
UART_RX_IFXUART_TX_IFX
3D_BOOST_EN
3D_LCD_BANK_SEL
3D_LCD_EN
FM_I2S_CLK
FM_I2S_DI
FM_I2S_FSYNC
FM_I2S_DO
BT_PCM_SYNC
BT_PCM_CLKBT_PCM_DIN
BT_PCM_DOUT
WL_CLK_REQ
BT_UART_RTS/BT_UART_CTS/
WLAN_CLK
WLAN_SDIO[0]WLAN_SDIO[1]WLAN_SDIO[2]WLAN_SDIO[3]
WLAN_CMD
WLAN_HOST_WAKEUP
BT_UART_TXDBT_UART_RXD
WLAN_EN
BT_EN
WL_CLK_IN
UART1_TX_IPC
UART1_RX_IPC
MIPI_HSI_AC_FLAG
McSPI4_SOMI
MIPI_HSI_AC_DATA
McSPI4_SIMO
MIPI_HSI_CA_READY
McSPI4_CLK
USIF1_SW
IPC_SRDYIPC_MRDY
MODEM_SEND
IFX_USB_VBUS_EN
RESET_PMU_N
OMAP_SEND
IFX_PWR_ON_SW/
IPC_I2S_CLKIPC_I2S_DOUT
IPC_I2S_SYNCIPC_I2S_DIN
CP_CRASH_INT
AUD_CLK_IN
HDMI_CECHDMI_SCLHDMI_SDA
HDMI_CT_CP_HPD
HDMI_LS_OE
OMAP_CLK_IN
OMAP_CLK_IN
OMAP_CLK_REQ
OMAP_CLK_REQ
HDMI_HPD
HDMI_D1-
HDMI_D0-HDMI_D0+
HDMI_D1+HDMI_D2-HDMI_D2+
HDMI_CLK-HDMI_CLK+
PDM_DL_DATAPDM_UL_DATA
ABE_CLKSPDM_CLK
PDM_FRAME
AUD_PWRON
5M_MCLK
PRIMARY_5M_MIPI_DATA0_PPRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_CLK_PPRIMARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_DATA0_NSECONDARY_5M_MIPI_DATA0_P
SECONDARY_5M_RESET_N
SECONDARY_5M_MIPI_CLK_N
GPS_UART_TXD
GYRO_INT
CAM_SUBPM_EN
SYS_nIRQ2
PRIMARY_5M_MIPI_DATA1_PPRIMARY_5M_MIPI_DATA1_N
MOTION_INT
GPS_RESET_N
GPS_UART_RXDGPS_UART_RTS_NGPS_UART_CTS_N SYS_BOOT4
SYS_BOOT4
SYS_BOOT7
SYS_BOOT7
PROXI_LDO_EN
GPS_LNA_SD
VIBE_PWM
VIBE_EN
SYS_BOOT1
SYS_BOOT1
SYS_BOOT2
SYS_BOOT2
SYS_BOOT6
SYS_BOOT6
PRIMARY_5M_RESET_N
MIPI_HSI_CA_WAKEMIPI_HSI_CA_DATAMIPI_HSI_CA_FLAG
MIPI_HSI_AC_READYMIPI_HSI_AC_WAKE
TOUCH_RESET
LCD_EN
KEY_C[1]
COMPASS_INT
FUEL_INT/
FUEL_SDA
FUEL_SCL
MIPI HSI
For Touch S/W control
Rev.B
ARRAY TP
FM I2S
(Rev.1.0)
BOTTING
Removed
Rev.B
Rev.B
Rev.B
IFX control
Added(Rev.C)
SD/MMC2
Reference Clock
JATG & UART INTERFACE
1.2V_VIOGPIOs
USBMUIC
SYSTEM
Key Pad
UART4
1st 5M CAM, VT CAM, CAM PMU, MUIC
I2C4
I2C3
TCXO_BUFFER, TI PMIC, TI CODEC
BT PCM
USB HSIC
IPC_PCM
NO ASSIGN
CSI2_1
CSI2_2
Composite
DSI1
DSI2
UART1
McSPI4
HDMI
UART2
GPIOs
SD/MMC1
PDM
IPC
McBSP1
McBSP2
FM, SD/MMC5(WLAN)
McSPI port usageSPI1
SPI2
SPI3
SPI4
DMB
JTAG
Video
I2C
SYSTEM
1.8V & 3.0V_VIO
BT
MICROSD
WLANSD/MMC5
I2C2
I2C1
Port I2C port usage
TOUCH, LCD backlight booster, Flash LED driver, Compass sensor
2st 5M CAM, Gyro sensor, PROXI/ALC sensor
TI PMICSRI2C
eMMC4.4
Rev.C
Rev.C
Added (P925 Rev.A)
Rev.D
Added(Rev.D)
Rev.E, 1.0
Added (Rev.E)
Rev.E
Removed (Rev.E)
Rev.1.0
Changed(Rev.1.0)
Removed (Rev.1.0)
Added (Rev.1.1)
- 177 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
SC7911
137R
K74
C739 1u
0.1u
C626
0.1u
C609
1u
C627
SC7921
SDIN5C2-8G-974DU721
5R
3R
2R
1R
41P
31P
21P
01P
3P
2P
1P
41N
31N
21N
01N
3N
2N
1N
41M
31M
21M
01M
9M
8M
5M
3M
2M
1M
41L31L21L3L2L1L41
K31
K21
K11
K01
K9
K8
K7
K5
K
AH11K3AH9K1AH6J14AH4J13AG13J12AG2J11AE14J10AE1J9AA14J8AA13J7AA12J1AA11H14AA10H13AA9H12AA8H11AA7H10AA2H9AA1H8Y14H7Y13H6Y12H2Y11H1Y10D14Y9D1Y8B13Y7B2Y6A11Y3A9Y1A6W14A4W13W12AA5W11AA3W10Y4W9W4W8K6W7AA6W3AA4W2Y5W1Y2V14K4V13U8V12R10V3P5V2M7V1U9U14T10U13N5U12M6U10U7K2U6U5W5U3U2W6U1T14J6T13J5T12J4T5J3T3J2T2H5T1H4R14H3R13R12L4
NC140 NC74NC75
DAT0 NC76DAT1 NC77DAT2 NC78DAT3 NC79DAT4 NC144DAT5 NC81DAT6 NC82DAT7 NC83
NC84CLK NC85
NC86CMD RESET
NC153VDDI NC150
NC148VCC1 NC91VCC2 NC92VCC3 NC93VCC4 NC94VSS1 NC95VSS2 NC96VSS3 NC97VSS4 NC98VSSQ1 NC99VSSQ2 NC100VSSQ3 NC101VSSQ4 NC102VSSQ5 NC103VCCQ1 NC104VCCQ2 NC105VCCQ3 NC106VCCQ4 NC107VCCQ5 NC108
NC109NC1 NC110NC2 NC111NC3 NC112NC4 NC113NC5 NC114NC6 NC115NC7 NC116NC8 NC117NC9 NC118NC10 NC119NC146 NC120NC147 NC121NC13 NC122NC14 NC123NC15 NC142NC16 NC125NC17 NC126NC18 NC127NC19 NC128NC20 NC129NC21 NC130NC22 NC131NC23 NC132NC24 NC133NC25 NC134NC26 NC135NC27 NC136NC28 NC137NC29 NC138NC30 NC139
941C
N23
CN
33C
N43
CN
5 3C
N63
CN
73C
N8 3
CN
93C
N04
CN
14C
N24
CN
34C
N44
CN
54C
N64
CN
74C
N84
CN
151C
N251
CN
451C
N541
CN
35C
N45
CN
55C
N65
CN
75C
N85
CN
141C
N06
CN
16C
N26
CN
36C
N46
CN
551C
N341
CN
76C
N86
CN
96C
N07
CN
17C
N27
CN
651C
N
SC7931
SC7941
SC7961
SC7951
K74637
R
C659 1u
VSEL_1.8V
1u
C619
0.1u
C744
2.2u
C743
FB743 600
SC7971
1u
C620
10R721
10R723
10R724
10R725
10R726
10R728
R727 10
R730 10
240R632
C610
0.1u
240R631
VSEL_1.8V
0.1u
C742C741
2.2u
FB741 600
C740 0.1u
737R
K74
K74837
R
937R
K74
537R
K74
337R
K74
K74437
R
K74237
R
VSEL_1.8V
VSEL_1.8V
10R722
10R729
U7011
Fiducial1
VPMIC_VAUX1
SC7981
0.1u
C611
0.1u
C614C613
0.1u
C612
0.1u
NFM18PS105R0J3D_FL621
IN OUT
GND
VSEL_VCORE3
VSEL_1.8V
VPMIC_VCXIO
VPMIC_VCXIO
C661 1u
VSEL_1.8V
VPMIC_VUSB
C618
0.1u
VPMIC_OMAP_VPP_CUST
VSEL_1.8V
0.1u
C671
0.1u
C656 C645
0.1u
1uC662
C665 1u
0.1u
C655C654
0.1u
VSEL_VCORE3
0.1uC651
C646 0.1u
C648 0.1u VSEL_1.29V
VPMIC_VMMC
0.1uC644
VSEL_1.8V
C639
0.1u
C637
0.1u
VSEL_1.29V
VSEL_1.8V
0.1u
C683
C603
0.1u0.1u
C602C600
0.1u 0.1u
C601
0.1u
C682
C680
0.47u
C677
0.1u 0.1u
C678 C679
0.1u
C657 220n
VSEL_1.29V
VSEL_VMEM
C675
0.1u0.1u
C674C673
0.1u
C670
220n
C668 0.1u
C669
220n
C667 220n
220nC663
C658
0.1u
C652
0.1u
C653
0.1u
0.47u
C681
C649
220n
C647
220n
VSEL_1.29V
VPMIC_VDAC
VSEL_1.8V
C650
0.47u
0.1u
C642
0.1u
C641
0.1u
C640
VSEL_1.8V
VCORE2_OMAP_IVAUD
0.47u
C621
C607
1u
VCORE1_OMAP_MPU
U500OMAP4430
41R
31R
21R
71P
61
P
51
P
41P
31P
21P
71N
61N
51N
41N
31
N
21
N
31H
12M
71M
61M
51M
41M
31
M
71Y
1M
62L
52L
12L
9N
82K
2K
12
J
4J
3J
82H
91H
71H
11H
1H
52
F
2F
2C
72B
31B
6B
3B
32A
02
A
01
A
H15
N27
M27
K22
K21
T21
B28
B1
A28
AH28
N7
L22
D6
D5
D4
D3
C6
C5
C4
AH27
AG28
Y22
J8
AB12
A2
A1
T7
U22
AB11
AB13
N21
R21
AB10
M7
G9
G22
J7
V22
AA16
H16
G16
G7
H7
W7
G20
G19
G18
G17
AA14
AB17
AA7
AB18
AB19
AB8
AB20
AB16
AB21
AH25
AH20
AH18
AD28
AB28
AB22
AA21
AA22
T28
AH12
AH9
AH4
AF1
AC1
AB9
AA9
AA8
Y1
U1
L8
L28
L7
M8
J28
H21
H20
H9
H8
G21
G8
G1
E28
D1
A25
A22
A17
A12
A9
A6
A4
B2
A26
AF28
AH16
T8
G15
R27
Y14
AH3
AF27
C28
A3
T2
T1
N28
AG14
B15
A15
AG27
AG2
C1
R28
P1
N1
AH14
C27
A13
A5
A7
M28
AB14
N22
P7
T22
Y16
P9
G13
G12
A11
V28
W28
L2
L1
Y7
K7
W22
AB7
V7
U7
J22
H22
AA18
AA19
AA17
Y21
Y20
Y19
Y18
W21
W20
V21
AA10
Y10
Y9
Y8
W9
W8
V8
U9
V9
V20
T9
AA13
Y13
Y12
Y11
U20
T20
R20
N20
M20
M9
L20
L9
K20
K9
J20
J19
J18
J17
J16
J15
J13
J12
J11
J10
J9
H18
H12
22R
8N
8P
11
G
22
M
01G
01H
12H
A
31H
A
01
HA
8H
A
62
GA
71
GA
4GA
2FA
72E
A
1BA
8K
02
AA
21
AA
11A
A
62
Y
52Y
82U
12U
71
U
61
U
51
U
41
U
31U
21U
8U
2U
71
T
61
T
51
T
41T
31
T
21T
71R
61R
51
R84
_S
SV
94
_S
SV
05
_S
SV
15
_S
SV
25
_S
SV
35
_S
SV
45
_S
SV
55
_S
SV
65
_S
SV
75
_S
SV
85
_S
SV
95
_S
SV
06
_S
SV
16
_S
SV
26
_S
SV
36
_S
SV
46
_S
SV
56
_S
SV
66
_S
SV
76
_S
SV
86
_S
SV
96
_S
SV
07
_S
SV
17
_S
SV
27
_S
SV
37
_S
SV
47
_S
SV
57
_S
SV
67
_S
SV
77
_S
SV
87
_S
SV
97
_S
SV
08
_S
SV
18
_S
SV
28
_S
SV
GTO
0A
BS
U_
AS
SV
V3P
3_G
TO
0A
BS
U_
AS
SV
IN
U_
AS
SV
CA
DV
_I
MD
H_
AS
SV
0_
IS
D_
AS
SV
1_
IS
D_
AS
SV
2IS
C_
AS
SV
VDD_CORE_0VDD_CORE_1VDD_CORE_2VDD_CORE_3VDD_CORE_4VDD_CORE_5VDD_CORE_6VDD_CORE_7VDD_CORE_8VDD_CORE_9VDD_CORE_10VDD_CORE_11VDD_CORE_12VDD_CORE_13VDD_CORE_14VDD_CORE_15VDD_CORE_16VDD_CORE_17VDD_CORE_18VDD_CORE_19VDD_CORE_20VDD_CORE_21VDD_CORE_22VDD_CORE_23VDD_CORE_24VDD_CORE_25VDD_CORE_26VDD_CORE_27VDD_CORE_28
VDD_MPU_0VDD_MPU_1VDD_MPU_2VDD_MPU_3VDD_MPU_4VDD_MPU_5VDD_MPU_6VDD_MPU_7VDD_MPU_8
VDD_IVA_AUDIO_0VDD_IVA_AUDIO_1VDD_IVA_AUDIO_2VDD_IVA_AUDIO_3VDD_IVA_AUDIO_4VDD_IVA_AUDIO_5VDD_IVA_AUDIO_6VDD_IVA_AUDIO_7VDD_IVA_AUDIO_8VDD_IVA_AUDIO_9
VDDS_1P8_0VDDS_1P8_1VDDS_1P8_2VDDS_1P8_3VDDS_1P8_4VDDS_1P8_5VDDS_1P8_6
VDDS_1P8_FREF
VDDA_DSI1VDDA_DSI2
VDDA_CSI21VDDA_CSI22
VDDA_HDMI_VDAC_0VDDA_HDMI_VDAC_1
VDDA_DPLL_CORE_AUDIO
VDDA_DPLL_MPUVDDA_DPLL_IVA_PER
VDDA_LDO_SRAM_COREVDDA_LDO_EMU_WKUPVDDA_LDO_SRAM_IVA_AUDIOVDDA_LDO_SRAM_MPU
VDDA_UNI
VDDA_USBA0OTG_1P8VVDDA_USBA0OTG_3P3V
POP_VDD1_LPDDR21_A15POP_VDD1_LPDDR21_C28POP_VDD1_LPDDR21_AJ15POP_VDD1_LPDDR22_N2POP_VDD1_LPDDR22_R1POP_VDD1_LPDDR22_P29POP_VDD1_LPDDR2_SHARED_C1POP_VDD1_LPDDR2_SHARED_AH2POP_VDD1_LPDDR2_SHARED_AH28
POP_VDD2_LPDDR21_A16POP_VDD2_LPDDR21_B16POP_VDD2_LPDDR21_AH15POP_VDD2_LPDDR22_P28POP_VDD2_LPDDR22_T1POP_VDD2_LPDDR22_T2POP_VDD2_LPDDR2_SHARED_A3POP_VDD2_LPDDR2_SHARED_C29POP_VDD2_LPDDR2_SHARED_AG28POP_VDD2_LPDDR2_SHARED_AH3
VDDCA_VREF_LPDDR21VDDCA_VREF_LPDDR22VDDQ_VREF_LPDDR21VDDQ_VREF_LPDDR22POP_LPDDR21_ZQ_AJ17POP_LPDDR22_ZQ_AG29
POP_VACC_LPDDR2_B28POP_VACC_LPDDR2_B2
VDDQ_LPDDR2_0VDDQ_LPDDR2_1VDDQ_LPDDR2_2VDDQ_LPDDR2_3VDDQ_LPDDR2_4VDDQ_LPDDR2_5VDDQ_LPDDR2_6VDDQ_LPDDR2_7VDDQ_LPDDR2_8VDDQ_LPDDR2_9
VDDQ_LPDDR2_10VDDQ_LPDDR2_11VDDQ_LPDDR2_12VDDQ_LPDDR2_13VDDQ_LPDDR2_14VDDQ_LPDDR2_15VDDQ_LPDDR2_16VDDQ_LPDDR2_17VDDQ_LPDDR2_18VDDQ_LPDDR2_19VDDQ_LPDDR2_20VDDQ_LPDDR2_21VDDQ_LPDDR2_22VDDQ_LPDDR2_23VDDQ_LPDDR2_24VDDQ_LPDDR2_25VDDQ_LPDDR2_26VDDQ_LPDDR2_27VDDQ_LPDDR2_28VDDQ_LPDDR2_29VDDQ_LPDDR2_30
VDDCA_LPDDR2_0VDDCA_LPDDR2_1VDDCA_LPDDR2_2VDDCA_LPDDR2_3VDDCA_LPDDR2_4VDDCA_LPDDR2_5VDDCA_LPDDR2_6VDDCA_LPDDR2_7VDDCA_LPDDR2_8VDDCA_LPDDR2_9
VDDS_DV_BANK0VDDS_DV_BANK1
VDDS_DV_BANK2_0VDDS_DV_BANK2_1
VDDS_DV_BANK3VDDS_DV_BANK4VDDS_DV_BANK5VDDS_DV_BANK6
VDDS_DV_C2C_0VDDS_DV_C2C_1VDDS_DV_C2C_2
VDDS_DV_GPMC
VDDS_DV_FREF
VDDS_SDMMC1_0VDDS_SDMMC1_1
VDDS_DV_SDMMC2_0VDDS_DV_SDMMC2_1
VDDS_1P2
VDDS_DV_CAM
VDDS_SIM
VDDA_DLL0_LPDDR21VDDA_DLL1_LPDDR21VDDA_DLL0_LPDDR22VDDA_DLL1_LPDDR22
CAP_VBB_LDO_IVA_AUDIOCAP_VDD_LDO_SRAM_IVA_AUDIO
CAP_VBB_LDO_MPUCAP_VDD_LDO_SRAM_MPUCAP_VDD_LDO_SRAM_CORECAP_VDD_LDO_EMU_WKUP
PBIAS_SDMMC1PBIAS_SIM
VDDA_BDGP_VBB
VPP_CUSTVPP_STD
VSENSEIFORCE
RSVD1RSVD2RSVD3RSVD4RSVD5RSVD6RSVD7RSVD8RSVD9
LPDDR21_NCS0
NC1NC2NC3NC4NC5NC6NC7NC8NC9
0_S
SV
1_
SS
V2
_SS
V3
_S
SV
4_S
SV
5_SS
V6_S
SV
7_S
SV
8_S
SV
9_
SS
V0
1_S
SV
11_
SSV
21_
SSV
31_
SSV
41_
SSV
51_
SSV
61_
SSV
71_
SSV
81
_S
SV
91_S
SV
02_
SSV
12_
SSV
22_S
SV
32_
SSV
42_
SSV
52_
SSV
62
_S
SV
72
_S
SV
82_
SSV
92_
SSV
03_S
SV
13_
SSV
23_
SSV
33_
SSV
43_
SSV
53_S
SV
63_
SSV
73_
SSV
83_
SSV
93_
SS
V0
4_
SSV
14_
SSV
24_
SSV
34
_S
SV
44_
SSV
54_
SSV
64_
SSV
74_
SS
V
VSEL_1.8V
SC7991
C660 1u
C636
220n
C635
0.1u
C617
0.47u
OJ704
FL627NFM18PS105R0J3D_
IN OUT
GND
C605
1u
VSEL_1.29V
C686
220n
C685
220n
C687
4.7u 1u
C688
OJ701
C684 0.1u
OJ703OJ702
SDMMC2_CMD
SDMMC2_CLK
SYS_nRESWARM
SDMMC2_DAT[0]
SDMMC2_DAT[1]
SDMMC2_DAT[2]
SDMMC2_DAT[3]
SDMMC2_DAT[4]
SDMMC2_DAT[5]
SDMMC2_DAT[6]
SDMMC2_DAT[7]
Shield Can Clip (Top)1%
1%
eMMC 8GB
PoP LPDDR24Gb
Voltage Level Check!!!
OMAP POWER
Shield CanTop Bottom
Screw
Added (P925 Rev.A)
Added (P925 Rev.A)
Added (P925 Rev.A)
Changed (P925 Rev.A)
Changed (Rev.E)
Changed (Rev.E)
Added (Rev.E)
Added (Rev.1.0)
- 178 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
2.2uC890
C8921u
C83010p 10p
C833
R811
(1%)80.6K
C8070.47u
VBAT
(0603)
C803
6p
C802
10p(0603)
VSEL_1.8V
10uC813
K01008
R
TWL6030U800
21A
11A
51B
41A
21B
31A
41B
11B
21D
21K
31E
31D
9J
9K
8K
7M
6N
21L
8H
8G
9G
9H
6M
51N
21M
11M
5K
5L
5J
7K
5M
5N
01K
31M
31N
4M
4N
2N
51A
8J
11N
21N
1T
2T
1R
5H
61T
51T
61R
1A
2A
1B
R12
T12
R11
T11
R13
R10
T10
H15
H16
J15
J16
G16
K15
K16
E15
E16
D15
D16
F16
C15
C16
M15
L16
M16
P15
P16
N16
L15
R14
T14
T13
H2
H1
J2
J1
G1
K2
K1
R5
T5
R6
T6
R4
R7
T7
M2
L1
M1
P2
P1
N1
L2
R3
T3
T4
E8
A8
A10
J10
H10
E9
F5
F2
E2
F1
E1
E6
D4
E4
G2
B3
B4
A4
A3
D6
D5
H7
E5
F4
J7
D2
C2
D1
C1
E12
F12
A9
H12
G12
B16
A16
G10
01
E
7A
7D
4K
31
J
51
G
51
F
9R
9T
8T
01
B
8B
5B
6B
6A
5A
4G
8M
7G
4H
9D
31
L
11E
01
M
8N
31
B
9M
31H
31
F
7B
8D
31
K
21
J
8R
01
N
7N
4J
01
D
11
D
4L
9B
31
G
9N
1B_
DDV
2B_
DDV
3B_
DDV
4B_
DDV
NI
_C
TRV
NI
_A
NAV
NI_
PPV
NI_
1X
UAV
NI_
2X
UAV
NI_
3X
UAV
1NI
_C
MMV
2NI
_C
MMV
1NI_
MI
SUV
2NI_
MI
SUV
NI_
OI
XCV
NI
_C
ADVO
IV
TA
BV
1B
_AN
A_
DNG
2B
_AN
A_
DNG
3B
_AN
A_
DNG
4B
_AN
A_
DNG
5B
_AN
A_
DNG
6B
_AN
A_
DNG
7B
_AN
A_
DNG
OI
V_GI
D_
DNG
CT
RV
_GI
D_
DNG
1B
_D
NGP
_G
RHC
2B
_D
NGP
_G
RHC
3B
_D
NGP
_G
RHC
4B
_D
NGP
_G
RHC
MI
SUV
AN
AV
1X
UAV
2X
UAV
3X
UAV
OI
XCV
CA
DV
CM
MV
PPV
CT
RV
BS
UV
PU
KC
ABV
VPROG
PBKG_B51PBKG_B53
VBG
IREF
REFGND_B1REFGND_B2
IDVBUS_B1VBUS_B2VBUS_B3VBUS_B4
CHRG_EXTCHRG_ENZVACCHRG_DET_NCHRG_EXTCHRG_STATZCHRG_LED_TESTCHRG_LED_IN
CHRG_SW_B1CHRG_SW_B2CHRG_SW_B3CHRG_SW_B4
CHRG_BOOTCHRG_CSIN
CHRG_CSOUTCHRG_AUXPWR
CHRG_PMID_B1CHRG_PMID_B2CHRG_PMID_B3CHRG_PMID_B4CHRG_VREF
CLK32KAUDIO
CLK32KAO
CLK32KG
OSC32KIN
OSC32KOUTOSC32KCAP
VCORE1_IN_B1VCORE1_IN_B2VCORE1_IN_B3VCORE1_FDBKVCORE1_SW_B1VCORE1_SW_B2VCORE1_SW_B3
VCORE1_GND_B1VCORE1_GND_B2VCORE1_GND_B3
VCORE2_IN_B1VCORE2_IN_B2VCORE2_FDBKVCORE2_SW_B1VCORE2_SW_B2
VCORE2_GND_B1VCORE2_GND_B2
VCORE3_IN_B1VCORE3_IN_B2VCORE3_FDBKVCORE3_SW_B1VCORE3_SW_B2
VCORE3_GND_B1VCORE3_GND_B2
V1V8_IN_B1V1V8_IN_B2V1V8_IN_B3V1V8_FDBK
V1V8_SW_B1V1V8_SW_B2V1V8_SW_B3
V1V8_GND_B1V1V8_GND_B2V1V8_GND_B3
V2V1_IN_B1V2V1_IN_B2V2V1_FDBK
V2V1_SW_B1V2V1_SW_B2
V2V1_GND_B1V2V1_GND_B2
V1V29_IN_B1V1V29_IN_B2V1V29_FDBK
V1V29_SW_B1V1V29_SW_B2V1V29_GND_B1V1V29_GND_B2
VMEM_IN_B1VMEM_IN_B2VMEM_FDBK
VMEM_SW_B1VMEM_SW_B2
VMEM_GND_B1VMEM_GND_B2
34B_
GKBP
24
B_
GKB
P14B
_GKB
P3
3B_
GKB
P23
B_
GKB
P1
3B_
GK
BP
2B_GKBP
31B_
GK
BP
21B_
GKBP
11B_
GKBP
MIS
CM
MNE
TS
ET
VTSET
ERUCESM
AD
S_
C2ILT
CLCS
_C2I
LTC
AD
S_
C2I
RS
LC
S_
C2
IRS
TNI
NORW
PSERN
MR
AW
SER
N1N
EG
ER
2N
EG
ER
NORW
PNO
RWPR
1MWP
2MWP
ECRO
FMWP
NESY
S3TO
OB
2T
OO
B1
TOO
B0T
OO
BLAVO
MERTAB
3QER
PC2QE
RP
B2Q
ERP
A2
QE
RP
1Q
ER
P
NSER_
EG
UAGG
PSER
_EGUAGG
TR
AT
S_CDA
PG
0N
I_CDA
PG
1N
I_
CDA
PG
2N
I_
CD
APG
3N
I_
CD
APG
4NI_C
DAPG
5NI_
CDAPG
6NI_
CDAPG
1F
ER
V_CDA
PG
4FE
RV_C
DA
PG
0.1uC812
BAT800311HR-VG1
R804150K
(0603)
C801
10n
VSEL_1.8V
VCHG
ZD801
PSD12-LF
VSEL_1.8V
USB_VBUS
C853
2.2u
(0603)100p
C800
VBAT
)%1(
828R
smho
K2
R891150
FB803 220
C848
1u
C855
1u1u
C850
R809330k
1u
C854
1u
C844 C852
1u
2.2u
C836
2.2u
C837
2.2u
C838 C839
2.2u 2.2u
C840
C849
1u
C816
4.7u
VA800
RF051V1015050L
VCI
VSEL_1.8V
FSUSB63U851
1112
9
4
6
3
5
2
7
1 8
10HSD3+
HSD2+D+
HSD2-
D-
HSD1-
GND
HSD1+
SEL0
HSD3-
VCC SEL1
1u
C841
K01308
R
ESD9B5_0ST5G
ZD802
120FB805
CN801
GU077-5P-SD-E1500
11
10
9
5
4
3
2
1
8
7
6
VBUSD-
D+
ID
GND
508R
K01
CN800
EAG62832401
3
2
1
D1
D2
VPMIC_VRTC
NFM18PC104R1C3FL800
IN OUT
GND1 GND2
IN
D818
R
VSEL_1.8V
VSEL_1.8V
C805
100u
VBAT
R893150
C858
10n
VBAT
220FB800
(0603)10KR821
1uC811
C809
1u
728R
)%1(
065
C817
4.7u
R830 1M
2.2u
C845
32.768KHzFC-135
X800
21
L804 0.47u
L806 0.47u
L800 0.68u
C842
2.2u
808R
K01
C804
(0603)3p
0.47uL801
C834
2.2u
C832
2.2u
L802 0.47u
L805 0.47u
L803 0.68u
C891
1u
VCORE1_OMAP_MPU
C831 10u
628C
u7.4
C828 10u
4.7u
C824
120FB801
VSEL_VMEM
C825 10u
4.7u
C819
120FB804
VSEL_1.29V
C821 10u
VSEL_2.1V
928C
u7.4
10uC818
C814
4.7u
120FB802
USB_VBUS
VCORE2_OMAP_IVAUD
VSEL_1.8V
VSEL_VCORE3
C815 10u
C808
4.7u
FB806 120
56KR850
C827
1u
2.2KR848
ZD803
PSD05-LF
VSEL_1.8V
C822
0.1u
U801RT9524
65
74
83
92
101
11PGND
VIN BATT
ISET PGB
GND1 CHGSB
LDO GND2
IEOC EN_SET
2.2u
C835
R892100K
C823
1u
C8461u
43
21
2.2u
C851
C820
100n
R895 0
R894 0
U891 MAX17043G
9
74
81
6
5
32CELL VDD
ALRT
QSTRT
CTG SDA
GND SCLDN
GP
R896 DNI
DNIR897
TP809
1uC810
R8541.5K
U811MAX14526EEWP+TCC6
2B
1C
2C
C3 A2
C4
D3
D1 D4
A1
B1
A3
B4 B3
B5 A5
C5 A4
D5 D2BATVB
DN1COMN1
DP2COMP2
U1UID
U2
RES
MIC
AUD1CAP
AUD2
GND
ISETIC LC
S
AD
S
TNI
R8531.5K
R80110K 10K
R802
NTUD3169CZQ801
4 3
5 2
6 1S1D1
G1G2
D2S2
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VPMIC_VAUX1
VPMIC_VDAC
MR
AW
SE
Rn _S
YS
VPMIC_VMMC
VPMIC_VUSB
VPMIC_OMAP_VPP_CUST
VPMIC_VCXIO
CHG_STATUS/
BATT_THM_ADC
BATT_THM_ADC
I2C3_SCLI2C3_SDA
CHG_EN_SET/
USB_VBUS
/TE
D_D
SO
RCI
M
VCHG
VCHG
CLK32K_MAIN
CLK32K_AUD
I2C1_SCL
LC
S_ 1C2 I
I2C1_SDA
AD
S_1C2I
TWL_LDO_1.8V
MUIC_INT/
USB_DM_OMAP
USB_DP_OMAP
LC
S_C2I
RS
AD
S_C2I
RS
VPMIC_VRTC
PCB_VER_ADC
PCB_VER_ADC
CE
SM_
MR
D_S
YS
UART4_RX_OMAP
UART4_TX_OMAP
UART_SW1UART_SW2
SYS_nRESPWRON
UART_TX_SW
UART_RX_SWUART_RX
UART_RX
UART_TX
UART_TX
1Q
RIn_S
YS
QE
RR
WP_
SY
S
CLK32K_GATE
USB_D-_IFX
USB_D+_IFX
0TO
OB
BOOT0
1TO
OB
BOOT1
2TO
OB
BOOT2
3TO
OB
BOOT3
USB_IDUSB_DPUSB_DM
WS_
NO_
RW
P
TWL_LDO_2.8V
VSEL_2.1V
NE_
ODL_
RO
SN
ES
TWL_LDO_3.0V
FUEL_INT/
FUEL_SDAFUEL_SCL
PCB VERSION CHECK
CHARGER : 1mm
Changed (Rev.C)
FUEL GAUGE
Sensing node
Close to batt. connector
Rev.B
Rev.B
Rev.B
# VBAT LINE WIDTH (STAR Connection)GSM PA : 2mm -> WCDMA PA 1mm
PMB9801 : 1mm
TWL6030 : 1.5mm
1mm1mm0.15mm
150K
150K
150K
150K
150K
150K 10K
1.8V
1.8V
1.8V
1.8V
1.8VRev.1.0
1.8V
1.8V
150K
# PCB Revision Check ADC
REV
E
330K
C 100K
180K
D 130K
B
240K
EVB
VDD
1.8V
150K
A
68K
Rev.1.1
R1 R2
47K
ADC
Deleted (Rev.B)
780 ohm->(680mA)2K(10%)->91mA
0.05mm
(Sudden Momentary Power Loss)
through many vias for heat emission.
820 ohm->(646mA)
SMPL DETECTION
560 ohm->(910mA)
R1
R21%
Added (Rev.B)
0.113V
0.561V
0.720V
0.836V
1.108V
0.982V
1.238V
0.429V
Rev.C
1%
CHARGER IC
BATTERY CONNECTOR
GND pad on the bottom of chip has to be connected to main GND trace
DP3T SWITCH
1mm
90ohm matching !!90ohm matching !!
MICRO USB CONN. + MUIC
(Rev.C)Removed Res.
Changed (Rev.C)
Removed HOOK_ADC (Rev.C)
)C.veR( LAVO
MER_TAB devomeR
Added (P925 Rev.A)
Changed (P925 Rev.A)
Changed
Changed (P925 Rev.A)
Added (P925 Rev.B)
Changed (Rev.E)
Added (Rev.E)
Changed (Rev.E)
Changed (Rev.E,1.1)
Changed (Rev.E, 1.1)
(P925 Rev.A, Rev.E)
Changed ( Rev 1.0)
Added (Rev.1.1)
- 179 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
470nC940
RF0518130SVCI
VA901
C934
2.2u
C926 0.47u
C991
1u
C975
1uAMI306U975
10
95
4
63
72
81
DD
VA
YD
RD
DN
GL
CS
GE
RV
PP
V
INT
SDA ADDR
DVDD
R973DNI
C902
4.7u
R9021.5K
SENSOR_3.0V
C920 0.1u
0.1uC919
C922 0.1uC901
4.7u
1u
C992
SENSOR_3.0V
1u
C973
0.1u
C965
VSEL_1.8V
TP901
VSEL_1.8V
C962
0.1u
C972
0.1u
0.1u
C971 U971
KXTF9
4
3
2
1
501
6
7
8
9SCL
DNC4
INT
DNC3
AD
SD
DV
IO_VDD
DNC1
DNC2
GND
VSEL_1.8V
SENSOR_3.0V
MPU3050AU961
25
21
20
22
19
23
24
81 71
9
8
10
7
11
6
12
5
31
4
41
3
51
2
61
1NI
KLC
7C
N
1C
N
6C
N
2C
N
5C
N
3C
N
DD
V
4C
N
INT
AD_
EMI
FSYNC
IME_CL
REGOUT
VLOGIC
AD0
8C
N
DN
G
SDA
SCL
RESV1
CLKOUT
CPOUT
RESV2
NC9
0.1uC916
ISA1000
EUSY0238306
U981
90111
54
63
72
81EN VDP
PWM GND
MODE VDD
GAIN VDN
3C
N
2C
N
1C
N
C961 2.2n
TP902
C993
1u
0R921
TP903
2.2u
C935
0.1uC917
RT9032AGQWU991
9
54
63
72
81VIN VOUT1
EN1 VOUT2
P2 GND
P1 EN2
DN
GP
TP904
VBAT
PROXI_3.0V
SENSOR_3.0V
C941
100n
0.1u
C963
TWL_LDO_3.0V
C987
2.2u
R982
DNI
1u
C923
L988 82n
L989 82n
C915 0.1u
C936
220n
2.2uC924
R919 0
C933
100n
VBAT
120FB941
FB913 120
U901TWL6040
8G
7G
8F
7E
6E
E5
D7
D6
D5
01D
11
D
1D
2E
7L
9F
1G
01
H
01
C
9L
4K
2L
2B
2C
01
A
7A
6A
3A
7J
9E
2G
01
J
11
B
5H
B1
A2
D3
C1
A8
A9
B5
B4
B8
B9
A5
A4
F4
G4
F3
G3
K11
J11
C11
B10
F1
F2
H2
H1
J3
H4
J4
J2
K1
K3
L4
J5
H7
K7
L11
A11
L1
A1
K2
E1
G5
L5
K6
L6
B7
B6
D4
E8
J9
D8
G6
H6
H8
K8
L10
L8
K9
F11
G11
G9
E11
E10
H11
K10
E4
F7
F6
F5
8J
2D
3B
6J
9C
8C
7C
6C
4C
5C
01
G
01
F
1J
9D
3E
3L
3H
9H
5K
FERD
NG
SHD
NG
CI
MAD
NG
CI
MDD
NG
1O
DLD
NG
2O
DLD
NG
MCVD
NG
1P
CND
NG
2P
CND
NG
1L
FHD
NG
2L
FHD
NG
3L
FHD
NG
1R
FHD
NG
2R
FHD
NG
3R
FHD
NG
GIDD
NG
RB
IVD
NG
LB
IVD
NG
OID
NG
PBKG1PBKG2PBKG3PBKG4PBKG5
VDDREGNCPNCPOUT1NCPOUT2NCPFBCFLYPCFLYN
PDMDNPDMUPPDMCLKPDMCLKLBPDMFRAME
SDASCL
AUDPWRONNRESPWRONNAUDINT
GPO1GPO2GPO3
REFNREFPREFPLUGDETACCONN
ATESTDTEST1DTEST2DTEST3PROG
MCLK
CLK32K
DBIAS1DBIAS2MBIASMMICPMMICNSMICPSMICN
HBIASHMICPHMICN
AFMRAFML
EARPEARN
HSLHSR
AUXLPAUXLNAUXRPAUXRN
HFLP1HFLN1HFRP1HFRN1HFLP2HFLN2HFRP2HFRN2
VIBLPVIBLNVIBRPVIBRN
FER
VDDV
RA
ED
DV
SHD
DV
LUD
DV
LD
DDV
LLPDDV
1LF
HDD
V2LF
HDDV
1RF
HD
DV
2R
FH
DDV
LBI
VDDV
RBIV
DDV
SAIBM
AD
DV
SAIBM
DDD
VOIV
DDV
RAE
SSV
SHS
SV
LUS
SV
LD
SS
VL
LP
SSV
1V
2VDDV
OD
LDDV
NIOD
LSSV
ODL
SSV
NC1NC2NC3NC4
5C
N6
CN
7C
N8
CN
9C
N
VBAT VSEL_1.8V
C932
0.1u
VSEL_2.1V
C931
0.1u
C939
0.1u 0.1u
C930 C929
0.1u
0.1uC928
C938
0.1u 2.2u
C937
2.2uC927
4.7uC904
C905 4.7u
C903
4.7u
FB901 120
C925 0.1u
FB914 120
1n
C913
1n
C914
VSEL_2.1V
C921 0.1u
C918 0.1u
C978
1u
VA902ICVS0318150FR
R986 470K
ICVS0318150FRVA903
0R987
TP905
R981100K
R9011.5K
VSEL_1.8V
C986 3.9n
VSEL_1.8V
C976
10n
CLK32K_AUD
I2C1_SCLI2C1_SDA
SYS_nRESPWRON
SENSOR_LDO_EN
MICBIAS
MMIC_P
AUD_SPK_NAUD_SPK_P
VIB_L_P
VIB_L_N
AUD_RCV_NAUD_RCV_P
I2C4_SDA
I2C4_SDA
I2C4_SCL
I2C4_SCL
HS_MICBIAS
EAR_LEAR_R
SMIC_PSMIC_N
HOOK_ADC
HS_MIC
EAR_SENSE
MMIC_N
FM_AUDIO_LFM_AUDIO_R
AUD_CLK_IN
PDM_DL_DATAPDM_UL_DATA
ABE_CLKSPDM_CLK
PDM_FRAME
AUD_PWRON
GYRO_INT
SYS_nIRQ2
MOTION_INT
PROXI_LDO_EN
VIBE_PWMVIBE_EN
IME_DA
AD
_E
MI
IME_CL
LC_
EM
I
COMPASS_INT
AUDIO CODEC (TWL6040) GYRO SENSOR MOTION SENSOR
SENSOR LDO
MOTOR DRIVER
Digital Compass Movee to MAIN (P925 Rev.B)
Added (Rev.B)
Open/ground switch input
stereo headphone
stereo speaker
earpiecea differential class-AB driver
stereo line outputs
DOWNLINKUPLINK
filterless class-D outputs with 1.5W
with 2 Vrms capability to a typical 32Ohm
a stereo line-input
2.1V
2.1V
XX
Microphone input
Removed (Rev.C)
Added (P925 Rev.A)Added (P925 Rev.A)
Added (P925 Rev.A)
Added (P925 Rev.A)
Changed (P925 Rev.A)
Added (P925 Rev.A)
Changed (P925 Rev.A)
Digital Compass Sensor
Removed (Rev.C)
Added (Rev.1.0)
- 180 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
C1175
0.1u 0.1u
C1176 R1176
10K
FL1172
ICMEF112P900M
5
6
31
42P2 P4
P1 P3
6P
5P
1uC1143
43
21
R1136
510K
R1195
1K
G5TS0_5B9
DSE
ZD1172
R1191 DNI
100KR1101
ICMEF112P900M
FL1171 5
6
31
42P2 P4
P1 P3
6P
5P
100KR1126
10uL1121
600FB1143
1u
C1102 C1103
1u
VSEL_1.8V
ICMEF214P101M
FL1142
01
9
84
73
62
51P1 P5P2 P6P3 P7P4 P8
1G
2G
51KR1133
200KR1174
VSEL_1.8V
2.8V_3D_LCD
R11021.5K
12V_3D_LCD
PROXI_3.0V
2.8V_LCD_VCI
1.8V_LCD_IOVCC
SENSOR_3.0V
12V_3D_LCD
VSEL_1.8V
VBAT
VBAT
24-5804-034-000-829+CN1161
1817
1916
2015
2114
2213
2312
2411
2510
269
278
287
296
305
314
323
332
341
FL1141
ICMEF214P101M 01
9
8 4
7 3
6 2
5 1P1P5P2P6P3P7P4P8
1G
2G
1u
C1122
LM3528U1121
B2
D1
C3
A2
3D
C2
A3
2D
B3
A1
C1
B1GPIO1
HWEN/PGEN/GPIO
OVP
SET
WS
SUB/FB
SDA
DN
G
MAIN
IN
VIO
SCL
TWL_LDO_1.8V
C1121
1u
SENSOR_3.0V
CN114124-5804-030-000-829+
16 15
17 14
18 13
19 12
20 11
21 10
22 9
23 8
24 7
25 6
26 5
27 4
28 3
29 2
30 1
12KR1125
VSIM_2.9V
VBAT
VPMIC_VMMC
C1177
33p
200K
R1134
1.8V_LCD_IOVCC
2.8V_LCD_VCC
2.8V_LCD_VCC
VBAT
C1101
1u
1u
C1173
4.7KR1186
C1134
0.1u
CN1191SIDEKEY_4P
4
3
2
1
G5TS0_5B9
DSE
3911DZ
1911DZ
G5TS0_5B9
DSE
2011AV
RF0518130SVCI
G5TS0_5B9
DSE
2911DZ
5311R
K22
4011AV
RF0518130SVCI
C1179
10u
0.1uC1132
2.2K
R1178
TWL_LDO_2.8V
470p
C1178
C1138 0.1u
C1137
1u
4.7u
C1131TPS61093
U1131
11
10
9
4
7
3
5
2
8
6
1GND
SS
OUT
VIN
EN
CP2
FB
CP1
SW
VO
Exposed_GND
D1122
G5TS0_5B9
DSE
28 11DZ
VSEL_1.8V
G5TS0_5B9
DSE
1811DZ
VSEL_1.8V
VSMF05LCCD1175
43
52
61
24-5804-020-000-829+CN1181
11 10
12 9
13 8
14 7
15 6
16 5
17 4
18 3
19 2
20 1
VBAT
G5TS0_5B9
DSE
5911DZ
R1173 1M
U1101RT9032AGQW
9
54
63
72
81VIN VOUT1
EN1 VOUT2
P2 GND
P1 EN2
DN
GP
C1141
1u
1800FB1175
1800FB1176
FB1177 1800
FB1173
1800
L1172
DNI
2.8V_3D_LCD
C1171 1n
C1174
27p
R11714.7K
Q1186UMT2222A
1
23
120FB1174
100KR1187
CN1195
2
1
DNIR1190
U1106BU28TD2WNVX
5
3 24 1
VOUTVINGNDSTBY
DN
GP
4.7uL1131
24-5804-034-000-829+CN1171
18 17
19 16
20 15
21 14
22 13
23 12
24 11
25 10
26 9
27 8
28 7
29 6
30 5
31 4
32 3
33 2
34 1
C1107
1u
R1172
DNI
C1172
DNI
R11031.5K
VBAT
C1106
1u
U1108NLSV1T244MUTBG
43
52
61VCCA VCCB
A B
GND OE_
VSEL_1.8V 2.8V_LCD_VCC
Q1173
2SJ347
2
3
1G
DS
GSM_TXON_IND
I2C3_SCLI2C3_SDA
MICROSD_DET/
PWR_ON_SW
PWR_ON_SW
I2C2_SCL
I2C2_SCL
I2C2_SCL
MICROSD_CMD
MICROSD_DAT0MICROSD_DAT1MICROSD_DAT2MICROSD_DAT3
MICROSD_CLK
FLASH_EN
MICBIAS
MICBIAS
FM_ANT
MMIC_P
AUD_SPK_N
AUD_SPK_P
VIB_L_P
VIB_L_N
AUD_RCV_NAUD_RCV_P
I2C2_SDA
I2C2_SDA
I2C2_SDA
VT_0.3M_MIPI_DATA0_PVT_0.3M_MIPI_DATA0_N
VT_0.3M_MCLK
VT_0.3M_MIPI_CLK_PVT_0.3M_MIPI_CLK_N
HS_MICBIAS
USIM_RESET/USIM_CLKUSIM_DATA
PROX_INT
VT_CAM_PWDNVT_CAM_RESET/
LCD_RESET_N
FRONT_KEY_LED_EN
EAR_LEAR_R
LED_C2
LED_C2
LED_C1
LED_C1
LED_A
LED_A
DSI2_LCD_MIPI_CLK_PDSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_PDSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_N
SMIC_P
SMIC_N
MICROSD_COVER_DET/
LCD_CP_EN
TOUCH_INT_N
KEY_C[0]KEY_R[0]
HOOK_ADC
HS_MIC|HOOK_ADC
HS_MIC
KEY_R[1]
KEY_R[1]
EAR_SENSE
MMIC_N
UART_RX_IFXUART_TX_IFX
3D_BOOST_EN
3D_LCD_BANK_SEL
3D_LCD_EN
3D_LCD_BANK_SEL_1
3D_LCD_BANK_SEL_1
TOUCH_RESET
LCD_EN
KEY_C[1]
LCD BACKLIGHT LED Boost
Changed (Rev.B)
KEY FPCB ConnectorTOP FPCB Connector
SUB FPCB Connector
3D LCD 12V Boost
(0.9T, 34 Pin)
(0.9T, 40 Pin) (0.9T, 20 Pin)
KEY_C[0] - KEY_R[0] : Volume UP
KEY_C[0] - KEY_R[1] : Volume Down
KEY_C[1] - KEY_R[1] : Hot Key
Volumm Key
Rev.B, Rev.D
Rev.B
Added (Rev.B)
Changed Pin map (Rev.B)
Added (Rev.B)
Changed Pin map (Rev.B)
Added Res. (Rev.B)
Added Res. (Rev.B)
Changed (P925 Rev.B)
LCD Power
3D LCD CONNECTOR
P925 Rev.B
Added (Rev.C)
LCD Level ShifterAdded (Rev.C)
Removeed VA1101, VA1103 (Rev.C)
Changed (P925 Rev.A)
Changed (P925 Rev.A)
Changed (P925 Rev.A)
Changed (P925 Rev.A)
Rev.D
Added (Rev.D)PWR On Key
Changed Pin map (Rev.D)
Rmoved (Rev.E)
Added (Rev.E)
Added (Rev.E)
Rev.E
Changed (Rev.1.0)Added (925 Rev.D)
- 181 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
C1212
10u
C1241
4.7u
U1201LP8720TLX
1B
E1C2
B2
C1
E2
D3
C3
A1C4
B3
A3
D4
E3
D2
B4E4
2A
1D
4A
TTA
BV
2NI
V
1NI
V
VINB LDO1
FB
SW
GNDB
LDO2
IRQ_N
SDA LDO3
SCL
DVS
EN
LDO4
DEFSEL
IDSEL LDO5
DN
G
C1271
100n
5V_HDMI
R1271100K
FL1223
ICMEF214P101M01
9
84736251
P1 P5P2 P6P3 P7P4 P8
1G
2G
1u
C1204
1uL1251
C1252
4.7u
CN1221GB042-40S-H10-E3000
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
ICMEF214P101M
FL1222
01
9
84
73
62
51P1 P5P2 P6P3 P7P4 P8
1G
2G
C1211
2.2u
C1205
1u
CN127178618-0001
25
24
23
22
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
21
20
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
5M_VANA_V2V7_P
1u
C1236
4.7u
C1235
5M_VCM_V2V8_P
C1209
2.2u
5M_VCM_V2V8_S
2.2u
C1210
FL1221ICMEF214P101M
01
9
8
7
6
5P1
1P5
P22
P6P3
3P7
P44
P8
1G
2G
5M_VCM_V2V8_S
10u
C1201
5M_VCM_V2V8_P
5M_VANA_V2V7_P
VBAT
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
2.2u
L1201
G5TS0_5B9
DSE
4221DZ
G5TS0_5B9
DSE
5221DZ
1u
C1206
0.1u
C1230C1228
4.7u
C1229
1u
0.1u
C1237
VSEL_1.8V
C1231
0.1u
5V_HDMI
C1253
0.1u
VBAT
0.1u
C1232
C1207
1u
C1208
1u
0.1u
C1234
C1233
0.1u
U1251TPD12S015
D2
E1
A4
C1
B3
F3
G3
A3
A2
C2
B2
D1B1
A1
D3
F1
E2
F2
E3
E4
F4 C3
G4
G1
C4
D4
B4
G2VBAT
D1+
D0+
D1-
PGND
CLK-
GND2CLK+
D0-
SCL_B
SW
GND1
5VOUT
CEC_B
LS_OE
SCL_A CT_CP_HPD
CEC_A
HPD_A
VCCA
D2+
HPD_B
SDA_B
GND3
SDA_A
D2-
FB
GND0
100KR1202 I2C3_SCL
I2C3_SCL
I2C3_SDA
I2C3_SDA
I2C4_SDAI2C4_SCL
HDMI_CEC
HDMI_SCLHDMI_SDA
HDMI_CT_CP_HPDHDMI_LS_OE
HDMI_HPD
HDMI_D1-
HDMI_D0-
HDMI_D0+
HDMI_D1+HDMI_D2-
HDMI_D2+
HDMI_CLK-
HDMI_CLK+
5M_MCLK
PRIMARY_5M_MIPI_DATA0_PPRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_CLK_PPRIMARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_PSECONDARY_5M_MIPI_DATA0_NSECONDARY_5M_MIPI_DATA0_P
SECONDARY_5M_RESET_N
SECONDARY_5M_MIPI_CLK_N
CAM_SUBPM_EN
PRIMARY_5M_MIPI_DATA1_PPRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_RESET_N
C_HDMI_CECC_HDMI_CEC
C_HDMI_SCL
C_HDMI_SCL
C_HDMI_SDA
C_HDMI_SDA
C_HDMI_HPD
C_HDMI_HPD
5M_MCLK_CAM
5M_MCLK_CAM
3D CAMERA MODULE
Changed Con. (Rev.B)
Must Check Pin Map!!!
Added Res. (Rev.B)
Changed Pin Map (P <--> S)(Rev.C)
HDMI BackEnd IC
HDMI Connector
CAM POWERChanged IC (Rev.C, 1.1)
4E o t esol
C
Changed (P925 Rev.A)
Removed (Rev.1.0)
Removed (Rev.1.1)
- 182 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
CN1803
1L1810 1n
FL1801
SFAC0002701
LFD211G57DPMD153
240MHzMURATA
43
52
61P2 GND3
GND1 P3
P1 GND2
L1811
6.8nL1807
1n
C1831
1u
C182122p
FB1815 60 60FB1817
9.1nL1803
10nC1814
VBAT VCC_GPS_2V8
C18172.2u
VCC_GPS_2V8
2.2u
C1822
TP1801
26MHz
KT2520F26000ACW18TAKX1821
4 3
5 2
6 1GND1VCC
NC1NC2
GND2OUT
BU28TD2WNVXU1831
53 24 1
VOUTVINGNDSTBY
DN
GP
1u
C1832
47pC1801
C1808
1.8p
C1803330p
L1806
DNI
TP1802
TP1803
TP1804
R1803
1.5K
VDD_GPS_TCXO_1V8
C18182.2u
C18020.1u
FB181860
VDD_GPS_TCXO_1V8
VCC_GPS_2V8
60
FB1812
C18152.2u
VSEL_1.8V
2.2uC1816
U1811BCM4751
4F
2E
3F
2F
C3
D3
D4
E4
B3
B5
C4
C6
G4
B2
B1
E5
E3
C2
A1
G3
C5
A4
E6
G6
B6
A2
A3
E1
C1
D2
D5
D1
A5
G2
F1
G1
6A
5F
4B
6D
6F
5G
TA
B_
DD
V
ER
P_
DD
V
1C
DDV
2CD
DV
EROC
_2
P1D
DV
OI
DD
V
RFIP
VSSIF
VSSLNA
GPS_CAL
TCXO/TSXO
LPO_IN
ADCP
VDDADC
ADCN
SYNC/PPS_OUT
IFVALID
RST_N
REGPU
TM2
SDA1
SCL1
AUXOP
CAL_REQ/ANT_SEL
VSSADC
VDD_AUX_O
VDD_AUX_IN
HOST_REQ
LNA_EN
REF_CAP
SCL2/UART_TX
SDA2/UART_RX
UART_nRTS
UART_nCTS
AVSS
VSSC1
VSSC2
VSSC3
AN
LD
DV
FID
DV
LP
DD
V
FR
G_
2P1
DD
V
C1812
2.2u
100pL1802
ALM-2712U1801
8
9
11
2
1RF_IN
GND
DS
V
VDD
RF_OUT
10R1802
26MHz_GPS_REF
DPX_IN
GPS_PWR_ON
GPS_PWR_ON
VSEL_1.8V
CLK32K_GATE
GPS_UART_TXDGPS_RESET_N
GPS_UART_RXD
GPS_UART_RTS_NGPS_UART_CTS_N
GPS_LNA_SD
GPS_26MHz
GPS
TCXO for GPS
Removed Mobile Switch(Rev.B)
LDO for GPS
Changed (P925 Rev.A)Changed (P925 Rev.A)
(P925 Rev.A)
Changed (Rev.D)
Changed (Rev.1.0,1.1)
(Rev.1.1)
* TMUS* Global, AT&T
L1810 L1811
1nH 6.8nH8.2nH 1.8pF
- 183 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
TP1901
TP1911
TP1903 TP1904
C1917
DNI
SWB_VIO_1.8V
FB1914 600
1091LF661
A8GS54
G212BFL
zH
M054
2
NIT
UO
1D
NG
2D
NG
C1915 0.1u
U1901WL1271
6B
11D
2C
4B
9M
9D
9J01K
2E
1 1B
01D
0 1G
3G
3H
6K
2K
4 L01A
1A
M11J10
D6J11
C7K8
C6J8
B7L10
D4L9
D3L11
L1L5
H10K5
H7M5
H9L7
H6
F4J6
G4H5
C10
F6A11
F7
H11H8
F8E8
E6
E7
J7E9
M7F10
M8
K7E5
F5
K9
A9
D8
D7
A5
A4G7
A3G8
A2G11
B1E11
C1
H2
H1
F1
D5J3
F2J4
F3
E4J5
J2K4
G5L3
H4M3
11K
7A
1M
3E
9C
6A
8C
8A
8B
5C
3C
2B
11C
4C
2D8L
01B
6M
3K
2G9F
4M6L1J
1G
9G
11F
01E
2M
1K
6G2L
ODL_
GID_
NIV
TA
BV_
SM
P
ODL_
ME
M_D
DV
ODL_
GID_
DD
V
1D
DV
2D
DV
3D
DV
4D
DV
5D
DV
6D
DV
7D
DV
1S
DD
V
2S
DD
V
3S
DD
V
4S
DD
V
TBF
R_D
DV
MFV8
P1D
DV
WO
CD_
CC
V
WA
NA_
CC
V
TB
OC
D _D
DV
WX
R_C
CV
WA
XT_C
CV
WB
XT_C
CV
5P1
SS
ALC_
DD
V
TBFI_
AP
P_D
DV
5P1
SS
ALC_
NI_O
DL_D
DV
WNI_
ODL
TB
NI_O
DL_D
DV
WO
CD_
NI_O
DL
V8P1_T
SET_
SM
P
PA
CG
BFE
RF
PA
CP
AG
BMF
SPI_CLK FM_EN
SPI_DIN BT_EN
SPI_DOUT WL_EN
SPI_CSX WL_PAEN_B
NC1
SDIO_D1 WL_BTH_SW
SDIO_D2 WL_TX_SW
WL_RX_SW
WL_RS232_TX
WL_RS232_RX
NC2
HCI_CTS NC3
HCI_RTS NC4
HCI_TX DRPWRXBP
HCI_RX DRPWRXBM
DRPWTXB
XTALP
XTALM
RFIOBT
SLOWCLK
CLK_REQ_OUT
CLK_REQ_OUT_N JTAG_TDO
JTAG_TDI
BT_FUNC1 JTAG_TCK
BT_FUNC2 JTAG_TMS
BT_FUNC6
BT_FUNC5
BT_FUNC4 AUD_CLK
BT_FUNC7 AUD_FSYNC
AUD_OUT
TESTMBT AUD_IN
TESTPBT
FM_I2S_FSYNC WLAN_IRQ
FM_I2S_CLK WL_UART_DBG
FM_I2S_DI
FM_I2S_DO VPP
FM_SCL IFORCE
FM_IRQ VSENSE
FM_SDA DC_REQ
FMRFINP DRPWPABC
FMRFINM DRPWPDET
FMRFOUTP DRPWTEST1
FMAUDLIN DRPWTEST2
FMAUDRIN DRPWTEST3
FMAUDLOUT DRPWTEST4
FMAUDROUT TESTMODE
6C
N
TBF
R_S
SV
1GI
D _S
SV
2GI
D_S
SV
3GI
D_S
SV
4GI
D_S
SV
5GI
D_S
SV
6GI
D_S
SV
7GI
D_S
SV
TB
OC
D_S
SV
WO
CD_
SS
V
MFFR
AS
SV
MF LLP
AC
DA
AS
SV
LAT
X_S
SV
MFHT
NY
SA
PA
SS
V
1WF
R_S
SV
2WF
R_S
SV
LLP
DTB_
SS
V
WA
NA_
SS
V
20 91C
u1
U1902RF3482
71
4151
7
61
8
9
10
11
12
2
31
1
5
4
6
3BT
2B
V
PAEN
1B
V
TXB
TN
A
GND1
BTH_SW
RX_SW
TX_SW
VB3
TE
DP
NB
XR
CB
AP
PB
XR
2D
NG
DN
GP
8091C
u1 u19091
C
1.5n
C1920
0191C
u1
u11091
C
100pC1932
1u
C1923
VBAT_FEM
TP1902
DNI
C1933
C1930
2.2u 4.7u
C1931
DNI
C1922
20K
R1902
+1.8V_BT
u1.03191
C
+1.8V_BTVBAT_FEM
+1.8V_BT+1.8V_BT
L1901 180n
L1924
100n
4 091C
u1
220nC1916
VBAT_FEM
u1.02191
C
1191C
u1.0
VBAT_FEM
VBAT_FEM
u 1.07 091
C
4 191C
u 1.0
3091C
u1.0
L1903 1.5u
VBAT
TPS62611YFDRU1904
C1C2
A2
B2
A1
B1SW
MODE
EN
VIN
GND FB
C1918
DNI
CN1904
1
L1926
1n
TP1907
6091C
u1
TP1905
L1923 3.3n
L1925
DNI
C1936 100p
VSEL_1.8VSWB_VIO_1.8V
R1905
0
u15091
C
TP1906
TP1912TP1913TP1914
CLK32K_GATE
FM_ANT
FM_AUDIO_L
FM_I2S_CLK
FM_I2S_DI
FM_I2S_FSYNC
FM_I2S_DO
BT_PCM_SYNCBT_PCM_CLK
BT_PCM_DINBT_PCM_DOUT
WL_CLK_REQ
BT_UART_RTS/BT_UART_CTS/
WLAN_CLK
WLAN_SDIO[0]
WLAN_SDIO[1]WLAN_SDIO[2]
WLAN_SDIO[3]
WLAN_CMD
WLAN_HOST_WAKEUP
BT_UART_TXDBT_UART_RXD
FM_AUDIO_R
WLAN_ENBT_EN
DC_MODE
DC_MODE
DC_EN
DC_EN
BT_RFBT_RF
WL_RX_SW
WL_RX_SW
WL_TX_SW
WL_TX_SW
WL_BTH_SW
WL_BTH_SWWL_CLK_IN
SWB_VIO_1.8V
BT/WIFI/FM
(Rev.B)Removed Cap.
Removed TP
(Rev.B)
(Rev.B)
Changed Library
(Rev.B)Removed TP
Added(Rev.C)
Removed(Rev.D)
Removed(Rev.1.0)Added(Rev.C)
Added (P925 Rev.A)
Added(Rev.D)
Changed (P925 Rev.A)
Changed (P925 Rev.A)
Removed TP (P925 Rev.A)
Added (P925 Rev.A)
Changed (Rev.D)
Removed (Rev.E)
Removed (Rev.E)
- 184 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
L101 1u
R118
27
R117
27
IN
D121
R
VSEL_1.8V
C106
4.7u
R122
DNI
CN102
65
74
83
92
101
401R
IN
D
IN
D501
R
VPMIC_VMMC
30 1AV
VSEL_1.8V
IN
D601
R
211R
K01
CN101
1817
1916
2015
2114
2213
2312
2411
2510
269
278
287
296
305
314
323
332
341
C101
10pC104
10p
TOUCH_3.3V
C115
1u
VSEL_1.8V
50 1DZ
IN
D011
R
901R
IN
D
TP101
TP105
CN110
HJ-BCT-04Y
1
TP103
C119
2.2u
S101GND
DAT2
CD_DAT3
CMD
VDD
CLK
VSS
CARD_DETECT
DAT0
COVER_DETECT1
DAT1
0.1u
C103
C105
0.1u
J101
87
63
52
41VCC GND
RST VPP
CLK I_O
GND1 GND2
VSIM_2.9V
D102
43
52
61
VPMIC_VMMC
D101
43
52
61
K7.4
101R
VSIM_2.9V
D103
43
52
61
VSIM_2.9V
TOUCH_3.3V
C102
DNI
10 1D Z
U102
5
3 24 1
VOUTVDDGNDCE
DN
GP
VBAT
2 01DZ
VBAT
3 01DZ
40 1DZ
601DZ
TP102
u1021
C
VSEL_1.8V VPMIC_VMMC
VBAT
VSIM_2.9V
SENSOR_3.0V
U101
B1
D3
C1
C3
C2
B2
4A
C4 A2
D2
D4
D1
3A
3B
A1
4B
2D
NG
LED1
2W
S
1W
S
TX2/INT/GPIO2
HWEN
SDA
OUT1IN
1D
NG
OUT2
TX1/TORCH/GPIO1
STROBE
LEDI/NTC
SCL
LED2
C107
10u
TP104
C109
10u
101DL
2
1
VA102
I2C2_SCL
I2C2_SCL
I2C2_SCL
MICROSD_DAT0
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT2
MICROSD_DAT3
MICROSD_DAT3
MICROSD_DET/
MICROSD_DET/
I2C2_SDA
I2C2_SDA
I2C2_SDA
TOUCH_INT_N
TOUCH_INT_N
USIM_RESET/
USIM_RESET/
USIM_RESET/
USIM_CLK
USIM_CLK
USIM_CLK
USIM_DATA
USIM_DATA
USIM_DATA
MICROSD_COVER_DET/MICROSD_COVER_DET/
PWR_ON_SW
PWR_ON_SW
VBAT
SENSOR_3.0V
UART_RX_IFX
UART_RX_IFX
UART_TX_IFX
UART_TX_IFX
FLASH_EN
FLASH_EN
MICROSD_CMD
MICROSD_CMDMICROSD_CLK
MICROSD_CLK
TOUCH_RESET
TOUCH_RESET
GSM_TXON_IND
GSM_TXON_IND
Routing line must be thick enough to support 1A!!
MicroSD Socket(Hinge Type)USIM for XMM6260
TP gap(center to center) 2mmMust Check Schematic
Routing line must be thick enough to support 1A!!
CAMERA FLASH LEDTouch Connector
Main2Sub B2B Con.* layout note : CLK and IO must be seperated
NEST JIG
Rev.F
Routing line must be thick enough to support 1A!!
Rev.BRev.B
Remove Series R
Rev.B
Touch LDO
Rev.E
(Rev.E)
2ch -> 1ch (Rev.E)
Zif -> BtB (Rev.E)
Rev.E
Rev.C
Rev.E & 1.0Rev.F
Rev.C
Rev.FRev.F
Remove 0 ohm (Rev.G)
I2C4 -> GND(Rev.G)
Camera Deco contact C-clip
PU Resistor Moved to Main PCB (Rev.E)
Rev.D
Rev.E
Rev.E
Rev.B
DNI R Added
Rev 1.0 value change
Rev 1.0 value change
- 185 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
CN103
1110
129
138
147
156
165
174
183
192
201
PROXI_3.0V
201D
101D
L102
100n
U101
54
63
72
81SDA VDD
INT SCL
LDR GND
LEDK LEDA
CN104
65
74
83
92
101
CN102
2
1
C105
22p
SENSOR_3.0V
1uC101
CN101
18 17
19 16
20 15
21 14
22 13
23 12
24 11
25 10
26 9
27 8
28 7
29 6
30 5
31 4
32 3
33 2
34 1
MIC101
4
3
2
1P
G1
G2
O
0.1u
C103
TWL_LDO_1.8V
TWL_LDO_2.8V
0.1u
C104
FB101
401D
30 1D
SENSOR_3.0V
TWL_LDO_1.8V
TWL_LDO_2.8VPROXI_3.0V
C1021u
AUD_RCV_P
AUD_RCV_P
AUD_RCV_N
AUD_RCV_NPROX_INT
PROX_INT
SMIC_P
SMIC_P
SMIC_N
SMIC_N
VT_CAM_RESET/
VT_CAM_RESET/
VT_CAM_PWDN
VT_CAM_PWDN
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
VT_0.3M_MIPI_CLK_P
VT_0.3M_MCLK
VT_0.3M_MCLK
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P
VT_0.3M_MIPI_DATA0_P
MICBIAS
MICBIAS
I2C3_SDA
I2C3_SDA
I2C3_SDA
I2C3_SCLI2C3_SCL
I2C3_SCL
HS_MIC
HS_MIC
EAR_L
EAR_L
EAR_SENSE
EAR_SENSE
EAR_R
EAR_R
FM_ANT
FM_ANT
Rev.1.1 (VSEL 1.8V Remove)
Receiver
SUB MICMust Check Schematic
Proxi. Ambiant Sensor
Rev.B(Removed Bypass Cap)
Rev.1.1 (VSEL 1.8V Remove)
(FPCB, Aptina 1/11", Hansung)
Main2FPCB B2B
VGA(MIPI)
Rev.B(Pull Up Move to Main PCB)
Rev.B(Bead Move to Main PCB)
Must Check!!! Pin MAP
TOP
- 186 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
J101
EAG62831701
6
1
4
4D
5M5-MIC
M4-DETECT
M4-L
M1-R
M6-GND
CN101
65
74
83
92
101
HS_MIC
HS_MIC
EAR_L
EAR_L
EAR_SENSE
EAR_SENSE
EAR_REAR_R
FM_ANT FM_ANT
EAG628317013.5pi Ear Jack Connector
Remove HS_GND
- 187 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
R101
130
R102
130
VB101
2
1
SP101
HIR-02A57-0000AA
2
1
C114
0.1u
FB103120
L104100n
R104
130
R103
130
501R
IN
D
L103100n
101DL
201DL
301DL
4 01D L
VBAT
33p
C103
KB101
C110
27p
C113
33p
D101 D102
CN102
11 10
12 9
13 8
14 7
15 6
16 5
17 4
18 3
19 2
20 1
MIC101
4
3
2
1P
G1
G2
O
L10182n
L10282n
VBAT
VIB_L_N
VIB_L_N
VIB_L_P
VIB_L_P
LED_SINK
LED_SINK
AUD_SPK_P
AUD_SPK_P
AUD_SPK_N
AUD_SPK_N
MMIC_N
MMIC_N
MMIC_P
MMIC_P
MICBIAS
MICBIAS
KEY_R[1]
KEY_R[1]
KEY_C[1]
KEY_C[1]
Q-Motor(Not Fixed)
MAIN MIC3D HOT_KEY
SPEAKERMain2Key B2B MAIN KEY LED
MOTOR
Volume Key
Must Check Schematic!!!TOP
Rev.B
Rev.B
- 188 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
CN103
HJ-ICT-06Y
1
CN104
HJ-ICT-06Y
1
SW101
G1
ANTG2
C106
0.5p
L105 1.5n
MAIN ANT
- 189 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
KB101
CN101
2
1PWR_ON_SW
PWR_ON_SW
ON/OFF/LOCK
POWER Key
- 190 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
KB101 KB102
CN101SIDEKEY_4P
4
3
2
1
KEY_R[1]KEY_R[1]KEY_R[0]KEY_R[0]KEY_C[0]KEY_C[0]
UPDOWNVolumm Key
KEY_C[0] - KEY_R[1] : Volume Down
KEY_C[0] - KEY_R[0] : Volume UP
8. BGA PIN MAP
- 191 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U181 PMB5712 (Transceiver)8. BGA PIN MAP
U181 PMB5712 (Transceiver)
Used
Not Used
8. BGA PIN MAP
- 19� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U301 PMB 9811 (Digital Baseband Processor,3G)U301 PMB 9811 (Digital Baseband Processor,3G)
Used
Not Used
8. BGA PIN MAP
- 193 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U350 H8BCS0QG0MMR-46MU350 H8BCS0QG0MMR 46MU350 H8BCS0QG0MMR-46M
8. BGA PIN MAP
- 194 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U701 K3PE4E400M-XGC1 4Gb LPDDR2 PoP
Used
Not Used
8. BGA PIN MAP
- 195 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U500 OMAP4430 IC, Application Processor
Used
Not Used
Not Used
8. BGA PIN MAP
- 196 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U800 PMIC
Not Used
8. BGA PIN MAP
- 197 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U721 S
anDisk 8G
NA
ND
Flash
U721 SanDisk 8G NAND Flash
Not Used
Used
8. BGA PIN MAP
- 198 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U901 (TWL6040 Audio codec)
Not Used
8. BGA PIN MAP
- 199 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U811 MUCI
Used
Not Used
- 200 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
FAU
CK
D T
H
YJ
0 1
GA
HA
1AB
U
12
CA
DA
EAW Y AA
BAV
A
B
C
DEFGHJ
E F G H J K L M N P R
PNMLKJ TR
LN M
71A B C
1
41
A B C D GFE
1AA BA CA D AEA FA GA H A
16
K L M N P R T U V W
F
ABCDE
14
821
A B C D E F G H
1ABCDE
GHJKLMNPRT
B A1
CD
5
109
R78
9R
C991
C312
SC796
3091
L
C353
923
C
246
C
C618
215
R
C674
TP512
C635
R631
C648
506
C
C667
C671
C684
C679
C636
R516
C600
608L
286
C
107
U
0 76
C
C619
105
C
C660
966
C73
6C
316
C41
6C
876
C31
5R
056
C
786
C
656
C08
6C
C620
C645
706
C24
3R
1 08L
108
NC
0 18
C10
8U
458
R
358
R
R986
3911
DZ
2911
D Z
1911
D Z1 6
9U
C961
279
C
569
C
C973
369
C
379
R2 6
9C
C986
209
R28
9R
189
R
1911
NC
R593
R592
U971
C971
989L
6811
Q 889L
189
U78
9C
TP905
7811
R68
11R
CN1195
147B
F49
7C
S59
7C
S59
11R
5 911
DZ
C742
347B
F34
7C
147
C
C744
TP523
425
PT
TP525
R382
453
C48
3R
753
C6 5
3C
R383
C344823
C
C302C343
433
C
633
R
C333
733
C73
3R
033
C72
3C
C318
TP313
C315
TP311
781
R
TP310 TP312
413
R
313
R
913
R
413
C
903
C
3 03
C
503
C
U1904
C1931
0391
C
FB1914
053
U
533
C
C342
X300
523
C
C341
103
U30
3L
603
C
TP513
256
C79
5R
856
C
C336
828
C
C307
TP1912 TP1911
127
U
C993
TP904
C992
U991
TP901
091
C TP902
C627
C351 C352
C358
C662
C661
553
C
423
CU303
C316
528
C
713
C32
3C
203B
F
403
C31
3C
103B
F
L304
L805
C840
ZD591ZD593
TP1913 TP1914
TP1906
716
C
R501
TP1905
776
C
236
R
TP301
146
C
936
C
206
C
8 18
R
576
C
C845 038
R
908
R
218
C
4 08
R
446
C
366
C
C841
L804
428
C
C850
C837
C849
FB804
628
C
C821
FB805
C851
FB803
C831 003
PT
L803
918
C
927
R
R733R723
X800
SC793
ZD592
R727
R738R728
R737
937
C
C740
R724
R732
R726
R734
R736
R725
R731
R735
R722
R730 R739
R721C505
R581
586
C
866
C
R591
386
C
686
C
7 56
C
005
U
306
C
746
C
3 56
C
126
C
946
C
046
C
C844C854 C833 C830
U800
C846
928
C
108B
F41
8C
608B
F
C848
438
C
L802
C507
C508
C502C509
205
U
C504
305
C
X500
495
R
695
R
485
R
685
R
376
C
C852
156
C
106
C
216
C
186
C
C611 126L
F83
8C
0 43
R
C818
Q301
C816
938
C
718
C
FB802
C832
C813
FB800
C815
L800
808
C
158
U11
8U
108
DZ11
8C
R805 R803
C827
C855
005
C
848
R
C820
R850
008L
F ZD802
197
CS
TP511
C823
C822
885
R
895
R
728
R
358
C
R808
297
CS
908
C
R800
R821
1721
NC
828
R
TP809
9. PCB LAYOUT
LG-P925_MAIN_1.1_TOP
U721 : EMMC memory- no Booting- no Service
X500 : 38.4Mhz X-tal- no Booting
U502 : Clock Buffer IC- no Booting- no BT/WiFi/FM- no Audio
U851 : DP3T S/W- no CP USB/UART port- no AP UART port
U811 : MUIC- no USB/UART
CN801 : uUSB Conn.- no USB/UART- no Charging
U500 + U701: AP + POP memory- no Booting
CN1271 : HDMI Conn. - no HDMI diplay
Q301 : FET- no CP USB
U800 : PMIC- no Booting- no Power On- no Service
U801 : Charger IC - no Charging- no AP/CP USB
U991 : Dual LDO - no Gyro sensor- no Motion sensor- no Compass sonsor- no Proximity sensor
U1904 : DCDC - no Bluetooth/WiFI/FM
U350 : CP memory - no Service
U303 : SPDT S/W- no CP UART port- no AP-CP UART port
U961 : Gyro sensor- no Gyro sensor- no Motion sensor
U971 : Motion sensor- no Motion sensor
U301 : CP modem- no Service
U981 : Motor D-IC- no Vibration
- 201 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
LG-P925_MAIN_1.1_BOT
34
F
30
11
C
4
1204
01
E
02
0211
F
1
EDCBA
KLM
JHG
61 A
11
D
15
16
18
17
31A B C D E
1
8 14 3
71G H J K L M
A
B
C
D
31
14
A B
L
A
B
C
D
H
G
F
E
K
J
1
D E F G
CN1904
U1201
FL1221
R811
U1901
R521
181
C
L1131
R892
C1916
R500
481
C
C248
902
C
C206
U1131
C1134
L179
622L
U891 C310
L180
U1101
3711
BF18
1U
FL1171
5711
D27
11L
FL1172
R306
491
C
U121
L138
231
C
L152
U1108
C1141
1521
L
U1811
TP903
C1818
FB1818
149
C
FB941
C610
646
C C934
C609
C1253
L162
L105
111L
F
Q801
C105
L1121
CN1803
L1201
1121
C
5221
DZ
181 1
NC
C975
5291
L
C1204
1021
C
212 1
C
FL1223
1221
NC
4221
DZ
C978
C976
7191
C
C1936
R1202 C1208
C1230
308
DZ
L1924
6291
L
C1206
C1205
C1209
C1207
C1210
FL1222
8221
C
C1233
C1232
C1231
C1229
C1237
C1236
C1234
5321
C
579
U
ZD1181
ZD1182
508
C
308
C
408
C
819 1
C
CN800
008
C
108
C
7 08
C
2 08
C
VA800
FL1901
C890
2291
C
3291
LC1923
3391
C
C1932
BAT800
2091
U
102B
F
022
U
C891 R891
C1920
C1909
5091
C
C1908C1906
C1910
C1914
C1913
TP1904
R1902
1091
C
TP1903
942L
C250
942
C
C243
142
C U241
C251
C1131
2311
C
C233
C225
C230
R1133
C221
622
C42
2C
858
C79
8R
R893
698
R
R1101
1011
C
R522
C242
5311
R
7311
C20
11C
CN1161
C1907
TP1907
C1902
C1911
R1905C1915 C1912
C1903
L1901
C1904
C916
C915
742
C
L248
742L
L244
L245
C244
542
C
R1136
C1138
C231
C232
R1134
C222
722L
322
C
C255
C228
C892 FB1143
103
C
C227
R514
113
C
R895
R894
515
R
3011
C
3711
R
8711
C
2091
PT67
1 1R
352
C
C191
252
C86
1L
851L
371
C
871
C
271
C
U171
171
C
3711
C
R1178
C1179
FB1176
1091
PT
FB1175
7711
BF
6711
C5 7
1 1C
R1172
C1171
2711
C
PT301
3711
Q
4711
R
C187
681
R
481
X
581
C
802
C
102
C
C192
C204
C183
C200
C189
591
C
L169 L159
1911
R
803
C
R316
4011
AV
091 1
RC1143
CN1141
VA1102
1711
R
C197
201
PT
741L
731 L
721 L
7 71 L
2411
L F
4711
C
7 71 1
C
171 1
NC
ZD1172
3081
PT
C188
702
C45
2C20
2C
391
C
C199
302
C
C205
C198
281
C84
1L
L128
351
C
L176
C835
638
C
C175
1411
LF
7181
BF
718 1
C
C926
C133
7011
C2011
R
5 21 1
R6 21 1
R
3 011
R
FB1174
C1832
1381
C
U1831
FB1812
4081
PT
C1814
2081
PT
1081
PT
639
C
C1815
739
C
C1816
C665
FB1815
C659
C1812
309
C
C925
C626
FB901
109
C
726L
F
209
C
C939
C688
556
C
C654
429
C
C123
121
C22
1L
L143
L141
361
C
241L
161 L
311L
L131
L112
C151
C112
108
R
L110 L111C109
C842
1211
C
2211
D
221 1
C
U1121
C1808
R1802
C114
6011
C
308 1
R
C1801
C1802
L1803U1801
C938
239
C
929
C
409
C
C1803
139
C
509
C
C1822
1281
C
U901
C913
539
C
319B
F
C914
419B
F71
1C
L116
611
C
511
C
L114
R511208
R R510
6011
U
1081
LF
1281
X
049
C
142 1
C10
1W S
L1807
L1802L215
312L
412L
C211
339
C
112L
F21
2L
VA901C923
L211
309
AV
C917
VA902C922
919
R
029
C
C930
C928
919
CC921
R921
C918
729
C
1721
R
1 521
U
C1252 C1271
L104
C103
201
WS
C101 201L
L1806 1181
LL1810
CN1171 : Top FPCB Con.- no Ear-jack- no Sub MIC- no Receiver- no VT Camera- no Illumination sensor- no Proximity sensorU1902 : BT/WiFi RF Module
- no BT Connection- no WiFi connection
CN1161 : Sub PCB Con.-no SIM-no T-flash memory-no Flash LED-no Touch
CN1904 : WiFi/BT Ant- no WiFi/Bluetooth
U1901 : WiFi/BT/FM Module- no WiFi connection- no BT Connection- no FM Radio
U1201 : Camera PMIC.- no 5M Camera- no VT Camera
CN1803 : GPS Ant.- no GPS
U1831 : LDO (for GPS)- no GPS
U1811 : GPS chip- no GPS
CN1221 : 3D Cam con.- no 5M Camera- no 3D Camera
FL1801 : Diplexer (GPS/B4 Diversity)- no GPS
X1821 : 26Mhz X-tal- no GPS
U901 : Audio codec- no Sound
U1251 : HDMI IC- no HDMI Display
U1801 : GPS RF Module- no GPS
U1106 : LDO- no 3D LCD
U1121 : LCD LED boost- no LCD backlight
FL1141/FL1142 : EMI filter- no Display
CN1141 : LCD Conn.- no Display
U1131 : 3D LCD boost- no 3D LCD
U975 : Compass sensor- no compass sensor
CN1181 : Key FPCB Con.- no 4 key LED- no 3D key- no Main MIC- no Speaker- no Vibrator
BAT800 : Backup Cap.- RTC Reset
U891 : Fuel gauge- Battery-bar accuracy declined
U1101 : Dual LDO- no Display
U241 : PMU(for Transceiver)- no Service- RF Sensitivity & TX Power
X184 : 26Mhz X-tal- no Service
U181 : Transceiver- no Service- RF Sensitivity & TX Power
U121 : Bank Duplexer- no Service- RF Sensitivity & TX Power
FL111 : FEM- no Service- RF Sensitivity & TX Power
U220 : DCDC (for PAM)- no Service- RF Sensitivity & TX Power
U171:MMMB (Multi PAM)- no Service- RF Sensitivity & TX Power
SW102 : RF S/W- no Service
SW101 : Coaxial Conn.- no Service
- 202 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
3418
17
CN101
LG-P925_F_SUB_1.0_TOP
- 203 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
5
106
LD101
ZD101
R112
201
U
R121
101S
TP105
201
D
201A
V
CN110
511
C90
1C
C104VA103
ZD105
CN102
C120C119
601
DZ
401
DZ
201
DZ
301
DZ
2 21
R 1 01
C
2 01
C
R101
301
C
301
D7 0
1C
101
U
L101
TP102 TP101
101J
TP104TP103
501
R
401
R01
1R
901
R1 0
1D
6 01
C81
1R
7 11
R50
1C
601
R
LG-P925_F_SUB_1.0_BOT
- 204 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
20
10
11
C104
101
U
FB101
401
D
201
D
101
CIMCN103
301
D
C10130
1C
C102
201
NC
101
D
LG-P925_F_VTCAM_1.1_TOP
- 205 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
610
5
43
81 71
L102
C105
CN104
101NC
LG-P925_F_VTCAM_1.1_BOT
- 206 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
LG-P925_F_EAR_1.0_TOP
- 207 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
LG-P925_F_EAR_1.0_BOT
- 208 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
L103
D101
D102
L104
LD101
L102R101MIC101
VB101
101
PS
101B
K
1 01LC103FB103 R102
LD102
501
R
011
C
311
C
411
CR104
LD103
R103
LD104
LG-P925_RF_KEY_1.1_TOP
- 209 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
LG-P925_RF_KEY_1.1_BOT
110 2
01
201
NC
- 210 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
CN
104
CN
103501L
C106101WS
LG-P925_E_PCB_1.0
- 211 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
KB101
LG-P925_F_SK_PWR_1.0
- 212 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
201B
K10
1BK
LG-P925_F_SK_VOL_1.0
10. CALIBRATION
- �13 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10. CALIBRATION
10.1 Configuration of Tachyon
10.1.1 Configuration of directory
P9�5/ LGP9�5
LGP9�5
LGP9�5
LGP9�5
10. CALIBRATION
- �14 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10.1.2 Description of basic folders
10.1.3 Description of configuration files
Folder Description
Tachyon Exe file and MFC dll, UI dll is present.
Common Common dll files.(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
Config Envirement files.(Port configuration, Loss adjust)
Instrument Tester control dll.
ModelModel files is present. (Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL NAME(LGGW620, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, …)
OCX Conponent files.
PhoneCmd Phone communication file
Report Report Files is present.(Cal data, test data)
File Description
‘MODEL NAME’_Calibration.XML There are imformations to calibrate.It consist of calibration items.
‘MODEL NAME’_CallSetup.XML There are imformations to call.
‘MODEL NAME’_NV.INI It consists of default values.It is written when ‘cal&auto’ is begun.
‘MODEL NAME’_Sequence.XML It is described a testing procedures.
10. CALIBRATION
- �15 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10.2 How to use Tachyon
10.2.1 Model selection
Follow the procedure before start calibration & auto test
a. Click the icon, in tool bar. Then, you can see the below screen.
b. Select Model “LGP9�5”
B
LGP9�5
LGP9�5
10. CALIBRATION
- �16 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
c. Select the model : You should select “LGP9�5”
d. Select the buyer (must be double clicked) Then, you can see “PASS” in Config File Check.
e. Click select button
CD
E
LGP9�5
LGP9�5LGP9�5
LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5LGP9�5
10. CALIBRATION
- �17 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10.2.2 Start cal & auto
a. Click calibration & autotest button, in Tool bar.
b. Calibration & autotest will be executed in order.
1) Precede Action.
- NV write
- Test command send.
�) Calibration
3) Auto test
4) After action
- Phone reset
- Change UE to AMSS
LGP9�5
11. HIDDEN MENU
- �18 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. HIDDEN MENU
Hidden Menu Start
Start shortcut keys:3845#*9�5#
Hidden Menu List
Start the desired menu: Menu, click
Device Test
List:
Auto all Test: Device functionality testing at the factory to use
Accelerometer Test
ALC/Proximity Test
AutoDetecting Test
Bluetooth Scan Test
Camera Test
Compass Test
Gyroscope Test
External Memory Test
Font Test
Key/Compass Test
LCD Test
S3D LCD Test
3D LCD Test
RTC Test
Sound Test
Touch Test
Vibrator Test
Wifi Scan Test
Gyro Cal Test
EMI Test
HDMI Output Test
HDMI Test
Touch LED Brightness
Gesture Manager Test
Gmtest_app�
Gesture Test
11. HIDDEN MENU
- �19 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Device Test List
Auto All Test :
-> Auto All Test menu click
-> Continuous information on the menu, giving you ability test
Accelerometer Test
Proximity Test
: Proximity Sensor
Phone contact with your fingers in the top of the sensor
determine the sensor response
Far 1.0
Near 0.0
Check the “Auto brightness mode”
- ALC level changed due to the brightness
11. HIDDEN MENU
- ��0 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
AutoDetecting Test
: USIM, SD card, Ear jack
• Check the SIM card
• Check the SD card
• Check Ear phone(jack)
- Ejected ear jack is normal
Bluetooth Scan Test
Camera Test
Menu features disabled
This feature is part of Auto All Test replaced by
-> Auto All Test
-> Camera Preview
-> VTCamera Preview
-> 3DCamera Preview
11. HIDDEN MENU
- ��1 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Camera Test 1
Camera Preview
Camera Test 2
VTCamera Preview
Camera Test 3
3DCamera Preview
11. HIDDEN MENU
- ��� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Compass Test
Gyro Sensor test
External Memory Test
SD Card
SD Card test -> Write a test check of the SD Card memory
11. HIDDEN MENU
- ��3 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Font Test
Change native font
Key/Compass TestUp/Down key : Check RecognitionMenu key : Check RecognitionHome key : Check RecognitionBack key : Check RecognitionSearch key : Check Recognition3D key : Check recognitionEnd key : Check recognition
Phone contact with your fingers in the top of the sensor determine the sensor response - Far 1.0 - Near 0.0 - ALC Change
Compass test
LCD Test ListManual Test : Click on the following screen Automatic Test : Automatically, without clicking
- Manual Test- Automatic Test- �D pattern Test- 3D pattern Test
- Red Display- Green Display- Blue Display- White Display- Red, Green, Blue, White Display- Gradation brightness Display
11. HIDDEN MENU
- ��4 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
S3D LCD Test
3D LCD Test
RTC test
11. HIDDEN MENU
- ��5 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Ring test
Touch window testWrite with finger
Vibrator testA case-by-state vibration tests
11. HIDDEN MENU
- ��6 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Wifi Scan test
Gyro Cal TestGyroscope calibration
EMI TestDisplay EMI
11. HIDDEN MENU
- ��7 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
HDMI output TestUsing HDMI output
HDMI TestDisplay HDMI
Touch LED Brightness
11. HIDDEN MENU
- ��8 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Gesture Test
Audio Loop Back TestMic & Speak Phone loop Back test
ELT TestAutomatic Mode: Test Automatically Manual Mode : Test selectivity
11. HIDDEN MENU
- ��9 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
ELT TestAutomatic Mode : LCD Automatic on/off test -> time setting
ELT Manual TestLCD Backlight RingtoneVibratorCameraAudio Loopback-> test on the device is working
(The ability to use plant)
SW Sanity TestFPRI TestCRC Test: BIN CRC CAL CRC EFS CRC EFS CRC Detail
11. HIDDEN MENU
- �30 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Factory ResetFormat External SD card : External SD Card Data reset Format Internal SD card : Internal SD Card Data resetFactory Rest :Changing the Factory
Version InfoClassified Information representation
Module Test list • BT DUT setting • SMS Prefer set • LCD Always ON • Hidden Reset • USB mode selection • Reboot CP/AP • Stability Test • Charging Test • FOTA Test • Crash Handling • SMPL Setting • SMPL count • Wakelock Monitoring Setting
11. HIDDEN MENU
- �31 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
WLAN TestWLAN performance on SW
ERS Menu
Contacts Test
11. HIDDEN MENU
- �3� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Aging Test
Port Setting
Select -> OK
KR Setting
-> Select OK
11. HIDDEN MENU
- �33 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Log service
Browser Utility
AT Test
11. HIDDEN MENU
- �34 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Modem Setting
Menu:
Engineering Mode
Band Selection
Auto Call Answering
RRC Version Setting
QCRIL/Android Log On/Off
PDP Setting
HSDPA Category
GSM A5 Algorithm
Protocol Test
GCF Flag
Arm9 Log ON/Off
GPS Test
GPS HW Test
11. HIDDEN MENU
- �35 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
SMS Test
->Automatic Memfull Test
DRM Test
Call Test
VC Auto answer
-> Select Disable or Enable
11. HIDDEN MENU
- �36 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
MMS Test
WPS test
Network Mode
11. HIDDEN MENU
- �37 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Network Mode
Preferred networks
FM radio Test
Input the Freq. & Volume
11. HIDDEN MENU
- �38 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Development Menu Setting
For monkey cage test
VT memu
Connectivity Test
11. HIDDEN MENU
- �39 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TouchArea Setting
Fake Language
12. DISASSEMBLE GUIDE
- �40 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. DISASSEMBLE GUIDE
12.1 Folder disassemble method (Front Cover / Frame / LCD Module)
Task Order : 1) Front Cover Assy separation → �) LCD separation
12.1.1 Front Cover Assy separation
10 9
1
�
3
4 5
8
7
6
Task
1) First, you should confirm Front Cover Hook’s position
(See the left picture , ten points) and then Front cover’s Open.
�) Separate a Front Cover Assy and Frame.
Notice
1) You should confirm FPCB Ear-jack’s separation before the separation
�) Please note the tear when separated Touch FPCB
3) Please note the tear when separated LCD FPCB
12. DISASSEMBLE GUIDE
- �41 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12.1.2 LCD Module separation
[Case 1] : LCD is attached to the Front
Task & Notice1) Separates the LCD using LCD’s right corner* LCD is attached to the Window by double-sided adhesive Pad.
1
�) Open the LCD’s side using a nail (or HERA) → After the separation of left&right side same, Remove the LCD.
2
12. DISASSEMBLE GUIDE
- �4� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
[Case 2] : LCD is attached to the Frame
Be careful Crack by LCD flexure
Task & Notice1) Lift the LCD while pusing the back of Frame’s Open section using LCD Hook* LCD is attached to the Frame by conductive double-sided tape
1
2
2
* If you do not separate in this way , you should life the LCD’s side using a nail (or HERA).
- 243 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
ACQ00
EAA00
EAU00
EBR00
EBR01
EBR02
EBR03
SURY00
ACQ01
SVCY00
SVLM00
SWCC00
MCQ00
ADV00
GMEY00
MBG00
MBG01
MBG02
MCQ01
MCQ02
MEG00
MJN00
MJN01
MJN02
MJN03
MJN04
MJN05
EBP00
GMZZ00
GMEY01
EBR04
EBR05
EAX00
MBK00
MBK01
EBR06
ACQ02
EAC00
Cover Assembly,Rear
Antenna Assembly
Motor,DC
PCB Assembly,Flexible (Connector,RF)
PCB Assembly,Flexible (Microphone,Condenser)
PCB Assembly,Flexible (Microphone,Condenser)
PCB Assembly,Flexible (Jack,Phone)
Receiver
Cover Assembly,Front
Camera Module
LCD,Module-TFT
Cable,Assembly
Damper
Frame Assembly
Screw,Machine
Button
Button
Button
Damper,LCD
Damper
Holder
Tape
Tape
Tape
Tape
Tape
Tape
Camera Module
Screw,Machine
Screw,Machine
PCB Assembly,Flexible (Socket,Card)
PCB Assembly,Main
PCB,Sidekey
Can,Shield
Can,Shield
PCB Assembly,Flexible (PCB,Sidekey)
Cover Assembly,Battery
Rechargeable Battery,Lithium Ion
Description Location
MJN05
MJN04
ACQ01MCQ01
MJN01
SVLM00 MBG00
SVCY00 SURY00
EBR02
ADV00MJN03
MBG01
MCQ00EBR03
MJN00
EBP00
MJN02
SWCC00
MBG02
MBG00
MJN03
GMEY00EBR00
ACQ02
GMEY01
GMZZ00
EAC00
EAU00
EAA00
ACQ00
EBR04
MBK00EBR06
EAX00
MBK01
EBR05
MCQ02
EBR01
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.1 EXPLODED VIEW
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �44 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Note: This Chapterisused for reference,Part order is orderedby SBOM standard on GCSC
Level LocationNo. Description PartNumber Spec Remark
1 AGF000000 Package Assembly AGF76258585LGP925.ACAPDB ZZ:Without ColorLGP925.ACAPDB_COSMO2 Ply-WD_LA LATINP925 for Only_700ea
2 MAY084001 Box,Unit MAY65193104COMPLEX LGP920.AGBRML ZZ:Without ColorCOSMO 2_H/Case Lower_LG-P920_LargeENG_UK / ASIA / MEA / LA
2 MAY084002 Box,Unit MAY65193117COMPLEX LGP920H.ACAOML ZZ:Without ColorCOSMO 2_H/Case_LGP920h_Large LA SPN_ForOnly
2 MAY047100 Box,Master MAY65217302COMPLEX LGP920.AORUML ZZ:Without ColorCOSMO 2_M/Box_LGP920_None_UK / ASIA / MEA/ LA
2 MEZ084100 Label,Unit Box MEZ64160717 COMPLEX LGP920.AORDML ZZ:Without ColorCOSMO_USP Label_LGP925_LA SPN_For Only
2 MEZ003500 Label,Barcode MEZ64187101 COMPLEX LGP920.ADEUML ZZ:Without Color -
2 MGA000000 Pallet MGA62599505COMPLEX LGA230.AINDZY ZZ:Without ColorCosmo 2 6Ply-WD pallet_700ea (6side woodenpallet new type)
2 MEZ047200 Label,Master Box MLAJ0004402PRINTING CG300 CGR DG ZZ:Without ColorLABEL MASTER BOX(for CGR TDR 2VER.mbox_label) GSM standard_master box label
2 MEZ000000 Label MLAZ0050901 COMPLEX KU990.AGBRBK ZZ:Without ColorBattery Warning Label (Lithium ion Battery Label)
1 AGQ000000 Phone Assembly AGQ86389706 LGP925.ACAPDB DB:DARK BLUE UADS : refer toAGQ86509301, AGQ86389702
2 MEZ002100 Label,Approval MLAA0062301 COMPLEX KB770 DEUBK ZZ:Without Color -
2 ACQ100400 CoverAssembly,EMS ACQ85898401 LGP925.ACAPDB DB:DARK BLUE -
3 ACQ00 CoverAssembly,Rear ACQ85531911 LGP925.AATTDB DB:DARK BLUE LG-P925
AATTZY, Cover Assy Rear
4 MBL063801 Cap,Receptacle MBL64837611 MOLD PC LUPOY SC-1004A LGP925.AATTDBDB:DARK BLUE Cap (USB)
4 MJN000001 Tape MJN67853301 COMPLEX LGP920.ASFRZY ZZ:Without Color -
13.2 ReplacementParts<Mechanic component>
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �45 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
4 MCK063300 Cover,Rear MCK66589811MOLD PC LUPOY SC-1004A LGP925.AATTDBDB:DARK BLUE LG-P925 AATTZY, Cover Rear,GF 10%
4 MCQ000000 Damper MCQ66627501 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MCQ000001 Damper MCQ66627601 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MCQ000003 Damper MCQ66627701 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MCQ000002 Damper MCQ66627801 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MCQ000004 Damper MCQ66627901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MCQ000005 Damper MCQ66628001 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MCQ000006 Damper MCQ66650901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MFB029600 Lens,Flash MFB62473601 MOLD PMMA LGP920.ASFRZY ZZ:Without Color -
4 MGJ000000 Plate MGJ63003011 COMPLEX LGP925.AATTDB DB:DARK BLUE PlateMobile S/W
4 MEZ000900 Label,After Service MLAB0001102 COMPLEX C2000 CGRSV WA:White C2000USASV DIA 4.0 PRINTING,
4 MKC009400 Window,Camera MKC63903301 CUTTING SODA LIME GLASS LGP920.ASFRZYZZ:Without Color -
4 MCQ000007 Damper MCQ66627401 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MCR000000 Decor MCR64367601 CASTING AL LGP920.ASFRZY SV:Silver -
4 MJN009400 Tape,Camera MJN67788001 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MJN000000 Tape MJN67788101 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MBL063800 Cap,Receptacle MBL64823211 MOLD PC LUPOY SC-1004A LGP925.AATTDBDB:DARK BLUE Cap (HDMI)
3 ACQ003400 CoverAssembly,Bar ACQ85692116 LGP920H.ATCLDB DB:DARK BLUE P920H
7 EAX010700 Contact MCIZ0008401 COMPLEX LG-C900 ATTDW ZZ:Without ColorPRESS, BeCu, , 3.0, 1.2, 1.5,
4 ACQ01 CoverAssembly,Front ACQ85371111 LGP925.AATTDB DB:DARK BLUE LG-P925
AATTZY, Cover Ass'y Front
5 MCR000001 Damper MCQ66687601 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 EBD030100 Decor MCR64356501 PRESS STS 304 0.3 LGP920.ASFRZY BK:Black -
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �46 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
5 MJN000001 Filter MDJ63124401 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MJN000000 Filter MDJ63124501 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MJN020801 Guide MEA62590801 MOLD PC LGP920.ASFRZY ZZ:Without Color lightplate
5 MJN020800 Holder MEG62706101 MOLD NBR LGP920.ASFRZY BK:Black -
5 MEG000001 Holder MEG62719001 MOLD NBR LGP920.ASFRZY BK:Black -
5 MEG000000 Tape,Decor MJN67787701 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MEA000000 Tape,Decor MJN67787801 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MDJ000000 Tape MJN67787901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MDJ000001 Tape MJN67901801 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCR000002 Damper,Camera MCQ66627301 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCQ000000 Damper,Speaker MCQ66627201 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCQ009400 Cover,Front MCK66589611 MOLD PC LGP925.AATTDB DB:DARK BLUE LG-P925 AATTZY, Cover Front
6 MCR000000 INSERT,NUT MICE0016909 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
5 MCQ000001 Decor MCR64367511 MOLD PC+ABS LGP925.AATTDB DB:DARK BLUEDeco Front (Top)
5 MCQ074200 Decor MCR64367411 MOLD PC+ABS LGP925.AATTDB DB:DARK BLUEDeco Front (Bottom)
5 MET099500 Damper MCQ66723401 COMPLEX LGP920.ASFRZY ZY:Color Unfixed -
4 MEZ000000 Label MLAZ0038303 COMPLEX LG-LC3200 WA:White PRINTING, PPRIPRINTING
4 MJN000006 Tape MJN67928901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MCQ00 Damper MCQ66886701 COMPLEX LGP920.AGBRML ZZ:Without Color -
4 ADV00 Frame Assembly ADV73885501 LGP920.ASFRZY BK:Black -
5 MCQ009400 Damper MCQ66476501 COMPLEX LGP920.ASFRZY ZZ:Without Color -
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �47 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
5 MCQ000002 Damper,Camera MCQ66476601 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MJN000002 Damper MCQ66671001 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MJN000001 Frame MDQ62840301 COMPLEX LGP920.ASFRZY SV:Silver -
5 MJN000000 Damper MCQ66829101 COMPLEX LGP920.AGBRML ZZ:Without Color -
5 MJN009400 Tape,Camera MJN67710401 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCQ000001 Tape MJN67710501 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MDQ000000 Tape MJN67889001 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MJN009401 Tape MJN67889101 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCQ000000 Tape,Camera MJN67697901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 GMEY00 Screw,Machine GMEY0018101 GMEY0018101 FH + 1.4mM 1.5mM SWCH FZB N -KUMGANG SCREW CO., LTD
4 MBG00 Button MBG64110511 MOLD PC LUPOY SC-1004A LGP925.AATTDBDB:DARK BLUE Button (3D)
4 MBG01 Button MBG64110611 MOLD PC LUPOY SC-1004A LGP925.AATTDBDB:DARK BLUE Button (Power)
4 MBG02 Button MBG64110711 MOLD PC LUPOY SC-1004A LGP925.AATTDBDB:DARK BLUE Button (Volume)
4 MCQ01 Damper,LCD MCQ66476801 COMPLEX LGP920.ASFRZY BK:Black -
4 MCQ02 Damper MCQ66720201 MOLD URETHANE LGP920.ASFRZY ZZ:WithoutColor P920 Pad LCD Rubber
4 MEG00 Holder MEG62719101 MOLD NBR LGP920.ASFRZY BK:Black -
4 MJN00 Tape MJN67808901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MJN01 Tape MJN67880801 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MJN02 Tape MJN67889201 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MJN03 Tape MJN67889301 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4 MJN04 Tape MJN67902001 COMPLEX LGP920.ASFRZY ZZ:Without ColorP920 USP Film, Europe
4 MJN05 Tape MJN67905401 COMPLEX LGP920.ASFRZY ZZ:Without Color -
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �48 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
3 GMZZ00 Screw,Machine GMZZ0017701 GMZZ0017701 BH + 1.4mM 3mM MSWR NI PLT N- ASIA BOLT
3 GMEY01 Screw,Machine GMEY0007902 GMEY0007902 CS + 2.7M 4.5M SWRH BLACK N AKUMGANG SCREW CO., LTD
6 U101 Contact MCIZ0008701 COMPLEX L-04C, ANTTWV ZZ:Without ColorPRESS, YCUT-FX, 4.2, 2.5, 1.5,
5 MBK00 Can,Shield MBK62874101 PRESS STS 0.15 LGP920.ASFRZY ZZ:WithoutColor -
5 MBK070300 Insulator MEV63895901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MJN000000 Insulator MEV63896101 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MBK01 Can,Shield MBK63052601 PRESS STS 304 0.2 LGP920.ASFRZY ZZ:WithoutColor -
6 EBR070500 Can,Shield MBK62873901 PRESS STS 0.15 LGP920.ASFRZY ZZ:WithoutColor -
6 EAX010500 Tape MJN67832201 COMPLEX LGP920.ASFRZY ZZ:Without Color -
6 RAA050100 Tape MJN67868301 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MEZ000000 Label MLAZ0038301 COMPLEX LG-VX6000 ZZ:Without Color PID Label4 Array PRINTING,
6 R592R593 Can,Shield MBK62874201 PRESS CU 0.2 LGP920.ASFRZY ZZ:Without Color
-
6
C351C358C501C741C743C987
Contact MCE62252901 COMPLEX LGP999BN ZZ:Without Color LG-P999CLIP_SUB
6 R809 Can,Shield MBK63032501 PRESS STS 304 0.2mm LGP920.ASFRZYSV:Silver -
6 R1902 Clip MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -
6 L1201 Can,Shield MBK62874001 PRESS CU 0.2 LGP920.ASFRZY ZZ:Without Color-
1 AAD000000 Addition Assembly AAD85829603 LGP925.ACAPDB DB:DARK BLUE -
2 ACQ02 CoverAssembly,Battery ACQ85513212 LGP925.AATTDB DB:DARK BLUE LG-P925 Cover
Assy Battery, Canada
3 MJN000000 Tape MJN67907401 COMPLEX LGP920.ASFRZY ZZ:Without Color -
3 MCR000000 Decor MCR64356401 PRESS AL 0.3 LGP920.ASFRZY BK:Black -
3 MJN061100 Tape,Protect MJN67972301 COMPLEX LGP920.AGBRML ZZ:Without Color -
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �49 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
3 MGJ000000 Plate MGJ63107801 COMPLEX LGP920.ASFRZY ZZ:Without Color -
3 MCK00 Cover,Battery MCK66590112 MOLD PC LUPOY SC-1004A LGP925.AATTDBDB:DARK BLUE LG-P925, Cover Battery, GF10%
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �50 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Note: This Chapterisused for reference, Part order is orderedby SBOM standard on GCSC
Level LocationNo. Description PartNumber Spec Remark
4 EAA031 PIFAAntenna,Multiple EAA62605801 ACB-00109 TRIPLE -5DB 5.0 Planar Inverted F
Type - MOBITECH CORPORATION
4 EAA00 Antenna Assembly EAA62609301P925-MODULE-LAIRD LGP925.AATTDB DARKBLUE DARK BLUE DARK BLUE LAIRDTECHNOLOGIES KOREA
5 EAU010 PIFA Antenna,RF EAA62584901 P925-MAIN-LAIRD MULTI -2DB 3.0 LDS Type -LAIRD TECHNOLOGIES KOREA
5 EAU00 Motor,DC EAU61504701 MVMU-A363F 2V 90mA 90mA 0RPM 0RPM60mSEC 0GF.CM 26OHM LG INNOTEK CO., LTD
4 EBR00PCBAssembly,Flexible(Connector,RF)
EBR74500101 LGP925.AATTDB - Flexible
5 EBR070400PCBAssembly,Flexible,SMT
EBR73844801 LGP925.AATTDB 1.0 Flexible
6 EBR070200PCBAssembly,Flexible,SMT Top
EBR73844901 LGP925.AATTDB 1.0 Flexible
7 C106 PCB,Flexible EAX64306301 LGP925.AATTDB 1.1 POLYI Double 2 0.13 Flexible
6 L105PCBAssembly,Flexible,SMT Bottom
EBR73845001 LGP925.AATTDB 1.0 Flexible
7 SW101 Capacitor,Ceramic,Chip ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
7 CN103CN104
Inductor,Multilayer,Chip ELCH0003831
LQG15HS1N0S02D 1NH 0.3NH - 300mA 0.07OHM10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.
7 EBR070300 Connector,RF ENWY0005501 20279-001E-01 NONE STRAIGHT SOCKET SMDR/TP AU 50OHM 400mDB I-PEX CO., LTD
4 EBR01
PCBAssembly,Flexible(Microphone,Condenser)
EBR74767201 LGP920.AGBRML 1.0 Flexible
5 EBR070400PCBAssembly,Flexible,SMT
EBR74045101 LGP920.AGBRML 1.0 Flexible
6 EBR070300PCBAssembly,Flexible,SMT Bottom
EBR74045201 LGP920.AGBRML 1.0 Flexible
13.2 ReplacementParts<Main component>
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �51 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
7 EAX010700 Connector,BtoB ENBY005350114-5804-020-000-829+ 20P 0.40MM STRAIGHTMALE SMD R/TP 900mM - KYOCERA ELCOKOREA SALES CO.,LTD.
6
LD101LD102LD103LD104
PCBAssembly,Flexible,SMT Top
EBR74045301 LGP920.AGBRML 1.0 Flexible
7 L103L104 PCB,Flexible EAX63975001 LGP920.ASFRZY 1.1 POLYI Multi 4 0.4 Flexible
7 L101L102 LED,Chip EDLH0015109
19-219UTD-S592/TR8 WHITE 2.7~3.1 25mA112~285mcd x, y 95mW 1608 R/TP 2P -EVERLIGHT ELECTRONICS CO., LTD.
7
R101R102R103R104
Inductor,Multilayer,Chip ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MMR/TP COILCRAFT SINGAPORE PTE LTD.
7 C103C113
Inductor,Multilayer,Chip ELCH0004717
1005GC2T82NJLF 82NH 5% - 150mA 2.1OHM700MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
7 D101D102 Resistor,Chip ERHZ0000415 MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP -
ROHM.
7 C114 Capacitor,Ceramic,Chip ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
7 MIC101 Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300mW,R/TP,15pF SCG HONG KONG SAR LTD.
7 FB103 Capacitor,Ceramic,Chip ECCH0000182
GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.
7 C110 Microphone,Condenser SUMY0010609
SPU0410HR5H -PB SPU0410HR5H -PB,UNIT,42dB,3.76*2.95*1.1,mems smd mic KNOWLESACOUSTICS
7 EBR070200 Filter,Bead SFBH0007101BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25%0.25 ohm 0.5A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.
7 CN102 Capacitor,Ceramic,Chip ECCH0000117
CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD.
4 EBR02
PCBAssembly,Flexible(Microphone,Condenser)
EBR74727001 LGP920.AGBRML 1.0 Flexible
5 EBR070400PCBAssembly,Flexible,SMT
EBR74043901 LGP920.AGBRML 1.0 Flexible
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �5� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 EBR070200PCBAssembly,Flexible,SMT Bottom
EBR74044001 LGP920.AGBRML 1.0 Flexible
7 L102 Inductor,Multilayer,Chip ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MMR/TP COILCRAFT SINGAPORE PTE LTD.
7 CN104 Connector,BtoB ENBY005200124-5804-010-000-829+ 10P 0.40MM STRAIGHTFEMALE SMD R/TP 900mM - KYOCERA ELCOKOREA SALES CO.,LTD.
7 CN101 Connector,BtoB ENBY0057401
14-5804-034-000-829+ 34,0.4mm,STRAIGHT,gold,34,0.40MM,STRAIGHT,MALE,SMD,0.9T, KYOCERA ELCO KOREA SALESCO.,LTD.
7 C105 Capacitor,Ceramic,Chip ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 EBR070300PCBAssembly,Flexible,SMT Top
EBR74044101 LGP920.AGBRML 1.0 Flexible
7 EAX010700 PCB,Flexible EAX63975101 LGP920.ASFRZY 1.1 POLYI Multi 5 - FLEXIBLE
7
D101D102D103D104
Diode,TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEKDEVICES INC.
7 CN103 Connector,BtoB ENBY0039601 GB042-20S-H10-E3000 20P 0.4MM STRAIGHTSOCKET SMD R/TP 1M - LS Mtron Ltd.
7 MIC101 Microphone,Condenser SUMY0010609
SPU0410HR5H -PB SPU0410HR5H -PB,UNIT,42dB,3.76*2.95*1.1,mems smd mic KNOWLESACOUSTICS
7 C101C102
Capacitor,Ceramic,Chip ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREACOOPERATION
7 C103C104
Capacitor,Ceramic,Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.
7 U101 IC,Ambient LightSensor EUSY0431901 APDS-9900 - - - - - - AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED
7 FB101 Filter,Bead SFBH0006806CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm0.3A SMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICS CO., LTD.
4 EBR03PCBAssembly,Flexible(Jack,Phone)
EBR74044201 LGP920.AGBRML 1.2 Flexible
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �53 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
5 EBR070400PCBAssembly,Flexible,SMT
EBR74044301 LGP920.AGBRML 1.2 Flexible
6 EBR070300PCBAssembly,Flexible,SMT Bottom
EBR74044401 LGP920.AGBRML 1.2 Flexible
7 EAX010700 Jack,Phone EAG63070601 KJA-PH-4-0176 5P 2P ANGLE R/TP 3.5M BLACK5P - KSD CO., LTD
6 CN101PCBAssembly,Flexible,SMT Top
EBR74044501 LGP920.AGBRML 1.2 Flexible
7 EBR070200 PCB,Flexible EAX64142901 LGP920.ASFRZY 1.0 POLYI Multi 3 - Flexible
7 J101 Connector,BtoB ENBY005190114-5804-010-000-829+ 10P 0.40MM STRAIGHTMALE SMD R/TP 900mM - KYOCERA ELCOKOREA SALES CO.,LTD.
4 SURY00 Receiver SURY0010114BWBR1207L-04B-P 30mW 32OHM 105DB0HZTO0HZ WIRE - BUJEON ELECTRONICS CO.,LTD
5 MCK032700 Touch WindowAssembly EBD61005201
S09CL04301B CAPACITIVE TOUCH G/GSynaptics Gen3 4.3 BB - KyoshinTechnosonic(Korea)Co.,LTD.
4 SVCY00 Camera Module SVCY0027901LM08MIFF LM08MI VGA Aptina 1/11", MIPI I/F,FPCB type, 90deg HANSUNG ELCOMTECCO.,LTD.
4 SVLM00 LCD,Module-TFT SVLM0043201LH430WV2-SD01 WVGA 4.3INCH 480X800 170CDCOLOR 70% 15/9 1000:1 60Hz Inverter N 3D LCDLG Display Co. Ltd.
4 SWCC00 Cable,Assembly SWCC0010601 80186-202B-80L 80 mm,LINE,20311-011R_20311-011R,H=2.0, I-PEX CO., LTD
3 EBP00 Camera Module EBP61302201HSIS-LM58SNAFVS HSIS-LM58SNAFVS 5M AFDual Sony 1/4 CIS,MIPI,RFPCB 0degreeHANSUNG ELCOMTEC CO.,LTD.
3 EAN060000 Memory CardAssembly EAN62247401 -
4 EAN011400 IC,MemoryCard,MICRO SD EAN62090801
MMB3R04GUACA-2MGMK 4GBYTE 2.7VTO3.6VMICRO SD CARD 11.0x15.0x1.0MM TR 8P 4GBMicroSD Card (32nm TLC) SAMSUNGELECTRONIC CO.,LTD
3 EBR04PCBAssembly,Flexible(Socket,Card)
EBR74045401 LGP920.AGBRML 1.0 Flexible
4 EBR070400PCBAssembly,Flexible,SMT
EBR74045501 LGP920.AGBRML 1.0 Flexible
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �54 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
5 EBR070300PCBAssembly,Flexible,SMT Bottom
EBR74045601 LGP920.AGBRML 1.0 Flexible
6 EAX010700 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -
30TO+85C 1005 R/TP - TDK CORPORATION
6 CN101 Connector,BtoB ENBY0051001 GB042-10S-H10-E3000 10P 0.4MM STRAIGHTFEMALE SMD R/TP 1M - LS Mtron Ltd.
6 EBR070200 Resistor,Chip ERHY0000193 RC1005F270CS 27OHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C103C105 Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300
mW,R/TP,15pF SCG HONG KONG SAR LTD.
6 CN102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONESMD R/TP AMOTECH CO., LTD.
6 R117R118 Resistor,Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP
- ROHM.
6
ZD101ZD102ZD103ZD104ZD105ZD106
Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP- ROHM.
6 VA103 Socket,Card ENSY0023802 SCHB1B0201 Micro-SD 8P ANGLE SMD R/TP -ALPS ELECTRIC KOREA CO.,LTD.
6 R112 Capacitor,Ceramic,Chip ECCH0005604
GRM188R60J106M 10000000pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATAMANUFACTURING CO.,LTD.
6 R101 Capacitor,Ceramic,Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNGELECTRO-MECHANICS CO., LTD.
6 S101 IC,DC,DCConverter EAN61850201
LM3559TLX 2.5 to 5.5V adj 0W MICRO SMD R/TP16P - NATIONAL SEMICONDUCTOR ASIAPACIFIC PTE. LTD.
6 C107C109
Capacitor,Ceramic,Chip ECCH0000110
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 C106 Capacitor,Ceramic,Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C101C104
IC,LDO VoltageRegulator EUSY0353801 RP103K331D 1.7V TO 5.25V 3.3V 400mW DFN
R/TP 4P - RICOH COMPANY, LTD.
6 C119 LED,Chip EDLM0009501LXCL-PWF4 WHITE 2.8~4.6 150mA 28~59cd NA1W 2016 R/TP 2P - LUMILEDS LIGHTINGU.S.,LLC
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �55 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 CN110 Inductor,WireWound,Chip ELCP0008008
MIPS2520D1R3-LG 1.3UH 30% - 1.2A 1.4 1.20.09OHM - - SHIELD 2.5X2X1MM NONE R/TPFDK CORPORATION.
6 U102 Diode,TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP6P 5 PROTEK DEVICES INC.
6 LD101 Capacitor,Ceramic,Chip ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREACOOPERATION
6 L101 Card Socket ENSY0022101 GCA26C-6S-H15-E1500 GCA26C-6S-H15-E1500,6,ETC2.54 mm,H=1.5 LS Mtron Ltd.
6D101D102D103
Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONESMD R/TP AMOTECH CO., LTD.
5 C115C120
PCBAssembly,Flexible,SMT Top
EBR74045701 LGP920.AGBRML 1.0 Flexible
6 J101 PCB,Flexible EAX63974901 LGP920.ASFRZY 1.0 POLYI Multi 4 0.4 FLEXIBLE
6 VA102 Connector,BtoB ENBY0057401
14-5804-034-000-829+ 34,0.4mm,STRAIGHT,gold,34,0.40MM,STRAIGHT,MALE,SMD,0.9T, KYOCERA ELCO KOREA SALESCO.,LTD.
3 EBR05 PCBAssembly,Main EBR73836903 LGP925.ACAPDB 1.0 Main
4 EBR071500PCBAssembly,Main,Insert
EBR74043701 LGP920.AGBRML 1.2 Main
5 EAX00 PCB,Sidekey EAX64050301 LGP920.ASFRZY 1.0 POLYI Multi 2 0.18 SIDEKEY
5 EBR06PCBAssembly,Flexible(PCB,Sidekey)
EBR74214101 LGP920.AGBRML 1.0 Flexible
6 EAX010500 PCB,Sidekey EAX64144001 LGP920.AGBWBK 1.0 POLYI Double 2 0.18Sidekey
5 MBK070301 Resin,PC BRAH0001301 UF2040 or 3075BHF . . NONE
4 EBR071800PCBAssembly,Main,SMT
EBR73837003 LGP925.ACAPDB 1.0 Main
5 EBR071700PCBAssembly,Main,SMT Bottom
EBR72793004 LGP925.AATTDB 1.0 Main
6 EAX010000 Capacitor,Ceramic,Chip ECCH0006201 C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -
55TO+85C 1608 R/TP - TDK CORPORATION
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �56 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6
C302C309C315C317C323C324C327C328C329C330C333C334C335C337C352C353C354C355C356C357C504C505C600C601C602C603C611C612C613C614C618C635C637C639
Capacitor,Ceramic,Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �57 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6
C640C641C642C644C645C648C651C652C653C656C658C668C671C673C674C675C677C678C679C682C683C684C740C742C744C812C962C963C965C971C972
Capacitor,Ceramic,Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C502C503C605C627C660C661C662C739C973C992C993
Capacitor,Ceramic,Chip ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C1005 R/TP - MURATA MANUFACTURINGCO.,LTD.
6
C305C312C313C344
Inductor,Multilayer,Chip ELCH0001411
LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM16GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.
6
C809C810C811C855C991
Resistor,Chip ERHY0009511 MCR006YZPJ152 1.5KOHM 5% 1/20W 0603 R/TP- ROHM.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �58 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6
R588R591R594R596R597
Resistor,Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005R/TP - ROHM.
6 U303 Capacitor,Ceramic,Chip ECCH0005604
GRM188R60J106M 10000000pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATAMANUFACTURING CO.,LTD.
6
C1931C687C808C814C816C817C819C824C826C829
Capacitor,Ceramic,Chip ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNGELECTRO-MECHANICS CO., LTD.
6 FL621 Capacitor,Ceramic,Chip ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREACOOPERATION
6C316C318C325
Capacitor,Ceramic,Chip ECZH0003503
GRM188R61E105K 1uF 10% 25V X5R -55TO+85C1608 R/TP - MURATA MANUFACTURINGCO.,LTD.
6
C813C815C818C821C825C828C831
IC,DC,DCConverter EUSY0430301
LM3528TMX 2.5 to 5.5V adj 0W CSP R/TP 12P -NATIONAL SEMICONDUCTOR ASIA PACIFICPTE. LTD.
6 U500 Resistor,Chip ERHZ0000220 MCR01MZP5F1501 1.5KOHM 1% 1/16W 1005R/TP - ROHM.
6
FB801FB802FB804FB805FB806
PCBASSY,MAIN,PADSHORT
SAFP0000401 LG-LU3000 LGTBK,MAIN,A,
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �59 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6
C304C314C343C636C647C649C657C663C667C669C670C685C686
Resistor,Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -ROHM.
6 ZD801 Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300mW,R/TP,15pF SCG HONG KONG SAR LTD.
6
C617C621C650C680C681
Resistor,Chip ERHY0009555 MCR006YZPF1202 12KOHM 1% 1/20W 0603 R/TP- ROHM.
6 C846 Capacitor,Ceramic,Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
6
R516R800R803R805R808R821
Capacitor,Ceramic,Chip ECZH0000813
C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6
R1186R313R314R319R342R383
Filter,Bead EAM62150301CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm0.65A SMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C303C500C607C619C620C827C841C844C848C849C850C852C854
Capacitor,Ceramic,Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNGELECTRO-MECHANICS CO., LTD.
6 U1904 Capacitor,Ceramic,Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �60 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 FB301FB302
Inductor,Multilayer,Chip ELCH0001056
1005GC2T2N7SLF 2.7NH 0.3NH - 300mA0.17OHM 5.5GHZ 8 SHIELD NONE1.0X0.5X0.5MM R/TP PILKOR ELECTRONICSLTD.
6 Q1186 Capacitor,Ceramic,Chip ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C 0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
R501R721R722R723R724R725R726R727R728R729R730
Capacitor,Ceramic,Chip ECCH0009506 MCH032A270JK 27pF 5% 25V NP0 -55TO+125C
0603 R/TP - ROHM.
6
ZD1191ZD1192ZD1193ZD1195ZD591ZD592ZD593ZD802
Capacitor,Array EAE62463801 GNM0M2R60J105ME18D 1uF2 20% 6.3V 2R SMDR/TP 4P MURATA MANUFACTURING CO.,LTD.
6
R853R854R901R902
Capacitor,Ceramic,Chip ECCH0009228
GRM033R61A472K 4700pF 10% 10V X5R -55TO+85C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6 U991 Module,RFAmplifier SMZY0027801
ALM-2712 0DBM 14.2DB 0% 0A 200mA 0DB80DBM 1.26DBM 0P 3.0x2.5x1.0MM - AVAGOTECHNOLOGIES INTERNATIONAL SALES PTE.LIMITED
6C507C508C509
Filter,Bead EAM62070801BLM15EG221SN1D 220 ohm 1.0X0.5X0.5 25%0.28 ohm 0.7A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.
6 CN1271 IC,Magnetic Sensor EBD60985501 AMI306 1.7 to 3.6V - QFN R/TP 8P - AICHI STEELCORPORATION
6 R513 Capacitor,Ceramic,Chip ECZH0025920
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6 R804 Oscillator,TCXO EXST0002501KT2520F26000ACW18TAK 26 MHz,2 PPM,10pF,SMD,2.5*2.0*0.8,2ppm,26,1.8V,2.5,2.0,0.8,SMD,R/TP KYOCERA CORP.
6
SC791SC792SC793SC794SC795
Connector,TerminalBlock EAG62832401
04-9254-003-037-037-829+ 3P 2.50MM ANGLESMD T/REEL - KYOCERA ELCO KOREA SALESCO.,LTD.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �61 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 R827 Diode,Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mWEMD2 R/TP 2P 1 AUK CORP
6 U981 Capacitor,Ceramic,Chip ECCH0009231
GRM033R71C471K 470pF 10% 16V X7R -55TO+125C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6 C823 Capacitor,Ceramic,Chip ECZH0003504
GRM188R71E104K 100nF 10% 25V X7R -55TO+125C 1608 R/TP - MURATAMANUFACTURING CO.,LTD.
6 FB1914 Filter Separator SFAY0015301BGSF18DM20 800,1900,1.0 dB,1.0 dB,25 dB,25dB,3226,3228Size INFINEON TECHNOLOGIES(ASIA PACIFIC) PTE LTD.
6
C1930C832C834C837C838C839C840C845C851C853
Connector,BtoB ENBY0057501
24-5804-034-000-829+ 34,0.4mm,STRAIGHT,gold,34,0.40MM,STRAIGHT,FEMALE,SMD,0.9T, KYOCERA ELCO KOREA SALESCO.,LTD.
6
C341C342C830C833
Capacitor,Ceramic,Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V C0G -
55TO+125C 0603 R/TP - TDK CORPORATION
6
L801L802L804L805L806
Capacitor,Ceramic,Chip ECCH0009216
GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6 R830 Resistor,Chip ERHY0009547 MCR006YZPF2003 200KOHM 1% 1/20W 0603R/TP - ROHM.
6 U350 IC,Fuel Gauge EAN61958601 MAX17043G 2.5 to 4.5V Vbat 0W DFN R/TP 8P -MAXIM INTEGRATED PRODUCTS INC.
6 R336 Inductor,Multilayer,Chip ELCH0003832
LQG15HS2N2S02D 2.2NH 0.3NH - 300mA - -0.12OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MMR/TP MURATA MANUFACTURING CO.,LTD.
6 X300X800
Inductor,Multilayer,Chip ELCH0001403
LL1005-FHL1N0S 1NH 0.3NH - 400mA 0.1OHM20GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.
6 U301 Filter,Saw SFSY0035004
B9469 2140MHz,1.4*1.1*0.45,SMD,2110M~2170M,IL2.5,5pin,U-B,50-100,BAND IDIVERSITY,2140MHz,1.4*1.1*0.45,SMD,R/TPEPCOS PTE LTD.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �6� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 R631R632 Resistor,Chip ERHY0009528 MCR006YZPJ474 470KOHM 5% 1/20W 0603 R/TP
- ROHM Semiconductor KOREA CORPORATION
6 R1195 Inductor,WireWound,Chip ELCP0008019
VLS252010ET- 4R7M 4.7UH 20% - 800mA 0.8 0.820.398OHM - - SHIELD 2.5X2X1MM NONE R/TPTDK CORPORATION
6
R731R732R733R734R735R736R737R738R739
Filter,EMI/Power SFEY0015901ICMEF214P101MFRICMEF214P101MFR,SMD,ESD Common modeFilter INNOCHIPS TECHNOLOGY
6 C336C820
Capacitor,Ceramic,Chip ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 SC797PCBASSY,MAIN,PADOPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI
6 L800L803 Thermistor,NTC SETY0006301
NCP15XH103J03RC 10KOHM 5% 0V 0A 3.35KKSMD P/TP 1005size MURATA MANUFACTURINGCO.,LTD.
6 C306C307
IC,RFTransceiver,3G EUSY0432901
PMB5712 XMM6260 RFIC ,; ,IC,Tx/Rx WFWLBR/TP 138P INFINEON TECHNOLOGIES (ASIAPACIFIC) PTE LTD.
6 FB800FB803 IC,WiFi EUSY0378501
WL1271BYFFR 0VTO0V 0W 137P - WLCSP R/TP137P TEXAS INSTRUMENTS KOREA LTD,HONGKONG BRANCH.
6
R581R584R586R598
Capacitor,Ceramic,Chip ECCH0032801
GRM033R60J224M 0.00000022F 20% 6.3V X5R -55TO+85C 0603 R/TP 0.3MM MURATAMANUFACTURING CO.,LTD.
6 R986 Capacitor,Ceramic,Chip ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C 1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L988L989 Varistor SEVY0008901 ICVS0318150FR 18V 0% 15pF 0.6*0.3*0.33 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
6 L303L304
Capacitor,Ceramic,Chip EAE62286801
CL03A104KP3NNNC 0.0000001F 10% 10V X5R -55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R850 Inductor,Multilayer,Chip ELCH0001048
1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM2.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �63 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 C822 Inductor,WireWound,Chip ELCP0008014
MIPSZ2012D4R7 4.7UH 30% - 280mA 0.28 0.70.23OHM - - SHIELD 2.0X1.2X0.9 NONE R/TPFDK CORPORATION.
6 FB741FB743
Capacitor,Ceramic,Chip ECCH0009213
GRM0335C1E6R0D 6pF 0.5PF 25V X7R -55TO+125C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6 FL800 Capacitor,Ceramic,Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNGELECTRO-MECHANICS CO., LTD.
6 U721 Resistor,Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP- ROHM.
6 Q301 Resistor,Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -ROHM.
6R1187R340R981
Filter,Bead SFBH0008102BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25%2.2 ohm 0.2A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.
6 R828 Varistor SEVY0003601 ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55NONE SMD R/TP INNOCHIPS TECHNOLOGY
6 R848 IC,DC,DCConverter EAN61841601
TPS61093 1.6 to 6V adj 1.6W DFN R/TP 10P -TEXAS INSTRUMENTS KOREA LTD, HONGKONGBRANCH.
6 U800 FET EQFP0000101 2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A40OHM 100mW SSM R/TP 3P TOSHIBA
6 CN801 Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005R/TP - ROHM.
6 C986 CapacitorAssembly SMZY0023501
PAS311HR-VG1 3.8 Backup Capacitor0.03F,Module Assembly, KOREA TAIYOYUDEN.CO., LTD.
6 R187 Filter,Bead SFBH0007101BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25%0.25 ohm 0.5A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.
6 U502 Capacitor,Ceramic,Chip ECCH0009201
GRM033R60J473KE19D 47nF 10% 6.3V X5R -55TO+85C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6 U701 Capacitor,Ceramic,Chip ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 R337 Capacitor,Ceramic,Chip ECCH0000145
MCH155CN152KK 1.5nF 10% 50V X7R -55TO+125C 1005 R/TP - ROHM SemiconductorKOREA CORPORATION
6 U961 Filter,EMI/Power EAM62230801NFM18PS105R0J3D_ EMI 0HZ 1uF 0H SMD R/TP6.3V, 2A, 0.03ohm MURATA MANUFACTURINGCO.,LTD.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �64 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 X500 Inductor,Multilayer,Chip ELCH0001034
HK1005 3N3S-T 3.3NH 0.3NH - 300mA 0.16OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPTAIYO YUDEN CO.,LTD
6 R987 Resistor,Chip ERHZ0000296 MCR01MZP5F5103 510KOHM 1% 1/16W 1005R/TP - ROHM.
6 C961 Capacitor,Ceramic,Chip ECCH0000182
GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.
6 C190 Capacitor,Ceramic,Chip ECCH0034801
CL03A474MQ3NNNH 0.47uF,6.3V,M,X5R,HD,0603,R/TP,0.0000047,20%,6.3V,X5R,-55TO+85C,0603,R/TP,.3 mm SAMSUNGELECTRO-MECHANICS CO., LTD.
6 U851 Connector,RF ENWY0008701MS-156C NONE STRAIGHT SOCKET SMDT/REEL AU 50OHM 400mDB HIROSE KOREACO.,LTD
6 U971 Inductor,WireWound,Chip ELCP0009408
LQM2HPN1R0MG0 1UH 20% - 1A 1 1.6 0.055OHM- - SHIELD 2.5X2X1MM NONE R/TP MURATAMANUFACTURING CO.,LTD.
6 L1903 Inductor,Multilayer,Chip ELCH0001404
LL1005-FHL1N5S 1.5NH 0.3NH - 400mA 0.13OHM15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.
6 U801 IC,Level Translator EUSY0391601 NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP6P - SCG HONG KONG SAR LTD.
6 U811 IC,Audio Codec EUSY0424501TWL6040 BGA,120,R/TP,6X6,OMAP4XXX,IC,AudioCodec TEXAS INSTRUMENTS KOREA LTD,HONGKONG BRANCH.
6 EBR071600 Inductor,Multilayer,Chip ELCH0003831
LQG15HS1N0S02D 1NH 0.3NH - 300mA 0.07OHM10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.
6 C244,C247 Capacitor,Ceramic,Chip ECCH0009230
GRM033R61A222K 2.2nF 10% 25V X5R -55TO+85C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6
C1812C1815C1816C1817C1818C1822C209C230C231C249C924C927C937
IC,LDO VoltageRegulator EUSY0407101
BU28TD4WNVX SSON004,4,R/TP,2.8V 150mASingle LDO,IC,LDO Voltage RegulatorIC,LDOVoltage Regulator ROHM.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �65 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6
C1107C1173C1204C1205C1206C1207C1208C1832C1901C1902C1905C193C241C245C250C659C665
Capacitor,Ceramic,Chip ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C 1005 R/TP - ROHM SemiconductorKOREA CORPORATION
6 L131 Resistor,Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP- ROHM.
6
R1102R1103R510R511
Capacitor,Ceramic,Chip ECCH0000183
GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.
6 R811 Oscillator,VCTCXO EAW614438011XXA26000FBA 26MHZ 1PPM 1.8V2.5x2.0x0.8MM ; SMD R/TP DAISHINKUCORPORATION.
6 C1201 Inductor,Multilayer,Chip ELCH0003818
LQG15HS9N1J02D 9.1NH 5% - 300mA 0.26OHM3.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.
6
C1209C1210C1211C227C835C836C842C890C934C935
Resistor,Chip ERHY0009502 MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP -ROHM.
6
C1101C1102C1103C1106C1121C1831C1923C891C975C978
Resistor,Chip ERHY0009554 MCR006YZPF2002 20KOHM 1% 1/20W 0603 R/TP- ROHM.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �66 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 C1122C1137
Capacitor,TA,Conformal ECTH0002703
TCTAL1A107M8R-V2 100uF 20% 10V 50UA -55TO+125C 2.5OHM 3.2X1.6X1.1MM NONE SMDR/TP 1.2T max. ROHM CO.,LTD.
6 U1121 Filter,EMI/Power SFEY0016301ICMEF112P900M COMMON MODE NOISEFILTER 0HZ 0F 0H SMD R/TP INNOCHIPSTECHNOLOGY
6 R1803 Resistor,Chip ERHZ0000243 MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005R/TP - ROHM.
6
R1905R894R895R919R921
Capacitor,Ceramic,Chip ECCH0005603
GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C 1608 R/TP - MURATAMANUFACTURING CO.,LTD.
6R1176R801R802
Filter,Bead SFBH0008101BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6ohm 0.3A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.
6
ZD1172ZD1181ZD1182ZD1224ZD1225
Filter,Ceramic SFCY0000901 LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMDR/TP 4P MURATA MANUFACTURING CO.,LTD.
6 R1125 Capacitor,Ceramic,Chip ECCH0000110
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �67 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6
C1134C1175C1176C1230C1231C1232C1233C1234C1237C1253C173
C1802C1903C1907C191
C1911C1912C1913C1914C1915C194C200C201C202C203C204C206C207C208C251C301C609C610C626
Capacitor,Ceramic,Chip ECZH0025917
GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6
C646C654C655C915C916C917C918C919C920C921C922C925C928C929C930C931C932C938C939
Capacitor,Ceramic,Chip ECZH0025917
GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �68 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6
FB1812FB1815FB1817FB1818
Inductor,WireWound,Chip EAP61747901
VLS3010ET-100M 10UH 20% - 560mA 0.56 0.80.468OHM - - SHIELD 3.0X3.0X1.0 MM NONER/TP TDK KOREA COOPERATION
6
C105C1932C1936L102
L1802
Capacitor,Ceramic,Chip ECCH0009109 C0603X7R1H331KT00NN 330pF 10% 50V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6
C1228C1235C1241C1252C192C243C248C901C902C903C904C905
Inductor,Multilayer,Chip ELCH0001035
HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPTAIYO YUDEN CO.,LTD
6
C115C1814C185C801C858
Inductor,Multilayer,Chip ELCH0003847
LQG15HS1N8S02D 1.8NH 0.3NH - 300mA 0.1OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.
6L176L211L212
Capacitor,Ceramic,Chip ECZH0001108
C1005X7R1E682KT000F 6.8nF 10% 25V X7R -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6
C1141C1229C1236C1904C1906C1908C1909C1910C225C688C892C923
FET,Array EBK61611301 NTUD3169CZ N/P-CHANNEL 20 8 0.22(0.2) 2(6)0.125 SOT-963 R/TP 6P 2 ON SEMICONDUCTOR
6 C114C1174 Diode,TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP
6P 5 PROTEK DEVICES INC.
6 C1143 Connector,BtoB ENBY005360124-5804-020-000-829+ 20P 0.40MM STRAIGHTFEMALE SMD R/TP 900mM - KYOCERA ELCOKOREA SALES CO.,LTD.
6 C187 Inductor,WireWound,Chip ELCP0008013
MIPSZ2012D2R2 2.2UH 30% - 700mA 0.77 0.70.23OHM - - SHIELD 2.0X1.2X1.0 MM NONE R/TPFDK CORPORATION.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �69 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 U1801 Inductor,WireWound,Chip ELCP0008015
MIPSTZ2012D1R0 1UH 30% - 700mA 0.7 0.80.18OHM - - SHIELD 2.0X1.2X0.8 MM NONE R/TPFDK CORPORATION.
6 FB201 IC,DC,DCConverter EUSY0264510 RF6560 2.9 to 5.1V adj 0W CSP R/TP 24P - RF
MICRO DEVICES INC
6 U975 Filter,Separator,Spdt SFAC0002701
LFD211G57DPMD153 0.67 13.5 - 2050,240MHz,0.67 dB,13.5 dB,1575,6 MHz,0.88 dB,18.3dB,SMD,ETC,diplexer,GPS/PCS,2.0*1.25,MURATA MANUFACTURING CO.,LTD.
6
C1171C189C913C914
IC,MM PMIC EUSY0264511RF6590 CSP ,16 ,R/TP,3B,2LDO,CSP,1.732X1.722 ,; ,IC,DC,DC ConverterMICRO DEVICES, INC.
6 X1821 Resistor,Chip ERHY0009527 MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP -ROHM.
6 CN800 Capacitor,Ceramic,Chip ECCH0009110 C0603X7R0J223KT 22nF 10% 6.3V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6 SC798 IC,I/O Support Chip EUSY0426301
TPD12S015 ESD protection HDMI companion chip,; ,IC,CMOS WCSP R/TP 28P TEXASINSTRUMENTS KOREA LTD, HONGKONGBRANCH.
6 D1122 Connector,BtoB ENBY0036001GB042-40S-H10-E3000 40P 0.4MM STRAIGHTSOCKET SMD R/TP 1M ENGINEERING PLASTICUL94V-0 AU OVER NI LS Mtron Ltd.
6 C1178 Capacitor,Ceramic,Chip ECZH0001216
C1005X5R1A224KT000E 220nF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREACOOPERATION
6 C1138 Resistor,Chip ERHY0042406 RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP- YAGEO CORPORATION
6 FL111 Capacitor,Ceramic,Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.
6 CN1161CN1171 Resistor,Chip ERHZ0000244 MCR01MZP5F2202 22KOHM 1% 1/16W 1005
R/TP - ROHM.
6 C800 Inductor,Multilayer,Chip ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH - 300mA 0.17OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.
6 C1821 IC,LDO VoltageRegulator EUSY0407401
RT9032 WDFN8L,8,R/TP,Programmable DualLDO,IC,LDO Voltage RegulatorIC,LDO VoltageRegulator RICHTEK TECHNOLOGY CORP.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �70 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 R1134R1174
Capacitor,Ceramic,Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
6 U891 Inductor,WireWound,Chip EAP61785901
LQW15CN18NJ00D 18NH 5% - 1.4A - - 0.046OHM3GHZ - SHIELD 1.0X0.5X0.5MM NONE R/TPMURATA MANUFACTURING CO.,LTD.
6L122L142L161
Capacitor,Ceramic,Chip ECZH0000822
C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6L127L137L213
Connector,BtoB ENBY005380124-5804-030-000-829+ 30P 0.40MM STRAIGHTFEMALE SMD R/TP 900mM - KYOCERA ELCOKOREA SALES CO.,LTD.
6 FL211 Filter,Multiplexer EAM62070401B40761DY2045L Duplexer Bank for UE2j,Band1/2/4/5/8+DCS1800, 10.4*3.6*1.0 KOREATAIYO YUDEN.CO., LTD.
6 R521R522 Module,WLAN SMZY0027002
RF3482 TI WLAN WL1271 COB 3x3 SP3T + PAM+ DET + Balun + Tx Filter,RF Module RF MICRODEVICES INC
6 L1131 Inductor,Multilayer,Chip ELCH0003830
LQG15HSR18J02D 180NH 5% - 130mA 3.38OHM500MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.
6
FL1141FL1142FL1221FL1222FL1223
Inductor,Multilayer,Chip ELCH0001430
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.
6
C116C117C121C132C151C163
Capacitor,Ceramic,Chip ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005 BK-DUP - MURATAMANUFACTURING CO.,LTD.
6
R1190R1191R896R897
Capacitor,Ceramic,Chip ECZH0000802
C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 PT301 Resistor,Chip ERHY0024601 RC0603J151CS 150OHM 5% 1/20W 0603 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 U181 IC,GPS EUSY0415301BCM4751IUB2G ,42,BCM4750 Shrink version65nm,IC,GPS WLBGA R/TP 42P BROADCOMCORP
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �71 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 U1901 Module,Tx Module SMRH0006901 RF6260 0DBM 0DB 0% 0A 0A 0DB 0DBM 0DBM0P 0.0x0.0x0.0MM - RF MICRO DEVICES INC
6
C1916C308C310C311C936
Inductor,Multilayer,Chip ELCH0003813
LQG15HN47NJ02D 47NH 5% - 200mA 1.15OHM1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO.,LTD.
6 C1131C242 Connector,RF ENWY0005501 20279-001E-01 NONE STRAIGHT SOCKET SMD
R/TP AU 50OHM 400mDB I-PEX CO., LTD
6
VA1102VA1104VA901VA902VA903
Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P1 PROTEK DEVICES INC.
6
C1271C195C222C933C941
Capacitor,Ceramic,Chip ECCH0042009
GRM0335C1E3R0BD01D 3pF,25V,B,C0G,TC,0603,R/TP,0.000000000003,0.1PF,25V,C0G,-55TO+125C,0603,R/TP,0.3 mmMURATA MANUFACTURING CO.,LTD.
6 L113 Inductor,Multilayer,Chip ELCH0009109
0402CS-6N8XJEW 6.8NH 5% - 680mA 0.083OHM4.8GHZ 20 NON SHIELD NONE1.19X0.64X0.66MM R/TP COILCRAFTSINGAPORE PTE LTD.
6L244L247L249
Resistor,Chip ERHY0009593 MCR006YZPJ272 2.7KOHM 5% 1/20W 0603 R/TP- ROHM.
6 C803 Inductor,Multilayer,Chip ELCH0012510
LQW15AN15NG00D 15NH 2% - 460mA 0.16OHM5GHZ 30 NON SHIELD NONE 1.0X0.5X0.5MMR/TP MURATA MANUFACTURING CO.,LTD.
6 CN1803CN1904 IC,MM PMIC EUSY0227205
LP8720TLX 2.7 To 5.5V Adj 1.2W CSP R/TP 20P -NATIONAL SEMICONDUCTOR ASIA PACIFICPTE. LTD.
5
C1179C1212C223C224
PCBAssembly,Main,SMT Top
EBR72793204 LGP925.AATTDB 1.0 Main
6 R1171R316 PCB,Main EAX63973701 LGP920.ASFRZY 1.1 FR-4 Any Layer 10 0.75 MAIN
6 R186 Capacitor,Ceramic,Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �7� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6
FB1173FB1175FB1176FB1177
Capacitor,Ceramic,Chip ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C1005 R/TP - MURATA MANUFACTURINGCO.,LTD.
6 VA800 Capacitor,Ceramic,Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNGELECTRO-MECHANICS CO., LTD.
6 U1131 Capacitor,Ceramic,Chip ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREACOOPERATION
6 Q1173 Resistor,Chip ERHY0009522 MCR006YZPJ332 3.3KOHM 5% 1/20W 0603 R/TP- ROHM.
6 R892 IC,Analog Switch EUSY0186504 FSA2259UMX QFN ,8 ,R/TP ,Dual SPDT ,;,IC,Analog Switch FAIRCHILD SEMICONDUCTOR
6 BAT800 Capacitor,Ceramic,Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNGELECTRO-MECHANICS CO., LTD.
6
FB1174FB901FB913FB914FB941
Filter,EMI/Power EAM62230801NFM18PS105R0J3D_ EMI 0HZ 1uF 0H SMD R/TP6.3V, 2A, 0.03ohm MURATA MANUFACTURINGCO.,LTD.
6
C197C198C199C205
Capacitor,Low ESL EAE62487001LLL153C80J224ME14E 0.22uF 20% 6.3V X6S -55TO+105C 1005 R/TP 0.35T max. MURATAMANUFACTURING CO.,LTD.
6 C153 Capacitor,Ceramic,Chip ECCH0005604
GRM188R60J106M 10000000pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATAMANUFACTURING CO.,LTD.
6 C1920 IC,ApplicationProcessor EUSY0425001
OMAP4430 ,54,547pin,IC,Digital Signal ProcessorsBGA R/TP 547P TEXAS INSTRUMENTS KOREALTD, HONGKONG BRANCH.
6 FL627 Filter,Bead EAM62071101BLM15PD121SN1D 120 ohm 1.0X0.5X0.5 25%0.09 ohm 1.3A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.
6 L1923 Capacitor,Ceramic,Chip ECCH0032801
GRM033R60J224M 0.00000022F 20% 6.3V X5R -55TO+85C 0603 R/TP 0.3MM MURATAMANUFACTURING CO.,LTD.
6 R1136 Diode,TVS EDTY0008602 PSD12-LF 12V 13.3 25.9V 21A 500W SOD323R/TP 2P 1 PROTEK DEVICES INC.
6 C172 Capacitor,Ceramic,Chip ECCH0034801
CL03A474MQ3NNNH 0.47uF,6.3V,M,X5R,HD,0603,R/TP,0.0000047,20%,6.3V,X5R,-55TO+85C,0603,R/TP,.3 mm SAMSUNGELECTRO-MECHANICS CO., LTD.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �73 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 C807C926 Resistor,Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -
ROHM.
6 SW102 Capacitor,Array EAE62463801 GNM0M2R60J105ME18D 1uF2 20% 6.3V 2R SMDR/TP 4P MURATA MANUFACTURING CO.,LTD.
6 L226 Resistor,Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP- ROHM.
6L147L158L168
Capacitor,Ceramic,Chip ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C 0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 U1108 Filter,Bead EAM62150301CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm0.65A SMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 SC799 IC,DC,DCConverter EUSY0416301
TPS62611YFDR CSP,6,R/TP,DCDC Converter forWiFi BT Module Power,IC,DC,DC Converter TEXASINSTRUMENTS KOREA LTD, HONGKONGBRANCH.
6 U901 TR,Bipolar EQBN0005301UMT2222A NPN 6V 75V 40V 600mA 100mA100~300 200mW UMT3 R/TP 3P ROHMSemiconductor KOREA CORPORATION
6L1807L1810L1926
Resistor,Chip ERHY0009502 MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP -ROHM.
6 C228 Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300mW,R/TP,15pF SCG HONG KONG SAR LTD.
6 U1106U1831 Resistor,Chip ERHY0009511 MCR006YZPJ152 1.5KOHM 5% 1/20W 0603 R/TP
- ROHM.
6 C221C976
IC,LDO VoltageRegulator EUSY0407401
RT9032 WDFN8L,8,R/TP,Programmable DualLDO,IC,LDO Voltage RegulatorIC,LDO VoltageRegulator RICHTEK TECHNOLOGY CORP.
6
R1101R1126R1202R1271
Capacitor,Ceramic,Chip ECCH0009206
GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C 0603 R/TP - MURATAMANUFACTURING CO.,LTD.
6 C109C1808 Connector,I/O EAG62832201 78618-0001 19P 0.40MM ANGLE RECEPTACLE
DIP R/TP - HANKOOK MOLEX
6 X184 Resistor,Chip ERHY0009593 MCR006YZPJ272 2.7KOHM 5% 1/20W 0603 R/TP- ROHM.
6 L1803 Resistor,Chip ERHZ0000222 MCR01MZP5F1503 150KOHM 1% 1/16W 1005R/TP - ROHM.
6 R1802R500 Resistor,Chip ERHY0042406 RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP
- YAGEO CORPORATION
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �74 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 C805 Resistor,Chip ERHZ0000298 MCR01MZP5F5600 560OHM 1% 1/16W 1005 R/TP- ROHM.
6 FL1171FL1172 IC,Motor Driver EUSY0238306 ISA1000 2.4~3.6V 150mV~300mV 0W DFN R/TP
8P -
6 R1178 Capacitor,Ceramic,Chip ECZH0001420
C1608X5R1A105KT000E 1uF 10% 10V X5R -55TO+85C 1608 R/TP - TDK KOREACOOPERATION
6 C226 Filter,Bead SFBH0008101BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6ohm 0.3A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.
6 FB1143 Capacitor,Ceramic,Chip ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNGELECTRO-MECHANICS CO., LTD.
6 FL1901 Capacitor,Ceramic,Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
6 C112 Inductor,WireWound,Chip ELCP0014001
CIG21LR47MNE 470NH 20% - 1.3A 1.4 1.30.08OHM - - SHIELD 2X1.25X1MM NONE R/TPSAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C1801 Resistor,Chip ERHY0009553 MCR006YZPF1004 1MOHM 1% 1/20W 0603 R/TP- ROHM Semiconductor KOREA CORPORATION
6 L1121 IC,MCP,NAND EUSY0425901H8BCS0QG0MMR-46M NAND/1G SDRAM/512M0VTO0V 8.0x9.0x1.0 TR 130P NAND+DRAM BGA -HYNIX SEMICONDUCTOR INC.
6 C1803 Resistor,Chip ERHY0035301 RC1005F4021CS 4.02KOHM 1% 1/16W 1005 R/TP- SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L110L215 Crystal EXXY0018701 FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM
12.5PF 32*15 SMD R/TP SEIKO EPSON CORP
6 L179IC,DigitalBasebandProcessor,3G
EUSY0432001PMB9811 1.7VTO2V,1.7VTO2V,1.7VTO2V 100mW300P - BGA P/TP 300P INFINEONTECHNOLOGIES (ASIA PACIFIC) PTE LTD.
6 C188 Resistor,Chip EBC61856201 RC0201FR-07240RL 240OHM 1% 1/20W 0603R/TP - YAGEO CORPORATION
6 Q801 Resistor,Chip ERHY0009504 MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP -ROHM.
6 D1175 Resistor,Chip ERHY0009527 MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP -ROHM.
6 CN1181 Capacitor,Ceramic,Chip EAE62286801
CL03A104KP3NNNC 0.0000001F 10% 10V X5R -55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L1251 Inductor,WireWound,Chip ELCP0013901
XPL2010-681MEC 680NH 20% - 2.1A 2.19 2.10.057OHM - - SHIELD 2.0x1.9x1.0MM NONE R/TPCOILCRAFT INC.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �75 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 U220 Capacitor,Ceramic,Chip ECCH0017501
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNGELECTRO-MECHANICS CO., LTD.
6 FL1801 Filter,Bead EAM62071001BLM18KG221SN1D 220 ohm 1.6X0.8X0.8 25%0.05 ohm 2.2A SMD R/TP 2P 0 MURATAMANUFACTURING CO.,LTD.
6 R1173PCBASSY,MAIN,PADOPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI
6 U241 Resistor,Chip ERHZ0000487 MCR01MZP5J474 470KOHM 5% 1/16W 1005 R/TP- ROHM.
6 U1251 Inductor,Multilayer,Chip ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MMR/TP COILCRAFT SINGAPORE PTE LTD.
6 C1177C184
Inductor,WireWound,Chip ELCP0008007
MIPS2520D3R3M 3.3UH 30% - 400mA 0.4 10.12OHM - - SHIELD 2.5X2X1MM NONE R/TPFDK CORPORATION.
6 CN1221 Resistor,Chip ERHY0009561 MCR006YZPF5602 56KOHM 1% 1/20W 0603 R/TP- ROHM.
6 C171C232
Capacitor,Ceramic,Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATAMANUFACTURING CO.,LTD.
6 R1133 Capacitor,Ceramic,Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C1132 Filter,Bead SFBH0006806CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm0.3A SMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R1135 Filter,EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMDR/TP MURATA MANUFACTURING CO.,LTD.
6 L114 IC,MCP,eMMC EUSY0431102SDIN5C2-8G-974D FBGA,166,ETC,8GB eMMCv4.41 / 12.0x16.0x1.2 / 169ball,;,IC,MCP SANDISKCORPORATION
6 U1101 FET EQFP0003601NTJD4105CT1G P-CHANNEL MOSFET 20V +-12660mA 0.63OHM 270mW SC70 R/TP 6P ONSEMICONDUCTOR
6 C802 Resistor,Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP- ROHM.
6 C211 Resistor,Chip ERHZ0000236 MCR01MZP5F2001 2KOHM 1% 1/16W 1005 R/TP- ROHM.
6 L227 IC,PMIC EAN62093401TWL6030B107CMR 2.5 to 4.8V adj 1.7W BGAR/TP 187P - TEXAS INSTRUMENTS KOREA LTD,HONGKONG BRANCH.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �76 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 CN1141 Resistor,Chip ERHY0009516 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP- ROHM.
6 U121 Connector,I/O ENRY0011501GU077-5P-SD-E1500 5,0.65mm,ETC,0.64MM,RECEPTACLE,DIP,R/TP,Reverse,Offset (1.50mm),SUS plate LS Mtron Ltd.
6 U1902 Capacitor,Ceramic,Chip ECZH0001120
CC1005X7R1H392KT000F 3.9nF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 L1901 Resistor,Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -ROHM.
6 L104L1924 IC,Buffer EUSY0428301
CDC3S04 1.65~1.95 999 999 999W 999W 33~68 4WCSP R/TP 20P Quad Sine-wave Clock BufferTEXAS INSTRUMENTS KOREA LTD, HONGKONGBRANCH.
6 C940 IC,MCP,NAND EUSY0429001
K3PE4E400M-XGC1 4096MBIT1.14VTO1.3V,1.7VTO1.95V 12.0x12.0x0.71 TR216P DRAM FBGA 4Gb LPDDR2 PoP 216ball forOMAP4 Series Chipset (44nm) SAMSUNGELECTRONIC CO.,LTD
6 C123C175 Resistor,Chip ERHY0040202 RC0201FR-074R7L 4.7OHM 1% 1/20W 0603 R/TP
- YAGEO CORPORATION
6 R891R893 IC,Gyro Sensor EUSY0434601 MPU3050 1.8~3.6 Gyro Sensor - QFN R/TP 24P -
INVENSENSE
6 U1811 Oscillator,TCXO EXST00026011XXB38400FAA 38.4 MHz,1.5 PPM,10pF,SMD,2.5*2.0*0.8,38.4,1.5PPM,1.8V,2.5,2.0,0.8,SMD,R/TP DAISHINKU CORPORATION.
6 U171PCBASSY,MAIN,PADSHORT
SAFP0000401 LG-LU3000 LGTBK,MAIN,A,
6 L152 Capacitor,Ceramic,Chip ECCH0000147 MCH155CN222KK 2.2nF 10% 50V X7R -
55TO+125C 1005 R/TP - ROHM.
6 SW101 Capacitor,Ceramic,Chip ECZH0001108
C1005X7R1E682KT000F 6.8nF 10% 25V X7R -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 ZD803 IC,Analog Switch EAN61871401FSUSB63 2.7~4.3V 400NSEC 45NSEC 0W MLPR/TP 12P 1 FAIRCHILD SEMICONDUCTORHONG KONG LTD.
6 C804 IC,AccelerationSensor EUSY0410101
KXTF9 1.8V to 3.6V 400KHZ 12BIT 1SPS 1W LGAR/TP 10P Accelerometer Sensor - LGA R/TP 10P -KIONIX, INC.
6 L1811 Inductor,WireWound,Chip ELCP0012801
MIPS2520D1R5-LG 1.5UH 30% - 1.2A 1.2 1.20.1OHM - - SHIELD 2.5X2X1MM NONE R/TP FDKCORPORATION.
6 R514R515 IC,Charger EUSY0410801
RT9524 DFN,10,R/TP,DFN Cal Test Mode SingleCharger IC for Micro USB,IC,ChargerIC,ChargerRICHTEK TECHNOLOGY CORP.
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �77 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 U1201 Resistor,Chip ERHZ0000538 MCR01MZP5F3303 330KOHM 1% 1/16W 1005R/TP - ROHM.
6 L245L248 IC,MUIC EUSY0371201
MAX14526EEWP+TCC6MAX14526EEWP+TCC6,WLP,MUIC for 5Pin MicroUSB WLP R/TP 20P MAXIM INTEGRATEDPRODUCTS INC.
5 SAD010000 Software,Mobile SAD33286401 Base V10a - CENTRAL AND SOUTH AMERICAOMAP-IFX -
13. EXPLODED VIEW & REPLACEMENT PART LIST
- �78 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Note: This Chapterisused for reference,Part order is orderedby SBOM standard onGCSC
Level LocationNo. Description PartNumber Spec Remark
2 EAD010000 Cable,Assembly EAD61951501 LG0056 HDMI PLUG HDMI PLUG 2.0M 19 BLACKnone N ningbo broad telecommunication co.,ltd
2 MFL000000 Manual MFL67463101 COMPLEX LGP925.ACAPDB ZZ:Without ColorManual for LG-P920H CAP
2 EAB010200 Earphone,Stereo SGEY0007612EMB-LGE013STAC 3mW 16OHM 98DB65HZTO112HZ 1.08M BLACK 3.5 L TYPESTEREO 4POLE PLUG - CRESYN CO.,LTD
2 EAC00 RechargeableBattery,Lithium Ion EAC61679801
FL-53HN_WWU_TOCAD PRISMATIC 3.7V 1.5AH300mAH 45x53x5.3 54.5x47.8x5.7 BLACK FrameType 534553, 1500mAh, Frame, WW, Up TOCADDONG-HWA CO., LTD
2 EBX000000 Accessory,DataCable SGDY0017903 LG0040 ,1.2M,Micro USB,BLACK, ningbo broad
telecommunication co.,ltd
2 EAY060000 Adapters SSAD0033802STA-U13WV 90Vac~264Vac 5.1V 1A 5060 UL/CSANONE NONE - Power Systems Technologies FarEast Ltd
2 EAD010000 Cable,Assembly EAD61951501 LG0056 HDMI PLUG HDMI PLUG 2.0M 19 BLACKnone N ningbo broad telecommunication co.,ltd
2 MFL000000 Manual MFL67463101 COMPLEX LGP925.ACAPDB ZZ:Without ColorManual for LG-P920H CAP
2 EAB010200 Earphone,Stereo SGEY0007612EMB-LGE013STAC 3mW 16OHM 98DB65HZTO112HZ 1.08M BLACK 3.5 L TYPESTEREO 4POLE PLUG - CRESYN CO.,LTD
2 EAC00 RechargeableBattery,Lithium Ion EAC61679801
FL-53HN_WWU_TOCAD PRISMATIC 3.7V 1.5AH300mAH 45x53x5.3 54.5x47.8x5.7 BLACK FrameType 534553, 1500mAh, Frame, WW, Up TOCADDONG-HWA CO., LTD
2 EBX000000 Accessory,DataCable SGDY0017903 LG0040 ,1.2M,Micro USB,BLACK, ningbo broad
telecommunication co.,ltd
2 EAY060000 Adapters SSAD0033802STA-U13WV 90Vac~264Vac 5.1V 1A 5060 UL/CSANONE NONE - Power Systems Technologies FarEast Ltd
13.3 Accessory