lctpc/lpwp-7th phonemeeting

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16/08/2006 Ron Settles MPI-Munich/D ESY 7th W P phonemeeting 16 August 2006 1 LCTPC/LPWP-7th phonemeeting Date 16 August 2006 Time 7:00 west coast 10:00 east coast 16:00 central Europe 23:00 Japan To join, Phone +494089981390 code 52872#

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LCTPC/LPWP-7th phonemeeting. Date 16 August 2006 Time 7:00 west coast 10:00 east coast 16:00 central Europe 23:00 Japan To join, Phone +494089981390 code 52872#. Agenda for 7th WP phonemeeting. AGENDA -1.News Formation of the LCTPC/LP Collaboration - PowerPoint PPT Presentation

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LCTPC/LPWP-7th phonemeeting

– Date 16 August 2006 – Time

• 7:00 west coast• 10:00 east coast• 16:00 central Europe • 23:00 Japan

– To join, Phone +494089981390 code 52872#

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Agenda for 7th WP phonemeeting

AGENDA -1.News

Formation of the LCTPC/LP CollaborationWWS-R&D-panel tracking review at Beijing

-2.WP meetingLCTPC/LP goals (RS)LP electronics (Leif et al)LP endplate (Dan)

-3.Future meetings -4.AOB

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AGENDA -1a.Formation of the LCTPC/LP collaborationOn the next foil are the groups

who have replied with the name of their CB representative up to now: marked by

The non-checked groups have now been contacted directly. I will circulate the list of names as soon as it is complete.

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LCTPC/LP Groups (26 August 06)

AmericasCarleton Montreal VictoriaCornellIndianaLBNLMIT

PurdueYale

EuropeEuropeLAL OrsayLAL Orsay IPN OrsayIPN Orsay

SaclaySaclayAachenAachenBonnBonnDESYDESY

UHamburgUHamburgFreiburgFreiburgKarlsruheKarlsruhe

MPI-MunichMPI-MunichRostockRostockSiegenSiegenNIKHEFNIKHEF

UMM KrakowUMM KrakowBucharestBucharest

NovosibirskNovosibirskPNPI StPetersburgPNPI StPetersburg

LundLundCERNCERN

AsiaAsiaTsinghuaTsinghua

CDC:CDC:HiroshimaHiroshima

KEKKEKKinki UKinki USagaSaga

KogakuinKogakuinTokyo UA&TTokyo UA&T

U TokyoU TokyoU TsukubaU Tsukuba

Minadano SU-IITMinadano SU-IIT

…Other groups interested?

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AGENDA -1b.Tracking review at Beijing:

As announced at the VLSW06, the WWS-R&D Panel is starting regular reviews of the different R&D projects for the LC detector. Chris Damerell has sent the email that they want to start with tracking (Si and TPC) at the Asian LC meeting in Beijing (February 2007) (I will send everybody a copy). First ideas are to submit a report, give presentations at an open session (it is not yet clear by whom) and more (confidential information) at a closed session. The final modus operandi is not yet fixed.

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AGENDA -2a.Next iteration on the goals for LCTPC/LP.

For your info: we have started on thinking about ways to test Gem gating with (a) small prototype(s). If you are interested or have suggestions, let me know…

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AGENDA -2b.Electronics ideas (Leif et al)Reminder: for Eudet

1-2000 altro channels available ------------12/2007

Leif etal have written a note about the pad

layout and connectors. It is available at http://mppmu.mpg.de/~settles/tpc/lp/wpmtg/lpconnectorarr.pdf

The connectors are compatible with 1mm x 4mm pads, and adjustments to other pad sizes can be made.

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AGENDA -2d.Ideas for the endplate (Dan) Reminder: most urgent point for LP is to

design layout of endplate and finalize ~12/2006

See the latest iteration at

http://w4.lns.cornell.edu/~dpp/linear_collider/LargePrototype.html

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AGENDA

-3.Future meetings-At Vancouver, it was decided that a phonemeeting every 2

weeks is the right frequency for now.After Vancouver there are (in addition to phonemeetings):-Paris Endcap meeting organized by Paul/Akira (12-15

September 2006): first announcement already sent to the LCTPC groups.

-Eudet annual meeting MPI-Munich (18-20 October 2006)Website:http://www.eudet.org/AnnualMeeting2006/AnnualMeeting2006.html

-European LC workshop Valencia (6-10 November 2006)-Asian LC workshop Beijing (4-7 February 2007)

Website:http://bilcw07.ihep.ac.cn/

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AGENDA -4.AOB

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Back up slides, for reference

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AGENDA -1a.Formation of the LCTPC/LP collaborationDean, Takeshi and RS have started working on this.

First ideas:– 1)Three coordinators, one chosen by each region. These

spokespersons (SP) would coordinate the work of the following two boards:

– 2)The collaboration board (CB), consisting of the principle investigator (the group leader or other chosen member) from each group. Each CB member would take care of the resources for its group (money and people).

– 3)The technical board (TB), consisting of the existing workpackage (WP) conveners. The TB will ensure the technical integrity of their WP and compatibility with other WPs while maintaining close contact with the rest of the collaboration.

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AGENDA -1b.Formation of the LCTPC/LP collaboration

The SP will ensure that the coordination between the CB and TB is efficient and the work is carried out in a timely fashion. We also discussed that the CB and TB may each appoint an a kind of executive committee to steer the work, since this is a job more efficiently done with a small number of people. Details on the exact structure and how the steering is to be done still have to be worked out (feedback is welcome), but first:

The interim-SP and the TB exist. A preliminary from of the CB is the groupleader’s mailing list which evolved during the last couple of years. For this organizational work, we need a more official list of names, which was the subject of our 12 July email. Somewhat more than half have replied, so we need to get the rest in order to proceed. As soon as the full CB is known, we can start exchanging ideas between the SP, CB and TB.

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Akira Sugiyama – GLD DOD

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RS study - LDC DOD - together with

Joel PouthasPhilippe Rosier

(IPN Orsay)

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Aleph Endplate

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Some features• Zigzag structure prevented loss of tracks > θ~22°• Sectors mounted from inside using a “handling tool” to minimize the dead space between sectors. This straight-forward operation which was performed at least 30 times during the lifetime of Aleph. • Alu sandwich structure stiff, lightweight to

- contain 7mb overpressure- provide forced-air thermal insulation between electronics and TPC volume

• Water cooling of 1kW electronics/side in addition- 22K channels per side

• Combination water/air cooling blocked all heat to TPC• Overall thickness ~ 25%Xo (average) w/o cables• Bending of endplate

- 20 micrometers due to 7mb overpressure- 5 micrometers due to wire tension

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R&D Planning• 1) Demonstration phase

– Continue work with small prototypes on mapping out parameter space, understanding resolution, etc, to prove feasibility of an MPGD TPC. For CMOS/Si-based ideas this will include a basic proof-of-principle.

• 2) Consolidation phase– Build and operate the LP, large prototype, (Ø ≥ 75cm, drift

≥ 100cm), with EUDET infrastructure as pedestal, to test manufacturing techniques for MPGD endplates, fieldcage and electronics. Design is starting---building and testing will take another ~ 3 years.

• 3) Design phase– After phase 2, the decision as to which endplate

technology to use for the LC TPC would be taken and final design started.