large substrate stylus profiler automation & ease of use ... · • have insights into...

Large Substrate Stylus Profiler Automation & Ease of UseDektakXTL Delivers!

Outline

9/24/2014 2Bruker Confidential

• Introduction

• Brief overview of stylus profiler function

• Review DektakXTL functionality

• Applications overview

• Summary

IntroductionBruker Nano Surfaces Division


• Scanning Probe Microscopy

• 3D Optical Microscopy

• Stylus Profilometry

• Tribology and Mechanical Testing

IntroductionBruker Stylus and Optical Metrology


• Technology Leadership• 60+ Patents• 3 R&D 100 Awards• 6 Photonics Circle of

Excellence Awards

• Manufacturing Excellence• Lean, six sigma-based process• >100 systems/quarter

capacity• Rapid production ramp

capability

Bruker NSD SOM is part of Bruker Materials (BMAT), a division of Bruker

IntroductionSpeaker

Matt Novak, Ph.D.Director, Technology and Applications Stylus and Optical [email protected]

• Joined Bruker 2011 (~ 3.5 years)

• Industry experience (~17years) optical engineering, fabrication and metrology

• Earned Ph.D. working in private sector metrology capital equipment (instrument design/assembly/test)


• Those with need for stylus profilometry on 300mm samples will see capabilities of DektakXTL to meet these needs

• Those looking for quality metrology instruments to monitor steps or traces from nm to µm scales with accuracy and repeatability

• Those who are unfamiliar with stylus profilometry will gain an understanding of this powerful technique for measurement

• Those already familiar with stylus profilometry – will be introduced to new and enhanced features of DektakXTL

Who Will Benefit?Intended Webinar Audience


• Be aware of capabilities available from Bruker for stylus metrology - 300 mm+ substrates and wafers

• Understand DektakXTL’s advantages and built in functionality which make it a great benefit to users in QA/QC inspection for large panels/300 mm wafers

• Have insights into applications that can be addressed via automation or other easy analysis tools for DektakXTL

Key Value from WebinarAfter the Presentation You Will…


Outline


• Introduction




• Summary

What is Stylus Profilometry?Tactile 2D metrology

Three main elements• Scan Head• Electronics• PC Interface

• Scan Head• Stylus and LVDT core attached

to tower/bridge• Positioned stably over

mechanical stage (RΘ or XY)

• Electronics• Control force, approach along

z axis

• PC Interface• Acquire primary profile data• Perform analysis

© Copyright Bruker Corporation. All rights reserved

Drawing of main elements of system

What is Stylus Profilometry?Metrology Capabilities for DektakXTL

Stylus Profilometry Offers…

• Excellent measurement repeatability on steps

• Measure thin film steps below 50Å (5nm)

• Thin transparent films or dissimilar optical characteristics

• Long scan measurements up to 300mm to analyze thin film stress on wafers

• Ease of use (fast, simple, step heights)

• Lower cost, long life, durable and upgradeable relative to other inspection systems


1nm Step Height Measurement

Why Dektak?Dektak - Industry Standard


Outline


• Introduction




• Summary

Dektak XTL Technological AdvancesStable Metrology, Easy to Use

13

Designed for QA/QC environments

• Low noise floor achieved with Single-Arch design - increased stability

• Integrated vibration isolation table for most stable metrology

• 300mm encoded XY stage for accessing large sample areas with superior accuracy

• Environmental enclosure - ESD compliant with interlocked door for safe, easy sample loading

• Light tower and alarm allows status observation by operator at a distance

All With Dektak Known Quality Step Height Repeatability Better Than

0.5 nm!


Built-In Vibration Isolation

Ergonomic Design

Wide, Interlocked door for safe and easy sample loading

DXTL-W Configuration

Dektak XTL ConfigurationsWafer or Panel Platforms Suit Various Needs

Dektak XTL-W 200 & 300mm Wafer Solution

• Vacuum chuck• 300mm Encoded XY Stage• Automated Theta• Dual Cameras

Dektak XTL-P Panel Solution

• 350mm panel fixture• 300mm Encoded XY Stage• Dual Cameras

• Configurations optimized to meet different application requirements

14© Copyright Bruker Corporation. All rights reserved

Quick & EasyScan Setup & Review

Double-Click in either live video display to quickly and easily go to sample measurement locations.

Streamlines setup for automation as well as discrete measurements

Side View + Top Down Cameras

Configurable display - user may swap images, move 2nd view to any corner and resize.

• Setup controls organized in a single window with logical workflow

• Measurement setup is even faster with the new Dual Video Control™

Dektak XTL Features for Ease of Use300 mm + samples, easy control and setup!

• Flexible setup• COR saved to recipe for specific parts• COR taught for each sample type

• CMP for different samples – check center for different sizes

Set-up is easy!• Place Wafer on vacuum chuck • Drive to edge or feature• GUI automatically rotates theta a

predetermined number of times to set the COR

• Prompts for operator to drive the stage to align sample between moves make set up straightforward

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Dektak XTL Features for Ease of UseCenter of Rotation Wizard

• Select 2 points• Software automatically

aligns points to the scan stage for easy measurement


Dektak XTL Features for Ease of UseMake Horizontal Wizard

• Point and click to teach 2D SCAN start location and length with a single mouse click and release

• Use “flexible rectangle” to draw box around area to map

• Single mouse click and release to scan and capture primary profile


Dektak XTL Features for Ease of UseTeach Scan Length and Area Wizards

Automation ProgrammingEnhanced Features for QA/QC Data Tracking Over 300mm Wafers

• Wafer Setup, orientation

• Link unique Vision recipes to sites

• Program detailed measurement locations via automation editor

• Prompt Vision to run a user defined executable after automation –correlation, export data


Automation ProgrammingEnhanced Features for QA/QC Data Tracking Over 300mm XY, Multiple Sites

• Teach automation program? Screen shot?

• Unique measurement site names

• Site Naming

• Log site names to database for reference

• Link unique Vision recipes to sites and import positions via stage automation file

• Program Load/Unload theta Positions


Automated Pattern AlignmentReliably ID Metrology Features over 300mm Stage Travel in XY – Supports Fiducial Search in XY or RΘ


Production InterfaceIntuitive, Push Button GUI for Streamlined Use


Outline


• Introduction




• Summary

General Film Thickness + Step HeightWafer etch depths, film steps, others..

• Microelectronics and Semiconductor devices

• Thin film coatings on glass for buildings, automobiles or aircraft

• UV or hardness coatings on eye glasses or sun glasses

• Decorative coatings on faucets and fixtures (gold plating or other precious metals)

• Paint coatings and ink thickness and finishes

• Pressure sensors for automotive or aerospace applications


• Inspection of conductive streets - height, width

• Monitoring deposition process of thin film

• Laser scribing control and monitoring

• Thin film stress measurements

Flexible Solar Cell3D Map of Silver Trace

Mono & Poly Crystalline Cells


General Solar PV-Cell ApplicationsLarger Panels on DektakXTL

Large Sample DektakXTL ApplicationsStep heights and films

• Film and Wafer Applications• Step Height for deposited thin films

(Metal Oxides, Dielectrics)• Step Height for Resists (Soft film

materials)• Etching Rate Determinations• CMP (Chemical Mechanical

Planarization)• Erosion, Dishing and Bow

• ROA

• Large Substrate Applications• Printed circuit boards

• Bumps, step height

• Window coatings• Wafer masks• Wafer chuck coatings• Polishing pads

• Glass Substrate Applications• Step Height measurement for LCD R&D• Touch Panel coating film thickness

measurements• Thin film measurements for solar coatings


Monitoring Thin Film Stress300 mm Scans on DektakXTL

• Stress causes bowing or warping of substrate leading to de-lamination of layers, cracking or lithography problems

• DektakXTL enables up to 300mm scans before and after deposition to compare wafer bow caused by thin film stress

• DektakXTL software computes tensile and compressive stress, using Stoney’s equation, in MPa


ROA Measurement and AnalysisDektakXTL Automation According to SEMI M77

9/24/2014 28

Roll Off Amount (ROA)

Wafer Edge

FrontBevel

Distance from Edge 0.5mm or 1mm

3mm

5mm

Measure according to Semi M77 Standard• Use Step Detection to find wafer edge – Easy, automatic!• Set level points at -5mm and -3mm from wafer edge• Measure appropriate step heights from wafer edge• Set measurement via automation

Example measurement sites to check ROA -

Summary


• Introduction




• Questions?

large substrate stylus profiler automation & ease of use ... · • have insights into...

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