Ladder QA Status

Ladder QA Summary

Ladder 8 7 6 5 4 3 2 1 8 7 6 5 4 3 2 1 Remarks

1 X X X X X X X X O O O O O X O O • left : short (via-GND)• right chip3 : cannot mask

2 O O O O O O O O O O O O O O O D • right chip1 : defect of bump bond

3 O D D D O O O O O O O O X O O O• left chip5-7 : defect of bump bond (~30%)• right chip4 : delamination of chip• leakage current : 200mA at 20V

4 X X X X O O O O O O O O O O X X • left chip5-8 : short (via-GND)• right chip 1-2 : delamination of chip

5 O O O O O O O O O O O O O O O O• to be repaired (connector of left bus)• few % of left chip 1,2,5,7 and Right chip 2,4 : defect bump bond

6 O O O O O O O O O O O O O O O O

7 X X • left chip1-2 : destroyed

8 • wire bonding (going on)

9 • completion of sensor gluing

Left Right

Ladder 1

Noise pixelCannot mask

Cannot take data because ofshort between DATA B22 (via hole) and GND

Ladder 2

Ladder 3

Bonding wirepopped up

6

Wires of only chip4 of right BUS popped up.

Delamination for Ladder3delaminated from stave

chip6 chip5 chip4 chip3

Side view (Ladder3)

Top view (Ladder3)

Sensor module

8 7 6 5 4 3 2 18 7 6 5 4 3 2 1

BUS

popped upStave

Stave

Sensor module

BUS

Ladder 4

Cannot take data because ofshort between via hole and GND

Bonding wirepopped up

8

8 7 6 5 4 3 2 18 7 6 5 4 3 2 1

Wires of chip1 and 2 of right BUS were damaged.

Delamination for Ladder4

Wires of chip8 of left BUS (some analog line and JTAG line) were damaged.

Side view (Ladder3)

Top view (Ladder4)

Sensor moduleBUS

half area doesn’t respond

Stave

Ladder 5 To be repaired (connector of left bus)

Ladder 6

Ladder 7

Top view (Ladder7)

Wire side