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Ladder assembly stepsHFT PIXEL

updated for ultimate chip ladders2/12/2012

ladder fixture u.SLDASM

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ladder assembly with frame

assembly frame

full flex cable beforecutting off ends

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ladder exploded viewcable bundle

drivers

pixel chips

adhesive

wire bonds

capacitors

adhesive

composite backer

kapton flex cable

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order of assemblycable bundle

drivers

pixel chips

adhesive

adhesive

composite backer

kapton flex cable

1

12

6

5

3

4

7

5

details of ladder sandwich, end view

pixel chips

capacitors

carbon composite ladder backing

soft acrylic adhesive

flex kapton cable

soft acrylic adhesive

wire bonds

adhesive extends past bonded element to avoid bulge due to adhesive pucker

Carbon composite recessed to give room for vacuum chuck backing of kapton and silicon while wire bonding

backer to sector beam adhesive

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ladder assembly fixture

3/8 OD tube connection tovacuum

¾ ID tube connection to1 gallon vacuum ballast tank

vacuum release valve forhold down of the vacuum chucks

vacuum distribution manifold

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fixture parts (SLA and aluminum) for bonding silicon chips

v chuck chip u.SLDPRT

chip adhesive stop u.SLDPRT

chip stop u.SLDPRT

end drop chip.SLDPRT

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fixture parts for bonding composite backer

v chuck backer u.SLDPRT

backer adhesive stop u.SLDPRT

backer stop u.SLDPRT

end drop backer.SLDPRT

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install chip vacuum chuck

• install chip vacuum chuck against stops (arrow toward arrow)

• open valve to vacuum lock down line.

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attach chip adhesive to kapton cable• install chip adhesive stop u.SLDPRT and

lock down if necessary with vacuum • position paper backed adhesive and pull

down with 10 vacuum lines• strip top backing paper• position ladder and lock down with vacuum• position end drop chip.SLDPRT and lock

with vacuum• work kapton down on adhesive• release adhesive hold down vacuum• release ladder and “end pull down” vacuum• remove ladder and maybe seat adhesive

with vacuum bag

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install backer vacuum chuck• release and remove chip

vacuum chuck– note: since this is an O ring

seal it may be necessary to use vacuum release valve (see page 6)

• install backer vacuum chuck against stops (arrow toward arrow)

• open valve to vacuum lock down

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backer adhesive to kapton cable• install backer adhesive stop u.SLDPRT

and lock down if necessary with vacuum • position paper backed adhesive and pull

down with vacuum (chp 1)• strip top backing paper• position ladder and lock down with vacuum• position “end pull down” and lock with

vacuum• work kapton down on adhesive• release adhesive hold down vacuum• release ladder and “end pull down” vacuum• remove ladder and maybe seat adhesive

with vacuum bag

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attach backer to kapton cable

• position and lock down backer stop u.SLDPRT

• lock down backer on vacuum chuck, may require backing tape on composite if porous

• strip adhesive backing paper• position ladder on reference pins

and pull down with vacuum• position “end pull down” and lock

with vacuum• work kapton down on backer,

must push down on chips• release backer hold down vacuum• release ladder and “end pull down”

vacuum• remove ladder and seat chips and

backer with vacuum bag

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attach chips to kapton cable• switch to v chuck chip u.SLDPRT• position and lock down chip stop• butt chips one at time against

chip stop u.SLDPRT and neighbor chip and lock down with vacuum.

• strip adhesive backing paper• position ladder on reference pins and pull

down with vacuum• position “chip end pull down” and lock with

vacuum• work kapton down on chips• release chip hold down vacuum• release ladder and “end pull down” vacuum• remove ladder and seat chips and backer

with vacuum bag

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comments• Both SLA vacuum chucks have been modified to fit ultimate ladders• Reference holes on the flex PC carrier extensions have been moved

to be compatible with the ladder to sector bonding tools. That change is accommodated here with adjustments in the SLA vacuum chucks.

• New stops are of aluminum, replacing SLA pieces.• If the SLA vacuum chuck is flat enough then stops for the backer

could also be used for the chip and chip adhesive bonding steps.• The chip vacuum chuck has holes reduced from 1.5 mm to .75 mm• These instructions do not include Mario’s notes. It would be

desirable to include his notes, but they are probably not currently in electronic form