Klaus Gottschalk

kgottschalk@lenovo.com

2

1 IS THE 1ST PC COMPANY TO BRING MANUFACTURING BACK TO

THE U.S. IN MORE THAN A DECADE

2 100% OF LENOVO STOCK IS PUBLICLY TRADED WHICH BREAKS

DOWN TO 60% PUBLIC, 32% LEGEND HOLDING & 8% BY CEO

3 LENOVO HAS PASSED THE U.S. CFIUS PROCESS 6 TIMES WITH

STRINGENT REVIEW OF SUPPLY CHAIN & PROTECTION OF CLIENT DATA

4 LENOVO MOBILE DEVICES ARE USED BY 4 MILITARY BRANCHES;

UNITS ARE IN ACTIVE COMBAT, THEATRE & ALL LEVELS OF MILITARY

5 SUPPORTS CRITICAL INFRASTRUCTURE CUSTOMERS: WHICH

INCLUDES POWER, ENERGY, BANKING, HEALTHCARE, LARGE

RETAIL, EDUCATION & HIGHER EDUCATION

A $39B GLOBAL TECHNOLOGY COMPANY WITH 54,000+ PEOPLE AND CUSTOMERS IN 160+ COUNTRIES. FORTUNE 500 #286.

Diverse Senior Team

Publicly Trade on HKSE

Dual Head Quarters

Driven by Innovation

Integration Expertise

3 3

- -

Acquiring a Complete x86 Server Business Acquiring Complete x86 Server Business

ALL IBM x86 LINES System x

Flex System

BladeCenter

NeXtScale

System Networking

STRATEGIC OEM

RELATIONSHIP Storwize and Tape Storage

Cloud and cluster SW

SKILLED RESOURCES Sales force

Product Development

Continuity of Service &

Support

41 FACILITIES 34 R&D Labs & Offices

7 Manufacturing Plants

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Research Triangle Park, NC

Taipei, TW

LOCATION DRIVEN BY SKILLS

Lenovo Labs and Skills Around the World

5

o Nvidia – Graphics Processing

Mellanox – High Speed Fabrics

IBM – Files System and Work Load

Intel – Processing/Acceleration Innovation

The Power of Partnership Propelling HPC

2014 LENOVO INTERNAL. All rights reserved.

LRZ – Energy Efficient Systems and Software

STFC Hartree – HPC Software and Optimization

BSC – Extreme Application Scaling

CINECA – Big Data and Many Cores

RZG – Advancing Material Science

FZJ – HPC Storage

HPC Innovation Center Europe

Industry Leaders Visionary Client Partners

Bring together the newest

technology and skills Focused knowledge and deep skills

advance the science of HPC

15 total partners and growing

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HPC Innovation Center Event – Key Theme & Messages

2014 LENOVO INTERNAL. All rights reserved.

Collaboration: Partnership is Key to Success

Industry leaders bring together the newest technology and skills

Visionary client partners bring focused knowledge & deep skills in specific areas of science

Open: Shared IP Model is the Way to go

Clearly defined licensing process

Straight forward understanding of IP rights & ownership

Innovation: Innovation Continuum and Investment

Focused HPC team bringing best of breed x86 technology and excellent talent with passion to innovate

Continued investments in similar HPC Innovation Centers across the World

Innovation through Collaboration – Clear Goals, Clear Focus.

Lenovo Enterprise Systems Hardware, Software and Applications Expertise

Agreed to Goals

Powerful Outcomes

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Lenovo Full Member of ETP4HPC

2015 LENOVO INTERNAL. All rights reserved.

Lenovo application was accepted on Feb 18 board of the ETP4HPC org

The European Technology Platform for High Performance Computing (ETP4HPC) is an industry-led

forum. It provides framework for stakeholders to define European HPC technology research priorities

and action plans in order to achieve EU growth, competitiveness and sustainability through major

research and technological advances in the medium to long term.

Membership in ETP4HPC will enable Lenovo to : Participate in the definition of the European HPC R&D strategy

Share our ideas about the evolution of HPC technology

Pool our actions with those of the other members

Anticipate evolutions related to our HPC activity

Increase the visibility and the voice of Lenovo in the HPC

Next steps: • Few additional administrative data be provided to formally finalize the membership

• Forthcoming General Assembly of the ETP on March 5th in Barcelona during which all new members will have an

opportunity to present their organization (1 slide /3 minutes sharp) to entire ETP4HPC at this meeting.

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1P & 2P Rack & Tower systems

High-end rack systems

Broad rack and tower portfolio to meet a wide range of client needs from infrastructure to

technical computing

4/8 socket enterprise-class x86 performance, resiliency, security

Integration across Lenovo assets in systems and industry leading SW for maximum client

optimization and value

Optimize space-constrained data centers with extreme performance and energy efficiency

Converged/Blade systems

Dense systems

SOLUTIONS

Analytics Cloud HPC

Lenovo Enterprise System Portfolio

NETWORKING

System x®

STOR

AG

E

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Cloud (Private, Public, Hybrid; MSP/CSP,

Mobility) System x Solution for IBM Cloud Manager with OpenStack

Flex System Solution for Microsoft Hyper-V

PureFlex Solution for SmartCloud Orchestrator

PureFlex Solution for VMware vCloud Suite

System x Solution for VMware vCloud Suite on X6

System x Solution for Microsoft Hyper-V on X6

PureFlex & Flex System Solutions for MSPs

PureFlex Solution for Parallels - MSP

PureFlex Solution for Cloud Backup and Recovery

Virtualization & Infrastructure (VDI, BU/DR, Security,

SDDC, Networking) System x Solution for Desktop Virtualization with Atlantis ILIO

SmartCloud Desktop Infrastructure for VMWare View

SmartCloud Desktop Infrastructure for Citrix XenDesktop

SmartCloud Desktop Infrastructure for MS Win Server 2012

System x Solution for VMware Virtual SAN Ready Nodes

Storage Infrastructure with Splunk Enterprise

System x Reliability Solution for Stratus everRun Enterprise

Actifio Copy Solution (Arrow)

Business Applications (ERP, CRM, Mobile/Social, SAP,

MS) System x Solution for Microsoft Exchange Flex System Solution for Microsoft Exchange Server 2013

EPIC Healthcare Solution System x Solution for SAP Business One, powered by SAP HANA System x Solution for SAP Business Suite on X6 Polycom RealPresence Cloud on Flex

High Performance Computing (HPC) System x GPFS Storage Server

Application Ready Solutions for CAE (Abaqus, ANSYS, MSC Nastran),

Financial Services (Algorithmics), Life Sciences (BIOVIA/Accelrys, CLC bio),

Oil & Gas (Schlumberger)

Big Data and Analytics Systems solutions for SAP HANA

System solutions for SAP HANA - SAP Business One Analytics

System solutions for SAP NetWeaver Business WH Accelerator

Systems solution for DB2 with BLU Acceleration on X6

System x Reference Architecture for InfoSphere Streams

System x Reference Architecture for Hadoop: InfoSphere BigInsights

System x Reference Architecture for Hadoop: Cloudera

System x Reference Architecture for Hadoop: MapR

x86 Reference Architecture for SAS Visual Analytics

Lenovo Enterprise Business Group Solutions portfolio

Database (SAP, Microsoft, Oracle) • Systems solutions for SAP HANA

• Systems solution for DB2 with BLU Acceleration on X6

• Flex System Solution for Oracle RAC

• Storage Infrastructure with Splunk Enterprise

• System x Solution for DWFT for SQL Server 2014 on X6

• System x Solution for DWFT for SQL Server 2014 on M5

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Co

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ute

Ch

assis

Sto

rag

e

Acce

lera

tors

Sta

nd

ard

19” R

ack

Why NeXtScale is a good fit for HPC?

All the essentials, without all the extras

Clean, simple, and lightweight design

Shared Power and Cooling

Two 1Gb Intel NICs

Standard PCI card support

Flexible LOM/Mezzanine for IO expansion

Dedicated or shared 1Gb for management

Simple ‘pull out’ asset tag for naming or RFID

Power, LightPath, and KVM crash cart access

Blade-like size – rack server like individuality/control

NeXtScale delivers performance-centric IT

Up to 84 servers with top-bin performance per rack

High efficiency shared power and cooling to fit more into the data center

Front-access systems and cabling to reduce service errors

Simple, Flexible, and High Performance Infrastructure for HPC

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Syste

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NeXtScale nx360 M5 Server

Sim

ple

arc

hite

ctu

re

½ Wide 1U, 2 socket server

Intel E5-2600 v3 processors

(up to 18C)

16x DIMM slots (DDR4,

2133MHz))

2 Front Hot-Swap HDD option

(or std PCI slot)

4 internal HDD capacity

New, embedded RAID PCI slot

ML2 mezzanine for x16 FDR

and Ethernet

Native expansion (NeX)

support – storage and

GPU/Phi Supported in the same chassis as M4 version

Power, LEDs

Dual-port ML2 x16 mezzanine card (IB/Ethernet)

KVM connector

1 GbE ports

IMM management port

Optional Hot Swap HDD or PCIe adapter

x24 PCIe 3.0 slot

Haswell CPU

16x DIMMs

Drive bay(s)

x16 PCIe 3.0 slot

RAID Slot

nx360 M5 Server

NeXtScale NX360 M5 Compute Node

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Syste

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n1200 Enclosure

Optim

ized s

hare

d infr

astr

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IBM NeXtScale n1200 Enclosure

Fan and Power Controller

Bay 11

Bay 1 Bay 2

Bay 4

Bay 6

Bay 8

Bay 10

Bay 3

Bay 5

Bay 7

Bay 9

Bay 12

3x power supplies

3x power supplies 5x 80mm

fans

5x 80mm fans

Front View

Rear View

6U Chassis, 12 bays

½ wide component support

Up to 6x 900W or 1300W

power supplies N+N or N+1

configurations

Up to 10 hot swap fans

Fan and Power Controller

Mix and match compute,

storage, or GPU nodes

No built in networking

No chassis management

required

Mix and match M4 and M5

air cool nodes¹

Same Chassis for both M4 and M5 nodes

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Choice of air or water cool

NeXtScale System

Innovative direct water cooling

No internal fans

Extremely energy efficient

Extremely quiet

Lower power

Dense, small footprint

Lower operational cost and TCO

Ideal for geographies with high electricity

costs or space constraints

Air cooled, internal fans

Fits in any datacenter

Maximum flexibility

Broadest choice of configurable

options supported

Supports Native Expansion nodes Storage NeX

PCI NeX (GPU, Phi)

Air Cool Water Cool Technology

Your

Choice

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Sim

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arc

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Water Cool Compute Node

2 compute nodes per full

wide 1U tray

Water circulated through

cooling tubes for component

level cooling

Dual socket Intel E5-2600 v3

processors (up to 18C)

16x DIMM slots (DDR4,

2133MHz))

Infiniband FDR support via

choice of ConnectX-3 ML2

adapter or Connect IB PCIe

adapter

Onboard GbE NICs

nx360 M5 WCT Compute Tray (2 nodes)

Power, LEDs Dual-port ML2

(IB/Ethernet)

Labeling tag

1 GbE ports

PCI slot for Infiniband

PCI slot for Connect IB

x16 ML2 slot

CPU with liquid cooled heatsink

16x DIMM slots

Cooling tubes

Water Inlet

x16 ML2 slot

PCI slot for Connect IB

PCI slot for Connect IB

Water Outlet

1 GbE ports

NeXtScale nx360 M5 WCT Dual Node Compute Tray

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IBM NeXtScale n1200 WCT Enclosure

Fan and Power Controller

Front View shown with 12 compute nodes installed (6 trays)

Rear View

3x power supplies

3x power supplies

Rear fillers/EMC shields

Rear fillers/EMC shields

Syste

m i

nfr

astr

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re

Sim

ple

arc

hit

ectu

re

Water Cool Chassis

6U Chassis, 6 bays

Each bay houses a full wide,

2-node tray (12 nodes per 6U

chassis)

Up to 6x 900W or 1300W

power supplies N+N or N+1

configurations

No fans except PSUs

Fan and Power Controller

Drip sensor and error LEDs

for detecting water leaks

No built in networking

No chassis management

required

NeXtScale n1200 WCT Enclosure – Water Cool Chassis

Manifold

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The Worlds Fastest Announcement

The Benefits of Water Cool Technology

nx360 M5 WCT Compute Tray

Lenovo and Intel cooperated to develop an HPC unique

processor focused on high-core count and high frequency

Can only run in specially designed platforms

Available today from Lenovo

2.8 GHz 16 core Intel E5-2698a v3 CPUs

Highest Linpack performance per node of any Xeon at

1.083 Tflops

Highest Gflops/Watt of any Xeon at 2.45 GFlops/Watt

NeXtScale with WCT reduces the processor operating

temperature allowing a 6% reduction in processor power

draw

Inlet water temperature can range from 18 to 45°C -

meaning no need for chillers in the data center

2x E5-2698a v3 2x E5-2697 v3 2x E5-2690 v3

HPL (GF) 1083 907 813

Power (W) 441 402 385

Perf/Watt (MF/W) 2457 2256 2111

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HPC Storage Portfolio

EXP3524

8

9

16

17

System x3650 M40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

System x3650 M40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

EXP3524

8

9

16

17

GSS 24/26

GSS 21/22 Direct Attach

Network Attach

IBM Storwize

V3700/V7000 Unified

Mix of IBM OEM and Lenovo offerings …. more to come

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Key Features Benefits

De-Clustered RAID • Data and parity stripes are uniformly partitioned and distributed across disk array this eliminates risks of data loss in the event of disk failures

• Rebuild happens in seconds versus hours/days

Superior Data Protection • Frequent data checksum carried and checked

• Multi-level data protection to prevent bad writes

• Selectively rebuild portions of disk

Industry Standard Components • Affordable JBODs without the controller

• Off the shelf Disks

• Industry leading parallel file system (GPFS) that manages data

Single Part Number Support • One number to call for support for the entire solution

HPC Dense Storage Solution – GPFS Storage Server (GSS)

GSS delivers excellent sustained performance and industry leading throughput using efficient De-

Clustered RAID techniques. It is affordable solution that allows clients to start small and scale affordably

via incremental additions

System x3650 M40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

System x3650 M40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

EXP3524

8

9

16

17

Model 21s

24 SSD

EXP3524

8

9

16

17

System x3650 M40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

System x3650 M40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

EXP3524

8

9

16

17

Model 22s

48 SAS or SSD Drives

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x86 Leadership

Our Goal is Simple…

#1