k-832 ultra-soft silicone based thermal pad · 2018. 6. 27. · astm d5470 w/m.k ⏈0.4 5...
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K-832 Ultra-Soft Silicone Based Thermal Pad
K-Thermal Technology Ltd, 1 The Dairy, Wolvey Lodge Business Centre, Cloudesley Bush Ln, Hinckley LE10 3HB Company Number: 10657270 Email: [email protected]
Ultra-Soft Thermal Conductive Pad
K-832 is a premium ultra-soft, silicone based thermal pad, suitable for delivering high thermal conductivity. This thermal pad is a very soft and flexible material still providing excellent high temperature resistance and electrical insulation.
Typical Applications
Consumer Electronics, Portable communication devices, Wi-Fi devices, Military Electronics
Use:
Ensure the area of application are clean and dry, Position pad and gently apply pressure, please take care during application to avoid damage to the material
Properties
REACH Compliant ROHS Compliant
Dimensions and packaging
If required we can provide this is customised dimensions ranging from 0.5-4.0mm thickness
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Property Test Method Unit Tolerance Typical Value
Binder - - - Silicone Gel
Colour Visual - - Pink
Thermal Conductivity
ASTM D5470 W/m.K ⏈0.4 5
Flammability Rating
UL-94 - - V-0
Hardness ASTM D2240 Shore 00 ⏈5 40
Operating Temperature
- ℃ -45-200
Volume Resistivity
ESD STM11.12 Ohms.cm - >10
K-832 Ultra-Soft Silicone Based Thermal Pad
NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied
conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or
responsibility on our part and users should make their own test to determine the suitability of our products in any specific
situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise,
except that this product shall be of standard quality, and except to the extent otherwise stated T-Global Technology Europe and
North America’s invoice, quotation, or order acknowledgment. We disclaim any and liability incurred in connection with the use
of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein
shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing
future patents covering any product or material or its use.