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JIANMIN QU, Walter P. Murphy Professor

March 2015

Department of Civil and Environmental Engineering Department of Mechanical Engineering

Northwestern University, Evanston, IL 60208 Phone: 847-467-4528, E-Mail: j-qu@northwestern.edu

EARNED DEGREES

Degree Year University Field

Ph.D. 1987 Northwestern University Theoretical and Applied Mechanics M.S. 1984 Northwestern University Theoretical and Applied Mechanics B.S. 1982 Jilin University Mathematics

EXPERIENCE

Dr. Qu has a diverse range of expertise in areas such as micromechanics of composites, interfacial fracture and adhesion, fatigue and creep damage in metallic and polymer materials, thermomechanical reliability of microelectronic packaging, and ultrasonic nondestructive evaluation of advanced engineering materials. He has authored or co-authored two books, 11 book chapters and over 180 referred journal papers in these areas with an h-index of 41 (http://scholar.google.com/citations?user=CaJ6KPIAAAAJ). His research has been sponsored by the US National Science Foundation, the Office of Naval Research, the US Air Force, US Army, DARPA, Department of Energy, and many industries including Motorola, Ford Motor Co., IBM, AT&T, General Electric, Intel, AMD, Northrop Grumman, etc. Dr. Qu is a Fellow of ASME. He is currently on the Editorial Board of the International Journal of Computational Methods, and serving as an Associate Editor for the Journal of Nondestructive Evaluation. He is an adjunct professor at Harbin Institute of Technology and Beijing Institute of Technology, China. He had also been appointed Changjiang Chair Professor at Peking University, Beijing, China, and a Senior Visiting Professor at the Technical University of Delft, The Netherlands, and the University of Metz, France.

EMPLOYMENT HISTORY

Title Organization Years

Chair Dept. of Civil and Environmental Engineering, NU 2009-present Walter P. Murphy Professor Dept. of Civil and Environmental Engineering, NU 2009-present Associate Chair School of Mechanical Engineering, Georgia Tech 2007-2009 Interim Chair School of Mechanical Engineering, Georgia Tech 2007-2007 Professor School of Mechanical Engineering, Georgia Tech 2000-2009 Associate Professor School of Mechanical Engineering, Georgia Tech 1994-2000 Assistant Professor School of Mechanical Engineering, Georgia Tech 1989-1994 Postdoctoral Fellow Dept. of Mechanical Engineering, University of Pennsylvania 1987-1989

PUBLICATIONS

Books: 2 Book Chapters: 11 Referred Journal Papers: ~180+ (Google h-index is 41) Conference Proceedings Papers: ~ 150+ (See http://scholar.google.com/citations?user=CaJ6KPIAAAAJ for list of publications and citations)

TEACHING

A. Individual Student Guidance

Postdoctoral Fellows Supervised = 14 Ph.D. Students Supervised = 30

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M.S. Thesis Students Supervised = 27

B. Other Teaching Activities

New Course Developed at George Tech

ME 7224, Micromechanics of Composite. (with D.L. McDowell). ME 4803, Thermomechanical Reliability of Microelectronics Packages (with S. Danyluk and D.L.

McDowell) ME 6202, Energy and Variational Method in Elasticity and Plasticity ME 6452, Wave Propagation in Solids ME 6204, Micromechanics of Materials ME 6133, Elastic Yielding Design of Machine Members

Workshops

1. Taught a short course on "Mechanics of Interfaces in Microelectronic Packaging" at EuroSimu 2013, Wroclaw, Poland, April 15 – 17, 2013.

2. Taught a short course on "Mechanics of Interfaces in Microelectronic Packaging" at ITHERM08, Orlando, FL, May 28, 2008.

3. Taught a short course on "Thermomechanical Reliability of Electronic Packages" at InterPack 2005, San Francisco, July 17, 2005.

4. Taught a short course on "Thermomechanical Reliability of Electronic Packages" at the 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, June 1, 2004.

5. Taught a short course on "Thermomechanical Reliability of Microelectronic Packaging" at the 21st Semiconductor Thermal Measurement, Modeling, and Management Symposium, San Jose, March 8, 2004.

6. Taught a short course on "Thermomechanical Reliability of Electronic Packages," at the Wescon-2003 Exhibit and Conference, San Francisco, August, 13, 2003.

7. Taught a Georgia Tech Continuing Education Short Course on "Thermomechanical Reliability of Electronic Packages", Georgia Tech, Sept. 22, 2003.

8. Conducted a Workshop on "Thermomechanical Reliability of Electronic Packages," Intel, Costa Rica, August, 18 – 19, 2002.

9. Taught a short course on "Thermomechanical Reliability of Electronic Packages," at the Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, (EuroSimu 2002), Paris, France, April 15, 2002.

10. Conducted a Workshop on "Thermomechanical Reliability of Electronic Packages," Chalmers University, Gothenburg, Sweden, Sept. 20, 2001.

11. Taught a Georgia Tech Continuing Education Short Course on "Thermomechanical Reliability of Electronic Packages", Georgia Tech, June 11, 2001.

12. Taught a Georgia Tech Continuing Education Short Course on "Thermomechanical Reliability of Electronic Packages", Georgia Tech, May 18, 2001.

13. Taught a short course on "Interfacial Adhesion in Microelectronic Packaging" the IMAPS Advanced Technology Workshop, Braselton, GA, March 15 – 18, 2001.

14. Conducted a Workshop on "Thermomechanical Reliability of Electronic Packages," Chalmers University, Gothenburg, Sweden, Sept. 15, 2000.

15. Taught a Georgia Tech Continuing Education Short Course on "Thermomechanical Reliability of Electronic Packages", Georgia Tech, June 6, 2000.

16. Taught an IMAPS Short Course on "Thermomechanical Reliability of Electronic Packages" Gothenburg, Sweden, October 24-28, 1999.

17. Conducted a Workshop on Thermomechanical Reliability of Electronic Packages, IBM, Bromont, Canada, October 4, 1999

18. Taught a Georgia Tech Continuing Education Short Course on "Thermomechanical Reliability of Electronic Packages", Georgia Tech, June 25, 1999

19. Taught a Georgia Tech Continuing Education Short Course on "Thermomechanical Reliability of Electronic Packages", Georgia Tech, February 10-14, 1997.

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SERVICE

A. Professional Contributions

National Responsibilities

1. Associate Editor, Journal of Nondestructive Evaluation, 2011 – now. 2. Member, Editorial Board, International Journal of Computational Methods, 2013 – now. 3. Member and Treasurer, Board of Directors, Society of Engineering Sciences, 2013 – 2014. 4. Chair, Executive Committee, Electronic and Photonic Packaging Division, ASME, 2011- 2012. 5. Associate Editor, ASME Journal of Electronic Packaging, 2003 – 2013. 6. Associate Editor, ASME Journal of Pressure Vessel Technology, 2011 – 2013. 7. Member, Editorial Board, Journal of Surfaces and Interfaces of Materials, 2012 – 2013. 8. Vice Chair, Executive Committee, Electronic and Photonic Packaging Division, ASME, 2010 - 2011. 9. Treasure, Executive Committee, Electronic and Photonic Packaging Division, ASME, 2009 - 2010. 10. Member, Executive Committee, Electronic and Photonic Packaging Division, ASME, 2007 - 2009. 11. Member, Executive Committee, Nondestructive Evaluation Division, ASME, 2005 – 2010. 12. Chair, Sigma Xi Monie Ferst Award Committee 2007 - 2008. 13. IMECE Program Chair for the ASME Electronic and Photonic Packaging Division, 2006. 14. Guest Editor, Engineering Fracture Mechanics, Vol. 72, 2005. 15. Guest Editor, International Journal of Solids and Structures, Vol. 39, 2002. 16. Chair, Dynamic Response of Materials Committee, ASME, 2000-2001. 17. Vice Chair, Dynamic Response of Materials Committee, ASME, 1998-2000. 18. Newsletter Editor, Electric and Electronic Division, ASME, 2000-2002.

Memberships

ASME, Sigma Xi, IEEE, ASCE, SES, RILEM.

Symposiums/Workshops/Conference Sessions Organized

1. Co-Chair, Symposium on Micromechanics of Electronic Systems, 17th U. S. National Congress on Theoretical and Applied Mechanics, Michigan State University, East Lansing, Michigan, June 15-20, 2014.

2. General Chair, 48th Annual Technical Conference of Society of Engineering Sciences, Evanston, IL, Oct. 12 – 14, 2011.

3. Program Vice Chair, IEEE CPMT Int. Symposium on Advanced Packaging Materials, San Jose, CA, Oct. 3 – 5, 2007.

4. Track Chair, ASME InterPack 07, Vancouver, B.C., Canada, July 8 – 12, 2007. 5. General Chair, 11th Int. Symposium on Advanced Packaging Materials, Atlanta, CA, March 15 – 17, 2006. 6. Vice General Chair, 10th Int. Symposium on Advanced Packaging Materials, Irvine, CA, March 16 – 18,

2005. 7. Symposium on Advanced Nondestructive Evaluation Techniques for Damage Characterization and

Remaining Life Estimate, ASME, Nov. 13 – 19, 2004. 8. Technical Chair, 8rd Int. Symposium on Advanced Packaging Materials, Stone Mountain, GA, March 3 – 6,

2002. 9. Technical Chair, 7th Int. Symposium on Advanced Packaging Materials, Braselton, GA, March 5 – 8, 2001. 10. William Prager Medalist Symposium, San Diego, June 27-29, 2001. 11. Symposium on Failure Mechanisms and Application of Micromechanics, Orlando, Florida, Nov.5-10, 2000. 12. Symposium on Nondestructive Evaluation and Characterization of Engineering Materials for Reliability and

Durability Predictions, Orlando, Florida, Nov.5-10, 2000. 13. Session on Thermomechanical Reliability at the 4rd Int. Symposium on Advanced Packaging Materials,

Braselton, GA, March 15 – 18, 1998. 14. Session on Mechanics of Material at the 3rd Int. Symposium on Advanced Packaging Materials, Braselton,

GA, March 9 – 12, 1997. 15. Symposium on Quantitative Nondestructive Evaluation in Integrated Diagnostics, Dallas, Texas, Nov. 16 –

18, 1997. 16. U.S.-China Young Investigators Workshop on Advanced Materials, Beijing, China, Aug. 7 - 9, 1996.

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C. Other Contributions

Consulting

Tessera, CSP modeling and testing, 2000 - 2008 SanDisk, Flash memory packaging design and assembly, 2005. Motorola, Packaging encapsulation, 2004 - 2005 Amkor, Fracture analysis of molding compounds, 2002 - 2005 Broadcom, BGA analysis, 2001 Microsoft, Material characterization, 2000 MicroCoating Technologies, Adhesion measurement, 1997 Great American Technologies, Materials testing, 1995 IBM, Fracture mechanics in electronic packaging, 1993

VI. PROFESSIONAL HONORS AND AWARDS

Sigma Xi Best Ph.D. Thesis Award (Co-Advisor for Katie Matlack), 2015 Visiting Professor, Technological University of Delft (TUD), The Netherlands, 2008 – 2009 Outstanding Sustained Technical Contribution Award, Institute of Electrical and Electronics Engineers

(IEEE), Components, Packaging, & Manufacturing Technology Society (CPMT), 2008 Senior Member, Institute of Electrical and Electronics Engineers, 2007 Sigma Xi Best Paper Award, 2007 Sigma Xi Best M.S. Thesis Award (Co-Advisor for Christian Bermes), 2007 ASME Electronic and Photonic Packaging Division Outstanding Contribution Award (Engineering

Mechanics), 2006 Changjiang Professorship, Beijing University, 2005 - 2008 Associated Editor of the Year, ASME J. Electronic Packaging, 2003 Sigma Xi Best M.S. Thesis Award (Co-Advisor for Jens Becker), 2003 Visiting Professor, University of Metz, 2001 - 2002 Outstanding Young Researcher Award, Natural Science Foundation of China, 2002 Fellow, American Society of Mechanical Engineers, 2001 Water Arbitration Prize, Institute of Mechanical Engineers, UK, 2001 Sigma Xi Best M.S. Thesis Award (Co-Advisor for Thomas Meurer), 2001 Sigma Xi Best Ph.D. Thesis Award (Co-Advisor for Christine Valle), 2000 Woodruff Faculty Fellow, Georgia Tech, 1997 Ralph R. Teetor Education Award, SAE, 1996 Sigma Xi Young Faculty Award, 1994 Dow Outstanding Young Faculty Award, ASEE, 1993 Amoco Junior Faculty Teaching Excellence Award, Amoco Foundation, 1992 Lilly Teaching Fellow, Lilly Endowment, 1992 Research Initiation Award, Engineering Foundation, 1991 Research Initiation Award, National Science Foundation, 1991

PUBLICATION LIST

Jianmin Qu, Ph.D.

Walter P. Murphy Professor

Chair, Department of Civil and Environmental Engineering Professor, Department of Mechanical Engineering

Northwestern University Room A236

2145 Sheridan Road Evanston, IL 60208-3109

Phone: 847-467-4528, FAX: 847-491-4011

E-Mail: j-qu@Northwestern.edu

Web: http://www.civil.northwestern.edu/people/profiles/qu.html

http://scholar.google.com/citations?user=CaJ6KPIAAAAJ

Publication List, J. Qu

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A. Published Books and Parts of Books

1. Qu, J, 2015, “Adhesion and Failure of Polymer-Metal Interfaces in Microelectronic Packaging,” in Handbook of Damage Mechanics - Nano to Macro Scale for Materials and Structures, ed.,G.Z. Voyiadjis, Springer, pp. 1 – 30.

2. Kim, J.Y., Jacobs, L.J., and Qu, J., 2012, “Material Characterization by Nonlinear Ultrasonic Technique,” in Ultrasonic and Electromagnetic NDE for Structure and Material Characterization: Engineering and Biomedical Applications, ed. T. Kundu, CRC Press, Chapter 8, pp. 493 - 514.

3. Liu, Y., Liang L., and Qu, J., 2010, Modeling and Simulation in Microelectronic Devices and Packaging, Science Press, Beijing, China. (in Chinese)

4. Su, B. and Qu, J., 2008, “Fatigue Behavior of Electrically Conductive Adhesives,” in Electrically Conductive Adhesives, ed. R. Gomatam and K.L., Mittal, Koninklijke Brill NV., Leiden, The Netherlands, pp. 251 – 270.

5. Pucha, R.V., Qu, J., and Sitaraman, S.K., 2008, “Mixed-Signal Package Reliability” in Introduction to System-on-Package (SOP), ed. R. Tummala, McGraw-Hill, NY, pp. 451 – 500.

6. Qu, J. and M. Cherkaoui, 2006, Fundamentals of Micromechanics of Solids, John Wiley & Sons Inc., Hoboken, NJ.

7. Ferguson, T. and Qu, J., 2006, "The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging," in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Vol. 2, Physical Design / Reliability and Packaging, Suhir, E.; Lee, Y.C.; Wong, C.P. (Eds.), Springer, Secaucus, NJ, pp. 431 – 469.

8. Qu, J. and L. Jacobs, 2004, "Cylindrical Waves and Their Applications in Ultrasonic Evaluation," in Ultrasonic NDE for Engineering and Biological Material Characterization, ed. T. Kundu, CRC Press, p.311 – 362.

9. Qu, J., 2003, “Thermomechanical Reliability of Microelectronic Packaging,” in Comprehensive Structure Integrity – Fracture of Materials from Nano to Macro, ed. W. Gerberich and W. Yang, Elsevier Science, p.219 - 240.

10. Qu, J. and Guo, Y., 2001 “Fundamentals of Microsystems Reliability,” in Fundamentals of Microsystems Packaging, ed. R. Rummala, McGraw-Hill, p.878 - 923.

11. Qu, J., 2000, "Nondestructive Evaluation and Characterization of Engineering Materials for Reliability and Durability Predictions, ed., ASME, AMD-Vol240/NDE-Vol. 18.

12. Yang, L. and Qu, J., 1996, "Energy Release Rate For Cracks on a Non-Planer Interface," in Fracture of Composites, ed. E. Armanios, p.47-62. (SCI).

13. Qu, J., "Green's Function in Anisotropic Bimaterials, 1992" in Modern Theory of Anisotropic Elasticity and Applications, ed. by J.J Wu, T.C.T. Ting and D.M. Barnett, p. 62 - 73.

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14. Roberts, R.A., Qu, J. and Achenbach, J.D., 1988, "Experimental and Theoretical Analysis of Backscattering Mechanism in Fiber-Reinforced Composites," in Acousto-Ultrasonic: Theory and Application, ed. by J. C. Duke, Plenum Press, pp. 151-164.

http://www.civil.northwestern.edu/people/qu/Qu%20Papers/

B. Refereed Publications

1. Haftbaradaran, H. and Qu, J., 2015, “Two-Dimensional Chemo-Elasticity under Chemical Equilibrium.” Int. J. Solids and Structures, Vol. 56–57, pp. 126–135.

2. Morlock, M., Kim, J.Y., Jacobs, L.J., and Qu, J., 2015, “Mixing of Two Co-Directional Rayleigh Surface Waves in a Nonlinear Elastic Material,” J. Acoust. Soc. Am., Vol. 137, pp. 281 - 292.

3. Shui, G., Wang, Y.S. and Qu, J., 2015, “Nonlinear Ultrasonic Evaluation of the Fatigue Damage of Adhesive Joints,” NDT & E International, Vol. 70, pp. 9–15.

4. Matlack, K.H., Bradley, H.A., Thiele, S., Kim, J.Y., Wall, J.J., Jung, H.J., Qu, J., and Jacobs, L.J., 2015, “Nonlinear Ultrasonic Characterization of Precipitation in 17-4PH Stainless Steel,” NDT & E International, Vol. 71, pp. 8–15.

5. Song, J., Zhang, Y., Fan, H., Hu, T., Hu, L., Qu, J., 2015, “Design of Interfaces for Optimal Mechanical Properties in Al2O3/Mo Laminated Composites,” J. European Ceramic Society, Vol. 35, pp. 1123 – 1127.

6. Torello, T., Thiele, T., Matlack, K., Kim, J.Y, Qu, J., Jacobs, L.J., 2015, “Diffraction, Attenuation, and Source Corrections for Nonlinear Rayleigh Wave Ultrasonic Measurements,” Ultrasonics, Vol. 56, pp. 417 - 426.

7. Chen, Z., Tang, G., Zhao,Y., Jacobs, L.J., and Qu, J., 2014, “Mixing of Collinear Pulses in Elastic Solids with Quadratic Nonlinearity,” J. Acoust. Soc. Am., Vo. 136, pp. 2389 - 2404.

8. Yang, S. and Qu, J., 2014, "An Investigation of the Tensile Deformation and Failure of an Epoxy/Cu Interface Using Coarse-Grained Molecular Dynamics Simulations," Modelling and Simulation in Materials Science and Engineering, Vol. 22, 065011, DOI: 10.1088/0965-0393/22/6/065011.

9. Haftbaradaran, H. and Qu, J., 2014, “A Path-Independent Integral for Fracture of Solids under Combined Electrochemical and Mechanical Loadings,” J. Mech. Phys. Solids, Vol. 71, pp.1 - 14.

10. Yang, S. and Qu, J., 2014, “Coarse-Grained Molecular Dynamics Simulations of the Tensile Behavior of a Thermosetting Polymer,” Physical Review E, Vol. 90, 012601.

11. Thielea, S., Kim, J.Y., Qu, J. Jacobs, L.J., 2014, “Air-Coupled Detection of Nonlinear Rayleigh Surface Waves to Assess Material Nonlinearity, Ultrasonics, Vol. 54, pp.1470–1475.

12. K. H. Matlack, K.H, Kim, J.Y., Jacobs, L.J., and Qu, J., 2014, “Review of Second Harmonic Generation Measurement Techniques for Material State Determination in Metals,” J. Nondestructive Evaluation, Vol. 33, pp. 196-204.

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13. Matlack, K.H., Kim, J.Y., Wall, J.W., Qu, J., and Jacobs, L.J., 2014, “Nonlinear Ultrasonic Characterization of Radiation Damage Using Charpy Impact Specimen,” ASTM STP, in print.

14. Tang, G. Liu, M, Jacobs, L.J., and Qu, J., 2014, “Detecting Localized Plastic Strain by a Scanning Collinear Wave Mixing Method,” J. Nondestructive Evaluation, Vol. 33, pp 196-204 .

15. Matlack, K.H., Kim, J.Y., Wall, J.W., Qu, J., Jacobs, L.J, and Sokolov, M.A., 2014, “Sensitivity of Ultrasonic Nonlinearity to Irradiated, Annealed, and Re-Irradiated Microstructure Changes in RPV Steels,” J. Nuclear Materials, Vol. 448, pp. 26–32.

16. Yang, S., Cui, Z., and Qu, J., 2014, "A Coarse-Grained Model for Epoxy Molding Compound," J. Physical Chemistry Part B, Vol. 118, pp. 1660 – 1669.

17. Gao, X, Huang, Z., Qu, J., and Fang, D., 2014, “A Curvature-Dependent Interfacial Energy-Based Interface Stress Theory and Its Applications to Nano-Structured Materials: (I) General Theory,” J. Mech. Phys. Solids, Vol. 66, pp. 59–77.

18. Zeitvogel, D., Matlack, K.H., Kim, Y.J., Jacobs, L.J., Singh, P.M., and Qu, J., 2014, “Characterization of Stress Corrosion Cracking in Carbon Steel Using Nonlinear Rayleigh Surface Waves,” NDT & E International, Vol. 62, pp. 144–152.

19. Chen, Z. and Qu, J., 2013, “Dislocation-Induced Acoustic Nonlinearity Parameter in Crystalline Solids,” J. Appl. Physics., Vol. 114, pp. 164906.

20. Cui, Z., Gao, F. and Qu, J., 2013, “Two-Phase vs. Two-Stage vs. Multi-Phase Lithiation Kinetics in Silicon,” Applied Physics Letters, Vol. 103, pp. 143901.

21. Nagy, P.B., Qu, J., and Jacobs, L.J., 2013, “Finite-Size Effects on the Quasistatic Displacement Pulse in a Solid Specimen with Quadratic Nonlinearity,” J. Acoust. Soc. Am., Vol. 134, pp. 1760 - 1774.

22. Cui, Z., Sun, Y., and Qu, J., 2013, “Thermomechanical Properties of Non-Stoichiometric Gadolinium Doped Ceria by Molecular Dynamics Simulations,” J. Computational and Theoretical Nanoscience, Vol. 10, pp. 1359-1365.

23. Yang, S., Gao, F., Qu, J., 2013, “A Molecular Dynamics Study of Tensile Strength Between a Highly-Crosslinked Epoxy Molding Compound and a Copper Substrate,” Polymer, Vol. 54, pp. 5064 – 5074.

24. Qu, J. and Moon, K.S., 2013, “Introduction for JEP Special Issue on Printed Electronics,” J. Electronic Packaging, Vol. 135, pp. 010301.

25. Zhao, X., Borda, S.P.A., and Qu, J., 2013, “A Hybrid Smoothed Extended Finite Element/Level Set Method for Modeling Equilibrium Shapes of Nano-Inhomogeneities,” Computational Mechanics, DOI 10.1007/s00466-013-0884-1.

26. Zhao, X., Duddu, R., Borda, S.P.A., and Qu, J., 2013, “Effects of Elastic Strain Energy and Interfacial Stress on the Equilibrium Morphology of Misfit Particles in Heterogeneous Solids,” J. Mech. Phys. Solids, Vol. 61, pp. 1433–1445.

27. Cui, Z., Sun, Y., and Qu, J., 2013, “Development of Semi-ab initio Interionic Potential for CaO and MgO,” Molecular Simulation, Vo. 39, pp. 956-967.

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28. Cao, A. and Qu, J., 2013, “Atomistic Simulation Study of Brittle Failure in Nanocrystalline Graphene under Uniaxial Tension,” Applied Physic Letters, Vol. 102, pp. 071902.

29. Bender, F.A., Kim, J.Y., Jacobs, L.J., and Qu, J., 2013, “The Generation of Second Harmonic Waves in an Isotropic Solid With Quadratic Nonlinearity Under Presence of a Stress-Free Boundary,” Wave Motion, Vol. 50, pp.146–161.

30. Cui, Z., Gao, F., and Qu, J., 2013, “Interface-Reaction Controlled Diffusion in Binary Solids with Applications to Lithiation of Silicon in Lithium Ion Batteries,” J. Mech. Phys. Solids., Vol. 61, pp. 293 - 310.

31. Yang, S. and Qu, J., 2012, “Computing Thermomechanical Properties of Crosslinked Epoxy by Molecular Dynamic Simulations, Polymer, Vo. 53, pp. 4806 - 4817.

32. Zhao, X. and Qu, J., 2012, “Effects of Interfacial Excess Energy on the Elastic Field of a Nano-Inhomogeneity,” Mechanics of Materials, Vol. 55, pp. 41–48.

33. Cui, Z., Sun, Y., and Qu, J., 2012, “Molecular Dynamics Simulation of Reduced CeO2,” Solid State Ionics, Vol. 226, pp. 24 – 29.

34. Cui, Z., Gao, F., and Qu, J., 2012, “On the Perturbation Solution of Interface-Reaction Controlled Diffusion in Solids,” ACTA Mechanica Sinica, Vol. 28, pp. 1049 – 1057.

35. Liu, M., Tang, G., Jacobs, L.J., and Qu, J., 2012, “Measuring acoustic nonlinearity parameter using collinear wave mixing,” J. Applied Physics, Vol. 112, 024908.

36. Cao, A., and Qu, J., 2012, “Study on the Mechanical Behavior of Tilt Bicrystal Graphene by Molecular Dynamics Simulations: Bulk versus Nanoribbons,” J. Applied Physics, Vol. 112, pp. 043519.

37. Cao, A., and Qu, J., 2012, “Size Dependent Thermal Conductivity of Single-Walled Carbon Nanotubes,” J. Applied Physics, Vol. 112, pp. 013503.

38. Gao, F. and Qu, J., 2012, “Electrical Resistance at Carbon Nanotube/Copper Interfaces: Capped versus Open-end Carbon Nanotubes,” Materials Letters, Vo. 82, pp. 184–187.

39. Walker, S.V., Kim, J.Y., Qu, J., and Jacobs, L.J.,2012, “Fatigue Damage Evaluation in A36 Steel Using Nonlinear Rayleigh Surface Waves, NDT&E International, Vol. 48, pp. 10 – 15.

40. Tang, G., Jacobs, L.J., and Qu, J., 2012, “Scattering of time-harmonic elastic waves by an elastic inclusion with quadratic nonlinearity,” J. Acoust. Soc. Am., Vol. 131, pp. 2570 – 2578.

41. Cui, Z., Gao, F., and Qu, J., 2012, “A finite deformation stress-dependent chemical potential and its applications to lithium ion batteries,” J. Mech. Phys. Solids., Vol. 60, pp. 1280–1295.

42. Cao, A., and Qu, J., 2012, “Kapitza Conductance of Symmetric Tilt Grain Boundaries in Graphene,” J. Applied Physics, Vol. 111, pp. 053529.

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43. Matlack, K.H., Wall, J, Kim, J.Y, Qu, J., Jacobs, L.J., Viehrig, W.H., 2012, “Evaluation of Radiation Damage Using Nonlinear Ultrasound,” J. Applied Physics, Vol. 111, pp. 054911.

44. Cui, Z., Gao, F., Cui, Z., Qu, J., 2012, “A Second Nearest-Neighbor Embedded Atom Method Interatomic Potential for Li-Si Alloys,” J. Power Sources, Vol. 207, pp.150– 159.

45. Liu, Y., Kim, J.Y., Jacobs, L.J., Qu, J., and Li, Z., 2012, “Experimental investigation of symmetry properties of second harmonic Lamb waves,” J. Appl. Physics, Vol. 111, 053511.

46. Gao, F. and Qu, J., 2012, “Calculating the Diffusivity of Cu and Sn in Cu3Sn Intermetallic by Molecular Dynamics Simulations,” Materials Letters, Vo. 73, pp. 92–94.

47. Qu, J., Nagy, P., and Jacobs, L.J., 2012, “Pulse Propagation in an Elastic Medium with Quadratic Nonlinearity,” J. Acoust. Soc. Am., Vol. 131, pp. 1827 - 1830.

48. Jairazbhoy, V.A., Petukhov, P., and Qu, J., 2012, “Large Deflection of Thin Plates in Convex or Concave Cylindrical Bending,” ASCE Journal of Engineering Mechanics, Vol. 138, pp. 230-234.

49. Cui, Z., Gao, F., Cui, Z., and Qu, J., 2012, “Developing a Second Nearest-Neighbor Modified Embedded Atom Method Interatomic Potential for Lithium,” Modelling Simul. Mater. Sci. Eng., Vol. 20, pp. 015014.

50. Gao, F., Qu, J., and Yao, M., 2011, “Interfacial Thermal Resistance between Metallic Carbon Nanotube and Cu Substrate,” J. Appl. Physics, Vol. 110, 124314.

51. Hua, E., Sun, Y., Zeng, F., and Qu, J., 2011, “Nanoindentation simulation of PE/POSS under different shapes of indenters,” Acta Mechanica Solida Sinica, Vol. 24, 365 – 372.

52. Jing, J., Gao, F., Johnson, J., Liang, F.Z., Williams, R.L., and Qu, J., 2011, “Brittle Versus Ductile Failure of a Lead-Free Single Solder Joint Specimen Under Intermediate Strain Rate,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, pp. 1456 – 1464.

53. Cui, Z., Sun Y., Chen, Y. and Qu, J., 2011, “Semi-ab initio Interionic Potential for Gadolinia-Doped Ceria,” Solid State Ionics, Vol. 187, pp. 8–18.

54. Kim, J.Y., Jacobs, L.J., and Qu, J., 2011, “Nonlinear Ultrasound and Its Applications in Quality Inspection and Damage Assessment in Metallic Materials,” Transactions of JWRI, Vol. 39, No. 2, pp.52 - 55.

55. Gao, F., Qu, J., and Yao, M., 2011, “Effects of inter-wall interaction on the electrical conductance at the junction between a double-walled carbon nanotube and copper electrodes,” Applied Physics Letters, Vol. 98, 172103.

56. Qu, J., Jacobs, L.J., and Nagy, P., 2011, “On the Acoustic-Radiation-Induced Strain and Stress in Elastic Solids with Quadratic Nonlinearity" J. Acoust. Soc. Am., Vol. 129, pp.3349 - 3452.

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57. Gao, F., Qu, J., and Yao, M., 2011, “Electrical Contact Resistance at the CNT/Pd and CNT/Al Interfaces in End-Contact by First-Principles Calculations,” J. Electronic Packaging, Vol. 133, 020908.

58. Gao, F., Pei, M., and Qu, J., 2011, “Multi-Scale Simulations in Lead-Free Soldering,” Japan Welding Society, Vol. 80, pp. 52 – 55.

59. Matlack, K.H., Kim, J.Y., Jacobs, L.J., and Qu, J., 2011, “Experimental characterization of efficient second harmonic generation of lamb wave modes in a nonlinear elastic isotropic plate,” J. Appl. Physics, Vol. 109, pp. 014905.

60. Liu, M., Kim, J.Y., Jacobs, L.J, and Qu, J., 2011, “Experimental Study of Nonlinear Rayleigh Wave Propagation in Shot-Peened Aluminum Plates - Feasibility of Measuring Residual Stress,” NDT & E International, Vol. 44, pp. 67 – 74.

61. Apetre, N., Ruzzene, M., Jacobs, L.J. and Qu, J., 2011, “Measurement of the Rayleigh Wave Polarization Using 1D Laser Vibrometry,” NDT & E International, Vol. 44, pp. 247 - 253.

62. Treiber, M. Kim, J.Y., Qu, J., Jacobs, L.J., 2010, “Effects of sand aggregate on ultrasonic attenuation in cement-based materials,” Materials and Structures, Vol. 43, pp. 1 – 11, Suppl. 1.

63. Gao, F., Qu, J., and Yao, M., 2010, "Effects of local structural defects on the electron transport in a carbon nanotube between Cu electrodes," Applied Physics Letters, Vol. 97, pp. 242112. Also appeared in Virtual Journal of Nanoscale Science & Technology, January 3, 2011, Volume 23, Issue 1.

64. Gao, F. and Qu, J., 2010, “Elastic Moduli of (Ni, Cu)3Sn4 Ternary Alloys from First-Principles Calculations,” J. Electronic Materials, Vol. 39, pp. 2429-2434.

65. Zhou, H., Qu, J. and Cherkaoui, M., 2010, “Finite Element Analysis of Oxidation Induced Metal Depletion at Oxide-Metal Interface,” Computational Materials Science, Vol. 48, pp. 842-847.

66. Du, C., Bai, H., Qu, J., Su, X., 2010, “Dispersion of One Dimensional Stochastic Waves in Continuous Random Media,” Computer Modeling in Engineering & Sciences, Vol. 61, pp. 223 – 248.

67. Gao, F., Jing, J., Liang, F.Z., Williams, R.L., and Qu, J., 2010, "Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint," J. ASTM International, Vol. 7, pp. 1 - 15.

68. Deroo, F., Kim, J.Y., Qu, J., Sabra, K., and Jacobs, L.J., 2010, "Detection of Damage in Concrete Using Diffuse Ultrasound,” J. Acoust. Soc. Am., Vol. 127, pp. 3315 - 3318.

69. Gao, F., Qu, J., and Yao, M., 2010, “Electronic Structure and Contact Resistance at an Open-end CNT and Copper Interface, Applied Physics Letters, Vol. 96, pp. 102108.

70. Gao, F., Qu, J., and Takemoto, T., 2010, “Additive Occupancy in the Cu6Sn5-Based Intermetallic Compound between Sn-3.5Ag Solder and Cu Studied Using a First-Principles Approach,” J. Electronic Materials, Vol. 39, pp. 426 - 432.

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71. Mueller, M., Kim, J.Y., Qu, J., and Jacobs, L.J., 2010, “Characteristics of second harmonic generation of Lamb waves in nonlinear elastic plates,” J. Acoust. Soc. Am., Vol. 127, pp. 2141 – 2152.

72. Zhou, H., Qu, J., and Cherkaoui, M., 2010, “Stress-Oxidation Interaction in Selective Oxidation of Cr-Fe Alloys,” Mechanics of Materials, Vol. 42, pp. 63 – 71.

73. Liu, W.N., Sun, X., Khaleel, M.A., and Qu, J., 2009, “Global Failure Criteria for Positive/Electrolyte/Negative Structure of Planar Solid Oxide Fuel Cell,” J. Power Sources, Vol., 192, pp. 486 – 493.

74. Swaminathan, N. and Qu, J., 2009, “Evaluation of Thermomechanical Properties of Non-Stoichiometric Gadolinium Doped Ceria Using Atomistic Simulations,” Modelling and Simulation in Material Science and Engineering, Vol. 17, 045006.

75. Treiber, M., Kim, J.Y., Jacobs, L.J., and Qu, J., 2009, "Correction for partial reflection in ultrasonic attenuation measurements using contact transducers,” J. Acoust. Soc. Am., Vol. 125, pp. 2946 - 2953.

76. Cui, Z.W., Sun, Yi, and Qu, J., 2009, “The Neighbor List Algorithm for a Parallelepiped Box in Molecular Dynamics Simulations,” Chinese Science Bulletin, vol. 54, pp. 1 - 7.

77. Dingreville, R. and Qu, J., 2009, “A Semi-Analytical Method to Estimate Interface Elastic Properties, Computational Materials Science, Vol. 46, pp. 83–91.

78. Kuechler, S., Meurer, T., Jacobs, J. and Qu, J., 2009, "Two-Dimensional Wave Propagation in an Elastic Half-Space with Quadratic Nonlinearity -- A Numerical Study," J. Acoust. Soc. Am., Vol. 125, 1290 - 1301.

79. Gao, F., Nishikawa, H., Takemoto, T. and Qu, J., 2009, “Mechanical Properties Versus Temperature Relation of Individual Phases in Sn–3.0Ag–0.5Cu Lead-Free Solder Alloy,” Microelectronics Reliability, Vol. 49, pp 296 - 302.

80. Jing, J., Gao, F., Johnson, J., Liang, F.Z., Williams, R.L., Qu, J., 2009, “Simulation of Dynamic Fracture along Solder-Pad Interfaces Using a Cohesive Zone Model,” Engineering Failure Analysis, Vol. 16, pp. 1579 - 1586.

81. Pruell C., Kim J.Y., Qu J., and Jacobs L.J., 2009, “A nonlinear-guided wave technique for evaluating plasticity-driven material damage in a metal plate,” NDT & E International Vol. 42, pp. 199 – 203.

82. Pruell1, C., Kim, J.Y., Qu, J., Jacobs, L.J., 2008, “Evaluation of fatigue damage using nonlinear guided waves,” Smart Materials and Structures, Vol. 18, 035003.

83. Shui, G., Wang, Y., Qu, J., Kim, J-Y., and Jacobs, L.J., 2008, “Evaluation of the acoustic nonlinearity parameter of materials with Rayleigh waves excited directly,” Acta Acustica, Vol. 33, pp. 378 – 384.

84. Cui, Z., Sun, Y. and Qu, J., 2008, “Constant Pressure Molecular Dynamics Simulation for Ionic System,” J. Computational and Theoretical Nanoscience, Vol.5, pp. 1646–1650.

85. Johnson, J. and Qu, J., 2008, “Effective Modulus and Coefficient of Thermal Expansion of Ni-YSZ Porous Cermets,” J. Power Sources, Vol. 181, pp. 85–92.

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86. Capolungo, L., Benkassem, S., Cherkaoui, M., and Qu, J., 2008, “Self-consistent Scale Transition with Imperfect Interfaces: Application to Nanocrystalline Materials, Acta Materialia, Vol. 56, pp. 1546-1554.

87. Pei, M. and Qu, J., 2008, “Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys,” ASME J. Electronic Packaging, Vol. 13, pp. 031004: 1-6.

88. Shui, G., Kim, J.Y., Qu, J., Wang, Y.S. and Jacobs, L.J., 2008, “A New Technique for Measuring the Acoustic Nonlinearity of Materials Using Rayleigh Waves,” NDT&E International, Vol. 41, pp. 326–329.

89. 税国双, 汪越胜, Qu, J., Kim, J.Y., Jacob, L.J., 2008, “利用直接激发 Rayleigh 表面波

的方法测量材料的声学非线性系数, 《声学学报》, Vol. 33, pp. 378-384.

90. Bermes, C., Kim, J.Y., Qu, J., and Jacobs, L.J., 2008, “Nonlinear Lamb waves for the detection of material nonlinearity,” Mechanical Systems and Signal Processing, Vol. 22, pp. 638–646.

91. Spearot, D.E., Capolungo, L., Qu, J., Cherkaoui, M., 2008, “On the Elastic Tensile Deformation of <100> Bicrystal Interfaces in Copper,” Computational Materials Science, Vol. 42, pp. 57–67.

92. Dingreville, R., Kulkarni, A., Zhou, M. and Qu, J., 2008, “A Semi-Analytical Method for Quantifying the Size-Dependent Elasticity of Nanostructures,” Modelling and Simulation in Material Science and Engineering, Vol. 16, pp. 025002.

93. Jairazbhoy, V., Petukhov, P. and Qu, J., 2008, "Large Deflection of Thin Plates In Cylindrical Bending - Non-Unique Solutions,” Int. J. Solids and Structures, Vol. 45, pp. 3203 – 3218.

94. Su, B. and Qu, J., 2008, “Fatigue Behavior of Electrically Conductive Adhesives,” J. Adhesion Science & Technology, Vol. 22, pp. 927 – 946.

95. Pei, M. and Qu, J., 2008, “Creep and Fatigue Behavior of SnAg Solders with Lanthanum Doping,” IEEE Transactions on Components and Packaging Technology, Vol. 31, pp. 712 – 718.

96. Dingreville, R. and Qu, 2008, “Interfacial Excess Energy, Excess Stress and Excess Strain in Elastic Solids - Planar Interfaces,” J. Mech. Phys. Solids, Vol. 56. pp. 1944–1954.

97. Chen, X.J., Kim, J.Y., Kurtis, K.E., Qu, J., Shen, C.W., and Jacobs, L.J., 2008, “Characterization of Progressive Microcracking in Portland Cement Mortar Using Nonlinear Ultrasonic,” NDT & E International, NDT&E International, Vol. 41, pp. 112–118.

98. Pei, M. and Qu, J., 2007, “Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys, J. Electronic Materials, Vo. 37, pp. 331-338.

99. Pruell, C., Kim, J.Y., Qu, J., and Jacobs, L.J., 2007, “Evaluation of Plasticity Driven Material Damage Using Lamb Waves,” Applied Physics Letters, Vol. 91, pp. 231911-3.

100. Swaminathan, N. and Qu, J., 2007, “Interactions between Non-stoichiometric Stresses and Defect Transport in a Tubular Electrolyte," Fuel Cells, Vol. 7, pp. 453-462.

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101. Koreck, J., Valle, C., Qu, J. and Jacobs, L.J., 2007, "Computational Characterization of Adhesive Layer Properties Using Guided Waves in Bonded Plates," J. Nondestructive Evaluation, Vol. 26, pp. 97–105.

102. Capolungo, L., Spearot, D.E., Cherkaoui, M., McDowell, D.L., Qu, J., Jacob, K.I., 2007, "Dislocation Nucleation from Bicrystal Interfaces and Grain Boundary Ledges: Relationship to Nanocrystalline Deformation," J. Mech. Phys. Solids., Vol. 55, pp. 2300-2327.

103. Cui, Z., Sun, Y., Li, J., Qu, J., 2007, “On a Combination Method for the Calculation of Elastic Constants,” Physical Review B, Vol. 75, 214101-1-6.

104. Cornil, M.B., Capolungo, L., Qu, J. and Jairazbhoy, V.A., 2007, "Free Vibration of a Beam Subjected to Large Static Deflection," J. Sound and Vibration, Vol. 303, pp. 723 –740.

105. Punurai, W., Jarzynski, J., Qu, J., Kurtis, K.E., Jacobs, L.J., 2007, "Characterization of dissipation losses in cement paste with diffuse ultrasound," Mechanics Research Communications, Vol. 34, pp. 289–294.

106. Bermes, C., Kim, J. Y. , Qu, J., and Jacobs, L. J., 2007, "Experimental Characterization of Material Nonlinearity using Lamb Waves," Applied Physics Letters, Vol. 90 (2), pp. 021901.

107. Swaminathan, N., Qu, J. and Sun Y., 2007, "An Electrochemomechanical Theory for Ionic Solids I - Theory," Phil,. Mag., Vol. 87, pp. 1705 - 1721.

108. Swaminathan, N. and Qu, J., 2007, "An Electrochemomechanical Theory for Ionic Solids II - Examples," Phil. Mag., Vol. 87, pp. 1723 - 1742.

109. Johnson, J. and Qu, J., 2007, "An Interaction Integral Method for Computing Mixed Mode Stress Intensity Factors for Curved Bimaterial Interface Cracks in Non-Uniform Temperature Fields," Engineering Fracture Mechanics, Vol. 74, pp. 2282 – 2291.

110. Punurai, W., Jarzynski, J., Qu, J., Kim, J.Y., Jacobs, L.J., Kurtis, K.E., 2007, "Characterization of Multi-Scale Porosity in Cement Paste by Advanced Ultrasonic Techniques, Cement and Concrete Research, Vol. 37, pp. 38–46.

111. Capolungo, L, Cherkaoui, M., and Qu, J., 2007, "On the Elastic-Viscoplastic Behavior of Nanocrystalline Materials," Int. J. Plasticity, Vol. 23, pp. 561–591.

112. Dingreville, R. and Qu, J., 2007, "A Semi-Analytical Method to Compute Surface Elastic Properties, Acta Materialia, Vol. 55, pp.141-147.

113. Shui, G., Wang, Y., and Qu, J., 2006, "A Theoretical Model for Nondestructive Evaluation of Damage of Adhesive Joints," Key Engineering Materials, Vols. 324-325, pp. 339-342.

114. Kim, J.-Y., Jacobs, L. J., Qu, J. and Littles, J.W., 2006, "Experimental Characterization of Fatigue Damage in a Nickel-Base Superalloy Using Nonlinear Ultrasonic Waves," J. Acoust. Soc. Am., Vol. 120, pp. 1266 - 1273.

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115. Herrmann, J, Kim, J.Y., Jacobs, L.J., Qu, J., Littles, J.W., and Savage, M., 2006, "Assessment of Material Damage in a Nickel-Base Superalloy Using Nonlinear Rayleigh Surface Waves," J. Appl. Phys., Vo. 99, pp. 124913-1-8.

116. Kim, J.Y., Qu, J., Jacobs, L.J., Littles, J.W. and Savage, M.F., 2006, "Acoustic Nonlinearity Parameter due to Microplasticity," J. Nondestructive Evaluation, Vol. 25, pp. 28 - 36.

117. Punurai, W., Jarzynski, J., Qu, J., Kurtis, K.E., Jacobs, L.J., 2006, "Characterization of Entrained Air Voids in Cement Paste with Scattered Ultrasound," NDT & E International, Vol. 39, pp. 514-524.

118. Ferguson, T. and Qu, J., 2006, "Elastic Modulus Variation due to Moisture Absorption and Permanent Changes Upon Redrying in an Epoxy Based Underfill," IEEE Component and Manufacturing Tech., Vol. 29, pp. 105 – 111.

119. Junge, M., Qu, J. and Jacobs, L.J., 2006, "Relationship between Rayleigh Wave Polarizations and State of Stress," Ultrasonics, Vol. 44, pp. 233 – 237.

120. Dingreville, R., Qu, J. and Cherkaoui, M., 2005, "Surface Free Energy and Its Effect on the Elastic Behavior of Nano-sized Particles, Wires and Films," J. Mech. Phys. Solids., Vol. 53, pp. 1827–1854.

121. Shui, G., Wang, Y. and Qu, J., 2005, "Advances in Ultrasonic Nondestructive Testing and Evaluation of Material Property Degradation," Advances in Mechanics, Vo. 35, pp. 52 – 78.

122. Capolungo, L., Cherkaoui, M. and Qu, J, 2005, "A self consistent model for the inelastic deformation of nanocrystalline materials," ASME, J. Eng. Mat. Tech., Vol. 127, pp. 400 - 407.

123. Capolungo, L., Jochum, C., Cherkaoui, M. and Qu, J, 2005, "Homogenization method for strength and inelastic behavior of nanocrystalline materials," Int. J. Plasticity, Vol. 21, pp. 67 - 82.

124. Sun, Y., G. Wang, and J. Qu, 2005, "On solutions of crack surface opening displacement of a penny-shaped crack in an elastic cylinder subject to tensile loading," J. of Materials Science, Vol. 40, pp. 461-464.

125. Pucha, R.V., Sitaraman, S.K., Hegde, S., Damani, M., Wong, C.P., Qu, J., Zhang, Z., Raj, P.M., Tummala, R.R., 2004, "Materials and Mechanics Challenges in SOP-based Convergent Microsystems," Micromaterials and Nanomaterials. (A publication series of the Micro Materials Center Berlin (MMCB) at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany, Issue No. 4.

126. Lee, H.Y. and Qu, J. 2004, Dimple-type failures in a polymer/roughened metal system," J. Adhesion Science and Technology, Vol. 18, No. 10, pp. 1153 - 1172.

127. Becker, J., Jacobs, L.J. and Qu, J., 2003, “Characterization of Cement-Based Materials using Diffuse Ultrasound,” Journal of Engineering Mechanics, Vol. 129, No. 12, pp. 1478-1484.

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128. Xue, Y., Jairazbhoy, V.A., Niu, X. and Qu, J., 2003, "Large Deflection of Thin Plates under Certain Mixed Boundary Conditions - Cylindrical Bending," J. Electronic Packaging, Vol. 125, pp 53 – 58.

129. Ferguson, T. and Qu, J., 2003, "Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials," J. Electronic Packaging, Vol. 125, pp 24 – 30.

130. Lee, H. Y., and Qu., J., 2003, "Microstructure, Adhesion Strength and Failure Path at a Polymer/Roughened Metal Interface," J. Adhesion Science and Technology, Vol. 17, pp 195-215.

131. Qu, J. and Jacobs, L.J., 2003, "Guided Circumferential Waves and Their Applications in Characterizing Cracks in Annular Components," Materials Evaluation, Vol. 61, pp 85-93.

132. Xue, Y. and Qu, J., 2003, "On the Energy Release Rate of Elliptical Cracks in Anisotropic Elastic Media," Chinese Journal of Mechanics-Series A, Vol. 19, pp 233-239.

133. Wang, Y.S., Yu, G.L., Qu, J., 2003, "Subsonic slip waves along the interface between two anisotropic elastic half-spaces in sliding contact with separation, Int. J. Engineering Science, Vol. 41, p. 1785-1798.

134. Hoiseth, K. and Qu, J., 2003, "Cracking Paths at the Ply Interface in a Cross-Ply Laminate," Composites Part B: Engineering, Vol. 34, pp. 437 – 445.

135. Meurer, T., Qu., J. and Jacobs, L.J., 2002, "Wave Propagation in Nonlinear and Hysteretic Media - A Numerical Study," Int. J. Solids and Structures, Vol. 39, pp 5585-5614.

136. Yao, Q. and Qu, J., 2002 "Interfacial versus Cohesive Failure on Polymer-Metal Interface- Effects of Interface Roughness," J. Electronic Packaging, Vol. 124, pp.127 - 134.

137. Ferguson, T. and J. Qu, 2002, "Effect of Moisture on the Interfacial Fracture Toughness of Underfill/Solder Mask Interfaces," J. Electronic Packaging, Vol. 124, pp.106 - 110.

138. Qu, J. and Wong, C.P., 2002, “Effective Elastic Modulus of Underfill Material for Flip-Chip Applications,” IEEE Transactions on Components and Packaging Technology, Vol. 25, pp. 53 - 55.

139. Seifried, R., Jacobs, L.J, Qu, J., 2002, "Propagation of guided waves in adhesive bonded components," NDT and E International, Vol. 35, pp 317-328.

140. Valle, C., Niethammer, M., Qu, J. and Jacobs, L.J., 2001, “Crack Characterization using Guided Circumferential Waves,” J. Acoust. Soc. Am., Vol. 110, No. 3, pp. 1282-1290.

141. Niethammer, M., Jacobs, L.J., Qu, J., and Jarzynski, J., 2001, “Time-Frequency Representation of Lamb Waves,” J. Acous. Soc. Am., Vol. 109, No. 5, pp. 1841- 1847.

142. Bhattacharya, S. K., Sitaraman, S.K., Ume, I.C., Qu, J., Baldwin, D.F., Tummala, R.R., Wong, C.P., 2001, "Large area processing using small area substrates: A low-cost MCM-D thin film processing," Advances in Electronic Packaging, Vol. 3, p. 1443-1448.

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143. Hurlebaus, S., Niethammer, M., Jacobs, L.J. and Valle, C., 2001, “Automated Methodology to Locate Notches with Lamb Waves,” Acoustics Research Letters Online (http://ojps.aip.org/ARLO/index.jsp), Vol. 2, No. 4, pp. 97-102.

144. Qu, J., Berthelot, Y. and Jacobs, L., 2000 "Crack Detection in Thick Annular Components Using Ultrasonic Guided Waves," Proc. Instn. Mech. Engrs. Part C, Vol. 214, pp. 1163-1171. (SCI)

145. Davis, J. E. and Qu, J., 2000, "Numerical Analysis of Fiber Fragmentation in a SiC/Al Single Fiber Composite Specimen," J. Composites Science and Technology, Vol. 60: (12-13) pp. 2297-2307.

146. Bhattacharya, S., Baldwin, D., Sitaraman, S. Qu, J., Ume, C., and Tummala, R., 2000, "Large area Processing using small area substrates," High Density Interconnect, September 2000, pp 20-25.

147. Kuhl, A. and Qu, J., 2000, "A Technique to Measure Interfacial Toughness over a Range of Phase Angles," J. Electronic Packaging, Vol. 122, pp. 147 - 151.

148. Niethammer, M, Jacobs, L., Qu, J., and Jarzynski, J, 2000, "Time-Frequency Representation of Lamb Waves Using the Reassigned Spectrogram, " J. Acoust. Soc. Am., Vol. 107, L19-L24.

149. Rao, Y., Qu, J. Wong, C.P., and Marinis, T., 2000, "A Precise Numerical Prediction of Effective Dielectric Constant for Polymer-Ceramic Composite Based on Effective-Medium Theory, IEEE Tran. Component and Packaging Technology, Vol. 23, pp. 680 - 683.

150. Heller, K., Jacobs, L.J. and Qu, J., 2000, "Characterization of Adhesive Bond Properties Using Lamb Waves," NDT & E Int., Vol. 33, pp. 555-563. (SCI)

151. Bhattacharya, S., Gardner, B., Qu, J., Baldwin, D. and Tummala, R., 2000, "Low-cost large area processing using small area substrates - A Novel Multi-tiled Palletization Concept for MCM-D Thin Film Process," IEEE Transactions on Advanced Packaging, Vol. 23, pp. 661 - 671. (SCI)

152. Olliff, D., Qu, J., Gaynes, M., Kodnani, R., and Zubelewicz, A., 1999, "Characterizing the Failure Envelope of a Conductive Adhesive," J. Electronic Packaging, Vol. 121, p.23-30. (SCI)

153. Xue, Y. and Qu, J., 1999, "Elliptical Interface Cracks in Anisotropic Bimaterials," Mixed Mode Crack Behavior, ASTM, STP 1359, K. J. Miller and D. L. McDowell, Eds., American Society for Testing and Materials, West Conshohocken, PA, pp. 143 – 159.

154. Schubert, A., Dudek, R., Leutenbauer, R, Doring, R., Kloeser, J., Oppermann, Michel, B., H., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P. and Tummala, R., 1999, "Does Chip Size Limits Exist for DCA?" IEEE Trans. on Electronic Packaging Manufacturing, Vol. 22, pp. 255 - 263.

155. Bulsara, V.N., Talreja R. and Qu, J., 1999, "Damage Initiation under Transverse Loading of Unidirectional Composite with Arbitrarily Distributed Fibers," Composite Science & Technology, Vol. 59, p.673-682. (SCI)

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156. Moser, F., Jacobs, L.J. and Qu, J, 1999, “Application of Finite Element Methods to Study Wave Propagation in Wave Guides,” NDT & E Int., Vol. 32, pp 225-234.

157. Qu, J. and Xue, Y., 1999, “Three-Dimensional Interface Cracks in Anisotropic Bimaterials - The Non-Oscillatory Case,” J. Appl. Mech., Vol. 65, pp.1048 - 1055.

158. Valle, C., Qu, J. and Jacobs, L. J., 1999, "Guided Circumferential Waves In Layered Cylinders," Int. J. Eng. Science, Vol. 37, pp.1369 – 1387.

159. Yao, Q. and Qu, J., 1999, "Three-Dimensional vs. Two-Dimensional Finite Element Modeling of Flip Chip Packages," J. Electronic Packaging, Vol. 121, pp.196 – 201. (SCI)

160. Yao, Q., Qu, J., Wu, J., and Wong, C.P., 1999, “Characterization of Underfill/Substrate Interfacial Toughness Enhancement by Silane Additives,” IEEE Trans. on Electronic Packaging Manufacturing, Vol. 22, pp. 264 - 267.

161. Kley, M., Valle, C., Jacobs, L. J., Qu, J. and Jarzynski, J., 1999, “Development of Dispersion Curves for Two-Layered Cylinders Using Laser Ultrasonics," J. Acost. Soc. Am., Vol. 106, pp. 582 - 588.

162. Eisenhardt C., Jacobs, J.J., and Qu, J., 1999, "Application of Laser Ultrasonics to Develop Dispersion Curves for Elastic Plates," J. Appl. Mech., Vol. 66, No., pp. 1043-1045. (SCI)

163. Liu, G. and Qu, J., 1998, "Guided Circumferential Waves in a Circular Annulus," J. Appl. Mech., Vol. 65, p.424-430.

164. Liu, G. and Qu, J., 1998, "Transient Wave Propagation in a Circular Annulus Subjected to Impulse Excitation on Its Outer Surface," J. Acost. Soc. Am., Vol. 103, p.1210-1220.

165. Qu, J. and Hoiseth, K., 1998, "Evolution of Transverse Matrix Cracking in Cross-Ply Laminates," Int. J. Fatigue & Fracture Eng. Materials & Structures, Vol. 21, p.451-464. (SCI)

166. Qu, J., 1995, "Scattering of Plane Waves from an Interface Crack," Int. J. Engineering Science, Vol. 33, p.179-194.

167. Littles, J., Jacobs, L. and Qu, J., 1995, “Experimental and Theoretical Investigation of Scattering from a Distribution of Cracks,” Ultrasonics, Vol. 33, p.37-43.

168. Veazie, D.R. and Qu, J., 1995, "Effects of Interphases on the Transverse Stress-Strain Behavior in Unidirectional Fiber Reinforced Metal Matrix Composites," Composite Engineering, Vol. 5, p. 597-610. (SCI)

169. Veazie, D.R. and Qu, J., 1995, "Effects of Interphases on the Transverse Stress-Strain Behavior of Fiber Reinforced Metal Matrix Composites," ACTA Mechanica Solida Sinica, Vol. 8, p.625-628.

170. Qu, J., 1994, "Interface Crack Loaded by Time Harmonic Plane Waves," Int. J. Solids & Structures, Vol. 31, p. 329 - 345.

171. Qu, J. and Bassani, J.L., 1993, "Fracture Mechanics of Interface Cracks in Anisotropic Materials," J. Appl. Mech., 60, p.422 - 431. (SCI)

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172. Qu, J., 1993, "Eshelby Tensor for an Elastic Inclusion with Slightly Weakened Interface," J. Appl. Mech., 60, p.1048 - 1050.

173. Yang, L. and Qu, J., 1993, "Fracture Mechanics Parameters for Cracks on Slightly Undulating Interfaces," Int. J. Fracture, 64, p.79-91.

174. Qu, J., 1993, "Effects of Slightly Weakened Interfaces on the Overall Elastic Properties of Composite Materials," Mechanics of Materials, 14, p.269 - 281.

175. Bassani, J.L., and Qu, J., 1992 "Fracture Parameters for Interface Cracks," ASTM, Special Technical Publication, 1131, p.549 - 559.

176. Qu, J., Bassani, J.L., and Li, Q.Q., 1992, "Interfacial Dislocation in Anisotropic Bimaterials," ASTM, Special Technical Publication, 1131, p.578 - 589.

177. Qu, J. and Li, Q.Q., 1991, "Interfacial Dislocation and Its Application to Interface Cracks in Anisotropic Bimaterials," J. Elasticity, 26, p.169 - 195.

178. Qu, J., and Bassani, J.L., 1989, "Cracks on Bimaterial and Bicrystal Interfaces," J. Mech. Phys. Solids, 37, p.417-434. (SCI)

179. Bassani, J.L. and Qu, J., 1989, "Finite Crack on Bimaterial and Bicrystal Interfaces," J. Mech. Phys. Solids, 37, p.435-453. (SCI)

180. Bassani, J.L. and Qu, J., 1989, "On Elasticity Solutions for Cracks on Bimaterial and Bicrystal Interfaces," Materials Science and Eng., A107, p.177-184. (SCI)

181. Qu, J., 1989, "Discussion of General Solutions of a Central Crack in a Strip Sandwiched Between Two Different Outer Layers," Engineering Fracture Mechanics, 32, p.163-165.

182. Qu, J., Achenbach, J.D. and Roberts, R.A., 1989, "Reciprocal Relations for Transmission Coefficients: Theory and Application," IEEE Trans., Ultrasonics, Ferroelectrics and Frequency Control, 36(2), p.280-286.

183. Achenbach, J.D. and Qu, J., 1986, "Resonant Vibration of Submerged Beam," J. Sound and Vibration, 105, p.185-195.

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C. Conference Proceedings

1. Zeitvogel, D. T., Matlack, K. H., Kim, J.-Y., Jacobs, L.J. Singh, P.M., and Qu, J., 2013, “Characterization of Damage Due to Stress Corrosion Cracking in Carbon Steel Using Nonlinear Surface Acoustic Waves,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conf. Proc. Vol. 1511, pp. 1286 – 1292.

2. J. Gross, J., Kim, J.Y., Jacobs, L.J., Kurtis, K.E., and Qu, J., 2013, “Evaluation of Near Surface Material Degradation in Concrete Using Nonlinear Rayleigh Surface Waves,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conf. Proc. Vol. 1511, pp. 1309 – 1316.

3. Liu, M. Jacobs, L.J., and Qu, J. 2013, “A Chemo-Mechanical Model For The Acoustic Nonlinearity Change in Concrete with Alkali-Silica Reactions,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conf. Proc. Vol. 1511, pp. 1325 – 1332.

4. Matlack, K.H., Jacobs, L.J., and Qu, J., 2013, “Multi-Level Damage Detection with Nonlinear Ultrasonic Methods,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conf. Proc. Vol. 1511, pp. 683 – 690.

5. Tang, G., Liu, M., Jacobs, L.J., and Qu, J., 2013, “Detecting Plastic Strain Distribution by a Nonlinear Wave Mixing Method,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conf. Proc. Vol. 1511, pp. 1204 – 1211.

6. Tang, G., Jacobs, L, and Qu, J., 2012, “Wave Scattering by an Elastic Inclusion with Quadratic Nonlinearity,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conference Proceedings, Vol. 1430, pp. 269-276.

7. Liu, M., Tang, G., Jacobs, L, and Qu, J., 2012, “A Nonlinear Wave Mixing Method for Detecting Alkali-Silica Reactivity of Aggregates,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conference Proceedings, Vol. 1430, pp. 1524-1531.

8. Matlack, K. H., Kim, J. Y., Jacobs, L. J. and Qu, J. , 2011, “Feasibility of Using Nonlinear Guided Waves to Measure Acoustic Nonlinearity of Aluminum,” Health Monitoring of Structural and Biological Systems 2011, Kundu, T. Bellingham, SPIE-Int. Soc. Optical Engineering. 7984.

9. Tang, G., Jacobs, L.J. and Qu, J., 2010, “Wave propagation in elastic media with heterogeneous quadratic nonlinearity”, Review of Progress in Quantitative Nondestructive Evaluation, in press.

10. Liu, M., Tang, G., Jacobs, L.J. and Qu, J., 2010, “Measuring acoustic nonlinearity by collinear mixing waves”, Review of Progress in Quantitative Nondestructive Evaluation, in press

11. Bender, F., Kim, J.Y., Jacobs, L.J., and Qu, J., 2011 “Nonlinear Reflection of an Obliquely Incident Longitudinal Wave at a Free Surface,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conference Proceedings, to appear.

12. Rogers, D. J., Qu, J., Yao, M., 2010, “Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube - Substrate Interfaces,” New York, ASME.

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13. Cao, A., J. Qu, and M. Yao, 2010, “Atomistic simulations of heat transfer at carbon nanotube/Si interfaces ”, Proceedings - Electronic Components and Technology Conference, pp. 417-420.

14. Yang, Y., Gao, F., and Qu, J., 2010, “Molecular simulation of highly crosslinked epoxy molding compound and its interface with copper substrate,” Electronic Components and Technology Conference (ECTC), June 02-05, Las Vegas, USA: pp. 128-134.

15. Gao, F., Qu, J., Liang, F.Z., and Williams, R.L., “Interfacial failure simulation of single solder joint using a multi-scale approach,” ITHERM2010, CD Edition, June 01-04, 2010, Las Vegas, USA. (Best Paper Award)

16. Muller M.F., Kim J.Y., Qu J. and Jacobs, L.J., 2010, “On the Excitability of Second Harmonic Lamb Waves in Isotropic Plates,” Review of Progress in Quantitative Nondestructive Evaluation, Vol. 29, pp. 319-326.

17. Liu M., Kim J.Y., Qu J. and Jacobs, L.J., 2010, “Measuring Residual Stress Using Nonlinear Ultrasound,” Review of Progress in Quantitative Nondestructive Evaluation, Vol. 29, pp. 1365 - 1372.

18. Deroo F., Jacobs L.J., Kim J.Y., Qu J., Sabra K., 2010, “Damage Detection in Concrete Using Diffuse Ultrasound Measurements,” Review of Progress in Quantitative Nondestructive Evaluation, Vol. 29, pp. 1509 - 1516.

19. Rogers D.J., Qu J., Yao M., 2010, “Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube - Substrate Interfaces,” Proceedings of the ASME InterPack Conference 2009, Vol. 2, pp. 55 - 61.

20. Gao F., Qu J., Yao M., 2010, “Electronic Structure and Contact Resistance at the Interface between Carbon Nanotubes and Copper Pad,” Proceedings of the ASME InterPack Conference, Vol. 1, pp. 543 – 547.

21. Gao F. and Qu, J., 2010, “Elastic Properties of (Cu,Ni)(6)Sn5 Ternary Crystal Structure Using First-Principle Approach,” Proceedings of The ASME International Mechanical Engineering Congress and Exposition, Vol. 5, pp. 159-163.

22. Gao F., Jing J.P., Liang F.Z., Williams R.L., Qu J., 2009, “Cohesive Zone Simulation on Dynamic Fracture at the Interfaces of a Single Solder Joint,” EUROSIME 2009, pp. 743-749.

23. Gao F., Qu, J. and Yao, M., 2010, “Conducting Properties of a Contact Between Open-End Carbon Nanotube and Various Electrodes,” Proceedings of The ASME International Mechanical Engineering Congress and Exposition, Vol. 5, pp. 165 - 169.

24. Gao F., Qu J., and Takemoto T., 2009, “Additives Participation in Cu6Sn5 Phase Formed between Sn-3.5Ag Solder and Cu by First-Principle Approach,” 2009 IEEE 59th Electronic Components and Technology Conference, Vol. 1 – 4, pp. 1014-1020.

25. M. Treiber, M., Kim, J.Y., Jacobs, L.J., and Qu, J., 2009, “Characterization of Cement-Based Multiphase Materials Using Ultrasonic Wave Attenuation,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conference Proceedings, Vol. 1096, pp. 1520-1527.

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26. Braun, M., Jacobs, L.J., Qu, J. and Küchler, S., 2009, “Determination of Third-Order Elastic Constants Using Second-Harmonic Generation in an Elastic Material with Quadratic Nonlinearity,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conference Proceedings, Vol. 1096, pp 246-253.

27. Gao F., Jing J.P., Johnson J., Liang F.Z., Williams R.L., and Qu J., 2009, “Loading Direction versus Crack Propagation Path in a Lead-Free Single Solder Joint Sample,” Proceedings of the International Mechanical Engineering Congress and Exposition - 2008, Vol. 6 pp. 145 – 152.

28. Pruell, C., Kim J.Y., Qu, J. and Jacobs, L., 2009, “Evaluation of Fatigue Damage Using Nonlinear Guided Waves,” Review of Progress in Quantitative Nondestructive Evaluation, AIP Conference Proceedings, Vol. 1096, pp. 201-208.

29. Swaminathan N and Qu J., 2008, “Determination of Chemical Expansion Coefficient and Elastic Properties of Non-Stoichiometric GDC Using Molecular Dynamic Simulations,” Ceramic Engineering and Science Proceedings, Vol. 28, pp. 403 – 411.

30. Johnson J. and Qu J., 2008, “2D Digital Reconstruction of Realistic Microstructures of Porous Cermets Used in Solid Oxide Fuel Cells,” Ceramic Engineering and Science Proceedings, Vol. 28, pp. 413 – 422.

31. Jing, J., Gao, F. , Johnson, J., Liang, F.Z., Williams, R.L., Qu, J., 2008, “Simulation of Dynamic Fracture along Solder-Pad Interfaces Using a Cohesive Zone Model, Proceedings of IMECE 2008, ASME, IMECE, October 31-November 6, 2008, Boston, Massachusetts, USA, IMECE2008-68891.

32. Jing, J., Gao, F. , Johnson, J., Liang, F.Z., Williams, R.L., Qu, J., 2008, “Loading Direction Versus Crack Propagation Path In A Lead-Free Single Solder Joint Sample,” Proceedings of IMECE 2008, ASME, IMECE, October 31-November 6, 2008, Boston, Massachusetts, USA, IMECE2008-68099.

33. Prüll, C., Kim, J.-Y., Jacobs, L. J., and Qu, J., 2008, “Assessment of Fatigue Damage in Aluminum Plates Using Nonlinear Lamb Waves,” Review of Progress in Quantitative NDE, in press.

34. M. Treiber, M., Kim, J.-Y., Jacobs, L. J., and Qu, J. 2008, “Characterization Of Cement-Based Multiphase Materials Using Ultrasonic Wave Attenuation,” Review of Progress in Quantitative NDE, in press.

35. Gao, F., Qu, J., Nishikawa H., and Takemoto, T., 2008, "Temperature Dependence of Mechanical Properties of Individual Phases in Sn-3.0Ag-0.5Cu Lead-Free Solder Alloy,” Proceedings of 58th Electronic Components and Technology Conference, ECTC, 2008, pp. 466-471.

36. Qu, J. and Dingreville, R., 2008, “Modeling and Characterization of Interfaces – from an Atomistic Description to a Continuum Approach,” Proceedings – EuroSimE 2008, pp. 2 – 5.

37. Pei, M. and Qu, J., 2007, "Effect of Rare Earth Elements on Lead-Free Solder Microstructure Evolution," Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07, 2007, p 198-204.

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38. Pei, M. and Qu, J., 2007, "Hierarchal Modeling of Sn/Ag Solder Alloys," Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07, 2007, p 273-277.

39. Pei, M. and Qu, J., 2007, "Constitutive Modeling of Sn/Ag and Sn/Ag/Cu Solder Alloys," IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 118.

40. Tummala, R., Wong, C.P., Qu, J., Sitaraman, S., Raj, P.M., 2007, "Future of Packaging and packaging materials," IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interface, pp. 57.

41. Su, B. and Qu, J., 2007, "Electrical and thermomechanical Modeling of Electrically Conductive Adhesives," IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 69.

42. Dingreville, R. and Qu, J., 2007, "Modeling and characterization of the mechanical behavior of nano-sized structural elements," IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 108.

43. Swaminathan, N. and Qu, J., 2006, "A mechanical-electrochemical theory of defects in ionic solids," Ceramic Engineering and Science Proceedings, v 27, n 4, Advances in Solid Oxide Fuel Cells II - A Collection of Papers Presented at the 30th International Conference on Advanced Ceramics and Composites, p.125-136.

44. Johnson, J. and Qu, J., 2006, "Three-dimensional numerical simulation tools for fracture analysis in planar Solid Oxide Fuel Cells (SOFCs)," Ceramic Engineering and Science Proceedings, v 27, n 4, Advances in Solid Oxide Fuel Cells II - A Collection of Papers Presented at the 30th International Conference on Advanced Ceramics and Composites, p.393-405.

45. Luangvilai, K., Jacobs, L.J. and Qu, J., 2006, "An improved technique for modal decomposition of a double-mode Lamb wave signal," Proceedings of SPIE - The International Society for Optical Engineering, v 6176, Nondestructive Evaluation and Health Monitoring of Aerospace Materials, Composites, and Civil Infrastructure V, 2006, p. 61760L.

46. Qu, J., 2006, "Adhesion and Fracture of Polymer-Metal Interfaces," Proceedings of EuroSime 2006, Como, Italy, April 24 – 24, 2006.

47. Ferguson, T.P., Qu, J., 2006, "Predictive Model for Adhesion Loss of Molding Compounds from Exposure to Humid Environments," 2006 Proceedings, 56th Electronic Components & Technology Conference (IEEE Cat. No. 06CH37766C), 2006, p. 7 pp.

48. Ferguson, T.P., Qu, J., 2005, "An engineering model for moisture degradation of polymer/metal interfacial fracture toughness," 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No. 05TH8808), 2005, p 298-301.

49. Ferguson, T. P. and Qu, J., 2005 "An engineering model for moisture degradation of polymer/metal interfacial fracture toughness," Proceedings - 10th International

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Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, p 298-301 (Best Paper Award).

50. Johnson, J. and Qu, J., 2005 "A numerical simulation tool for fracture analysis in solid oxide fuel cells," Ceramic Engineering and Science Proceedings, v 26, n 4, Advances in Solid Oxide Fuel Cells. A Collection of Papers Presented at the 29th International Conference on Advanced Ceramics and Composites, 2005, p 307-314.

51. Liu, W. and Qu, J., 2005 "Creep deformation of Ni/YSZ cermet in SOFCs," Ceramic Engineering and Science Proceedings, v 26, n 4, Advances in Solid Oxide Fuel Cells. A Collection of Papers Presented at the 29th International Conference on Advanced Ceramics and Composites, 2005, p. 299-306.

52. Luangvilai, K., L. J. Jacobs and Qu, J., 2005, "Modal decomposition of double-mode Lamb waves: numerical verification and discussion on extension to general multimode leaky Lamb waves." Proceedings of the SPIE - The International Society for Optical Engineering 5768(1): 304-12.

53. Luangvilai, K., Jacobs, L.J., Wilcox, P.D., Lowe, M.J.S., Qu, J., 2005, "Broadband Attenuation Measurement for an Absorbing Plate," AIP Conference Proceedings, n 760, 2005, p 297-304.

54. Pei, M. and J. Qu (2005), "Constitutive modeling of lead-free solders," Proceedings - 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, p 45-49.

55. Su, B. and Qu, J., 2005, "Effect of filler geometry on the conduction of isotropically conductive adhesives," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging, 2006, pp. 1889-1901.

56. Su, B. and Qu, J., 2005, "Electrical contact resistance of silver with different coatings," Proceedings 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, pp. 75-78.

57. Su, B. and Qu, J., 2004, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives during Curing", Proceedings – Electronic Components and Technology Conference, pp. 1766-1771.

58. Junge, M., Jacobs, L.J., Qu, J., Jarzynski, J., La Saponara, V., 2004, "The Measurement of Applied Stresses Using the Polarization of Rayleigh Surface Waves," AIP Conference Proceedings, n 700, pt.2, 2004, p 1187-91.

59. Ferguson, T.P. and Qu, J., 2004, "Moisture and Temperature Effects on the Reliability of Interfacial Adhesion of a Polymer/Metal Interface", Proceedings - Electronic Components and Technology Conference, pp. 1752-1758.

60. Sun, Y., Zhang, R., Ma, J., and Qu, J., 2004, "A Microscopic Mechanics Model of Crack Growth with Fatigue-Creep Interaction," Proceedings of the 21st Int. Congress of Theoretical and Applied Mechanics, Warsaw, Poland, August 15-21.

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61. Dingreville, R., Qu, J. and Cherkaoui, M., 2004,"Effective elastic modulus of nano-particles," Proceedings - 9th International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, Vol. 9, p 187-192.

62. Fan, L., Su, B., Qu, J., Wong, C.P., 2004, "Effects of nano-sized particles on electrical and thermal conductivities of polymer composites," Proceedings - 9th International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, Vol. 9, p. 193 – 199.

63. Su, B. and Qu, J., 2004, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives During Curing," 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, pt. 2, p 1766-71 Vol.2.

64. Su, B. and Qu, J., 2004, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives During Curing," Proceedings - 9th International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, Vol. 9, p. 145-151.

65. Luangvilai, K., Jacobs, L.J., Qu, J., 2004, "Far-Field Decay of Laser-Generated, Axisymmetric Lamb Waves," AIP Conference Proceedings, n 700, pt.1, 2004, p 158-64.

66. Luangvilai, K., Jacobs, L.J., Wilcox, P., Lowe, M., Qu, J., 2007, "Characterization of lamb waves in absorbing plates," Proceedings of SPIE - The International Society for Optical Engineering, v 5394, Health Monitoring and Smart Nondestructive Evaluation of Structural and Biological Systems III, 2004, p 33-41.

67. Dingreville, R. , Qu, J., Cherkaoui, M., 2004, "Effective Elastic Modulus of Nano-Particles," 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742), 2004, p 187-92.

68. Ferguson, T.P, Qu, J., 2003, "Effect of moisture on the elastic modulus and interfacial adhesion of polymer-metal components in microelectronic assemblies, ASME EEP, Vol. 3, p.357-361.

69. Haynes, C.L., Qu, J., and Fedorov, A., “An Integrated Approach at Modeling and Mitigating SOFC Thermomechanical Failure,” 2003 Fuel Cell Seminar, Miami, Florida, Nov. 3-7, pp. 288-291.

70. J. Kang, J. Qu, A. Saxena and L. Jacobs, 2003, "On the Detection of Creep Damage in a Directionally Solidified Nickel Base Superalloy Using Nonlinear Ultrasound," Review of Progress in Quantitative NDE, Vol. 23, pp.1248 – 1255.

71. M. Junge, L. Jacobs, J. Qu, J. Jarzynski, and V. Saponara, 2003, "Measurement of Applied Stress Using the Polarization of Rayleigh Surface Waves," Review of Progress in Quantitative NDE, Vol. 23, pp.1187 – 1190.

72. K. Luangvilai, L. Jacobs, and J. Qu, 2003, "Far-Field Decay of Laser-Generated, Axisymmetric Lamb Waves," Review of Progress in Quantitative NDE, Vol. 23, pp.158 – 164.

73. K. Luangvilai, L. Jacobs, and J. Qu, 2003, "Propagation of Guided Lamb Waves in Concrete Repaired with Composite Plates," Proceedings of SPIE - The International Society for Optical Engineering, v 5057, 2003, p 85-90.

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74. Matthias, M., Jacobs, L., and Qu, J., 2002, "Nonlinear Wave Propagation in Silicon Rubber Using Bifrequency Signals and Laser Detection, AIP Conference Proceedings, n 615B, 2002, p 1369-76.

75. S. K. Bhattacharya, S. K. Sitaraman, I. C. Ume, J. Qu, C. P. Wong, D. F. Baldwin, R. R. Tummala, 2001, “Large Area processing Using Small Area Substrates: a Low-Cost MCM-D Thin Film Processing,” Proceedings of INTERPACK’01, The Pacific/RIM ASME, International Electronics Packaging, Technical conference and Exhibition, July 8-13, Kauai, USA.

76. Ferguson, T.P. and Qu, J., 2001, "Moisture Absorption in No-Flow Underfill Materials and Its Effect on Interfacial Adhesion to Solder Mask Coated FR4 Printed Wiring Board," Proceedings of International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562), p. 327-32.

77. Meurer, T., Qu, J., and Jacobs, L. J., 2001, “One-Dimensional Pulse Propagation in a Nonlinear Elastic Medium,” Advanced Nondestructive Evaluation for Structural and Biaological Health Monitoring, ed. Kundu, T., SPIE Vol. 4335, pp., 202-219.

78. Meurer, T. ,Jacobs, L.J., Qu, J., 2001, "Application of Nonlinear Ultrasonic Waves to Characterize Hysteretic Materials," AIP Conference Proceedings, n 557B, 2001, p 1242-7.

79. Niethammer, M., Eisenhardt, C., Jacobs, L.J., Jarzynski, J. and Qu, J., 2000, “Application of the Short Time Fourier Transform to Interpret Ultrasonic Signals,” Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 19A, pp. 703-708.

80. Schubert, A., Dudek, R., Leutenbauer, R., Doring, R. Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P., and Tummala, R., 2000, "Numerical and Experimental Investigation of Large IC Flip Chip Attach," Proceeding of 50th Electronic Components and Technology Conference, Las Vegas, Nevada, May 21-24.

81. Eisenhardt, C., Jacobs, L.J., and Qu, J., 2000 “Experimental Lamb Wave Spectra of Cracked Plates, Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 19A, pp. 343-349.

82. Valle, C., Qu, J., and Jacobs, L., 2000, “Scattering of Circumferential Waves in a Cracked Annulus,” Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 19A, pp. 217-224.

83. Rao, Y., Qu, J., Wong, C.P. and Marinis, T., 2000, “Self-Consistent Model for Dielectric Constants Prediction of Polymer-Ceramic Composites,” IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials.

84. Shi, S.H., Yao, Q., Qu, J. and Wong, C.P., 2000, “Study on the Correlation of Flip-Chip Reliability with Mechanical Properties of No-Flow Underfill Materials, IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, pp. 271-277.

85. Rao, Y., Wong, C.P., Qu, J. and Marinis, T.,2000, "Effective Dielectric Constant Prediction of Polymer-Ceramic Composite Based on Self-Consistent Theory,"

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Proceeding of 50th Electronic Components and Technology Conference, Las Vegas, Nevada, May 21-24.

86. G. Liu, J. Qu and L. Jacobs, 2000, "Effects of Cure State on the Ultrasonic Nonlinear Parameter in Adhesive Joints," ASME AMD-Vol. 240, pp. 83-94.

87. Q. Yao and J. Qu, 2000, "Interfacial versus Cohesive Failure on Polymer-Metal Interface- Effects of Interface Roughness," ASME EEPD-Vol.

88. T. Ferguson and J. Qu, 2000, "Effect of Moisture on the Interfacial Fracture Toughness of Underfill/Solder Mask Interfaces, ASME EEPD-Vol.

89. Valle, C., Qu, J., Jacobs, L. J., 1999, "On the Steady-State Characteristics of Circumferential Waves in s Two-Layered Cylinder," American Society of Mechanical Engineers, Applied Mechanics Division, AMD, v 234, 1999, p 99-105.

90. Kely, M., Jacobs, L., Valle, C., Qu, J., and Jarzynski, J,1999 "Development of Dispersion Relationship for layered Cylinders Using Laser Ultrasonics," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 18A, pp.263-268.

91. Liu, G., Qu, J., Jacobs, L., and Li, J., 1999, “Characterizing The Curing of Adhesive Joints by a Nonlinear Ultrasonic Technique,” Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 18B, p2191-2199.

92. Valle, C., Qu, J., and Jacobs, L.,1999 “On The Dispersion And Displacement Distribution of Circumferential Waves In a Composite Circular Cylinder,” Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 18A, pp.247-254.

93. Yao, Q. and Qu, J., 1999 "Effects of PWB Size on The Warpage of Flip Chip Assemblies," ASME, EEP-Vol. 26-1, Advances in Electronic Packaging, pp.27 – 31.

94. Yao, M., Qu, J., and Wu, S.,1999 "Thermomechanical Fatigue Life of Chip Scale Packages," ASME, EEP-Vol. 26-2, Advances in Electronic Packaging, pp.1533 – 1538.

95. Yao, Q., Qu, J. Wu, J., and Wong, C.P.,1999, "Adhesion Enhancement of Underfill Materials by Silane Additives," IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, p.27-30.

96. Liu, G., Qu, J., Jacobs, L., and Li, J., 1999, “Characterizing the Curing of Adhesive Joints by a Nonlinear Ultrasonic Technique,” Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 18B, p2191-2199.

97. Rao, Y., Wong, C.P., and, Qu, J., 1999, "Electrical and Mechanical Modeling of Embedded Capacitors" IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, p.158-162.

98. Yao, Q., and Qu, J., 1999, "Effect of Thermal Residual Stresses on the Apparent Interfacial Toughness of Epoxy/Aluminum Interface," IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, p.333-336.

99. Liu, G. and Qu, J.,1999, "Characterizing Adhesive Curing by Nonlinear Ultrasonic Techniques," Proceeding of the 2nd Japan-US Symposium on Advances in NDT, pp.52-58. June 21-25.

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100. Yao, M., Qu, J., and Wu, S., 1999, "Estimate the Thermomechanical Fatigue Life of a Flip Chip DCA," Proceeding of 49th Electronic Components and Technology Conference, pp.797-802, San Diego, CA, June 1-4.

101. Yao, M., Qu, J., Wu, J., and Wong, C.P., 1999, "Effect of Thermal Residual Stresses on the Apparent Polymer/Metal Interfacial Toughness," Proceeding of 49th Electronic Components and Technology Conference, pp.365-368, San Diego, CA, June 1-4.

102. Yao, M., Qu, J., Wu, J., and Wong, C.P., 1999, "Quantitative Characterization of Interfacial Toughness Enhancement by Silane Additives," Proceeding of 49th Electronic Components and Technology Conference, pp.1079-1082, San Diego, CA. June 1-4.

103. Yang, Wong, C.P., and Qu, J., 1999, "Electric and Mechanical Modeling of Embedded Capacitors," Proceeding of 49th Electronic Components and Technology Conference, pp.506 – 509, San Diego, CA. June 1-4.

104. Qu, J., Liu, G., Jacobs, L., 1999, "Using Ultrasonic Nonlinear Parameter to Characterize the Curing of Adhesive Joints," ABSTR. PAP. AM. CHEM. S., Vol. 218, pp. 125-PMSE, (SCI).

105. Yao, M. and Qu, J.,1999, "Effect of Thermal Residual Stresses on the Apparent Polymer/Metal Interfacial Toughness," ABSTR. PAP. AM. CHEM. S., Vol. 218, pp. 125-PMSE, (SCI).

106. Schubert, A., Dudek, R., Leutenbauer, R., Doring, R. Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P., and Tummala, R.,1999, "Do Chip Size Limits Exist for DCA?" IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, pp.150-157.

107. Qu, J. and Xue, Y., 1999, "Three-Dimensional Interface Cracks in Anisotropic Bimaterials,” Proceeding of the 6th Annual International Conference on Composite Engineering, pp. 671 – 672, Orlando, FL., June 24 – July 3.

108. Yao, Q. and Qu, J., 1999, "Solder Fatigue Life in Two Chip Scale Packages,” Proceedings of IEEE-IMAPS International Symposium on Microelectronics, pp. 563 – 570, Chicago, IL., October 25 – 28.

109. Yao, Q. and Qu, J., 1999, "Effects of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion,” ASME MD-Vol. 88, pp.25-28.

110. Moser, F., Valle, C., Jacobs, L.J., and Qu, J.,1998, "Application of Finite Element Methods to Study Transient Wave Propagation in Elastic Wave Guides," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 16A, p.161-167.

111. Liu, G. and Qu, J.,1998, "Guided Transient Waves in a Circular Annulus," Review of Progress in Quantitative NDE, Vol. 16A, p.153-160.

112. Qu, J. and Liu, G., 1998, "Effect of Residual Stress on Guided Waves in Layered Media," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 16B, p.1635-1642.

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113. Qu, J. and Wong, C.P., 1998, "Effective Thermomechanical Properties of Underfill Materials for Flip-Chip Packaging Applications," Proceeding of 48th ECTC, p.848-850.

114. Yao, Q. and Qu, J., 1998, "Finite Element Modeling and Deflection of Flip-Chip Package under Thermal Loading,” ASME MED-Vol. 8, pp.779-787.

115. Wong, C.P., Rao, Y., Qu, J., and Wu, Sean, 1998, "Creep Behavior Characterization of Some New Materials for High Density Interconnect Substrates Using Dynamic Mechanical Analyzer," Proceeding of 4rd Int. Symposium on Advanced Packaging Materials, March 15-18, Braselton GA, p.73-76.

116. Veazie, D. R., Lindsay, J. and Qu, J., 1998, "Characterizing Adhesive Joints Using An Interfacial Fracture Mechanics Approach," Proceedings of the SEM Spring Conference on Experimental and Applied Mechanics, Houston, TX, June 1 - 3.

117. Veazie, D. Qu, J. and Lindsay, J., 1998, "Effects of Elevated Temperature Aging on the Fracture Toughness of Adhesive Joints," Proceeding of the Eighth Japan - US Conference on Composite Materials, Baltimore, Maryland, Sept 24-25.

118. Kuhl, A.M. and Qu, J., 1998"A Technique to Measure Interfacial Fracture Toughness," Proceedings of the 21st Annual Meeting of the Adhesion Society, p.105-107.

119. Qu, J. and Yao, M., 1998, "Three Dimensional Finite Element Modeling of Flip Chip Packages under Thermal Loading," Proceedings of the 3rd Int. Symposium on Electronic Packaging Technology, pp. 271-275.

120. Qu, J. and Kuhl, A., 1998, "Interfacial Fracture Toughness between Cu and Several Underfill Materials," Proceedings of the 3rd Int. Symposium on Electronic Packaging Technology, pp.276-280.

121. Bulsara, V.N. Talreja, R. Qu, J.,1997, "Damage in ceramic matrix composites with arbitrary microstructures," ASME MD-Vol. 80, pp. 441-446.

122. LeGall, C. A., Qu, J., and McDowell, D. L., 1997, "Influence Of Die Size On The Magnitude Of Thermomechanical Stresses In Flip Chips Directly Attached To Printed Wiring Board," Advances in Electronic Packaging, EEP-Vol. 19-2, p. 1663-1670.

123. LeGall, C. A, Qu, J., and McDowell, 1997, "Thermomechanical Stresses in an Underfilled Flip Chip DCA," Proceeding of 3rd Int. Symposium on Advanced Packaging Materials, March 9-12, Braselton GA, p.128-129.

124. Wong, C.P., Tummala, R., Qu, J., and Sitaraman, S.,1997, "Microelectronic Packaging Trends - Role of Reliability in Particularly Related to Solder Joints Reliability," in Design and Reliability of Solders and Solder Interconnections, ed. By R.K. Mahidhara, D.R., Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw and W.L. Winterbottom, The Minerals, Metals and Materials Society, p. 3-8.

125. LeGall, C. A, Qu, J., and McDowell,1997, "Some Mechanics Issues Related To The Thermomechanical Reliability Of Flip Chip DCA With Underfill Encapsulation," ASME, EEP-Vol. 222, p.85-95.

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126. McDowell, D.L., Neu, R.W., Qu, J. and Saxena, A.,1997, "Prognostic Tools for Small Cracks in Structures," Emerging Technologies for Machinery Health Monitoring and Prognosis, ASME, TRIB-Vol. 7, p. 1-12.

127. Bulsara, V. N., Talreja, R. and Qu, J.,1997, "Damage in Ceramic Matrix Composites with Arbitrary Microstructures”, in Composites and Functionally Graded Materials, MD-Vol. 80, T. S. Srivatsan, et al., Eds., American Society of Mechanical Engineers, pp. 441-446.

128. Qu, J., Berthelot, Y., and Li, Z., 1996, "Dispersion of Guided Circumferential Waves in a Circular Annulus," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 15A, p. 169-176.

129. LeGall, C., McDowell and Qu, J., 1996, "Delamination Cracking in Encapsulated Flip Chips," Proceeding of 46th ECTC, p.430-443.

130. Qu, J. and Hoiseth, K., 1996, "Evolution of Transverse matrix Cracking in Cross-Ply Laminates," Progress in Advanced Materials and Mechanics, ed. by T. Wang and T.W. Chou, Peking University Press, p.1207.

131. Bulsara, V.N., Telreja, R. and Qu, J., 1996, "Using Spatial Descriptors To Identify Damage Initiation In Nicalon/MAS-5," Proceedings of the 11th Technical Conference On Composites, ASC, p. 10.

132. Shepherd, R., Qu, J., and Wu, Tien,1995, "Process-Induced Residual Stresses in a Glob Top Encapsulated Silicon Chip," Application of Fracture Mechanics in Electronic Packaging and Materials, ASME, EEP-Vol. 11, p.109-122.

133. Qu, J., 1994, "Guided Waves in an Anisotropic Layer Sandwiched Between Anisotropic Solids," Review of Progress in Quantitative NDE, Vol. 13, p.1391-1398.

134. Qu, J., 1994, "Scattering of Elastic Waves by Interface Cracks," Review of Progress in Quantitative NDE, Vol. 13, p.53-60.

135. Littles, J., Jacobs, L. and Qu, J., 1994, "Laser Interferometric Investigation of Scattering from A Distribution of Cracks," Review of Progress in Quantitative NDE, Vol. 13, p.61-68.

136. Qu, J.,1993, "Effects of Roughness on the Reflection Coefficient," Review of Progress in Quantitative NDE, 12, p.1783 - 1790.

137. Qu, J., 1993, "Reflection of Elastic Waves by an Array of Interface Cracks," Review of Progress in Quantitative NDE, 12, p.99 - 106.

138. Jacobs, L. and Qu, J., 1993, "Nondestructive Characterization of Damaged Bonds," Review of Progress in Quantitative NDE, 12, p.1587 - 1594.

139. Qu, J. 1993, "Reflection of Elastic Waves By a Randomly Cracked Interface," ASME, AMD-177, Ultrasonic Characterization and Mechanics of Interfaces.

140. Qu, J., 1992, "Reflection and Scattering by a Slightly Undulating Interface,"Review of Progress in Quantitative NDE, 11, p.41 - 48.

141. Qu, J., 1992, "Wave Reflection at a Slightly Undulating Interface," ASME, NCA, 14, Vibro-Acoustic Characterization of Materials and Structures, p. 73 - 77.

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142. Jacobs, L. and Qu, J., 1992, "Reflection and Scattering by a Traction-Free Surface with Small Defects," Review of Progress in Quantitative NDE, 11, p.1609 - 1614.

143. Qu, J., 1991, "Wave Scattering by an Inclusion with Imperfect Interface with the Matrix," Review of Progress in Quantitative NDE, 10, p.1281 - 1288.

144. Qu, J. and Yang, L.,1991, "Interaction of Dislocations in Anisotropic Bimaterials," Recent Development in Elasticity, AMD, 124, p.13 - 21.

145. Qu, J.,1990, "Low Frequency Scattering by a Planar Crack," Review of Progress in Quantitative NDE, 9, p.61-68.

146. Bassani, J.L. and Qu, J.,1989, "Interfacial Discontinuities and Average Bimaterial Properties," Acta/Scripta Metallurgica Proceedings Series, 4, pp. 401-406.

147. Qu, J. and Bassani, J.L., 1989, "Interface Cracks Between Anisotropic Elastic Solids," Acta/Scripta Metallurgica Proceedings Series, 4, pp. 407-412.

148. Qu, J. and Achenbach, J.D. and Roberts, R.A., 1988, "Backscattering from Porosity in Fiber-Reinforced Composites," Mechanics of Composite Materials, ed. By G. J. Dvorak and N. Laws, ASME, AMD-Vol. 92, p.69 - 77.

149. Qu, J., 1988, "Elastic Wave Scattering by Macro-Micro Crack Configurations," Review of Progress in Quantitative NDE, 8, p.79 - 86.

150. Qu, J. and Achenbach, J.D.,1987, "Backscattering from Porosity in Cross-Ply Composites," Review of Progress in Quantitative NDE, 7, p.1029 – 1036.

151. Qu, J. and Achenbach, J.D., 1986, "Analytical Treatment of Polar Backscattering from Porous Composites," Review of Progress in Quantitative NDE, 6B, p.1137 - 1146.

152. Achenbach, J.D. and Qu, J., 1985, "Backscattering from Flaw Distribution in Composite Materials," Review of Progress in Quantitative NDE, 5B, p.1179 – 1187.

153. Qu, J.1993, "Characterization of Interfaces from Ultrasonic Data," ASME, NCA-14/AMD-172, Dynamic Characterization of Advanced Materials, p.107 - 116.

154. Qu, J.1993, "Scattering of Elastic Waves by an Interface Crack," ASME, NCA-14/AMD-172, Dynamic Characterization of Advanced Materials, p.201 - 214.