INVESTOR PRESENTATION

JULY 2015

Safe Harbor Statement

This presentation contains statements about management's future expectations, plans and prospects of our business that

constitute forward-looking statements, which are found in various places throughout the press release, including , but not

limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of

purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of

words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,

“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking

statements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitutes forward

looking statements. While these forward looking statements represent our judgments and expectations concerning the

development of our business, a number of risks, uncertainties and other important factors could cause actual developments

and results to differ materially from those contained in forward looking statements, including the discovery of weaknesses in

our internal controls and procedures, our inability to maintain continued demand for our products; the impact on our

business of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipated

orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for

semiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline,

loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts of

terrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing and

protect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations,

political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations;

potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; those

additional risk factors set forth in Besi's annual report for the year ended December 31, 2014 and other key factors that

could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory

consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our

forward-looking statements whether as a result of new information, future events or otherwise.

2 July 2015

Agenda

I. Company Overview

II. Market

III. Strategy

IV. Financial Review

V. Outlook & Summary

3 July 2015

I. COMPANY OVERVIEW

4 July 2015

Besi Overview

• Leading assembly equipment supplier with #1 and #2 positions in key products. 28.5% addressable market share

• Broad portfolio: die attach, packaging and plating

• Strategic positioning in substrate and wafer level packaging

• Global mfg. operations in 7 countries; 1,684 employees worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• LTM revenue and net income of € 391.7 and € 74.2 million

• Cash at 6/30/15: € 113.7 million

• Total debt at 6/30/15: € 22.3 million

• € 114 million of dividends and share repurchases since 2011

Financial Highlights

• Growth of <20 nano advanced packaging, smart phones, wearable devices, auto electronics, IoT, wire bond/flip chip conversion and market share gains offer revenue upside

• Significant unrealized earnings potential from optimization of Asian production, supply chain efficiencies and development of common parts/platforms

Investment Considerations

5 July 2015

€ 85.5

€ 391.7

25.9%

46.5%

20%

25%

30%

35%

40%

45%

50%

55%

0

100

200

300

400

2003 LTM

Gro

ss M

arg

in (

%)

Reven

ue

(€

mill

ion

s)

Revenue Gross Margin

Company History

•2000 2002 2005 2009

Die Attach Acquisitions

•2006 Dragon I complete: € 6 million cost savings

•2008 Dragon II complete: € 15 million cost savings

•2010 Plan: € 7.0 million cost savings. Headcount and product line restructuring

•2012 : € 8.3 million cost savings. Headcount reduction. Plating unit rationalized

•2014: US die sorting operations rationalized. Transferred to Besi Austria

Restructuring

•2006-09 Standard packaging and certain die bonding systems transferred to Malaysia

•2007-09 Dutch tooling & Hungarian die bonding transferred to Asia

•2009-11 Epoxy die bonder transferred to Malaysia

•2003-12 Malaysian system and Chinese tooling capacity expansion.

•2013 Soft solder die bonder transferred to Malaysia

•2006-14 Asian headcount increased from 34% to 59%

•2015: Transfer of certain software engineering, logistics and related administrative functions from Switzerland to Singapore

•2015: Transfer of plating production from NL to Malaysia

Asian Production Transfer

6 July 2015

Best in Class Product Portfolio

• Molding - AMS series - AMS LM 95 - MMS series - FML

• Die Bonding - 2100 xPplus

- 2100 sDplus - 2100 sD PPPplus

- 2100 hS

- 2009 SSI - 2100 DS - 2100 SC

Die Attach Packaging & Plating

• Multi Module Die

Attach - 2200 evo - 2200 evo plus

• Flip Chip - 8800 FCQ Sigma - 8800 CHAMEO - 8800 TCB - 2100 FC

• Trim & Form - Compact series - Power series - Compact Line XHD New

• Plating - Leadframe - Solar - Film & Foil

In Development

•Next generation Die Attach

•Next generation Packaging

•Common modules

Datacon/Esec

Datacon

Esec

Fico

Meco

Fico

New

Fico

• Singulation

- FSL

New

New

• Die Sorting - DS 9000E - WTT - TTR - DLA

Datacon

New

New

New

New

7

New

New

July 2015

Dicing

Semiconductor Assembly Process

Die Attach Wire Bond Packaging Plating

Leadframe Assembly

Substrate

Wire Bond Assembly

Substrate

Flip Chip Assembly

Wafer Level Packaging

Flip Chip Assembly

Wire Bond

Die Bond

FC Die Bond

FC Die Bond

Molding

Molding

Molding

Trim & Form

Singulation

Singulation

Singulation

Plating

Ball Grid Array

Ball Grid Array

Die Sort

Die Sort

Die Sort

Die Attach Packaging Ball Attach

Product Positioning

8

Semiconductor Manufacturing Equipment (2014: $40.1B)

Front end: $32.2B (80%) Assembly: $4.0B (10%) Test: $3.9B (10%)

July 2015

Customers OEMs End Products

Customer Ecosystem

• Blue chip customer base, top 10 = 60% of 2014 revenue

• Leading IDMs and subcontractors. 60/40% split in 2014

• Equipment utilized to produce chips for leading fabless companies: Qualcomm,

Broadcom, MediaTek

• Long term relationships, some exceeding 45 years

IDMs

Subcontractors

9 July 2015

Current Operational Profile

as of 30 June 2015

Europe/NA Asia

Revenue (MMs) € 59.3 30.0% € 139.9 70.0%

Headcount 681 40.4% 1,003 59.6%

• Development activities in Europe

• Production and sales/service activities in

Asia

Sales Office

Production Site

Sales & Production Site

* R&D Site

Leshan

Chengdu Shanghai

Korea

Taiwan

Philippines Malaysia

Singapore*

Suzhou

Radfeld, (Austria)* Cham,

(Switzerland)*

Duiven & Drunen,

(The Netherlands)*

Chandler

Shenzhen

10 July 2015

Year Ended December

31,

(€ millions, except share

data) 2012 2013 2014

H1

2014

H1

2015

Revenue 273.7 254.9 378.8 186.2 199.2

Orders 276.1 251.9 407.6 235.3 196.1

Gross margin 40% 40% 44% 43% 48%

EBITDA 32.4 27.9 82.1 38.5 46.3

Pretax income 19.5 19.2 71.3 33.2 37.7

Net income 15.8 16.1 71.1 29.9 33.0

EPS (diluted) 0.42 0.43 1.87 0.79 0.86

Net margin 6% 6% 19% 16% 17%

Net cash 79.5 71.0 118.0 62.5 91.4

Summary Historical Financials

• Record 2014 Results:

• Revenue and orders +48.6% and 61.8%

• Gross Margin +4.0% to 43.8%

• Net Income +341% to € 71.1 million

• Net cash +€ 47.0 million

• Primary drivers:

• Industry rebound

• Strategic positioning in advanced packaging

has accelerated market share gains

• Enhanced profit potential of business model

• Operating initiatives have supported gross

and net margin development

• Solid liquidity base to finance growth and

shareholder returns

11 July 2015

Stock Price Information

• € 940 million ($1.04 billion) market capitalization as of June 30, 2015

• Upgraded to Euronext AMX mid cap index in March 2015

Market profile improving:

• Average daily volume:

• 2013: 99,811

• 2014: 117,084

• 2015: 238,312

Liquidity has increased significantly over past three years:

• Top 10 shareholders ≈ 30% of shares outstanding. Down from ≈ 60% in 2011

• Largest shareholder less than 7% currently

Share concentration has reduced:

• 40% NL

• 30% US

• 30% Europe ex NL

Geographic ownership has diversified:

• 6.6% currently

• Dividend payout ratio of between 40-80% net income per annum

Highest dividend yield among peers

12 July 2015

Dividend Trends

0.20 0.22 0.30 0.33

1.50

1.25

0.73

0.42 0.43

1.87

4.0%

4.3%

5.2%

4.0%

8.1%

0.0%

2.0%

4.0%

6.0%

8.0%

10.0%

12.0%

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

2010 2011 2012 2013 2014

Div

ide

nd

yie

ld

Div

iden

d (€)

Dividend EPS (diluted) Total Dividend Yield (a)

a) Based on year end stock price

16% 30% 71% 77% 80% Payout Ratio:

13 July 2015

II. MARKET

14 July 2015

Assembly Equipment Market Trends

15 July 2015

• VLSI forecasts flat growth in 2015 and 2016 after big 2014 increase as capacity digested

• Growth reaccelerates in 2017 and 2018

• Besi revenue growth exceeding assembly market in 5 of past 6 years

326.9

273.7 254.9

378.8

186.2 199.2

-16.3% -6.9%

48.6%

7.0%

-50%

0%

50%

100%

150%

-

100.0

200.0

300.0

400.0

2011 2012 2013 2014 YTD 2014 YTD 2015

(€ m

illi

on

s)

Besi Revenue Revenue YoY Growth Rate

4.4 4.0

3.1

4.0 4.0 3.9

4.6 4.9 4.8

-9.2%

-22.4%

29.1%

1.6% -2.5%

16.3% 7.7%

-2.3%

-30%

-20%

-10%

0%

10%

20%

30%

40%

0.0

1.0

2.0

3.0

4.0

5.0

6.0

2011 2012 2013 2014 2015F 2016F 2017F 2018F 2019F

(US

$ b

illi

on

s)

Assembly Equipment Market Size YoY Growth Rate

Source: VLSI May 2015

Die Bonding 39.7%

Flip Chip 15.8%

Die Sorting 3.0%

Singulation 9.3%

Presses 11.2%

Molds 13.5%

Lead Trim & Form 5.5%

Plating 2.0%

Assembly Equipment Market Composition

• Half of assembly market represented by die attach and packaging equipment

• Die Attach represents Besi’s largest addressable market

Die Attach

59%

Packaging

39%

Plating

2%

Assembly Equipment Market *

(2014: $4.0 billion) Besi Addressable Market *

(2014: $1.7 billion)

* Source: VLSI May 2015

Wire Bonding 21.7%

Die Attach 29.7% Packaging

21.8%

Plating 0.9%

Other Assembly

(Inspection, Dicing) 25.9%

16 July 2015

Advanced Packaging Unit Volume and Market Share Are Increasing

• Advanced Packaging (Flip Chip/WLP) is fastest growing assembly process

• In growth phase with move to <20 nano internet device applications

Source: VLSI February 2015

10%

13%

19%

26%

31% 32%

34% 35%

37% 38%

0%

5%

10%

15%

20%

25%

30%

35%

40%

-

5

10

15

20

25

30

35

40

45

2010 2011 2012 2013 2014 2015 2016 2017 2018 2019

AP

Ma

rket

Sh

are

%

M w

afe

rs, 3

00

MM

Eq.

Advanced Packaging Silicon Demand Growth & Market Share 2010 - 2019

Advanced Packaging Wafers

Advanced Packaging Unit Market Share (%)

CAGR 2010-2019: 21.1%

CAGR 2014-2019: 10.3%

17 July 2015

Driven Primarily by Growth in Internet Connected Devices

• Key End Use Applications:

• Mobile internet devices,

connectivity, computing power,

Big Data analytics, automotive

• 35% CAGR device growth

forecast over next 5 years

• Powered primarily by devices

used for IoT

• Positive trajectory for smart

phones, tablets, wearables, and

automotive

18 July 2015

Requiring Changes in Process/Equipment Development

19

Today=> Tomorrow Front End

Transistor Scaling

Lithography

New Structures 3D

Back End Assembly

More Contacts

Smaller Pitches

Thinner/denser

more complex packages

Stacked Structures 3D

From Simple Wire Bond to BGA/Flip Chip to Complex 3D structures with TSVs,

Microbumps and thin dies

July 2015

• Spending on <25 nano nodes has increased from ~15% in 2011 to an estimated 70% of

total spending in 2015

• Node shift below 25 nano = new assembly equipment capacity

Which Has Significantly Increased Equipment Spending for < 25 Nano Nodes

20 July 2015

Advanced Packaging Growth Favors Besi

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage

• <20 nanometer geometry will be the standard chip design over the next 3-5 years

• System on Chip or System in Package via substrate and wafer level packaging process is the only answer

• Besi has full range of AP systems. 2014E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach

• Die Sorting: DS 9000

• Die Bonding: ES 2009, ES2100

• Flip Chip: DC 8800, ES2100

• TCB: DC 8800 TCB

• Multi Module: DC evo 2200

Packaging

• Molding: AMS-LM 95

• Singulation: FSL

High Growth End

User Areas:

Mobile internet

devices, Autos,

MEMS, Big Data,

Cloud Servers, IoT,

Wearable devices

Datacon Esec Fico

21 July 2015

Computer,

PCs50%

Mobile

Internet Devices

22%

Auto13%

Industrial

10%

LED3%

Service

2%

2008

And Is Reflected in Besi End User Application Trends

Computer,

PCs20%

Mobile Internet Devices

35%

Auto17%

Industrial

10%

LED

3%

Spares/ Service

15%

2014

Source: 2014 Company Estimates

• Mobile internet devices

now equal 35% of

Besi’s end user

revenue

• Automotive has also

increased significantly

in recent years

• Service/spare parts

have grown to 15%.

Less cyclical revenue

stream

22 July 2015

New Smart Phone Designs Increase Besi’s Addressable Market Potential

• Besi systems can assemble 50% of 2012 generation components and 70% of 2014 generation components

- New Main Components

Generation

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

Processor X X Apple TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LMDRAM Memory X X Hynix/Micron Hynix/Micron 2100sD, FSLNAND Flash X X Hynix/Toshiba Hynix/Amkor/Toshiba 8800FCQ, AMS-W/LMPower Management

Apple PM IC X Dialog Dialog 2100sDPMIC X X Qualcomm N/A

M3 Microcontroller X NXP Amkor/NXP 8800FCQ, AMS-W/LMAccelerometer/Gyroscope/Barometric

Gyroscope X X Invensense Amkor/ASE/STM 2100xP, 2100sD, AMS-W/LM, FCL3-ax accelerometer X Bosch Bosch evobarometric sensor X Bosch Bosch evo

CommunicationsGeneration

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

Wifi/NFCWifi module X X Murata Murata Murata's equipmentNFC X NXP Amkor 8800FCQ, AMS-W/LMNFC Booster IC X AMS Daca N/A

LTELTE Modem X Qualcomm Amkor/Stats/Spil/ASE 8800FCQ, AMS-W/LMLow Band LTE PAD X Skyworks Skyworks 2200evo, FSLMid Band PAD X Skyworks Skyworks 2200evo, FSLHigh Band PAD X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM

Receiver/TransceiverRF Transceiver X X Qualcomm Amkor 2100xP, 2100sD, AMS-W/LMRF Receiver X X Qualcomm N/AEnvelop Tracking IC X Qualcomm TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM

Antenna Switch X X RFMD Amkor/ASE,/RFMD 2100xP, 2100sD PA

PA X X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LMPA Module X Triquint ASE 2200evo, 2100sD

Video/AudioGeneration

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

CameraBack side 8M (OSI) X X Apple LG, Sharp, Mitsumi 2200evoFront 1.2M X X Apple Cowell, Sony 2200evo

Finger print sensor X Apple ASE 2200evoAudio

2+4 microphones X ST ST 2100 xpAudio Codec X X Cirrus Logic Amkor 2100xP, 2100sD, AMS-W/LM

Touch screen controlTouch screen control X X Broadcom Signetics 2100sDTouch Transmitter X TI TI FCL

23 July 2015

Flip Chip/Wire Bond Process Shift Is Another Revenue Opportunity

Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Offers higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

* Source: VLSI May 2015

24

• Move to <20 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 29% currently of total potential market of $1.2 billion

• Flip chip expected to gain share over next 5 years

• Growth could accelerate depending on adoption rates by key IDMs/subcons

CAGR 2014 - 2019*

Flip Chip 7.4%

Wire Bond 2.9%

Flip Chip $508 34%

Wire Bonding

$994 66%

2019*

Flip Chip $356 29%

Wire Bonding

$861 71%

2014*

July 2015

Thermo Compression Bonding Is An Emerging Assembly Technology

TCB: Next Die Bonding Process Evolution:

• Besi has most advanced industry concept

• 7 Axis bondhead, 2 bond heads/system

• High throughput => 2x competition

• User friendly compact design

• Principal competition: ASM PT, KLIC (in development)

• Orders significantly expanded in 2015

• Production transferred to Besi APac to reduce cost

• Memory producers first TCB adopters

• Issue: Memory performance lags CPU performance

• Solution: Advanced stacking design using TCB/TSV

• 15x Higher transfer speeds

• 70% Less energy per bit

• 90% Less space

• Wire bonding process eliminated

25 July 2015

Wire Bonded BGA Stacked Die Memory Device

TSV TCB Memory Cube

Wire Bond connections replaced by direct connection

Besi TCB System

Besi Has Gained Share In Its Addressable Markets

• Gaining share in fastest growing segments of the assembly equipment market:

• Flip chip and multi module die attach and ultra thin molding for advanced

packaging applications

Besi Market Share

Source: VLSI, May 2015 and Besi estimates 2012 2013 2014

Total Assembly Equipment Sales 8.6% 10.6% 12.7% Besi Addressable Market 21.4% 26.0% 28.4%

Total Die Attach Equipment 26.8% 31.2% 34.7% Die Bonding 29.7% 39.2% 38.7% Flip Chip 22.2% 24.4% 31.8% Other 17.1% 4.8% 9.1%

Total Packaging Equipment 11.1% 15.9% 16.4% Molds 12.0% 19.1% 19.5% Lead Trim & Form 15.0% 17.6% 19.0% Singulation 5.3% 5.1% 6.8%

Total Plating 75.8% 82.3% 75.4%

26 July 2015

• Customers are largest semi mfrs.

• Engaged in most advanced

packaging applications

• Strong customer market shares:

• 50 - 100% of die attach

requirements

• 25 - 100% of packaging

requirements

• Customer market shares p.a. vary

based on capacity needs and

purchasing cycles

• Primary competition:

• Die Attach: ASM-PT, Hitachi,

Shinkawa, Panasonic, Toray

• Packaging: Towa, Hanmi,

ASM-PT

And With Leading Edge Technology Customers

N/B No reported bookings for Besi or its competitors

a) Year to date through April 30, 2015

b) Merger pending

c) Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly

production done by subcontractors

d) In general, Samsung satisfies approximately 50% of its equipment needs internally

Die Attach Packaging

In USD 2012 2013 2014 2015 (a) 2012 2013 2014 2015 (a)

Subcontractors ASE 67% 59% 69% 74% 36% 65% 36% 28%

Amkor 75% 84% 89% 100% 45% 11% 22% 38%

JCET (b) 75% 48% 67% N/B 0% 8% 0% N/B

STATSChippac (b) 95% 100% 85% N/B 28% 100% 100% N/B

SPIL 47% 93% 89% 100% 37% 76% 19% 38%

Nantong Fujitsu N/B 72% 100% 100% N/B 14% 0% 100%

UTAC N/B N/B 100% 100% N/B 100% N/B 100%

Unisem 92% 84% 100% 100% N/B N/B N/B N/B

Cowell/Foxconn

100% N/B 100% 100%

(Camera Modules) N/B N/B N/B N/B

IDMs (c) Skyworks 100% 96% 100% N/B 13% 24% 38% 100%

ST Micro 91% 72% 78% 94% 44% 76% 42% 46%

Infineon 81% 97% 100% 100% 0% 24% 90% 100%

Micron 86% 100% 43% 42% 50% N/B 100% 100%

NXP N/B 100% 100% 100% N/B 7% 100% 86%

Samsung (d) 5% 0% N/B N/B 0% 100% N/B N/B

% of product revenue 49% 52% 64% 51% 54% 70% 65%

70%

27 July 2015

III. STRATEGY

28 July 2015

Summary Strategy

• Maintain best in class tech leadership in advanced packaging

• Expand tech capabilities and applications for TCB, thin die, eWLB die bonding; large area, ultra thin and wafer level molding

Develop new products and markets

• Leverage lead in core competencies at expense of Japanese and Asian competitors

• Capitalize on <20 nano expertise to exploit new device introductions, further penetrate largest smart phone supply chains and expand in Chinese handset market

• Apply TCB tech advantage to more mainstream applications

Increase market share in addressable markets

• Expand Asian materials sourcing and direct shipments

• Expand Malaysian, Singapore and Chinese operations. Target more local production and shorter cycle times

• Develop common platforms, common modules and common parts

• Continue to reduce euro based costs. Better align currency exposures

Achieve a more scalable, flexible and lower cost manufacturing model

• Expand tech leadership in advanced packaging including wafer level assembly

Acquire companies with complementary technologies and products

29 July 2015

Besi Revenue Growth Drivers

30

July 2015

Revenue Growth Drivers

World tooling up for new

tech cycle <20 nano

Increased smart phone functionality

New device introductions: IoT, wearables

Wire bond/flip chip

conversion

Solar cell plating

transition from copper to

silver

Increased share of

Japanese supply chain and China handsets

TCB expansion to memory and logic devices

Key Development and Operational Objectives

Development Objectives

Advanced TCB die bonding development

Introduction of next generation packaging systems

Common parts/platform activities

Operational Objectives

Transfer of certain Swiss Die Attach software, logistics and administrative functions to Singapore

Transfer of certain die bonding production from Malaysia to China

Transfer of Plating Production from NL to Malaysia

Further reduction of European based costs

Expansion of Asian supply chain. System module outsourcing

2015 2016

July 2015 31

Asian Production Transfer Has Helped Reduce Break Even Revenue Levels

32

Asian Production Has Significantly Expanded

Leading to Lower European Headcount

And Reduced Break Even Revenue Levels

396

487

658 673

963

170

331

553 579

927

43%

68%

84% 86%

96%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

-

200

400

600

800

1,000

1,200

2010 2011 2012 2013 2014

% D

irect

Sh

ipm

en

ts

Sh

ipm

en

ts

Total Asian ShipmentsDirect Asian Shipments% Direct

741 680 624 602 597 597

802 799

810 908 933 967

1,543 1,479

1,434 1,510 1,530 1,564

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2011 2012 2013 2014 Q12015

Q22015

Head

co

un

t

Europe/NA Fixed HC Asia Fixed HC

270

235

212 207

-

50

100

150

200

250

300

2011 2012 2013 2014

(€ m

illi

on

s)

July 2015

Workforce Has Become More Scalable and Flexible

• Significant revenue ramps

achieved using primarily Asian

production temps

• Aggregate headcount varies

with cyclicality and seasonality

of business

741 680 624 602 597 597

802 799

810 908 933 967

64 60

24

122 150 120 1,607

1,539 1,458

1,632 1,680 1,684

0.0%

2.0%

4.0%

6.0%

8.0%

10.0%

12.0%

-

500

1,000

1,500

2,000

2,500

2011 2012 2013 2014 Q1 2015 Q2 2015T

em

p %

of

Tota

l

Headcount

Europe/NA Fixed HC Asia Fixed HC

Temporary HC Temp % of Total

33 July 2015

Materials Cost Reduction Is Also a Key Priority

• Qualify and Select Asian Vendors

• 75% of material is now purchased in Asia

• Significant potential cost savings

Supply Chain Actions

• Redesign products

• Increase standardization of systems

Development Actions

45-50% thru

cycle Gross

Margin

• Material costs represent largest single expense: approximately 45% of revenue

• Management Board reviews progress weekly component by component

• Shift to Asia centric supply chain reduces personnel, transport, logistics and inventory costs

• Also improves cycle time and ramping flexibility

34

Estimated savings 2014 2015E 2016/17E

Headcount € 0.9 MM € 2.8 MM € 1.0 MM

Materials Cost € 2.7 MM € 1.6 MM € 1.5 MM

Subtotal € 3.6 MM € 4.4 MM € 2.5 MM

July 2015

Partially Achieved Through Common Parts Product Redesign

• Magazine handler

• Wafer gripper

• Dispenser

• Wafer table

• Wafer Cassette Handler

• Die Ejector

• Control Platform

Areas of focus:

Potential Unit Cost Savings

DB2100 (7%)

2200evo (11%)

8800FCQ (11%)

Average (9%)

35

• Development efforts underway to redesign die attach and packaging systems to increase

common parts utilized per system

• Benefits: Lower unit cost, design and maintenance hours, improved working capital mgt,

shorter cycle times

July 2015

IV. FINANCIAL REVIEW

36 July 2015

37 July 2015

€ 116.2

€ 104.3

19.7% 14.8%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

€ 0

€ 20

€ 40

€ 60

€ 80

€ 100

€ 120

€ 140

Q2 2014 Q2 2015

Net

marg

in %

€ m

illio

ns

Revenue Net Income

Gross Margin

OPEX

Headcount

Effective Tax Rate

9.4% 11.8%

1,672 1,684

€ 24.6

MM

€ 32.0

MM

+12

+2.4%

+30.1%

43.2% 47.9%

-10.2%

-4.9 points

Q2-14/Q2-15 H1-14/H1-15*

+4.7 points

€ 15.5

€ 186.2

€ 199.2

16.1% 15.0%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

0 €

50 €

100 €

150 €

200 €

250 €

2014 2015*

Net

marg

in %

€ m

illio

ns

Revenue Net Income

Gross Margin

OPEX

Headcount

Effective Tax Rate

9.9% 12.7%

1,672 1,684

€ 46.1

MM

€ 60.2

MM

42.9% 48.1%

+12

+2.8 points

+30.6%

+5.2 points

+7.0%

-1.1 points

€ 29.8 € 29.9 € 22.9

* Excluding net restructuring benefit

Solid Revenue and Profit Development in 2015 in Less Favorable Industry Environment

Mar11

Jun 11Sept11

Dec11

Mar12

Jun 12Sept12

Dec12

Mar13

Jun 13Sept13

Dec13

Mar14

Jun 14Sept14

Dec14

Mar15

Jun 15

Total Equipment 0.95 0.94 0.71 0.85 1.12 0.93 0.78 0.92 1.11 1.10 0.97 1.02 1.06 1.10 0.94 0.99 1.10 0.98

Assembly Market 1.01 0.92 0.81 1.02 1.28 1.11 0.53 0.92 1.08 1.26 0.68 1.06 1.25 1.25 0.69 0.84 1.34 0.92

0.95

0.71

1.10

0.97

0.94

1.10

0.98 1.01

0.81

1.26

0.68 0.69

1.34

0.92

0.50

0.75

1.00

1.25

1.50

1.75

Quarterly Book to Bill Trends Reflect Quarterly Seasonality and Volatility

• Strong industry growth in H1 followed by weaker H2 has been the trend

• Assembly market more volatile than general semi equipment business

Source: Semi July 2015

Assembly

Market

Total Semi

Equipment

38 July 2015

• Cyclical quarterly revenue/order

patterns:

• Three cycles past 3 years

• Short term patterns due to customer

caution and increased seasonality

• 2014 year end shows higher base line

order levels than prior years

• Gross margins have improved despite

cyclicality:

• Increased scalability of production model

and shorter cycle times

• Shift to higher margin advanced

packaging systems

• Lower unit costs due to:

• Asian production transfer

• More direct shipments

• Reduction in European personnel

• Favorable USD/euro starting in H2-14

Revenue/Order/Gross Margin Trends

65

53

70

116

104

89 94.9

104.3

48

57

111

124

91

81

104.2

91.9

39.2% 40.1%

42.3% 43.2%

45.3%

43.8%

49.0% 47.9%

48.2%

35.0%

40.0%

45.0%

50.0%

55.0%

60.0%

-

20

40

60

80

100

120

140

Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15 Q2-15G

ross M

arg

in %

eu

ro in m

illio

ns

Revenue Orders

Gross Margin Adjusted Gross Margin

39 July 2015

Net Income Trends

3.4

12.2

14.2

(2.0)

7.5 3.3

4.4 1.4

7.0

22.9

21.5

19.7

17.5

15.5

6.8% 6.4%

10.0%

19.7% 20.8%

13.7% 15.0% 14.8%

-5%

0%

5%

10%

15%

20%

25%

30%

35%

40%

(3)

0

3

6

9

12

15

18

21

24

Q3-13 Q4-13(a)

Q1-14 Q2-14 Q3-14 Q4-14(a)

Q1-15(a)

Q2-15

(euro

in m

illio

ns)

Net Margin ex. NR Net Income ex. NR

Non Recurring Net Margin

40

• € 15.5 million Q2-15 net income

• +€ 1.3 million vs. €14.2 million (ex-

restructuring) in Q1-15

• -€ 7.4 million vs. Q2-14

• Sequential quarterly profit growth since Q4-

14 ex non recurring items

• Less volatile trajectory than prior years

• Reflects absence of H1-14 smart phone

capacity spike

• Higher base line profits and margins than prior

years

• Tax rate up slightly in 2015 due to absence of

Q2-14 tax benefit ($700k)

• 9.9% in H1-14 (12.0% ex. deferred tax benefit)

vs. 12.4% in H1-15

(a) Adjusted to exclude:

• After tax net restructuring (Q1-15) (€ 3.3 million)

• Deferred tax benefits (Q4-14) (€ 7.5 million)

• € 0.5 million and € 2.0 million non recurring charges in Q2-13 and Q4-13, respectively

July 2015

Liquidity Trends

• Solid liquidity position

• € 113.7 million cash at 6/30/15

• € 3.02 per share vs. € 24.96 price (as of

June 30, 2015)

• Net cash of € 91.4 million at end of Q2

2015

• Has Been Utilized to Enhance

Shareholder Value

• € 114 million spent on cash dividends and

share repurchases 2011-2015

• Includes May dividend payment

• Strong balance sheet helps support

future organic growth and acquisition

opportunities

41

78.5

89.6 91.9

83.8

105.4

135.3

161.6

113.7

22.5 18.6 19.1 21.3 19.3 17.3

28.5 22.3

56.0

71.0 72.8

62.5

86.1

118.0

133.1

91.4

0

20

40

60

80

100

120

140

160

180

Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15 Q2-15

(eu

ro in

mill

ion

s)

Cash Debt Net Cash

41 July 2015

V. OUTLOOK & SUMMARY

42 July 2015

43 July 2015

Q3-15 Guidance

Revenue Gross Margin Operating Expenses

Q2 Q3 Q2 Q3 Q2 Q3

€ 104.3 47.9% € 32.0

Down

15-20%

• Revenue down 15-20% vs. Q2-15 reflecting seasonal trends and less favorable

industry conditions

• Gross margins in 45-47% range

• Opex down approximately 10% vs. Q2-15

• Expect solid profit and cash flow generation in H2-15

Down ~10%

47%

-

45%

Summary

Leading semi assembly equipment supplier with #1

or #2 positions in fastest growing assembly

segments

Technology leader. Best in class product portfolio

Gaining market share in advanced packaging

Scalability and profitability of business model greatly

enhanced in cyclical industry

Significant upside potential.

Advanced packaging growth from new

technology cycle, operating initiatives and optimization of Asian production model

Committed to enhancing shareholder value.

Attractive dividend yield relative to peers

44 July 2015