introduction to the technology of microwave integrated circuits
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RADIO FREQUENCY INTEGRATED CIRCUITS
MODULE I
DIVYA P V
ASST.PROFESSOR
EC DEPT
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Introduction to the technology of microwave integrated circuitsConventional Microwave circuits
1.Constructed in coaxial or waveguide technology
2.Circuits and other components (filterc,directional couplers)were fabricatedseparately and then screwed together
3.Conductors in conventional circuits are coaxial lines or waveguides. MICs
1.Same as integrated digital circuits.
2.All the components are connected to each other and manufactured by using the sametechnology in a planar form
3.Conductors in MICs are microstrip line
The specific method used to develop and produce a special circuit functions in
micro strip is known as micro strip technology.
Principal requirements for a transmission structure to be suitable as a circuit element
in MIC is that the structure should be planar in configuration. A planar configuration
implies that the characteristics of the element can be determined by the dimensions in
a single plane. For example the width of a micro strip line on a dielectric substrate can
be adjusted to control its impedance.
There are several transmission structure that satisfy the requirement of beingplanar
1.Microstrip
2.Coplanar waveguide
3.Slotline4.Coplanar strips
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There is a wide range of MICs
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Advantages of MICs
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SUBSTRATES
Criteria for the choice of substrate material
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Criteria for the choice of substrate material
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Production methods (Technology ) for MICs
Various technologies available for the production of MICs
Difference among them are substrare material, the method of
fabricating conductors, resistors and capacitors and the degree of
integration
Degree of integration is a measure of the number of integrated elements
to be included in the total circuit.
Integrated elements are elements produced by the same technique
as the conductors, whereas hybrid elements are elements produced
separately and added to the circuit later.
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Important MIC technology in order of degree of freedom
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Thin film Hybrid Circuits
Most commonly used technique for the production of MICs is the thin film hybridtechnology.
Technology get its name from the method producing conductors, resistances andcapacitance rather than from the thickness of the substrate.
Conductors are produced either by vapour deposition or sputtering, both of which areperformed in vacuum and provide layers wih a thickness of less than 1um.
For use in microwaves the conductors are galvanically thickened to between 5um and10 um to reduce the losses
Resistance and capacitance as well as conductors can be produced as integratedcomponents
For thin film circuits with capacitors,the surface must be locally glazed or we mustuse saphire.
If the MIC is to have magnetic components,such as circulators then ferrite or garnetmust be used as substrates
Plastic substrates cannot be used for thin-film technology because they cannotwithstand the high temperatures and their outgassing makes a high vacuum verydifficult to attain.