introduction to rf pa design - cambridge wireless
TRANSCRIPT
Introduction to RF PA design
Presented by Dr. Chris [email protected]
Copyright © 2018 Chris Potter, Cambridge RF, U.K. All rights reserved
Power Amplifier Techniques WorkshopCambridge Wireless
22nd May 2018
Contents
◼ Generic PA transistor
◼ Achieving power amplification
◼ Application types
◼ Considerations of carrier frequency, power level
◼ Modulation waveform and how it affects PAPR
◼ Key specs
◼ Noise, distortion, efficiency
◼ Circuit and Topology choices
◼ Class A, AB, C, Balanced circuits
◼ Device Technology Overview
◼ Design methods
Generic PA Transistor
◼ A control current or voltage causes a greater current swing at the output
◼ A bias circuit holds the operating point at a desired part of the linear range
◼ Optimisation of output current-voltage relationship (load line)
◼ Minimisation and control of parasitics
Applications of PAs
Application Power Technology
TV Broadcast 100W x many in parallel
LDMOS, GaN
Cellular Base-station
10 to 50W LDMOS, GaN, GaAs FET
Cellular Handset
0.25 to 2W GaAs, Si, SiGe
WiFi 0.1W GaAs HBT, Si
Bluetooth, ZigBee, LoRa
0.001 – 0.1W Si
Device Technology Overview
◼ Differing parasitics and thermal conductivity characteristics
0.1W
1W
10W
100W
1000W
1000W
1GHz 3GHz 10GHz 30GHz
SiC MESFET
GaAs HEMT
Si MOS, LDMOS
GaN
GaAs HBT
Tubes, TWT
Modulation and PAPR
Technology Modulation PAPR
CW Sinewave 0dB
2-tone 2x sinewaves 3dB
GSM, DECT, Bluetooth 1.0
GMSK, GFSK 0dB
Bluetooth EDR, TETRA
QPSK, 8PSK 3.2dB
3GPP-UTRA WCDMA 11.2dB
3GPP-EUTRA LTE (OFDM) 11.5dB
802.11n OFDM 11.5dB
DVB-T OFDM 11.5dB
PA Specs: Efficiency
◼ PAs are most efficient when operating near maximum output power
◼ Drain Efficiency is the ratio of RF output power over DC input power
◼ Power-Added Efficiency subtracts RF input power from DE calculation
◼ For signals with high crest factor, the PA is backed-off and operates at lower efficiency most of the time
%100,
%100,
−
=−
=
inDC
inRFoutRF
inDC
outRF
P
PPPAEEfficiencyAddedPower
P
PDEEfficiencyDrain
PA Specs: Distortion
◼ Two input tones presented to a device with non-linearity will create many other frequency products
f1 f2
f1+f2
f2-f1
2f1+f2
2f1 2f2 3f1 3f2
2f1-f2 2f2-f1
2f2+f1
Third-order distortion products
Intermodulation distortion (IM3)
Third-order distortion products
Second-order distortion products
Frequency
Am
plitu
de
( ) ( )
( )( ) ( )( ) ......2cos2cos......
coscos
12
2
21
2
3210
21
++−+−+++=
+=
tABtBAaaaav
tBtAv
out
in
Input tones at f1, f2
Third-order terms
PA Specs: Noise
=
output
output
input
input
N
S
N
S
FfactorNoise ,
Thermal noise, P = kTB
Equates to -174 dBm/Hz at room temperature
G1 G2 G3
...11
21
3
1
21 +
−+
−+=
GG
F
G
FFF
Cascaded noise figure (Friis’ equation)
=
output
output
input
input
N
S
N
S
dBNFfigureNoise log10)(,
Circuit Topology - PA Classes
◼ Class A◼ Linear, simplest circuit,
◼ Transistor is conducting all the time
◼ 25 or 50% efficiency limit depending on circuit
◼ Class AB◼ Transistor is conducting most of the time
◼ Common compromise between efficiency and linearity
◼ Class B◼ Transistor is conducting half of the time
◼ 78.5% theoretical efficiency limit
◼ Class C◼ Transistor is conducting less than half of the time
◼ Non-linear amplification, high efficiency
Class A
◼ Transistor output swings from near-supply to near-zero
◼ Half-power dissipated in transistor, half in load
◼ Not all of the power in the load is useful signal though
◼ Example circuit:
◼ PR1=132.46mW (AC+DC)
◼ PR1=27.646mW (AC)
◼ PV2=228.92mW (AC+DC)
◼ 12% efficiency
Class B
◼ Transistor output swings from near-supply to near-zero
◼ Reduced input DC to cause transistor to spend 50% time off
◼ No dissipation while it is off
◼ Increased input swing
◼ Example Circuit:
◼ PR1=103.87mW (AC+DC)
◼ PR1=60.086mW (AC)
◼ PV2=147.97mW (AC+DC)
◼ 40.6% efficiency
50% 50%
Class C
◼ LC added to load, Transistor output swings from above-supply to near-zero
◼ Low input DC bias to cause transistor to spend >50% time off
◼ Increased input swing (less gain)
◼ Example Circuit:
◼ PR1=161.56mW (AC)
◼ PV2=227.28mW (AC+DC)
◼ 71.1% efficiency
Class AB◼ Linear amplification
with better than Class A efficiency
◼ Use two Class B stages
◼ Operate them in antiphase
◼ Combine outputs
◼ Adjust bias to minimise crossover distortion
◼ Example Circuit:
◼ PR1=206.31mW (AC)
◼ PV2=303.08mW (AC+DC)
◼ 68.1% efficiency
Balanced Power Amplifier
◼ 90° Hybrids, parallel PA stages
[SA]
[SB]
a1
b1
a2
b2
a1A
b1Aa2A
b2A
a1B
b1B a2B
b2B
3dB 90° 3dB 90°
PA Design Challenges
◼ Delivering RF power into 50 ohms requires a voltage swing 50x the load current (Amps) (from V = IR)
◼ Typical PA devices handle 5V to 28V supply, (GaN may be 55V)
◼ The load current for a typical PA device may be several Amps, with peaks of 10s of Amps
◼ “Matching” is required to transform the low output impedance up to 50 ohms
◼ Expect output device has parasitic series inductance and shunt capacitance
Devices and Package Parasitics
◼ The diagram shows an internally matched LDMOS device. Drain voltage is provided via a ¼ wave feed line. RF and Modulation frequencies are terminated by bulk decoupling capacitors at the supply side of the ¼ wave feed.
1/4 λ
VDD
LDMOS Package
Examples (Reference Designs)
Design Approaches
◼ Small Signal approach
◼ Load line
◼ Conjugate match
◼ Nonlinear approach
◼ Harmonic Balance modelling and simulation
◼ Non-linear characterisation and simulation
◼ Load pull
Load Pull System
Source Tuner Load Tuner
Signal Generator
Preamplifier
Coupler
Power meter
Sensor
Isolator
Coupler
Sensor
Spectrum Analyzer
Vector Signal
Analyzer
Input
Transformer
Output
TransformerDUT
Attenuator
Dual PSU
GPIBGPIB
Load Pull System
Load Plane Contours
Load match contours of ACLR,
gain and drain current for a 20
Watt 3GPP W-CDMA Device
1.40.5
0.1
0.2
0.3 0.4
0.1
0.2
0.3
0.4
0.5
0.6
0.7 0
.8 0.9 1.0
1. 2
1.4
1.6
1.8
3.0
2.0
4.0
5.0
10
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0 1.2
1.4
1.6
1.8
2.0
3.0
4.0
5.0
10
20
20
50
50
0.6
0.7
0.8
0.9
1.0
1.2
1.6
1.8 2.0
3.0 4.0
5.0
502010
Z0=3
BestEfficiency
MaximumGain
BestACLR
Conclusions
◼ Generic PA transistor
◼ Achieving power amplification
◼ Application types
◼ Considerations of carrier frequency, power level
◼ Modulation waveform and how it affects PAPR
◼ Key specs
◼ Noise, distortion, efficiency
◼ Circuit and Topology choices
◼ Class A, AB, C, Balanced circuits
◼ Device Technology Overview
◼ Design methods