introduction to microelectromechanical ......kobrinsky, senturia, deutcsh, jmems 2000 steve senturia...
TRANSCRIPT
MEMS 487Session #9Spring 03
INTRODUCTION TO
MICROELECTROMECHANICAL SYSTEMS
(MEMS)
520/530.487
Cantilever Beam Design
Cantilever Beam Design
Cantilever Beam Design
Cantilever Beam Design
Cantilever Beam Design
Cantilever Beam Design
Cantilever Beam Design
Lab 2 Beams
20 µµµµm Thick
100X1000
250X1000
Doubly Supported Beams9.6.2
Doubly Supported Beams9.6.2
Doubly Supported Beams9.6.2
M-Test
Kobrinsky, Senturia, Deutcsh, JMEMS 2000
Steve Senturia
Young’s modulus of polysilicon
1997 2001
169 GPaWNS
160 GPa
142 GPaSS
Buckling of Beams9.6.3
Buckling of Beams
Rarely Considered
Large Strains – 8.5
Plastic Deformation – 8.6
Large Deflections – 9.8
Plates10.4.6
Residual Stress
BendingStress
Stretching Stress
Square, LThick, HFixed
PlatesRoark
Membranes10.4. 7
Membranes
MembranesJayaraman and Hemker, 1998
MembranesJayaraman and Hemker
MembranesJayaraman and Hemker
Resonant Frequencies10.5.1
Resonant FrequenciesNathanson
Resonant FrequenciesNathanson
Finite Element Analysis
Sandia Polysilicon
Sandia Polysilicon
Sandia Polysilicon
Sandia Polysilicon
Sandia Polysilicon
Sandia Polysilicon
Boundary Conditions
Bulge Test Results by Stu Brown
• E = 328 GPa in 2000
• E = 258 GPa in 2002
from considering deformation of supports
Tensile Specimen
Bulge Specimen
Boundary Conditions
Cantilever Beam
Substrate
What you want
Oxide
Substrate
What you get
Oxide
Motion Measurement
