intro to sherlock_linkedin

© 2004 – 2010

Your Partner Throughout the Product Life Cycle

© 2004 - 2007© 2004 - 20109000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

Who is DfR Solutions?

The Industry Leader in Quality-Reliability-

Durability of Electronics

50 Fastest Growing Companies in the Electronics Industry

- Inc Magazine

2012 Global Technology Award Winner

Best Design Verification Tool- Printed Circuit Design


10 Years of Providing Solutions to the Electronics Marketplace

o DfR / DfM / DfT / DfS….. DfX

o Finite Element / Fluid Dynamics

o Physics of Failure Modeling

o FMEA / FTA

o 3rd Party Design Review

o Failure Analysis

o Root Cause Investigations

o Forensic Engineering

o Circuit Analysis

o Connector/Wiring Selection

o Analog/Power Design

o Material Characterization

o PCB / PCBA Onsite Audits

o Pottings and Coatings

o Software Risk Mitigation

End-to-End Quality and

Reliability Expertise


Results: Over 1000 Satisfied Customers

© 2004 – 2010

Sherlock Automated Design

Analysis™


o Physics of Failure-based design reliability analysis tool

o Predicts product failure early in design process, quickly

and accurately

o Electronics-focused –

used across all

industries

What is Sherlock?

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o First released in 2011

o Over 65 Companies and 150 users worldwide

today

o Renewal rate exceeds 85%

o First specified for automotive supply chain in 2015

o Major global verticals served are Automotive,

Avionics, Aerospace and Defense, Medical Devices

Sherlock Worldwide

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o Greater Insight Earlier in New Product Development

o Introduces Modeling/Simulation Earlier in the NPI Process

o Eliminate Test Failures Due To Design

o Accelerates product qualification process with fewer respins

o Release Rev1, not Rev3

o Quantitative Tradeoff Analysis (no more Opinioneering)

o Select the right material the first time based on real cost/benefit analysis

o Ensure More Rapid Acceptance Of Newer, More Ground-Breaking Technologies

o Allows for first-to-market with no change in quality

Sherlock Value Proposition


o Sherlock provides the Mechanical Analyst the ability to quickly and accurately develop intelligent 3D models of electronic assemblies

o Finite element simulations are post-processed to identify critical components and predict time to failure

Mechanical

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o Biggest risk in electronics manufacturing

is post-assembly flexure

o Current risk mitigations are insufficient

o Existing DfM tools only capture solder issues

o Strain measurements are laborious

o Supplier analyses often inaccurate

o Sherlock can rapidly assess all

post-assembly handling operations

o In-Circuit Test, Depaneling, Connector

Insertion, Compliant Pin, Heatsink

Attachment

Manufacturing

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o Sherlock performs reliability predictions previously not possible

o Commercial off-the-shelf (COTS) assemblies, wearoutof complex integrated circuits (ICs)

o Provides stronger linkage to mechanical group

o Takes results of mechanical and thermal analysis and makes a reliability prediction for thermal cycling, vibration, and shock

o Accelerates traditional design for reliability (DfR) activities

o MTBF, DFMEA, Thermal Derating

Reliability

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o Pass the test the first time

o Thermal cycling, Power-temperature cycling, sinusoidal

vibration, random vibration, mechanical shock

o Pre-HALT your HALT

o Make HALT an even

more powerful

activity

Test

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9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

How Does Sherlock Work?


Phase 1: Data Input

• Parses standard EDA files (schematic, layout, parts list) automatically

• Uses embedded libraries (part, package, materials, solder, laminate)

• Can build box-level finite element analysis model in minutes

Phase 2: Sherlock Analysis

• Produces holistic analysis critical to develop reliable products

• Easy to assign and create standard structures and conditions

• Assessment options include: Thermal Cycling, Mechanical Shock, Natural

Frequency, Harmonic Vibration, Random Vibration, Bending, Integrated Circuit

Wearout, Thermal Derating, Failure Rate, Conductive Anodic Filament, High

Fidelity PCB Model

Phase 3: Report & Recommend

• Presents results in multiple formats: Tabular / Histogram / Life curve / Overlay

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9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com15

• Easy-to-locate commands

• Industry terminology (parts list,

stackup, pick & place, etc.)


Handles very complex environments

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Import Standard Design Output Files (Gerber/ODB)

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Embedded / Fully Populated Libraries (Local and Global)

Parts/Package/Laminates/Materials/Solder

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FEA 3D Modeling

ICT and Shock/Vibration Analysis

• Fully 3D elements for the PCB,

components and mount points

• Increase simulation accuracy

• More reliable meshing algorithm

• Increased analysis flexibility

• Leads, heat-sinks, sub-

assemblies, chassis analysis

FEA Engine

• Multi-core and 64 bit support

• Faster analysis


Leads

Coating/Potting

Traces/Vias

Heatsinks

Wirebonds


• System Level Integration

– Attach one or more sub-assemblies to a

motherboard/backplane

– Supports edge connections or mezzanine

attached with standoffs

– Put it all together and model all of your

electronics and the housing in a single analysis

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Daughter

Card

Mezzanine Card

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Mode 1: Sherlock manages all FEA processing

Mode 2: Export model from Sherlock to FEA

Mode 3: Import FEA results into Sherlock for reliability analysis

ElectronicDesign Files

Life CycleConditions

3D Model /Analysis Steps

Pre-Processing

ReliabilityResults

3D Model /Disp Results /Strain Results

Post-Processing

PartsPackagesMaterials

FEATool

FEA

Model Results

FEAScript

SherlockDesign

Analysis

SherlockFailure

Analysis

SherlockData Store


Thermal Cycling Fatigue

• Cumulative Damage Index (CDI)

• Time to failure

• Thermal profile and Flowtherm results

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Automated Thermal Derating• Min / Max temperature assigned to

each part (Operating and Storage)

• Sherlock automatically combines operating temperatures with thermal profiles

• Parts that exceed their ratings are flagged

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Vibration/Shock/Bending

• Loading

• Mounting

• Direction

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• Multi-Axis Shock and Vibration Loads

• Specify load direction and/or PCB orientation

• Specify uni-axial or tri-axial harmonic profiles


Board-to-Board Connector Fretting Analysis

• Stick (< 2.5 um)

• Stick-Slip (5 – 10um)

• Slip (> 10 um)

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Results Summary• Results tabulated into a score

• Easy report generation– PDF Format

– Includes results and inputs

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• Only software tool that provides a complete life curve

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Constant Failure Rate Generic Actuarial MTBF Database

PTH Thermal Cycling Fatigue

Thermal Cycling Solder Fatigue

Vibration Fatigue

Over All Module

Combined Risk


Fully

Validated

Wirebonds

Chip ResistorsBGA

QFN


o Global Storage Manufacturer is using Sherlock to eliminate one (1) to two (2) physical tests for EACH PCBA Design

o Ten (10) PCBAs are designed annually

o Engineering labor and hard test costs (Chambers, Samples) are approximately $750,000 per test

o Results in an Annual Savings of $7,500,000

o Sherlock also eliminates two (2) design revs for EACH PCBA

o Time-to-Market Reduced by Six (6) Months

Sherlock Software Case Study 1

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Global Storage Manufacturer reduces

time-to-market by six (6) months


o In 2013 American Auto Manufacturer Motors begin utilizing Sherlock for electronic module analysis in parallel with its current testing plan. o American Auto Manufacturer believed that Sherlock could accurately

simulate power temperature cycling (PTC) tests and thereby eliminate certain tests, reduce valuable senior engineering time and correspondingly reduce reliability testing costs and time to market.

o Over the course of a twelve-month period, Sherlock identified 4 designs wherein the probability of failure during PTC exceeded the acceptable standard for American Auto Manufacturer. o Had the design moved forward, 4 additional PTC tests would have had

to be performed at a cost exceeding $346,000 each or $1,384,000 over the year


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American Auto Manufacturer® Motors saves

over $1,384,000 in test costs


o Understand the Problem You are Trying to Solve

o Understand the Process for Acquiring Software Tools

o Identify a Design

o Receive One Hour of Sherlock Training

o Complete 30-Day Trial with DfR Technical Support

How to Move Forward With Sherlock

33


o Case Study: Replacing Testing with Rapid Assessment

o Working closely with DfR, Tier 1 Automotive

Manufacturer has convinced a Major OEM to replace

elements of Product Qualification (temperature cycling,

vibration, mechanical shock) with a combination of

Sherlock and DfR-led Quality Assessment

o Initial focus on managing design changes and cost reductions

o Time-to-market reduced by 10 weeks and estimated

cost savings of $150,000


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o Case Study: Optimizing Test Conditions and Test Time

o Major HVAC manufacturer was performing extensive thermal cycling and thermal shock on all new designs

o Actual test time was in excess of seven weeks

o DfR used Sherlock ADA software to demonstrate test time was equivalent to 2X desired lifetime

o Sherlock also demonstrated that current test was not stressing the components at greatest risk of failure

o Time-to-market reduced by three weeks and test costs reduced by $50,000

Sherlock Services Case Study 4

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o A comparison of the performance of various solder joint

fatigue models was tested by Tom Clifford (formerly of

Lockheed Martin)

o Included chip resistors,

LCCC, QFP, and BGA

soldered to a polyimide

board

o Evaluated different

models and had some

models executed by

different users

Validation of Sherlock

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o “Following discussions with DfR and confirmation of the PCB material, from the supplier, I was able to refine the model for the QFN package and the PCB construction to predict the first failure of a QFN package at around 700 cycles.

It was interesting to note that the PCB material choice significantly altered Sherlock’s predicted solder joint life and choice of PCB material needs to be carefully considered from this perspective.

Subsequent real cycling of the test board has indeed produced a failure at around 770 temperature cycles and so appearing to add some (albeit limited) validation of the Sherlock prediction.

With the refined model failures of well soldered BGA joints were not predicted by Sherlock till around 3000 cycles. Our supplier has now finished the thermal cycles on the real boards seeing no BGA failures after about 1200 cycles.”

Validation – Avionics Manufacturer

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The cycles to failure prediction

provided by the Blattau

model (50,614 cycles) is within

5% of the observed time to

failure (53,215 cycles).

Validation – Advanced Energy (AEI)

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Thermo King (the customer)

now requires Watlow

(the supplier) to perform a Sherlock analysis

on every new design

Validation – Watlow

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o With all material and design information

received, Sherlock predicted failure of

I200 (Actel Microcontroller) in just over

300 thermal cycles of -55C to 125C

Validation – GPS Manufacturer

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o The Atmel device has two die

o This information is in the Atmel datasheet

o Results in a ball grid array (BGA) with a low coefficient of

thermal expansion (CTE)

o The PCB was constructed with TU-622-5 laminate

o This material has a high coefficient of thermal expansion (CTE)

o This material is in the Sherlock laminate library

o Certain part packages (e.g., BGAs) are very sensitive

to differences in CTE

Validation – GPS Manufacturer (cont.)

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Validation – HVAC Manufacturer

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Summary• Both Test and Sherlock

Simulation results are well

correlated

• Random profile pertaining to

Qualmark HALT chamber is

used for the simulation


o DfR created an ad-hoc Sherlock project using only a

picture and a component

Validation – Satellite Manufacturer

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o DfR predicted 1016 cycles to first failure and 1693 cycles to characteristic life

o Test data showed 750 cycles to first failure

o No stackup info

o Polyimide board

o Solder fatigue calculator was also used as a standalone tool


o “The Sherlock analysis that DfR solutions did last year predicted that the QFN would fail first during thermal cycling <sic>. At the time last year we did not agree with what Sherlock was telling us, but after lots of $$$ and thermal cycles, Sherlock was right.

It was a very important lesson learned about thermal cycling life of large QFN packages on boards that are epoxy laminated to aluminum chassis<sic>. This is something that we would not have guessed to be a problem. But it was.

Sherlock now has added merit for us to consider using on other new product reliability analyses”

- John DeCamp, Manufacturing Engineer

Validation – ViaSat

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Perfect correlation to testing

Validation – Consumer Electronics Manufacturer

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Mode1

experimental

Mode2

experimental

Frequency Simulation Experiment Difference

Homogenous

Layered Model

Mode1 307.4 Hz 307 -0.13%

Mode2 439 Hz 456 -3.7%

Mode3 796 Hz - -


Validation – GPU Manufacturer

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o Solder joint cracking was

occurring during In-Circuit Testing

(ICT)

o Customer asked if Sherlock could

be used to predict the cracking

since it had an internal FEA tool

o Customer supplied ODB++ files

and test point information of the

assembly with cracks.

o Sherlock predicted all cracks plus

hairline cracks

Validation – Plexus (In-Circuit Testing)


Sherlock Automated Design Analysis™ software is the go-to

electronics reliability tool used by designers and engineers across

every major industry.

Sherlock can help you design more reliable products faster and

more efficiently!

Reduced NPI time

Lower Development Costs

Better Decisions

Faster Time to Market

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Back Up Slides

50


DFMEA

• The only Design Failure Mode Effects Analysis (DFMEA) software dedicated to electronics

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Current DFMEA Tools (cont)

Sherlock – DFMEA module

– Module in Design Reliability Assessment tool

– Imports data from BOM or ODB++ design files (generated by PADS / Expedition)

» Later in design cycle than desired

» Earlier than typically being done today

» Facilitates integrating Reuse into DFMEA

– Highest level of automation – Standardized but customizable

– Common formatting – Can import / export to Excel

– Generates DFMEA by “Subcircuit” (Reuse Function)

– SEV / DET based on Standard Practices (Design Standards, etc.)

– OCC (Occurrence Rating)

» Based on component Reliability Predictions

Delphi Warranty Database

Multiple Industry databases

» Future:

Mission profile will drive reliability predictions / OCC

BaselineComponent Level DFMEA Generation

Schematic

Parts List

• Circuit Function / SubFunction / Sub-SubFunction

• Reference Designator

• Part Number

SherlockDesign Assistant

Delphi

Component

Database

(DMS)

Failure Rate ClassDelphi

DFMEA

Data Source

Failure Rate Class

• Failure Rate

• Failure Modes

• Fail Mode Distribution

Default:

• SEV, OCC, DET

• Failure Cause

• Failure Effects

• Preventions

• DetectionsBaseline DFMEA Assumes:

• Typical Application

• Not Safety Related

Description, properties

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Documents

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opinioneering o

technologies o

o biggest risk

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