interconnections: copper & low k dielectrics · ee311 notes/stanford univ. prof. saraswat ......
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EE311 Notes/Stanford Univ. Prof. Saraswat
Interconnections: Copper & Low K Dielectrics ITRS 2002 Interconnect Scaling Recommendations
Narrow line effects Ref: J. Gambino, IEDM Short Course, 2003
Interconnect Scaling Scenarios
2
3
4
5
6789
10
20
30
40
0.1 0.2 0.3 0.4 0.5 0.6
De
aly
Tim
e (
ps
ec
)
Feature Size (µm)
50
Cu+Low-k(2.0) Interconnect Delay
Gate Delay
Al+SiO2
Interconnect Delay
Cu+Low-k(2.0) Total Delay
Al+SiO2
Total Delay
Scaling need for lower resistivity metal, Low-k
EE 311 Notes/Prof. Saraswat Copper Interconnect
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1
1
A1
CS1
1
A1/S
1
SCS1
0.5 0.5 Scale Metal Pitch and Height - R and J increase by square of scaling factor - Sidewall capacitance unchanged - Aspect ratio for gapfill / metal etch unchanged - Drives need for very low resistivity metal with significantly improved EM
performance
1
1
A1
CS1
1
0.5
CS1
0.5 0.5
A1/S2
Why Cu?
• Lower resistivity than Al or Al alloys - reduced RC delay. Metal
Ag
Cu
Au
Al
W
Bulk Resistivity [!"•cm]
1.63
1.67
2.35
2.67
5.65
EE 311 Notes/Prof. Saraswat Copper Interconnect
3
0
2
4
6
8
10
12
14
Num
ber
of M
eta
l Layers
Technology Generation (µm)
0.09 0.13 0.18 0.25 0.35
Cu/Low-k
Al/Low-kCu/SiO
2
Al/SiO2
• Better electromigration reliability than Al alloys.
Al Cu
Melting Point 660 ºC 1083 ºC
Ea for Lattice Diffusion 1.4 eV 2.2 eV
Ea for Grain BoundaryDiffusion
0.4 – 0.8 eV 0.7 – 1.2 eV
Ref: S. Luce, (IBM), IEEE IITC 1998
Challenges for Cu Metallization Limited processing methods: Introduction of Cu must be managed carefully. • Obstacles - Line patterning: Poor dry-etchability of Cu - Poor adhesion to dielectrics
EE 311 Notes/Prof. Saraswat Copper Interconnect
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- Copper is very mobile in SiO2 => Contamination to Si Devices Increased leakage in SiO2 Increased junction leakage Lower junction break down voltage
Cu atoms ionize, penetrate into the dielectric, and then accumulate in the dielectric as
Cu+ space charge.
• Bias temperature stressing is employed to characterize behavior - Both field and temperature affect barrier lifetime - Neutral Cu atoms and charged Cu ions contribute to Cu transport through
dielectrics - Silicon nitride and oxynitride films are better barriers
Ref: A. Loke et al., Symp. VLSI Tech. 1998
EE 311 Notes/Prof. Saraswat Copper Interconnect
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• Fast diffusion of Cu into Si and SiO2
• Poor oxidation/corrosion resistance
• Poor adhesion to SiO2
Diffusion barrier /adhesion promotor
Passivation
• Difficulty of applying conventional
dry-etching technique
Damascene Process
Typical Damascene Process
Dielectrics
Barrier Layer
Cu
Solutions - Damascene process for patterning - Using diffusion Barriers
Liners TiN, TaN, etc Silicon Nitride, PSG
Barriers/Linears
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Barrier Requirements: Ultrathin films should be good barriers Low resistance Chemically stable Defect free to high temperatures
Barriers:
Transition metals (Pd, Cr, Ti, Co, Ni, Pt) generally poor barriers, due to high reactivities to Cu <450˚C − Exception: Ta, Mo, W ... more thermally stable, but fail due to Cu diffusion
through grain boundaries (polycrystalline films) Transition metal alloys: Can be deposited as amorphous films (stable up to 500˚C) Transition metal - silicon compounds: Adding Si to Ta, Ti, Mo, W yields amorphous
refractory barriers with stability to 700˚C Amorphous ternary alloys: Very stable due to high crystallization temperatures (i.e.,
Ta36S14,N50, Ti34Si23N43) • Currently PVD (sputtering/evaporation is used primarily to deposit the barrier/liner,
however, step coverage is a problem. ALD is being developed for barrier/liner application.
PVDALD
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Interconnect Fabrication Options
Metal
Etch
Positive
Pattern
Dielectric
Deposit ion
Dielectric
Planarization
by CMP
Negative
Pattern
Dielectric
Etch
Metal
Depos ition
Metal CMP
Dielectric
Depos ition
Metal
Dielectric
Photoresist
Etch Stop(Dielectric)
Subtractive Etch(Conventional Approach) Damascene
• Conventional approach of metal etch is used for Al • Damascene approach is used for Cu as it can’t be dry etched
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Cu Damascene Flow
Options
Oxide
Copper
Conductive Barrier
Dielectric Etch Stop/Barrier
Single Damascene Dual Damascene
Barrier
& Cu
Dep
Cu Via
CMP
Nitride
+ Oxide
Dep
Lead
Pattern
& Etch
+
Barrier
& Cu
Dep
Via
Pattern
& Etch
Cu Lead
CMPLead
Via
Via &
Lead
Pattern
& Etch
Barrier
& Cu
Dep
Cu CMPLead
Via
Cu Damascene Flow Options
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Deposition methods • Physical vapor deposition (PVD) : Evaporation, Sputtering
• conventional metal deposition technique: widely used for Al interconnects
• produce Cu films with strong (111) texture and smooth surface, in general
• poor step coverage: not tolerable for filling high-aspect ratio features Chemical vapor deposition (CVD)
• conformal deposition with excellent step coverage in high-aspect ratio holes and vias
• costly in processing and maintenance
• generally produce Cu films with fine grain size, weak (111) texture and rough surface
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Electroplating System for Cu
Dissociation: CuSO4 → Cu2+ + SO4
2- (solution) Reduction: Cu2+ + 2e- → Cu (cathode) Oxidation: Cu → Cu2++ 2e- (anode)
Direct electroplating on the barrier gives poor results. Therefore a thin layer of Cu is needed as a seed. It can be deposited by PVD, CVD or ALD.
Good step coverage and filling capability comparable to CVD process (0.25 µm) Compatible with low-K dielectrics Generally produce strong (111) texture of Cu film Produce much larger sized grain structure than any other deposition methods through
self-annealing process
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Trench Filling PVD vs. Electroplating of Cu non-conformal
"bottom-up filling"("superfilling")
void
PVD Electroplating Trench Filling Capability of Cu Electroplating
0.13µ trenches 0.18µ vias 029µ vias
Ref: Jonathan Reid, IITC, 1999
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Effect of the seed layer on the properties of the final Cu
Seed Layer Texture
Seed Layer Surface Roughness
Plated Film TexturePlated Film Texture
Plated Film Grain Size
• Strong (111) texture • Smooth surface
• Strong (111) texture• Large grain size
Seed Layer Electroplated Film
(Thin, PVD seed preferred)
Scanning electron micrographs of Damascene trenches of 0.13 µm width showing “bottom-up filling” of Cu electroplating using DC current (demonstrated by Novellus). Electroplating needs a seeding layer of Cu as electroplating does not occur at a dielectric or barrier surface. The deposition of the seed layer can be done by PVD or CVD. The properties of the final Cu layer critically depend upon the characteristics of the seed layer.
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Additives for Copper ECD Mixture of organic molecules and chloride ion which adsorb at the copper surface during plating to:
enhance thickness distribution and feature fill control copper grain structure and thus ductility, hardness, stress, and surface
smoothness Brighteners • Adsorbs on copper metal during plating, participates in charge transfer reaction.
Determines Cu growth characteristics with major impact on metallurgy Levelers • Reduce growth rate of copper at protrusions and edges to yield a smooth final
deposit surface. • Effectively increases polarization resistance at high growth areas by inhibiting growth
to a degree proportional to mass transfer to localized sites Carriers • Carriers adsorb during copper plating to form a relatively thick monolayer film at the
cathode. Moderately polarizes Cu deposition by forming a barrier to diffusion of Cu2+ ions to the surface.
Chloride • Adsorbs at both cathode and anode. • Accumulates in anode film and increases anode dissolution kinetics. • Modifies adsorption properties of carrier to influence thickness distribution.
Wafers immersed in platingbath. Additives not yetadsorbed on Cu seed.
Additives adsorbed on Cuseed. No current flow.
Conformal plating begins.Accelerators accumulate atbottom of via, displacing lessstrongly absorbed additives.
Accumulation of acceleratordue to reduced surface area innarrow features, causes rapidgrowth at bottom of via.
t = 2 sec
t = 10 sec t = 20 sec
t = 0 sec= Accelerators= Suppressors
c = Chloride ionsL = Levelers
Ref: J. Reid et al., Solid St. Tech., 43, 86 (2000)
D. Josell et al., J. Electrochem. Soc., 148, C767 (2001)
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Lognormal grain size distribution
electro- plating
0
0.02
0.04
0.06
0.08
0.1
0.01 0.1 1 10
annealedS = 2.682µmσ = 0.435
as-depositedS = 0.863µmσ = 0.716
electroless plating
0
0.02
0.04
0.06
0.08
0.1
0.01 0.1 1 10D (µm)
S = 0.150µmσ = 0.318
as-deposited
CVD
0
0.02
0.04
0.06
0.08
0.1
0.01 0.1 1 10D (µm)
as-deposited
annealed
S = 0.161µmσ = 0.372
S = 0.294µmσ = 0.344
(a)
(b)
(c)
D (µm) Comparison of grain size distribution of the films deposited by (a) CVD, (b) electroless plating, and (c) electroplating (S is the median grain size and s is the lognormal standard deviation of the grain size). Ref: H. Lee, PhD Thesis, Stanford University, 2001
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Electromigration Electroplated Cu has higher resistance to electromigration because of its grain structure (mostly grain size).
104
105
106
107
1.8 1.9 2.0 2.1 2.2 2.3
Tim
e-t
o-F
ail
ure
(s
ec
)
1/T (10-3
/K)
213 °C238263
Electroplated CuE
a = 0.89 eV
CVD CuE
a = 0.82 eV
grain size
eµ
eµ
=1.4 !m
=0.3 !m
Ref: C. Ryu et al., IEEE IRPS 1997
CVD Cu Electroplated Cu
Electromigration in Cu is strongly affected by grain size and texture, which is strongly affected by the linear, seed and the deposition method.
EE 311 Notes/Prof. Saraswat Copper Interconnect
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103
104
105
106
107
1.8 1.9 2.0 2.1 2.2 2.3
Tim
e-t
o-F
ailu
re (
se
c)
1/T (10-3
/K)
(111) CVD CuE
a = 0.86 eV
(200) CVD CuE
a = 0.81 eV
213238263 188 °C
Ref: C. Ryu etal., Symp. VLSI Tech. 1998
1 µm 5 µm 5 µm
(a) t = 2 hrs (b) t = 1 day (c) t = 60 days
Plan view TEM images showing evolution of grain size as a function of time for Cu films DC-plated with additives; at 10 mA/cm2. Grain size of the electroplated films increases with annealing time. (Ref: H. Lee, PhD Thesis, Stanford University, 2001)
EE 311 Notes/Prof. Saraswat Copper Interconnect
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0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0 10 20 30 40 50
gra
in s
ize
(µ
m)
DC plating current density (mA/cm2)
2 hrs
1 day
10 days
60 days
Grain size evolution for Cu films DC-plated at different plating current density. (Ref: Ref: H. Lee, PhD Thesis, Stanford University, 2001)
140
150
160
170
180
190
200
0 50 100 150 200 250
I (111)/I
(200) r
ati
o
Hours
3.5mA/cm2
7.5mA/cm2
20mA/cm2
10mA/cm2
Evolution of texture at room temperature for films DC-plated with different current density and with additives. (Ref: H. Lee, PhD Thesis, Stanford University, 2001)
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Scaling of Layered Interconnections
W. Steinhögl et al., Phys. Rev. B66 (2002)
Future
• Resistivity increases when barriers/liners are used. The main conductor
(Cu or Al) size is scaled down but the surrounding barrier film size is not scaled to ensure the barrier properties. •Barriers have much higher resistivity • Barrier consumes progressively larger area
• Barrier thickness doesn’t scale rapidly • Higher aspect ratio => larger barrier area (non-conformal deposition technology, e.g., PVD)
EE 311 Notes/Prof. Saraswat Copper Interconnect
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ALD IPVD C-PVD
• Resistivity increases as grain size decreases, which in turn is a function of the film thickness. Grain boundaries cause electron scattering leading to reduction in mobility. • Electron surface scattering: resistivity increases in future
• Reduced electron mobility as dimensions decrease
• Copper/barrier interface quality further reduces the mobility
Elastic scattering
No Change in Mobility
Diffuse scattering
Lower Mobility
P=0 P=1
w
hAR=h/w
Aint=AR*w2
Cu
Barrier
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Barrier Effect
Electron Surface Scattering Effect
!
!b
o bA
AR w
=
"
1
12
*
• Important parameter: Ab to Aint ratio • !b increase with Abto Aint ratio
• Future: ratio may increase
P: Fraction of electrons
scattered elastically from
the interfacek= d/ #mfp
#mfp: Bulk mean free path
for electrons
d: Smallest dimension of
the interconnect• Reduced electron mobility
• Operational temperature
• Copper/barrier interface quality
• Dimensions decrease in tiers: local, semiglobal, global
$
!s!o
=1
1"3(1" P)#mfp
2d
1
X3"1
X5
% &
' ( 1" e"kX
1" Pe"kXdX
1
)
*
Technology node (µm)
Al P=0P=0.5P=1
Cu, P=0.5
0.18 0.15 0.12 0.1 0.07 0.05 0.035
PVDC-PVD
I-PVD
ALD: 10nm
ALD: 3nmALD: 1nm
No BarrierEffe
ctiv
e re
sist
ivity
(µ o
hm-c
m)
Year
Global100°C
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Technology node (µm)
Al P=0P=0.5P=1
Cu, P=0.5
0.18 0.15 0.12 0.1 0.07 0.05 0.035
PVDC-PVD
I-PVDALD: 10nm
ALD: 3nmALD: 1nm
No Barrier
Semiglobal Temp.=100 0C
Kapur, McVittie & Saraswat, IEEE Trans. Electron Dev. April 2002
Temp.=100 0C
Technology node (µm)
Al P=0P=0.5P=1
Cu, P=0.5
0.18 0.15 0.12 0.1 0.07 0.05 0.035
PVD C-PVD
ALD: 10nm
ALD: 3nmALD: 1nm
No Barrier
Local
Year
Effe
ctiv
e re
sist
ivity
(µ o
hm-c
m)
Local Temp.=100 0C
•With ALD least resistivity rise • Higher P value => higher mobility • Al resistivity rises slower than Cu
• no 4 sided barrier • higher intrinsic resistivity => smaller λmfp => smaller thin film
effect • Cross over with Al resistivity possible
EE 311 Notes/Prof. Saraswat Copper Interconnect
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Cu Resistivity: Effect of Chip Temperature
2000 2004 2008 2012Year
0.18 0.12 0.07 0.05Technology Node (µm)
0.0353.6
3.2
2.4
1.6Effe
ctiv
e re
sist
ivity
(mic
rooh
m-c
m)
2
2.8
T=100 0C
T=27 0C
Global
Elastic
Diffuse
Elastic
Diffuse
Kapur, McVittie & Saraswat, IEEE Trans. Electron Dev. April 2002
•Higher temperature ⇒ lower mobility ⇒ higher resistivity •Realistic Values at 35 nm node: P=0.5, temp=100 0C
- local ~ 5 µΩ-cm - semi-global ~ 4.2 µΩ-cm - global ~ 3.2 µΩ-cm