intel confidential—nda platform roadmap, all dates and plans are subject to change without notice....
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Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice.11
1: Not all features are available on every processor line itemsIntel® FDI: Intel Flexible Display Interfacec
Lynnfield: Desktop Processor
Lynnfield Processor 1
• 45nm, Hi-K Process
Key Features:• Based on New Nehalem Microarchitecture
• Intel® Turbo Boost Technology
• Intel® Hyper-Threading technology (4 Cores, 8 threads) -> “i7 only”
• 8MB of Intel® Smart Cache
• Integrated Memory Controller (IMC) – 2ch DDR3
• Discrete graphics support – 1x16 or 2x8
Lynnfield Processor 1
• 45nm, Hi-K Process
Key Features:• Based on New Nehalem Microarchitecture
• Intel® Turbo Boost Technology
• Intel® Hyper-Threading technology (4 Cores, 8 threads) -> “i7 only”
• 8MB of Intel® Smart Cache
• Integrated Memory Controller (IMC) – 2ch DDR3
• Discrete graphics support – 1x16 or 2x8
Power: 95W• 2009A & 2009B FMB’s
Socket:• LGA1156 Socket (compatible with Clarkdale)
Platform Compatibility: • Intel® 5 series Chipset
LynnfieldProcessor
Intel® 5 series Chipset
DMI
DiscreteGraphics
TECHNICAL SPECIFICATIONS
Processor Series Clock Speed (GHz) Cores/Threads Cache Memory Speed Support TDP
i7-870 2.93 4/8 8 MB DDR3-1333 95 W
i7-860 2.80 4/8 8 MB DDR3-1333 95 W
i5-750 2.66 4/4 8 MB DDR3-1333 95 W
2
PCIe*Graphics GFX
Intel® 5 seriesChipset3
Processor
ME
DDR3
IMC
DISPLAY Display
DMI
Intel® Flexible Display
Interface (Intel® FDI)
I/O
What’s New: 향상된 터보 부스트기술 하이퍼스래딩기술 (only i7) 스마트캐시 향상된 Intel®Smart
Cache 저비용 플렛폼 저전력 CPUs (95W) 소켓 1156 2 채널 DDR3 메모리
2009 년 3 분기 인텔 ® 코어™ i7&i5 로의 전환 ( 린필드 )
Intel® P55 Express Chipset
Product Positioning – Not End-User Messaging
Intel Confidential - For Use with Customer under NDA 33
Key Features
Intel® Core™i7 & i5 ( Lynnfield )Key Message & Features
NEHALEM ARCHITECTURE
Integrated Memory Controller
DDR3 1333/1066 Support
Up to 8M Shared Smart Cache
Revolutionary Architecture and Performance leadership with
45nm Nehalem Processor
Key Message:Revolutionary, Intelligent, Incredible Performance
Potential instruction threads per processor
IMPROVED MULTITHREADING WITH INTEL® HYPER-
THREADING TECHNOLOGY(i7 only)
Processor delivers more performance in every day usage
applications
INTELLIGENT PERFORMANCE WITH INTEL TURBO BOOST
TECHNOLOGY
12
3
Processor speed can increase when running below
temperature/power limits
Dynamically Increases Frequency
3-minute pitch
Nehalem Desktop Processor Comparison
Feature Bloomfield(45n) i7 Lynnfield(45n) i7 Lynnfield(45n) i5
Processing Threads[via Simultaneous Multi-Threading capability (SMT)] 8 8 4
CPU Cores 4 4 4
Shared Cache 8MB 8MB 8MB
Integrated Memory Controller Channels 3 ch. DDR3 2 ch. DDR3
Discrete Graphics Support (PCIe Gen2) 2x16 or 4x8, 1x4 (via Tylersburg IOH)
1x16 or 2x81x16 or 2x8
Integrated GPU No No No
Processor Package TDP 130W 95W 95W
Socket LGA 1366 LGA 1156
First Samples / Production Q4 ’07 / Q4 ‘08 2H ’08 / 1H ‘09
Platform Support Tylersburg & ICH10 Ibexpeak
Common Features Turbo Mode, 7 additional SSE4 instructions, VRD11.1, 45nm process
Nehalem Processor Leadership with Integration
인텔 ® 코어™ i5( 린필드 ) 프로세서의 특징
2.93 GHz (turbo up to 3.6 GHz)8M, 4 Cores 8 threads
인텔 ® 스마트 캐시
기본 코어 주파수
하이퍼 스래딩
향상된 싱글 코어 주파수로 강력한 터보 부스트 기술
메인 스트림의 인텔 ® 터보 부스트 기술최적화된 성능향상과 에너지 효율
Previous Generationwithout Turbo
Lynnfield1
with Turbo
Highly Threaded Workload < TDP
1 Example based on 2.93GHz Lynnfield
Lightly-Threaded Workload < TDPSingle-Threaded Workload < TDPNear zero power for inactive cores
Not for End-User Messaging
6
Comparison of Desktop Sockets
LGA 1156LGA 775
Pin A1 Pin A1
LGA 1366
LGA 775
Kentsfield/Conroe
LGA 1156
(Lynnfield/Havendale Processors)
LGA 1366(Bloomfield Processors)
Contacts: 775
Package Size: 37.5 mm square
Contacts: 1156
Package Size 37.5 mm squareIndependent Load Mechanism (ILM)
Contacts: 1366Package Size 42.5 x 45mmIndependent Load Mechanism (ILM)