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Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

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Page 1: Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

Integration of hardware, intelligence and knowledgein communicating and anthropocentered systems

IMS-Bordeaux Labs

Page 2: Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

Thematic Organisation & technological support

From materialsto devices

HardwareIntegration

SystemsIntegration

MICROSYSTEMS

MATERIALS

BIOELECTRONICS

AUTOMATIC CONTROL

SIGNAL & IMAGES

PRODUCTION ENGINEERINGB. Vallespir

Y. Berthoumieu

A. Oustaloup

S. Renaud

C. Dejous

V. Vigneras

MDA

ELORGA

BIO-EM

ARIA

MEID. Chen

A. Zolghadri

I. Lagroye

D. Rebière

L. Hirsch

MMM

MHYPOP

ELIBIO

CRONE

ICOM. Zolghadri

A. Oustaloup

N. Lewis

I. Dufour

V. VignerasCEMT

MODEST

PSPR. Dupas

Y. Berthoumieu

D. Rebière

F. Demontoux

DESTINE. Grivel

VOLTIGEC. Germain

NANOELECTRONICS

DEVICES RELIABILITY

CIRCUITS DESIGNJ-B Bégueret

E. Woirgard

T. Zimmer

EDMINA

LASER

EC2

L. Béchou

T. Taris

D. Lewis

PACE

MODEL

CSH

H. Frémont

E. Kerhervé

C. Maneux

POWER

III-V

CSN

J-M. Vinassa

D. Dallet

N. Malbert

AS2NS. Saïghi

COGNITICS CIHJ-M André

ESCF. DaniellouJ-M AndréSystems and

interactions

Y. Deval

B. Veyret

X. MoreauFFTG

F. Cazaurang

Platforms of Technology

Platforms of Analysis & Characterization

Platforms VEHICLE OF FUTURE & BETHANIE

Platform of Life Sciences

C. Pellet

Page 3: Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

IMS in numbers 390 members with 160 PhDs

330 publications/year

10 patents/year

Annual budget of18 M€ including 8 M€ in salaries

10 000 m2 of research area including 1000 m2 shared with industry

4 Collaborative Research Lbs with Industry (STM, PSA, THALES, TOTAL)

7 startups with 50 employees

Page 4: Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

Collaborative Research Labs

With STMicroelectronics Analog and Mixed RF Technology Modeling and Characterization

With PSA Global Control of Automotive Chassis Dynamic Identification of the Drivers

With TOTAL Seismic imaging

With THALES Embedded Systems for Aeronautics

Page 5: Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

Microsystems MDA : Microsystems for acoustical detection

BiosensorsChemical detection in severe environments Characterization of complex liquidsCharacterization of micro and nano-structured materials

  MMM : Microassembling for microsystems

Thick films devices and microsystemsMicrocantilever sensorsPackaging hermiticity

Materials ELORGA : Organnic Electronics Organic LEDsPhotovoltaic Solar CellsOrganic FETs

  MHYPOP : Materials for hyperfrequency and optics

Analytical Modelling of photonic crystals and metamaterialsCharacterization of hyperfrequency materials

  CEMT : Electromagnetic Characterization & Remote sensing

Simulation for passive and active remote sensingCharacterization of geological environments

From Materials to Devices

Page 6: Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

Nanoelectronics LASER : Laser beam testing and analysis

Fault LocalisationIntegrated circuit hardness to ionizing radiationDynamic fault injection

MODEL : Compact modelling and device characterization

Compact models for integrated circuits librariesCharacterization & modelling of emergent devices

III-V : Evaluation et reliability of hyperfrequency technologies

Electrical characterization and analysis of AlGaN/GaN HEMTs Operational reliability of III-V technologiesMethodologies for failure analysis and advanced technologies

Devices Reliability EDMINA : Evaluation of micro and nano assemblies

Micro assembly and passive devicesOptoelectronic devices et laser matérials

PACE : Packaging, assembly and CEM

Packaging et assemblyElectromagnetic compatibility

POWER : Circuits et Systems for power management

Power devicesTechnologies for power assemblyConverters et hybrid sources management

Circuits Design EC2 : Analog and radiofrequency integrated cicruits

Radiofrequency systemsFront end radiofrequency circuits Ultra fast mixed integrated circuits

CSH : Hyperfrequency circuits and systems

RF and millimeter wave power amplificatorsPower VCOFrequency synthetisors and duplexors

CSN : Digital circuits et systems Data convertersAdequation algorithm-architectureHardware security of embedded systems

Hardware Integration

Page 7: Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

Automatics ARIA : Robust and integrated approach of automatic control

Model-based diagnosis, fault-tolerant controlSystem identification, guidance and control

CRONE : Robust command of Fractional-derivative systems

Theory of Fractional-derivative systemsSystem identification and command of fractional-derivative systems

Signal and Images MODEST : Modèles stochastiques n-D et méthodes d’estimation algébriques et stochastiques

Nouveaux modèles stochastiques pour les textures n-DMéthodes d’analyse des images inhomogènesMéthodes d’estimation et modèles paramétriques n-DIntégrale stochastique et approches bayésiennes

DESTIN : Détection et estimation pour systèmes de télécom et de localisation

Filtrage optimal et particulaireMéthodes d’estimation par blocDétection d’événements rares dans les séries temporelles

VOLTIGE : Analyse d’images et de volumes texturés

Traitement et analyse des textures directionnelles structuralesSegmentation morphologiqueFusion d'images

Production Engineering

MEI : Enterprise modelling and engineering

Modélisation d'entrepriseIntégration et interopérabilité des systèmesEvaluation de performances

ICO : Design Engineering Evaluation et pilotage des systèmes de conceptionEnvironnements d’assistance aux acteurs du système de conceptionCo-Evolution produit-réseau de partenaires

PSP : Driving of production systems

Planification hiérarchisée et agrégation de données techniquesPilotage des chaînes logistiquesIntégration Production/Transport

Systems Integration

Page 8: Integration of hardware, intelligence and knowledge in communicating and anthropocentered systems IMS-Bordeaux Labs

Cognitics ERGO : Ergonomie Systèmes techniques et organisationnels adaptés aux usagesFacteurs humains de la prévention des risques industriels et professionnels

CIH : Cognitique et ingénierie humaine

Ingénierie du facteur humain et intégration Homme/SystèmeGestion et technologies des connaissances et des compétencesAccessibilité et usages des technologies pour l’aide et la suppléanceContraintes cognitives des usagers

Bioelectronics BIO-EM : Bio-électromagnétisme Effets toxicologiques des champs électromagnétiques non invasifsEffets thérapeutiques des champs électromagnétiquesMécanismes d’action des champs électromagnétiques

ELIBIO : Systèmes électroniques en interaction avec la biologie

Acquisition et contrôle en boucle fermée sur interface électronique/vivantCircuits intégrés de traitement du signal bioélectroniqueSystèmes de communication temps réel

AS2N : Architectures de Réseaux de Neurones sur Silicium

Conception de réseaux de neurones sur siliciumIngénierie des systèmes neuromorphiques

Systems and Interactions