integrated microelectronics inc. (corporate brochure)

MILESTONES

Made it to list of the top 50 global EMS providers of Manufacturing Market Insider

2006

Received Circuits Assembly’s Service Excellence Award for Highest Overall Customer Ranking

2007

Listed by way of introduction on the Philippine Stock Exchange, established IMI Energy Solutions, and acquired power semiconductor company PSi Technologies, Inc.

Acquired EPIQ subsidiaries in Bulgaria, the Czech Republic,and Mexico

IMI has multiple sites spread out in Asia, North America, and Europe, providing solutions to OEMs catering for both regional and international markets

2010

2011

PRESENT

Started offering design and product development services

1998

Established global footprint through acquisition of the EMS assets of Saturn Electronics and Engineering Inc. and then Speedy-Tech

2005

Obtained the Philippine Quality Award level III for mastery in quality management

2001IMI was established as a joint venture between Ayala Corporation and Resins Inc.

1980

Expanded IC assembly business into contract manufacturing of electronics assemblies

1982

ISO 9001:2008 Quality Management System

ISO 14001:2004 Environmental Management System

ISO/TS 16949:2009 Quality Management System for Automotive Applications

ISO 13485:2003 Quality Management System for Medical Devices

QC080000 Hazardous Substance Free Process Management System

ISO/IEC 17025:2005 Quality Management System for Testing and Calibration Laboratories

International Standard Certifications include:

Philippines Singapore China Japan USA Mexico Bulgaria Czech Republic

buILd yOuR buSINESSwITh IMI’S INNOvaTIvE aNd FLExIbLE SOLuTIONS

Integrated Micro-Electronics, Inc.North Science AvenueSpecial Export Processing ZoneLaguna Technopark, Biñan 4024Laguna, PhilippinesTel (63 2) 756 6840Fax (63 49) 544-0322Email [email protected]

Speedy-Tech Electronics Ltd.Speedy-Tech Industrial Building20 Kian Teck LaneSingapore 627854Tel (65) 6262 1118Fax (65) 6262 6668

Shenzhen Speedy-Tech Electronics Co., Ltd.Speedy-Tech Industrial BuildingArea 7, Liantang Industrial ZoneLuo Hu, ShenzhenPeople’s Republic of China 518004Tel (86) 755 2570 8382Fax (86) 755 2570 8019

Speedy-Tech Industrial buildingBuilding A-3 & 4, Bengkang Industrial Zone,Jinye Road, Kuichong Town, Dapeng DistrictShenzhen, People’s Republic of ChinaTel (86) 755 8977 3788Fax (86) 755 8977 3068

Speedy-Tech Electronics (Jiaxing) Co., Ltd.Building 1-3, No. 688, Blk 3 He Ping Street Economic Industrial ZoneJiaxing City, ZhejiangPeople’s Republic of China 314001Tel (86) 573 82224 999Fax (86) 573 82210 558

PSi Technologies, Inc.Lot B2-5 Carmelray Industrial Park IIBarangay Tulo, Calamba, LagunaTel (63 2) 405 5001, (63 49) 554 9995 to 99 www.psitechnologies.com

IMI SaLES OFFICES

IMI Japan, Inc.461-0005 Aichi-ken,Nagoya-shi, Higashi-ku,Higashisakura 2-5-11Shoener Building 4th FloorTel (81 52) 932 1001Fax (81 52) 932 2002

IMI Europe & Middle East(Representative Office)Plockinger Str. 23D-85 298 ScheyernMunich, GermanyTel (49 8441) 80 3840Fax (49 8441) 80 3916

LOGISTICS OFFICE

Speedy-Tech Electronics (hK) Ltd.Unit B, 10/F, CDW Bldg.,No. 388 Castle Peak Road,Tsuen Wan, N.T., Hong KongTel (852) 2413 9830Fax (822) 2413 5911

IMI (Cheng du) Co., Ltd.Muwei Industrial Park , Huanghe Road, XinduDistrict Industrial Zone, East Chengdu City,Sichuan Province, People’s Republic of China 610500Tel (86) 28 8395 8377Fax (86) 28 8395 5509

IMI uSa Inc.14312 Franklin AvenueSuite A, Tustin, CA 92780, USATel (1 714) 734 7043Fax (1 714) 838 8787

IMI Energy Solutions46453 Landing ParkwayFremont, CA 94538Tel (1 510) 770 9825Fax (1 510) 770 9937

Integrated Micro-Electronics bulgariaIndustrial Zone “Mircroelektronika” P.O 662140 Botevgrad, Municipality of BotevgradSofia District, BulgariaTel (359) 723 68 359Fax (359) 723 68 246

Integrated Micro-Electronics Czech Republic S.r.o.Plzenká 1067, Třemošná 330 11Czech RepublicTel (420) 377 882 611Fax (420) 377 882 610

Integrated Micro-Electronics México, S.a.P.I. de C. vCalle 4 Poniente No. 10560Parque Industrial El Salto,C.P.45680 El Salto, Jalisco, MéxicoTel (52) (33) 4777-1500Fax (52) (33) 4777-3263

yOuR PaRTNER OF ChOICE.

IMI is a vertically-integrated global provider of electronics manufacturing services (EMS) and power semiconductor assembly and test services (SATS). Within the EMS market, we have consistently ranked among the top 30 in the world based on the Manufacturing Market Insider’s list. We have the capabilities to take on your specific outsourcing needs, providing you with innovative and flexible solutions that encompass design and product development, advanced manufacturing engineering, volume manufacturing, value engineering, test and systems development, automation, failure analysis and reliability testing, plastic encapsulation, and logistics and order fulfilment. Having served a variety of companies across different industries in several countries, we recognize that each business is unique. With this in mind, we go the extra mile to integrate our processes and systems with yours and tailor them to fit perfectly with your needs.

CollaborationWe make your concerns our concerns. We are passionate about what we do, and what we do best is work closely with you to achieve your objectives.

FlexibilityWe often challenge our own systems and processes to make sure that they are performing optimally. We are a company of quick thinkers comprising design, logistics and production people, with processes adaptable to your requirements.

PrecisionWe solve your problems to maximize your potential. We leverage our expertise – our capabilities, experience, and geographic footprint – to handle the complexities of your business. We take advantage of economies of scale, committed to minimizing your expenses and optimizing your results. We deliver quality products and services.

Standard business Model

Provides standard production processes

Semi-Custom business Model

Allows customers to integrate specific and custom-built processes into the standard manufacturing line

Custom business Model

Allows customers to gain a satellite factory through IMI.

business Models

design & Engineering SolutionsContract design and Joint development Solutions• Power Electronics• Embedded Systems• Camera and Imaging Systems• Power Semiconductors• Short-Range Wireless

design Services• Hardware & Software Development• Mechanical Design• Printed Circuit Board Layout• Design for Manufacturability, Reliability, and Testability• Simultaneous Engineering• Value Engineering• Prototyping

Pre-Certification Testing• FCC• RFI/EMI Testing• UL Safety• CSA• Other Customer Standards

advance Manufacturing Engineering (aME) Capabilities• Direct Chip Attach (COB, Flip Chip, and

Chip on Silicon)• Multi-Chip Module (MCM) and

Microsystem• MEMS (Microelectromechanical Systems)

Assembly• Thermally Enhanced Direct Chip Attach• Advanced Surface Metallurgies• Pre-flow Underfill Process (IMI Patent)• Traceless Flip Chip Technology (IMI Patent)• Substrate and Interconnect Technology• Small Precision Assembly

Test & System development • Co-development of test

specifications concurrent to new product development

• Design for testability and flexibility for product revisions

• Turnkey hardware design and assembly

• Parallel test solutions for high volume manufacturing

• Software development and upgrades

• Test documentation • Training and 24x7 manufacturing

support

Support & Fulfilment • Supply Chain Management

• ERP-based Materials Management

• Cost Management• Supply Chain Optimization• Supply Chain Assurance &

Continuity of Supply• Leveraging Resources

• Logistics and Distribution • Order Management • After-sales Service

1

Reliability Test, Failure analysis, and Equipment Calibration Capabilities Calibration Services• Thermometry• Electrical equipment • Metrology

Reliability Engineering• Accelerated testing to determine product

life expectancy, warranty and reliability

Failure analysis• Data analysis • Identification of the failure mode, failure

mechanism, and probable causes• Advice on preventive measures IMI Singapore, in particular, has a complete facility set-up that includes: • FCC-listed 10m semi-anechoic chamber

and shielded room for radiated emission• Shielded Room• EMC Diagnosis Equipment• Full-Compliance EMC Test and

Measurement Equipment• HALT/HASS Chamber, Climatic Chamber• Infrared Thermal Imager• Optics Laboratory

5

2 New Product Introduction (NPI)Services• Product Concept• Product Development• Process & Test Development• Design for Manufacturability• Design for Reliability• Prototyping• Line Integration• Offshore Manufacturing

3

Manufacturing SolutionsManufacturing• Complete Box Build• Sub-Assembly• Component Assembly• Processing rigid, flexible, ceramic and glass

substrates• RoHS-compliant Systems • Precision Assembly

• Specialty non-PCB substrates• Direct Die Attach• Die Attach & Wire Bond (Al & Au)

• PCB & FPC Assembly• Chip-on-Board• Flexible PCBA• Aluminium PCBA• Ceramic PCBA• Flip Chip • Hybrid Module PCBA• PCBA with Multiple BGA SMT –

Automated Manufacturing• Multi-Chip Module (MCM) and Microsystem• MEMS Assembly• Selective and Robotic Soldering• Cleanroom Operations• Power Semiconductor• Plastic Injection

46

7

IMI’S GLObaLFaCILITIES

By partnering with IMI, you can leverage our global network of manufacturing and engineering capabilities in key continents of the world.

Our plants in China and the Philippines are used for manufacturing for China and other emerging markets of Asia as well as for global markets, while our facilities in North America and Europe serve as a manufacturing base for OEMs that wish to lower their total cost of production through regional outsourcing.

Manufacturing Engineering Sales

uSa

FremontCalifornia

TustinCalifornia Guadalajara

Mexico

San AntonioTexas

DetroitMichigan

China Japan(Sales office only)

EuROPE

TřemošnáCzech Republic

BotevgradBulgaria

Shenzhen( Liantang, Kuichong)

JiaxingChengdu

LagunaTaguigCavite

Philippines

Singapore (Sales office only)

France

Germany

automotive electronics

IMI's Key Capabilities

• AutomotiveCameraPlatform

• SensorsandImagingContractDesign

• PowerElectronics

• COBManufacturing

• ProductMiniaturization

• DFMandDFT

• TestEquipmentDevelopment

• RigidPrintedCircuitBoardAssembly

• FlexPrintedCircuitAssembly

• FlipChipProcess

• AutomaticPinInsertion

• SimultaneousEngineering

• ISO/TS16949:2009CertifiedLines

• CriticalPartMonitoring(CPM)

• RejectProfileAnalysis(RPA)

• PartsAverageTest(PAT)

• StatisticalBinAnalysis

• RoHSCompliantLines

automotive electronics

integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines

Tel:(632)7566840Fax:(6349)5440322Email:[email protected]

AutomotiveCameraSunroofControllerAnti-FogSensor

TachometerInfotainment

DashboardBacklight

CarWiperPCBA&EnclosureSystem

GPS/GSMFleetTrackingSystem

LaneDepartureWarningSystem

RotatorSpeedController

OccupancySeatSensor

CruiseControlHeadlightControl

CarAlarmSystem

AutoDoorLockSystem

TirepressureSensorPCBA

TransmissionGearSensor

ABSPressureSensorPCBA

LEDTailLights

Product Experiences

• AutomotiveCamera• PCBAforElectronicStabilityProgram(ESP)• TirePressureSensorPCBA• CarWindshieldTemperatureandHumiditySensor• ElectronicPowerSteering(EPS)RotorPositionSensor(RPS)• PCBAforHeadlight• SwitchControllerforMainLight• CommunicationPowerPCBA• BodyControlModule(BCM)

• AntennaReceiver/DABTuner• PowertrainControlSolutions• SemiconductorsusedinElectricDrive/HybridElectricVehicles• FuelManagement• PumpDriver• SteeringWheelControlDevice• CockpitControlDevice• AudioProcessor• PlasticInjectionMolding

inDustrial


• Low-Volume/High-Mix

Manufacturing

• PowerSupplyDesign

• SensorandImagingContractDesign

• MechanicalEnclosureDesign

• DFMandDFT




• COB(Au&AlWires)

• CompleteBoxBuild

• MediumtoHighPowerDiscrete

PackagesandProcess

• PowerModules


inDustrial



Product Experiences

• AutomatedMeterReading(AMR)

• SecurityDevice

• ElectronicDoorAccessSystem

• SmartCard

• PointofSalesSystem

• PrinterControlBoard

• PowerAmplifier

• DC-DCPowerConverter

• EngineControllers

• WeldingMachineInverter

• MotorDriversforConveyor

• FanMotorControlBoard

• ComputerNumericalControl(CNC)ControlBoard

• MainPowerSuppliesforLEDStreetLighting

• ModulesforRenewableEnergyGeneration,TransmissionandConversion

meDical electronics


• Low-Volume/High-Mix

Manufacturing

• ProductDesignCo-development

• DFMandDFT




• FlipChipOnFlexAssembly

• COBincludingDieAttachedof

ImagerDie

• ISO13485:2003CertifiedLines

meDical electronics



Product Experiences

• FlatPanelImagingEquipment

• AutoBodyContouringImagingEquipment

• DentalImagingSystem

• DefibrillatorComponent

• ConcealedHearingAid

• BiomedicalandLaboratoryEquipment

• CentrifugeControlBoard

• FitnessEquipmentControlBoard

telecommunication infrastracture


• DesignforManufacturability


• Pre-certificationTesting



• COBincludingDieAttachedof

ImagerDie


• RepairServices


• PowerQFN

• PowermiteTM

• PowerManagement(IC)Discrete

Packaging,e.g.,TO-220,TO-263,

TO-252,TO-247 andPowerflexTM

telecommunication infrastracture



Product Experiences

• BackPanelforTelecommunicationBoard

• Fibertothe“X”(FFTx)Systems

• BoosterAmplifier

• GPON(GigabitPassiveOpticalNetwork)Systems

• WirelessSecuritySystem

• BaseStationPowerSupply

• DigitalStationControlBoard

• PowerTransistorsforAmplifiersinCellularBaseStations

• PowerConversionICsinAdaptersandChargersforCellPhones

andCordlessPhones

• DCPortandUSBPortProtectionforCellphonesandSatellite

RadioPeripherals

storage Devices






• FlipChipProcess

• MechanicalandOpticalPrecision

Assembly



• PowerQFN

• PowermiteTM

• PowerManagement(IC)Discrete

Packaging,e.g.,TO-220,TO-263,

TO-252,TO-247andPowerflexTM

storage Devices



Product Experiences

• CD/ComboDrive

• DVDDrive

• Blu-RayDiscDrive

• HardDiskDrive

• SolidStateDrives

• PrinterSensor

• PrinterControlBoard

• Multi-FunctionCopierMachine

• DVDRecorderPowerSupply

• PowerSuppliesforServers,PCs,Notebooks,andNetbooks

• Over-voltageProtectionforHDDandDCPortProtectionfor

KeyboardMouse

consumer electronics


• Cost-EffectiveHigh-Volume

Manufacturing

• FirmwareDevelopment

• MechanicalEnclosureDesign

• LowProfileSwitchModePowerSupplies

• Pre-certificationTesting


• FlipChipProcess


• CompleteBoxBuildAssembly

• LowtoHighPowerOutline

Packages

• SmalltoLargeOutlinePackages

• SpecializedInterconnectProcess

forProductPowerRequirements

• PlasticInjection

consumer electronics



Product Experiences

• UltrasonicToothbrush

• HybridIC

• GasIgnitorandRe-Ignitor

• Air-Conditioning(HVAC)Controller

• ProjectorLampDrivers

• PowerManagementandHomeApplianceforLightingControl

• RefrigeratorandCookerHoodControlBoard

• HouseholdMeteringDevice

• BluetoothHeadset

• ElectricDriveControlforHomeAppliances

• MainPowerSupplyforFlat-panelTV

• PowerSupplyforGameConsolesandEntertainmentElectronics

• HighVoltagePowerConversionICsinAdaptersandChargersforPersonalElectronics

• GarageDoorControl

• ProgrammableTimer

• PressureCookerModules

• SteamerControllerModules

• WashingMachineControllers

• CoffeeMachine

renewable energy


• PVModuleorPanelDesign/

Co-Development

• MaterialsQualification

• ProcessDevelopment

• Prototyping

• PanelTestingandCertification

(withRETC)

• Low-VolumeManufacturing

ofEngineeringorMarketing

Samples

• MassProductionofSolarPanels

(inJiaxing,China)

renewable energy



Product Experiences

• PVPanelAssembly

• PVCo-DesignandDevelopment

• PVPanelHighVolumeManufacturing

• PVPanelPlatform

• PVInverterPlatform

• InverterElectronics

power semiconDuctors


• Low-VolumeHigh-MixandHigh-VolumeLow-MixManufacturing

• PowerElectronicsContractDesign• RapidPrototyping• VirtualPrototyping(mechanicaldesigntoapplicationsimulation)

• PackageDesignandCo-development• HermeticsAssemblyCapability• CeramicIsolatedPackageTechnologyavailable

• HighDensityMatrixLeadFrameDesign• CUClipDesign• QFNMCMDesign• QFN3DDesign• TestEquipmentandProcessDevelopment

• ISO/TS16949:2002CertifiedLines• LowNRECost,duetoPrototypeAssemblyLine

power semiconDuctors



Product and Package Experiences

• PowerComponentsPackageExperiences-TO220,TO220FP,TO247,TO252,TO264,SOT227-HermeticsPackagesTO257,TO258-Al-wireandAu-wireBonding-StandardandVacuumSolderReflow

• PowerQFNProductExperiences-SawSingulationMultiDieandStackedDie-ICattachacctoDrMOSStandard-StackedDiePowerStage-ICCuWireBonding-PassiveComponentIntegration-CuClipAttach,AluminumRibbonBonding

• PowerModulesProduct/ProcessExperiences-ThyristorModuleAssemblyandTest(Inverter)-IGBTModuleAssemblyandTest(Inverter)-MOSFETModuleAssemblyandTest(SwitchInverter)-Al-wire,Cu-wire,Au-wireBonding-VacuumReflow,SolderDieAttach-TransferMolding-CaseJoiningPotting

integrated microelectronics inc. (corporate brochure)

Documents

quality management systemiso

xindudistrict industrial

bengkang industrial

muwei industrial park

quality management2001imi

liantang industrial

philippine quality award

jinye road