institute for electronics engineering - biccnet · pdf fileinstitute for electronics...

Institute for Electronics Engineering

www.lfte.de

1


Professor Dr. Robert Weigel, Head of InstituteProfessor Dr. Georg Fischer

www.lfte.de


www.lfte.de

Making Bits Fly!


www.lfte.de


www.lfte.de

40 Jahre „Tietze/Schenk“ (2009)


www.lfte.de

Structure

Friedrich-Alexander-Universität FAU

Philosophische Fakultät &

Fachbereich Theologie

Rechts- & Wirt-schaftswissen-

schaftliche Fakultät

Technische Fakultät Naturwissen-

schaftliche Fakultät

Medizinische Fakultät

Department Chemie & Bio-

ingenieurwesen

Department Informatik

Department Elektrotechnik

Elektronik Informationstech

.

Department Maschinenbau

Department Werkstoff-

wissenschaften

LHFT EASEE LRT LMS LTE LEB LRS LIKE LIT LSE LMK EMF


www.lfte.de

STAFF

• 2 Professors Robert Weigel, Georg Fischer

• 2 external Teaching Professors: Frank Ohnhäuser (Texas Instruments)

• 57 Research Assistants

• 4 Technical Staff Members

• 2 Secretarial Staff Members

• 40 external Ph.D. Students


www.lfte.de

ORGANIZATION

• Head Prof. Robert Weigel & Prof. Georg Fischer

• Group System EngineeringRichard Rose

• Group Circuits, Systems, and Hardware TestDr. Alexander Kölpin

• Group Chip DesignDr. Thomas Ußmüller

• Group RF Integrated Sensors Dr. Dietmar Kissinger


www.lfte.de

– Electronic Systems, Modules and (Integrated) Circuits from DC to 170 GHz- RF/Analog and Digital Circuit Design- Communications and Sensing (Wireless &

Wired) - Signal Processing

– Multidisciplinary, Hardware-oriented Approach– Application Areas:

- Information Electronics- Vehicular Electronics- Industrial Electronics- Medical Electronics

INSTITUTE PROFILE


www.lfte.de

COMPETENCES

– DESIGN (System Design, Signal Processing, Circuit Design, 3D Structure Design)

– EXPERIMENTAL CHARACTERIZATION (Measurements, Application, Packaging)

– LEADING EDGE TECHNOLOGIES in Cooperation with Industrial Partners


www.lfte.de

Business Model

• Publically Funded Research Projects with Industry

• Publically Funded Basic Research Projects (without Industry)

• Direct Contracts with Industry• LTE Personell working @ Industry• Industry Personell (often Ph.D.

Students) working @ LTE


www.lfte.de

Business Model

Our „Products“:

• Hardware/Software Demonstrators• Engineering Services• Case Studies• Consulting• Technology Transfer, Training, etc.• Human Resources Agency• Others, e.g. Writing of Research

Proposals


www.lfte.de

Business Model

Real Products and Services:

• Spin-Off Company eesy-id GmbHFounded August 20095 Engineers


www.lfte.de

Project ScopeFrom Chips to Systems


www.lfte.de

Chip Design


www.lfte.de

Module und Systeme


www.lfte.de

16

Novel Power Consumption Estimation and Monitoring Methodology

Power Consumption Model at System Level

On-chip monitoring and tracing capabilities

Automatic design space exploration

Time to market

Predictability

Energy efficiency

PowerEval


www.lfte.de

17

0 0.5 1 1.5 2 2.5 3 3.50

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45Power and Energy Profile of a GSM Receiver

0 0

2

4

6

8

10

12

14

16

Time (ms)

Receiver OFF

Receiver IDLE

Receiver ON

Receiver OFF

Receiver IDLE

PowerEval – Simulation Results

Highly accurate prediction of power consumption at system level


www.lfte.de

18

Medical Valley – Smart SensorsRF-based blood glucose measurement

CST-Simulation of variable glucose concentration.

Blood Glucose Measurement

Lab-setup for non-invasive concentration measurements.

Material under test


www.lfte.de

19

900 µm

700 µmMedical Valley – Smart SensorsRF-based blood glucose measurement

RF-Measurement-System @ 15 GHz

Chip Integration

Measurement ResultsFor variable Glucose Level


www.lfte.de

RFID-Feldtest

FPGA-Board Transceiver-Board

Reader (Interrogator) consisting of a Standard FPGA-Demoboard and a Transceiver-Demoboard.

Full EPC class 1 gen 2 compliant Arbitrarily extendable with new Functions Testing of the RFID Digital Part in Real-Word

Scenarios

RFID VHDL-Codeimplemented on a mobile FPGA with an external RF-frontend

EPC Code #1

EPC Code #2

EPC Code #3


www.lfte.de

Ortungs-Feldtest

RF Jammer for adjacent basestations

Typical catastrophe scenario Localization concept

Low-level basestation


www.lfte.de

Hard Rock-Feldtest


www.lfte.de

LTE-Men at Work


www.lfte.de

Hard Rock-Hard Ware


www.lfte.de

TEACHING I

• Undergraduate Courses:• Grundlagen der Elektrotechnik (Medizintechnik) - Weigel (4V+2Ü)• Arbeitstechnik – Fischer/Thielecke (1V)• Elektronik und Schaltungstechnik – Fischer (4V+2Ü)• Schaltungstechnik - Kölpin (2V+2Ü+3P)• - - - - - - - - - - - - - - - - - - - - - - - - -• Graduate Courses:• Analoge elektronische Systeme - Weigel (3V+1Ü)• Digitale elektronische Systeme – Weigel (3V+1Ü)• HF-Architekturen Basisstationen – Fischer (2V)• Elektronik programmierbarer Digitalsysteme – Ußmüller (2V+2Ü)• Architekturen der Digitalen Signalverarbeitung – Fischer (2V+2Ü)• Integrierte Schaltungen für Funkanwendungen - Weigel (2V+2Ü)


www.lfte.de

TEACHING II

• Graduate Courses (continued):• Systeme und Schaltungen der Übertragungstechnik

Weigel (2V+2Ü)• Analog Linear and Converter ICs (2V+1Ü) – Ohnhäuser• Entwurf programmierbarer Logikbausteine (PLD-Praktikum) (3P)• Seminar Technische Elektronik (2SE) • Seminar Medizinelektronik und elektronische Assistenzsysteme

des Alltags (2SE)• Forschungsseminar Technische Elektronik (2SE)• Studien-, Diplom- und Doktorarbeiten• Studienarbeiten in Shanghai, China• Elitestudiengang Systeme Informations- und Multimediatechnik• Graduate Summer School Hardware-Software-Codesign


www.lfte.de

OVERALL RESEARCH AREAS– System Design and System Simulation of

Communication, RFID, Sensor, Radar, Positioning Systems

– Partitioning in Analog- and Digital Systems, Definition of Interfaces

– Signal Processing (Hardware)– Design of Integrated RF/Analog/Digital Circuits– Design of MEMS and SAW/FBAR Devices and

Modules– System-in-Package, Electronic Packaging– Modelling and EMC-Oriented IC/PCB Design for

Automotive Applications– Hardware-in-the Loop– RF Measurements up to 44 GHz (170 GHz in work)


www.lfte.de

Actual Research Areas– Mobile Radio Terminals

ICs, Components and Subsystems as well as Algorithms for GSM, UMTS, LTE, WiMAX, WLAN, etc.

– Mobile Radio Base StationsPower Amplifiers, Filters

– RadarICs, Modules, Antennas and Algorithms

– Local and Global Positioning, NavigationICs, Algorithms and Systems for Galileo, industrial Positioning and Navigation Systems, Search and Rescue etc.

– RFID and Ad-hoc Sensor NetworksICs and Algorithms

– Automotive Electromagnetic CompatibilityAlgorithms and Software form Vehicle to IC

– System Integration, Test and Hardware-in-the LoopSimulation, Algorithms, Prototyping

Microwave Spectroscopy for Medical SensorsMolecul Resonances, Lab Measurements, NWA on chip

Wireless Audio (PMSE)Wireless Microphones, Cognitive Radio Resource Management


www.lfte.de

29

LTE Labs


www.lfte.de

EQUIPMENT

– 1400 qm Labs and Offices– Analog Measurement Set-Up incl. Wafer

Prober up to 44 GHz (170 GHz planned)– Digital Measurement Set-Ups incl. Logic

Analyzer up to 800 MHz & DSP-Lab– Board, Mounting Technology incl. Flip-

Chip-Bonding– Electronic and Computer Labs and

Workshops– Software ADS, Cadence, Sonnet, CST, etc.


www.lfte.de

Overview LTE-Labs• 300 sqm Laboratory Area• 9 Rooms

– Analog Lab up to 18 GHz– Analog Lab up to 43 GHz– Analog Lab up to 170 GHz (to be set up)– Digital Lab– Positioning Lab– Noise Measurements Lab– Fabrication & Assembly Lab– Infrastructure Lab

• Central Processing of– Compressed, oil-free Air– Cooling Water– Distilled Water– Vacuum– Argon– Nitrogen– Temperature stabilized Ventilation

• New Electric Installation


www.lfte.de

High-Performance Computing @ LTECPU and GPU cluster architecture

Large Problems (MPI), Fast Solvers (GPU), Parallel Distributed Computing (CPU Cluster)


www.lfte.de

Industry Partners

• Siemens, München, Erlangen• Infineon Technologies, München,

Regensburg, Graz• EPCOS, München, Deutschlandsberg• DICE, Linz• Daimler, Ulm• BMW, München• Audi, Ingolstadt• Alcatel-Lucent, Nürnberg, Stuttgart• Bosch, Stuttgart, Hildesheim, Bamberg• Conti, Regensburg• ST-Ericsson, Nürnberg• Texas Instruments, Erlangen• Diehl-Aerospace, Nürnberg• AWE, Stuttgart• Loewe, Kronach• ClearAudio, Erlangen• Ifen, Poing• iSyst, Nürnberg• Triquint Semiconductors, München

• CoreScience, Erlangen• Biotronik, Erlangen• Biolab, Berlin, Zürich• Areva, Erlangen• Herrenknecht, Schwanau• MEDAV, Erlangen• Corscience, Erlangen• eesy-id, Gräfelfing• Fujitsu, Yokohama, Japan• Gerotron, Gräfelfing, Tennenlohe• NSN, Ulm• Stangl, Baiersdorf• Intel Mobile Communications,

München• eesy-ic, Gräfelfing• DMCE, Linz


www.lfte.de

Institute/University Partners

• Fraunhoferinstitut für Integrierte Schaltungen, Erlangen• Fraunhoferinstitut für Mikrosystemtechnik, Berlin• Deutsches Luft- und Raumfahrtzentrum, Oberpaffenhofen• Linz Center of Competence in Mechatronics, Linz• Institute for Semiconductors IHP, Frankfurt/Oder• RWTH Aachen, Aachen• TU München, München• TU Ilmenau, Ilmenau• TU Chemnitz, Chemnitz• TU Dresden, Dresden• TU Berlin, Berlin• Universität Freiburg, Freiburg• ETH Zürich, Zürich• Universität Bremen, Stuttgart• Universität Stuttgart, Stuttgart• Universität der Bundeswehr München, Neubiberg• Helmut-Schmidt-Universität, Hamburg• Universität Linz, Linz• Tongji Universität, Shanghai, China• University of Zaragoza, Spain• Diakonie Neuendettelsau


www.lfte.de

MISCELLANEOUS• 2.6 Mio € Third-Party Funds in 2010• 15 PhD Thesis finished in 2010• about 70 International Publications per Year• about 20 International Talks per Year• about 3 Patents per Year• Organization of International Symposia,

Workshops, Training Courses, University Talks, etc.

• International Exchange of Students and Scientific Staff Members

• Hosting of International Visiting Scientists• Students‘ Excursions / Field Trips

institute for electronics engineering - biccnet · pdf fileinstitute for electronics...

Documents