innovations in eda: multi-technology rf design using the ...bbs.hwrf.com.cn/downrf/ads2011.pdf ·...
TRANSCRIPT
Joe CivelloADS Product Manager
Agilent Technologies
Welcome
© Agilent Technologies 2011
Agenda
Page 2
• RF & microwave market trends & how Agilent EEsof is investing its R&D• Multi-technology design with ADS 2011 - demo• New capabilities for all RF & microwave engineers
– Circuit design & simulation - demo– EM modeling (Momentum and FEM) - demo– Load Pull for improved PA matching network design - demo– Layout - demo– And more …
Complete MMIC/Module ADS Desktop Design
Page 3
RF & Microwave Market Trends
Increasing Complexity & Integration• Commercial wireless and Aerospace/Defense Industries are rapidly moving
from single packaged MMICs, to larger, more complex ICs in multi-chip RF modules
• Today’s flows combine multiple, poorly integrated tools, which are not able to address multiple technology design and verification
• The IC, laminate, package, and PCB system need to be designed together, interactively
• Electro-magnetic interactions between substrates need to be modeled
Page 4
ADS 2011: The IC/Module/Package/PCB Design SolutionRealizing the Multi-Technology Vision
Multi-Technology Circuit Design• Multiple die (IC and IPD)• Multiple substrates (die, laminate, LTCC,
package, PCB)• Multiple process design kits (PDKs)
– GaAs (HBT, pHEMT), GaN, SiGe, Si …
Integrated Electro-Magnetic Solvers• Multi-Technology EM simulation
– Full 3D EM Simulation• Finite Element Simulator• Parameterized Solid Models of Components
• Multi-layer 3D Planar EM simulation• Easy EM simulation for the every engineer
Mounted on Board
Multiple ICs Multiple Technologies
On Laminate &Packaged
Page 5
Designing Across Multiple Technologies
Page 6
The Multi-Technology Challenge
LNAGaAs Mixer
SiGe
RF Module Laminate
Layer Defs
AEL Cust
Single Technology Space
Traditional Design Tools• Designed to handle one
type of design– IC, Module, or PCB
• Have a single technology definition space
Page 7
True Multi-Technology Management
LNAGaAs
MixerSiGe
RF Module Laminate
Lam:Components
Lam:Material Prop
Lam:Layer Defs
Lam:AEL Cust
SiGe:Components
SiGe:Material PropSiGe:Layer Defs
SiGe:AEL Cust
GaAs:Components
GaAs:Material PropGaAs:Layer Defs
GaAs:AEL Cust
ADS 2011 Multi-technology Environment
New Library construct maintains separate technology definition areas• No namespace collisions• No layer mapping needed• No PDK conflicts
Page 8
Multi-Technology Design & Library Management
Page 9
Multi-Technology Circuit Simulation
• Simulate critical circuits across multiple technologies• Design closer to the margins• Detect and solve issues before manufacturing
Page 10
Module Laminate
MixerSiGe
LNA GaAs
Native Physical Multi-Substrate Support
• Easily add one or more pre-defined substrates– IC in a package, IC in a module,
module on a board, etc.• Unlimited levels of technology stacking
– i.e. IC on a module on a PCB• Supports flip chips, wire bonding, and
backside mounting• No modification of layers required• Directly modify any of the designs
– No flattening required• Works with all the ADS tools
– Layout, 3D Visualization, Momentum and FEM, etc.
Easy to combine multiple substrates
Page 11
New graphical substrate editor
Page 12
ADS Integrated 3D EM FlowMomentum & FEM in ADS, 3D EM Components & EMPro/FDTD link
EMPro PlatformADS Platform
FDTD SimulatorFEM SimulatorMomentum Simulator
Parameterized3D EM
Components
LayoutCAD Data
Multi-Technology EM SimulationCapabilities & Vision
• Discover coupling effects prior to fabrication
• More effectively optimize design elements for final packaging
• More easily make design trade-offs
• Help diagnose and solve performance problems
Page 13
+ =
3D view FEMMomentum
+
Package IC IC
Multi-technologyEM Simulation
Improved RF Circuit Design and Simulation
Page 14
ViewsEasily Manage Models & Design Representations• Cells represent a single design
object• Cell Views provide multiple
representations of that design object– Different schematic variants,
behavioral, measured, layout, EM data views, etc.
– User defined• Simplifies schematics• Easily select simulation model• Explore design variants
Cell name
Views
Page 15
Dynamic Simulation Model Selection
Design, by its nature, is evolutionary. Selecting model type and accuracy is key to this. This makes it simple and virtually instantaneous.
• Easily select the model to use for simulation– Tradeoff speed vs. accuracy
• Works on one or more selected components
• Current active model is shown on the schematic
• Easily create a model priority list to work on entire design hierarchy
Page 16
Major Improvements to Load PullFrom load pull to design in a few clicks
• New load pull data controller– Handles Maury load pull data
• Direct, instant loading of load pull data– Handles multiple files– Easier review of data
• Immediately simulate matching network– Easier design optimization, including
improved discrete optimization– Automatic interpolation of scattered
measurement data• Automatically display performance
parameters
Fast, Easy, Intuitive
Page 17
Making EM Simulation Part of Everyone’s Design Flow
Page 18
New Graphical Layer Definition
• Graphical, unified entry of layer and stackup data– Defines layers and properties for Layout, Momentum, and FEM
• Easy drag and drop operations– Easily select and modify properties
• Simpler, faster, and less error prone
Page 19
New Streamlined EM SetupMaking EM Work for Everyone
• Single dialog replaces 8 – Easily navigate & review the setup options• Same setup for Momentum, Momentum RF, & FEM
– Easy to try different solvers on the same design• Setup is automatically saved and can be reused for other EM simulations
Previous EM Setup ADS 2011
Page 20
Reusing Saved EM Setup ConfigurationsMaking EM Work for Everyone
• Makes it possible for non-experts to create accurate EM models
• Big productivity improvement for all users• Easier to experiment with different setup
options
FoundryPDK
EMExpert
PackagedWithADS
DesignEngineer
Designer’sown setups
Saves Mouse Clicks (30 down to 3)
Use saved setups on new work
Page 21
New Integrated EM Port Viewer/Editor
Features of new Port Editor• Copy a value and paste to
multiple ports• New filtering
– Quickly find ports by attributes
– Filter on one or multiple attributes
• Automatic port generation• Automatic port re-
sequencing
Page 22
Auto
Multi-port Editor
CombinedMulti-port
Viewer & Editor
Single port Editor
Preprocessor Mesher (2nd generation ) Solver
New Momentum 2nd Generation Mesher
• Increased accuracy, robustness and performance– Fast floating-point interval arithmetic
• Improved mesh quality– Avoids slivers– Improved handling of small and wide
shapes– New algorithm for edge mesh and
overlap extraction• Reduced mesh complexity
– New quadranglesrectangle
NEWquadrilateral
triangle
Page 23
OLD
NEW
Example: PDN impedanceFreq sweep 0-3 GHzMatrix size: 17.501
2005 2008 2010
solve time
load time
solve time
load time
load time
2003
Release Load Solve Storage
2005A
2008U12011
dense (N2) direct (N3) dense (N2)
dense (N2) iterative (NpN2) dense (N2)
dense (N2) direct (NlogN)1.5 sparse (NlogN)
sparse (NlogN) direct (NlogN)1.5 sparse(NlogN)
2003A
Momentum Solver – 5 years of (R)evolution
Page 24
* Performance will vary dependent on complexity, frequency and other factors
Expanded Bondwire Support• New, fast analysis of bondwires in Momentum
– Automatically modeled as part of Momentum simulation
– Calculates self and mutual inductance– FEM provides the most accurate analysis
• Bondwires work for both Momentum and FEM– Easily create the bondwire in Layout– Full parametric control of bondwire profile
• Jedec Bondwire – Follows the JEDEC standard parameters
• Shape Bondwire – More flexible control of the bondwire profile
• Bondwires now have edit handles
Page 25
Set parameters
Create and edit in 2D
Render in 3D
Layout
Page 26
Layout Usability: Object Handles
• Directly work on objects – quick & efficient• Objects with handles
– Arcs, Circles, Polylines, Polygons, Rectangles, Text
– Transmission Lines, Paths, Wires, Traces, Annotations, Wire Labels, Rulers, Dimension Lines
• Infrastructure available for end user customization– Add handles to pdk components and
design kits– Customizable behavior
Page 27
Layout Command Line & Toolbar
• Command line provides efficient keyboard entry for common functions • User can add their own functions to the command line• The toolbar provides single click operations for frequently used features
– Set vertex selection on/off, control pin-number display and align shapes
Page 28
Layout Command Line - Current Functions
Page 29
Performance w/ & w/o package
Accurately predict real performance
QFN DesignerPredict Packaged Performance in Minutes
Page 30
Quickly synthesize complex package, combine with IC & PCB data
Configure QFN package
And much more …
Page 31
Data Display Improvements• Improved Smith Chart graphics
– Better display of chart values– Better overall look and data granularity
• Set color for a group of traces – Easier interpretation of sweeps
• Improved Data Display Template Browser – Real time quick search – Direct editing of template properties– Save As and Delete from the Browser
Page 32
Other 2011 Improvements – Circuit Simulation• Linear Simulation Speedup - up to 10X
– For fully-linear circuits with swept, tuned, or optimized simulations• Improved Transmission line models (including multi-layer library)
– More accurate broad-band skin effect calculation– New, advanced method of calculating surface roughness loss– More accurate calculation of Power/Ground Plane loss
• Output simulator results in Matlab format– New controller makes it possible to filter the output
• New models supported– NXP SiMKit 3.4, PSP 102.3.4 and 103.1.1, Mextram 504.8, BSIMSOI 4.3.0, BSIM 4.6.5,
HiSIM_HV 1.2.0, MOSVAR 1.1, R3, PSPICE diode
• Support for Verilog A now included as part of ADS Core for use with all simulators
Page 33
Other 2011 Improvements
• Desktop LVS Viewer can now display Calibre errors• Backside component support• Allegro/ADS link (IFF for Allegro) now included in shipping product • New entry mode for circles and rectangles
– Use CTRL key and first point will be the center of the shape• New Array Reference (AREFs) objects to Layout
– Much more memory efficient way to create large arrays of objects• Advanced Model Composer (AMC) models can now be created with FEM • Layout connectivity engine is up to 40X faster than previous releases• Layout layers can now have sub-layers (purposes)
– Can visually distinguish different objects drawn on a layer
Page 34
Signal Integrity/Power Integrity
• Power Integrity with Momentum– Unique capability for PI analysis on split
power/ground plane PCBs– Accurate modeling of multi-GHz effects– Easy setup with SI/PI Analysis tool
• IBIS AMI simulation support– Fast, accurate SERDES models for ‘what if…?’
channel simulation
• More accurate modeling of high frequency effects in PCB transmission lines (multi layer models library and Momentum)– Surface roughness of copper traces– MLM causal dielectric loss algorithm now added to
Momentum also
Page 35
Improved Accuracy for Conductor ModelsNew Multi-level Hemispherical ModelAvailable in Momentum and Circuit Simulation
Closer correlation to measured data Hammerstad
Hemispherical
NEW Multi-level
2 4 6 8 10 12 14 160
-5
-4
-3
-2
-1
-6
0
freq, GHz
Measured Data
Agilent 5500Atomic Force Microscope
• More accurately reflects conductor surface• Can use AFM measurements to set params
Page 36
Support for International Character Set
• Can create annotations / documentation with international characters• Provided in schematic and data display
Page 37
ADS 2011 Summary
• ADS 2011 new capabilities for multi-technology RF design• ADS 2011 makes electromagnetic simulation easier for all designers• New circuit and electromagnetic simulation technologies increase
performance and usability• New physical design capabilities to make ADS Layout more powerful• IBIS-AMI simulation support & new Signal Integrity/Power Integrity wizard
for split Power/Ground planes
Agilent EEsof EDA“Innovative Solutions,Breakthrough Results”
Page 38
Questions?
Page 39
For More Information
Page 40
Agilent ADS 2011 Web page (new feature details)
www.agilent.com/find/eesof-ads2011
ADS 2011 on YouTube
www.youtube.com/user/AgilentEEsof
ADS 2011 Overview (Quick Start Video, Multi-technology Tutorials, …)
www.agilent.com/find/eesof-ads2011-overview
You can find more webcastswww.agilent.com/find/eesof-innovations-in-edawww.agilent.com/find/eesof-webcasts-recorded
You are invited
Amolak BadeshaSenior Application Expert Agilent Technologies
Page 41
Page 42
Innovations in EDA Webcast Series: Multi-Technology RF Design Using the New Advances in ADS 2011
ADS 2011:The IC/Module/Package/Board Design Solution
Joe CivelloADS Product ManagerAgilent EEsof EDA
July 2009
Agilent EEsof EDA Overview
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