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EUDET:EUDET:Status and PerspectivesStatus and Perspectives Ingrid-Maria Gregor, DESYIngrid-Maria Gregor, DESY

The EUDET initiative The EUDET initiative EUDET activitiesEUDET activities

Joint Research Joint Research ActivitiesActivities

NetworkingNetworking Summary and Summary and

OutlookOutlook

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EUDETEUDET

INFN FerraraINFN FerraraINFN MilanINFN MilanINFN PaviaINFN PaviaINFN RomeINFN Rome

NIKHEF AmsterdamNIKHEF Amsterdam

AGH CracowAGH CracowINPPAS CracowINPPAS Cracow CSIC SantanderCSIC Santander

Lund UniversityLund University

CERN GenevaCERN GenevaGeneva UniversityGeneva University

Bristol UniversityBristol UniversityUCL LondonUCL London

Charles University PragueCharles University PragueIPASCR PragueIPASCR Prague

HIP HelsinkiHIP Helsinki

LPC Clermont-FerrandLPC Clermont-FerrandLPSC GrenobleLPSC GrenobleLPHNE ParisLPHNE ParisEcole Polytechnique PalaiseauEcole Polytechnique PalaiseauLAL Orsay LAL Orsay IReS StrasbourgIReS StrasbourgCEA SaclayCEA Saclay

DESYDESYBonn UniversityBonn UniversityFreiburg UniversityFreiburg UniversityHamburg UniversityHamburg UniversityMannheim UniversityMannheim UniversityMPI MunichMPI MunichRostock UniversityRostock University

Tel Aviv UniversityTel Aviv University + 22 associated institutes+ 22 associated institutes

EUDET Partner InstitutesEUDET Partner Institutes

EUDET is an “Integrated Infrastructure Initiative (I3)” within the EUDET is an “Integrated Infrastructure Initiative (I3)” within the EU fundedEU funded “6“6thth framework framework programmeprogramme” ”

Support improvement of Support improvement of infrastructure for detector R&Dinfrastructure for detector R&D with larger with larger prototypes - but not the R&D itselfprototypes - but not the R&D itself

EUDET is EUDET is not a collaborationnot a collaboration

Other institutes can Other institutes can contribute and contribute and exploit the exploit the infrastructureinfrastructure

Infrastructure can be Infrastructure can be re-locatedre-located

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2006 2007 2008 2009

Magnet & Magnet & Pixel Pixel

Telescope Telescope 18%18%

Management Management 4%4%

CalorimeterCalorimeter 33%33%

Networking 9%Networking 9%

TA 2% TA 2%

Tracking 33%Tracking 33%

21.5 million EUR total21.5 million EUR total

(7.0 million EU contribution)(7.0 million EU contribution)

ManpowerManpower

≈ ≈ 57 FTE total57 FTE total

≈ ≈ 17 FTE funded by EU17 FTE funded by EU

most of the resources for the development most of the resources for the development of the infrastruturesof the infrastrutures

Duration of 4 yearsDuration of 4 years

Ramp-up first half 2006Ramp-up first half 2006

Full swing activities for 2.5 yearsFull swing activities for 2.5 years

Last year: phase-out and exploitation of infrastruturesLast year: phase-out and exploitation of infrastrutures

EUDET BudgetEUDET Budget

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Some ILC Detector Design CriteriaSome ILC Detector Design Criteria

Impact parameter resolutionImpact parameter resolution

Momentum resolutionMomentum resolution

Jet energy resolutionJet energy resolution

Calorimeter granularityCalorimeter granularity

Pixel sizePixel size

Material budget, centralMaterial budget, central

Material budget, forwardMaterial budget, forward

)sin/(105 23

przr

)(1051 15

GeV

pT

EEE %30

Need factor three better than SLDNeed factor three better than SLD

Need factor 10 better than LEPNeed factor 10 better than LEP

Needs to be better than ZEUSNeeds to be better than ZEUS

Need factor ~200 better than LHCNeed factor ~200 better than LHC

Need factor ~20 smaller than LHCNeed factor ~20 smaller than LHC

Need factor ~10 less than LHCNeed factor ~10 less than LHC

Need factor ~1000 less than LHCNeed factor ~1000 less than LHC

)sin/(337.7 23

przr

)(1051 15

GeV

pT

EEE %35

Requirements for ILCRequirements for ILC Compare to best performance to dateCompare to best performance to date

Adapte

d f

rom

M.

Dem

art

eau

337 ns

x2820

0.2 s

0.95 ms

Bunch TrainBunch Train

Bunch SpacingBunch Spacing

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EUDET EUDET

NetworkNetwork Transnational Transnational AccessAccess

Joint Research Joint Research ActivitiesActivities

ManagementManagement

Detector R&D Detector R&D NetworkNetwork

Access to Access to DESY Test BeamDESY Test Beam

Access to Detector Access to Detector R&D InfrastructuresR&D Infrastructures

Test Beam Test Beam InfrastructuresInfrastructures

TrackingTracking DetectorsDetectors

CalorimeterCalorimeter

JRA1JRA1

JRA2JRA2

JRA3JRA3

I3 projects based on three pilars (mandatory):I3 projects based on three pilars (mandatory):

EUDET StructureEUDET Structure

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Test beam Infrastructure JRA1Test beam Infrastructure JRA1

Provide test beam telescope with:Provide test beam telescope with:Very high precision: <3 μm precision even at lower energiesVery high precision: <3 μm precision even at lower energies

High readout speed (frame rate >1kHz)High readout speed (frame rate >1kHz)

Easy to use: well defined/described interfaceEasy to use: well defined/described interface

Large range of conditions: cooling, positioning, magnetic fieldLarge range of conditions: cooling, positioning, magnetic field

Suitable to different test beam Suitable to different test beam environments:environments:

construction & initial tests at construction & initial tests at DESY (EDESY (Ee-e- up to 6 GeV) up to 6 GeV)

exploitation at CERN, FNAL etc. exploitation at CERN, FNAL etc. possiblepossible

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JRA1 ScheduleJRA1 Schedule

Phase1: “Demonstrator”Phase1: “Demonstrator”

Phase2: Final telescopePhase2: Final telescope

First test facility will be available quickly for the groups developing pixels First test facility will be available quickly for the groups developing pixels

Use established pixel technology with analogue readout and no data reductionUse established pixel technology with analogue readout and no data reduction

Use pixel sensor with fully digital readout, integrated Use pixel sensor with fully digital readout, integrated Correlated Double Sampling (CDS), and data Correlated Double Sampling (CDS), and data sparsificationsparsification

The beam telescope ready at the end of 2008The beam telescope ready at the end of 2008

2006 2007 2008 2009

nowDemonstratorIntegration Starts

DemonstratorAvailable

Final Telescope Available

Magnet @ DESY Magnet available

CERN test beam

+ Large bore magnet+ Large bore magnet

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(Analogue) Telescope(Analogue) Telescope

Sensors with (analogue)Sensors with (analogue)outputoutput

ReadOutReadOut

Boards to carry theBoards to carry thesensorssensors

Mechanics to positionMechanics to positionthe sensors preciselythe sensors precisely

AUXboard

Ingredients needed for such a telescopeIngredients needed for such a telescope

Trigger LogicUnit

ee--

DUTDUT

EUDRBEUDRB

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Board StatusBoard Status

20 sets of boards 20 sets of boards

AUX board as interface to VME boardAUX board as interface to VME board

Proximity board housing the sensor Proximity board housing the sensor (two types)(two types)

AUX boardAUX board

Proximity boardProximity board

IPHC Strasbourg/DESYIPHC Strasbourg/DESY

AUXboard

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Reference Plane SensorsReference Plane Sensors

Demonstrator: MimoTelDemonstrator: MimoTeluse MimoTel prototypeuse MimoTel prototype

AMS 0.35 OPTO process with 14 and 20μm epitaxial AMS 0.35 OPTO process with 14 and 20μm epitaxial layerlayer

4 sub-arrays (64 × 256 pixel)4 sub-arrays (64 × 256 pixel)

30 × 30 μm30 × 30 μm22 pitch: active area: 7.7 × 7.7 mm pitch: active area: 7.7 × 7.7 mm22

readout : 1.6 ms (4 analog output nodes at 10 readout : 1.6 ms (4 analog output nodes at 10 MHz)MHz)

pixel designed to stand >1 MRad at room pixel designed to stand >1 MRad at room temperaturetemperature

engineering run was in summer 06engineering run was in summer 06

end of October, reception of engineering runend of October, reception of engineering run MimoStar3

MimoTEL Imager10µ Imager12µ

Mimosa16 Mimosa16

Latchup ADC ADC MyMap

TestStruct

Layout of the reticle of the Layout of the reticle of the engineering run AMS-035 OPTO engineering run AMS-035 OPTO 07/2006 on 14 µm (standard) and 20 07/2006 on 14 µm (standard) and 20 µm epi substrateµm epi substrate

From November to end of 2006, two tests in parallelFrom November to end of 2006, two tests in parallelprobe station setup preparation for wafer with 14 µm EPIprobe station setup preparation for wafer with 14 µm EPI

laboratory test for circuits with 20 µm EPIlaboratory test for circuits with 20 µm EPI

IPHC StrasbourgIPHC Strasbourg

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MimoTelMimoTel

End of 2006 to Jan. 2007, dicing 14 µm EPI End of 2006 to Jan. 2007, dicing 14 µm EPI waferwafer

Laboratory test for circuits with 14 µm EPILaboratory test for circuits with 14 µm EPI

AMS did not respect one of our specifications: AMS did not respect one of our specifications: high-resistivity polyhigh-resistivity poly

Biasing DACs out of rangeBiasing DACs out of range

No effect on Mimosa18 (High Resolution No effect on Mimosa18 (High Resolution Tracker)Tracker)

Small modification on the PCB board: MimoTel Small modification on the PCB board: MimoTel can be set "near" nominal conditionscan be set "near" nominal conditions

The dark current on rad-tol diodes (MimoTel) factor of 5 to 10 higher than The dark current on rad-tol diodes (MimoTel) factor of 5 to 10 higher than expected expected The dark current on non rad-tol diodes (Mimosa18) factor of 5 to 10 lower The dark current on non rad-tol diodes (Mimosa18) factor of 5 to 10 lower than expectedthan expected

IPHC StrasbourgIPHC Strasbourg

General remarks:General remarks:

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MimoTel ResultsMimoTel Results

MimoTel (20um EPI layer) MimoTel (20um EPI layer)

Response to Fe55 source at 18Response to Fe55 source at 18ooCC

Noise of 15 electrons in the range of Noise of 15 electrons in the range of what was expected what was expected

KK line good visible line good visible

IPHC/DESYIPHC/DESY

HitmapHitmap

columns

row

s

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Readout: Readout: EUEUDET DET DData ata RReduction eduction BBoard oard

Functionality of motherboard Functionality of motherboard on-line calculation of pixel pedestal and on-line calculation of pixel pedestal and noise, cluster finding, ADCnoise, cluster finding, ADCremote configuration of the FPGAremote configuration of the FPGAon-board diagnosticson-board diagnostics

4 independent signal processing and 4 independent signal processing and digitizing stagesdigitizing stagesImplementationImplementation

One analogue card -> signal processingOne analogue card -> signal processingOne digital card -> USBOne digital card -> USB

INFN FerraraINFN FerraraEUDRBEUDRB

Operational modesOperational modesZero SuppressionZero Suppression readout to minimize readout dead time while normal data takingreadout to minimize readout dead time while normal data takingFull FrameFull Frame readout mode for debugging or off-line pedestal and noise measurementsreadout mode for debugging or off-line pedestal and noise measurements

Boards tested and available for first test in beam June 2007Boards tested and available for first test in beam June 2007

ReadOutReadOut

EUDRBEUDRB

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DAQ Integration ConceptDAQ Integration ConceptHow to integrate the DUT hardware with the JRA1 beam How to integrate the DUT hardware with the JRA1 beam telescope?telescope?

different groups with different detector technologies different groups with different detector technologies and different, pre-existing DAQ systemsand different, pre-existing DAQ systems

nobody has a large pool of effort to rewrite existing nobody has a large pool of effort to rewrite existing codecode

Use completely different hardware and DAQ for the DUTUse completely different hardware and DAQ for the DUT synchronize only with Trigger, Busy and Reset signalssynchronize only with Trigger, Busy and Reset signals

readout software, DAQ and data storage is provided by readout software, DAQ and data storage is provided by the DUT userthe DUT user

events combined off-lineevents combined off-line

Trigger Logic Unit (TLU)Trigger Logic Unit (TLU)receives trigger and passes it on to receives trigger and passes it on to telescope and DUTtelescope and DUT

vetoes further triggers (BUSY)vetoes further triggers (BUSY)

records timestamprecords timestamp

hardware availablehardware available

file

telescopetelescope

DUTDUT

DAQDAQ

tel. ctrl

intfc

DAQDAQ

DUT ctrl

intfcPCPC PCPC

file

Trigger LogicUnit

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Telescope DAQTelescope DAQ

HardwareHardware HardwareHardware HardwareHardware

Writer taskWriter task

telescopetelescope‘‘producer’producer’

DUTDUT‘‘producer’producer’

otherother‘‘producer’producer’

Monitoring task 1Monitoring task 1 Monitoring task 2Monitoring task 2

DAQ buffersDAQ buffers

MonitoringMonitoring buffersbuffers

filefile

DAQ Software is divided into many parallel tasks:DAQ Software is divided into many parallel tasks:several Producerseveral Producer tasks read the hardware tasks read the hardware

one FileWriterone FileWriter task bundles events, writes to task bundles events, writes to file and sends subsets for monitoringfile and sends subsets for monitoring

There can be There can be severalseveral Online -Online - MonitoringMonitoring tasks tasks

oneone Buffer MonitorBuffer Monitor task allows to see what is task allows to see what is going ongoing on

a a FileReaderFileReader can re-inject data into the can re-inject data into the monitoringmonitoring

StatusStatusCan have several producers (Dummy, Mimosa, DEPFET, TLU) all running Can have several producers (Dummy, Mimosa, DEPFET, TLU) all running together.together.

Data from all of them combined by FileWriter and written to binary file.Data from all of them combined by FileWriter and written to binary file.

This can then be converted to a Root file for easier analysis.This can then be converted to a Root file for easier analysis.

First version will be available for test beam in June 2007First version will be available for test beam in June 2007

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Telescope MechanicsTelescope Mechanics

Box 1:Box 1:

fixed position, optical bench for three reference planesfixed position, optical bench for three reference planes

Wall to DUT can be removedWall to DUT can be removed

Box 2:Box 2:

movable in z-direction, optical bench for three reference planesmovable in z-direction, optical bench for three reference planes

Wall to DUT can be removedWall to DUT can be removed

Box 3:Box 3: Gap between 2 and 3, closed by thermal coverGap between 2 and 3, closed by thermal cover

DUT positioned on XYDUT positioned on XY-table -table

XYXY-table-table: external with “long” mechanical structure : external with “long” mechanical structure to locate the DUT between the reference planesto locate the DUT between the reference planes

boxes can be placed into magnetic field, not the XYboxes can be placed into magnetic field, not the XY--table (cost reasons)table (cost reasons)

Want to keep a lot of flexibility for different usersWant to keep a lot of flexibility for different users

Box 1Box 1

Box 3Box 3(DUT)(DUT)

ee--

Box 2Box 2

xx

yy

zz

x

y

PI

DESYDESY

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Senor BoxesSenor Boxes

Mechanics design almost completedMechanics design almost completed

3 planes on one main structure3 planes on one main structureMinimal distance between planes: 7mmMinimal distance between planes: 7mm

Maximum level arm:200 mmMaximum level arm:200 mm

Material: aluminumMaterial: aluminum

DESYDESY

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Telescope OutlookTelescope Outlook

The first version of the EUDET pixel telescope (“demonstrator”) will be The first version of the EUDET pixel telescope (“demonstrator”) will be available for users later this yearavailable for users later this year

Full telescope with digital readout and high resolution available at the Full telescope with digital readout and high resolution available at the end of 2008end of 2008

www.eudet.org

testbeam.desy.de

You can apply for travel money through You can apply for travel money through the the Transnational AccessTransnational Access and use the and use the EUDET test beam infrastructureEUDET test beam infrastructure

You can apply for test beam time at DESYYou can apply for test beam time at DESY

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JRA2: Tracking; TPCJRA2: Tracking; TPC

2007: FC construction

integrate the efforts of European institutions working on integrate the efforts of European institutions working on tracking detectors for the ILCtracking detectors for the ILC

improvement of existing infrastructures for tracking improvement of existing infrastructures for tracking detectors, detectors, the developments of common prototypesthe developments of common prototypesdevelopment of novel techniques for SI based tracking development of novel techniques for SI based tracking detectorsdetectors

Three tasksThree tasks

Large TPC prototypeLarge TPC prototype

field cage, end plate interface, readoutfield cage, end plate interface, readout

Si TPC readoutSi TPC readout

Timepix chip, diagnostics planeTimepix chip, diagnostics plane

Si trackingSi tracking

Mechanics, cooling, electronicsMechanics, cooling, electronics

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Large TPC PrototypeLarge TPC Prototype

a large field cage and prototype readout a large field cage and prototype readout electronicselectronics

developed to optimally use the magnet test developed to optimally use the magnet test facility (JRA1)facility (JRA1)

field cage structure which combines light field cage structure which combines light weight with excellent high voltage behaviour weight with excellent high voltage behaviour and mechanical stiffnessand mechanical stiffness

readout electronicsreadout electronics::a programmable preamplifier – shaper ASICa programmable preamplifier – shaper ASIC

a digitization system based on a modified a digitization system based on a modified ALTRO chip (ALICE)ALTRO chip (ALICE)

2007: FC constructionfield shaping strips developedfield shaping strips developed

field shaping system should guarantee field field shaping system should guarantee field homogeneity of better than 1% throughout the homogeneity of better than 1% throughout the active volume of the chamberactive volume of the chamber

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Timepix in a 3-GEM detector at DESY testbeamTimepix in a 3-GEM detector at DESY testbeam

5GeV e5GeV e-- track trackwith with -electron(s)-electron(s)

in TOT modein TOT mode in TOF mode in TOF mode

Si TPC ReadoutSi TPC Readout

use a CMOS pixel detector combined with some kind of gas gain griduse a CMOS pixel detector combined with some kind of gas gain grid

Upgrade Medipix2 chip to get 3D information: timestamp enables TOT infoUpgrade Medipix2 chip to get 3D information: timestamp enables TOT info

Timepix has been produced with a good yield and is working -> first testbeamTimepix has been produced with a good yield and is working -> first testbeam

Timepix covered with 4Timepix covered with 4m of amourphous Silicon with a standard Micromegas in m of amourphous Silicon with a standard Micromegas in He/C4H10 (80/20)He/C4H10 (80/20)

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Silicon TrackingSilicon Tracking

support for large sensor R&D

enable groups to contribute to the development enable groups to contribute to the development of long and thin Si-detector componentsof long and thin Si-detector components

providing common tools needed to test and providing common tools needed to test and simulate these sensors under real life simulate these sensors under real life conditionsconditions

highly multiplexed, deep submicron front-highly multiplexed, deep submicron front-end electronicsend electronics

with low power consumption and the with low power consumption and the possibility for power cyclingpossibility for power cycling

DSM (130 nm)DSM (130 nm)

prototype of the alignment system to prototype of the alignment system to work out work out

alignment challenges,alignment challenges,

the distortions handlingthe distortions handling

calibrations for the overall calibrations for the overall tracking systemtracking system

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JRA3: Infrastructure for CalorimetersJRA3: Infrastructure for Calorimeters

improving the existing calorimeter improving the existing calorimeter prototype stackprototype stack

development of novel stack development of novel stack instrumentationinstrumentationnovel readout systemsnovel readout systems

to be provided at the infrastructureto be provided at the infrastructure

ECALECAL, HCAL, VFCAL, HCAL, VFCAL

Electronics, DAQElectronics, DAQ

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ECALECALThe ECAL “EUDET module 0”The ECAL “EUDET module 0”

barrel module prototypebarrel module prototype

0.4t tungsten, 1.8m long0.4t tungsten, 1.8m long

~1/6 instrumented (12k ch.)~1/6 instrumented (12k ch.)

One tower for e test beamOne tower for e test beam

Embedded electronicsEmbedded electronics

1.5mm gap (PCB + wafer + ASICs1.5mm gap (PCB + wafer + ASICs

Power pulsingPower pulsing

Test full scale mechanics, cooling, Test full scale mechanics, cooling, communicationcommunication

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HCAL, VFCALHCAL, VFCAL

HCALHCALRealistic structure Realistic structure

Integrated electronicsIntegrated electronics

Readout architecture like Readout architecture like ECALECAL

Calibration system, test standCalibration system, test stand

VFCALVFCALSensor test standsSensor test stands

Irradiation test beam infrastructureIrradiation test beam infrastructure

Already usedAlready used

Readout electronicsReadout electronics

Laser alignment systemLaser alignment system

µm level precisionµm level precision

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Calorimeter ElectronicsCalorimeter ElectronicsVFCALVFCAL

ElectronicsElectronicsIntegration is key Integration is key Digital part next to sensitive analogue FEDigital part next to sensitive analogue FEPower pulsing, stabilityPower pulsing, stability

HaRDROCHaRDROC64 ch digital HCAL chip64 ch digital HCAL chipUnder testUnder test

SKIROCSKIROC36ch ECAL chip 36ch ECAL chip At foundry (0.35 AMS)At foundry (0.35 AMS)

SPIROCSPIROC36ch analogue (SiPM) HCAL chip36ch analogue (SiPM) HCAL chipUnder designUnder design

More versions in the pipelineMore versions in the pipeline

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(Calorimeter) DAQ(Calorimeter) DAQ

PC/s

ASICs

FE

Con

trol

-lin

k

ODR

Store

Data

-link

PC/s

ASICs

FE

Con

trol

-lin

k

ODR

Store

Data

-link

Slab

FEFPGA

PHYASIC

Data

ASIC ASICASIC

Conf

Clock + Control

FE

Slab

FEFPGA

PHYASIC

Data

ASIC ASICASIC

Conf

Clock + Control

Slab

FEFPGA

PHYASIC

Data

ASIC ASICASIC

Conf

Clock + Control

Slab

FEFPGA

PHYASIC

Data

ASIC ASICASIC

Conf

Clock + Control

FE

PC

Mo

the

rbo

ard

PCI-Receiver

Large FPGA

MemoryMicro-

Processor/s

TX Module

RX Module

RX Module

RX Module

RX Module PCIe Interface

CPUInter-Slot

PC

I-E

xpre

ss B

us

Fast ControlInterface

PC

Mo

the

rbo

ard

PCI-Receiver

Large FPGA

MemoryMicro-

Processor/s

TX Module

RX Module

RX Module

RX Module

RX Module PCIe Interface

CPUInter-Slot

PC

I-E

xpre

ss B

us

Fast ControlInterface

e.g. off-detector receiver: off-the-shelfe.g. off-detector receiver: off-the-shelf

Scalable DAQ system Scalable DAQ system Commercial hardware where possibleCommercial hardware where possible

Prototype for full detector Prototype for full detector andand useable in test useable in test beambeam

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EUDET Networking ActivityEUDET Networking Activity

EUDET Annual workshop, EUDET Annual workshop, MPI Munic, Oct 18-20, 2006MPI Munic, Oct 18-20, 2006

Information exchangeInformation exchangewww.eudet.orgwww.eudet.org

Annual workshops (open to Annual workshops (open to everyone)everyone)

Computing and analysisComputing and analysisGrid based computer clusterGrid based computer cluster

Common software for test Common software for test beams and ILC simulationsbeams and ILC simulations

Not EUDET specificNot EUDET specific; ; embedded in ILC software & embedded in ILC software & simulation effort, already simulation effort, already usedused

Shower simulation Shower simulation Support from Geant4 teamSupport from Geant4 team

Deep sub-micron rad-hard Deep sub-micron rad-hard electronics electronics

Access through CERN Access through CERN contractscontracts

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Transnational AccessTransnational Access

Imposed by EU to foster trans-European access to research Imposed by EU to foster trans-European access to research infrastructureinfrastructure

Take advantage of it: Take advantage of it: apply for travel money!apply for travel money!For travel to DESY test beamFor travel to DESY test beam

For travel to use any of the infrastructure created within the For travel to use any of the infrastructure created within the EUDET initiativeEUDET initiative

Magnet, beam telescopeMagnet, beam telescope

Field cage, SiTPC, Si trackerField cage, SiTPC, Si tracker

Calorimeter structure, readout, test standsCalorimeter structure, readout, test stands

Open to any European group Open to any European group EUDET or notEUDET or not

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ConclusionConclusion

EUDET is an “Integrated Infrastructure Initiative (I3)” within the EUDET is an “Integrated Infrastructure Initiative (I3)” within the EU EU fundedfunded “6 “6thth framework framework programmeprogramme” ”

an example of the high recognition of the ILC by the an example of the high recognition of the ILC by the European Union European Union

Support improvement of Support improvement of infrastructure for detector R&Dinfrastructure for detector R&D with with larger prototypes - but not the R&D itselflarger prototypes - but not the R&D itself

Different Joint Research Activities (JRA) Different Joint Research Activities (JRA)

The initiative provides resources which help to proceed towards The initiative provides resources which help to proceed towards the next phase of ILC detector R&Dthe next phase of ILC detector R&D

Start in 2006: first milestones met, first deliverables Start in 2006: first milestones met, first deliverables delivereddelivered

EUDET will have a big impact on the Detector R&D for ILC!EUDET will have a big impact on the Detector R&D for ILC!

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Backup SlidesBackup Slides

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EUDETEUDET

EUDET is an “Integrated Infrastructure Initiative (I3)” within the EUDET is an “Integrated Infrastructure Initiative (I3)” within the EU fundedEU funded “6 “6thth framework framework programmeprogramme” ”

an example of the high recognition of the ILC by the European Union an example of the high recognition of the ILC by the European Union

Support improvement of Support improvement of infrastructure for detector R&Dinfrastructure for detector R&D with larger prototypes - but not the R&D itself with larger prototypes - but not the R&D itself

Example: TPC field cage for R&D on end plates, calorimeter structure for R&D on novel sensors,Example: TPC field cage for R&D on end plates, calorimeter structure for R&D on novel sensors,……

EUDET is EUDET is not a collaborationnot a collaboration

Other institutes (EU, non-EU) can contribute and exploit the infrastructureOther institutes (EU, non-EU) can contribute and exploit the infrastructure

Infrastructure can be re-locatedInfrastructure can be re-located

EUDET brings some fresh money – but not enoughEUDET brings some fresh money – but not enough

Additional resources required to exploit infrastructureAdditional resources required to exploit infrastructure

No free lunch: administrative work and No free lunch: administrative work and timelinestimelines

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JRA1JRA1Test Beam Test Beam

InfrastructureInfrastructure

T. Haas T. Haas DESYDESY

JRA2JRA2Tracking Tracking DetectorsDetectors

J. TimmermansJ. TimmermansNIKHEFNIKHEF

JRA3JRA3

CalorimeterCalorimeter

F. SefkowF. Sefkow

DESYDESYCh. de la TailleCh. de la Taille

LAL OrsayLAL Orsay

NA2NA2Detector R&D Detector R&D

NetworkNetwork

K. DeschK. DeschBonnBonn

I3I3CoordinatorCoordinator

J. MnichJ. MnichDESYDESY

Steering Steering CommitteeCommittee

External External Scientific Scientific Advisory Advisory BoardBoard

EUEU

Members from Members from all 3 regionsall 3 regions

Task leaders have been assigned for the various work packagesTask leaders have been assigned for the various work packages

Annual EUDET meetings and workshopsAnnual EUDET meetings and workshops

EUDET ManagementEUDET Management

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EUDET and R&D collaborationsEUDET and R&D collaborations

EUDET may be seen as a sort of large virtual “institute” in the EUDET may be seen as a sort of large virtual “institute” in the overall worldwide ILC detector R&D “collaboration”overall worldwide ILC detector R&D “collaboration” Provides resources, takes responsibilitiesProvides resources, takes responsibilities Make optimal use and avoid duplication on international scale Make optimal use and avoid duplication on international scale

On sub-detector level, the EUDET activities (JRA’s) are closely On sub-detector level, the EUDET activities (JRA’s) are closely coordinated with the R&D collaborationscoordinated with the R&D collaborations

EUDET is a contract between partner institutes and EC with well EUDET is a contract between partner institutes and EC with well defined milestones and deliverablesdefined milestones and deliverables Needs some own management structure, meetingsNeeds some own management structure, meetings Somewhat reduced flexibilitySomewhat reduced flexibility

Most challenging impact: need to Most challenging impact: need to synchronizesynchronize the timelines the timelines

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EUDET ActivitiesEUDET Activities

Detector R&D Network:Detector R&D Network: Information exchange and intensified Information exchange and intensified

collaborationcollaboration Common simulation and analysis Common simulation and analysis

frameworkframework Validation of simulationValidation of simulation Deep submicron radiation-tolerant Deep submicron radiation-tolerant

electronicselectronics

Test Beam InfrastructureTest Beam Infrastructure Large bore magnetLarge bore magnet Pixel beam telescopePixel beam telescope

Tracking DetectorsTracking Detectors Large TPC prototypeLarge TPC prototype Silicon TPC readoutSilicon TPC readout Silicon trackingSilicon tracking

CalorimeterCalorimeter ECALECAL HCALHCAL Very Forward CalorimeterVery Forward Calorimeter FE Electronics and Data Acquisition SystemFE Electronics and Data Acquisition System