infineon easypak™ fs100r12w2t7

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Infineon EasyPACK™ FS100R12W2T7 Discover the newest IGBT technology from Infineon: TRENCHSTOP™ IGBT7 with EC7 Diode in EasyPACK™ Module. REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr SP20572 - Power report by Amine Allouche Physical analysis by Véronique Le Troadec October 2020 – Sample

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Page 1: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 1

Infineon EasyPACK™ FS100R12W2T7Discover the newest IGBT technology from Infineon: TRENCHSTOP™ IGBT7 with EC7 Diode in EasyPACK™ Module.

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

SP20572 - Power report by Amine AllouchePhysical analysis by Véronique Le Troadec

October 2020 – Sample

Page 2: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 2

SUMMARY

Overview / Introduction 4

o Executive Summary

o Market

o Reverse Costing Methodology

o Glossary

Company Profile 9

o Infineon Company Profile

o Datasheet & Technology

Physical Analysis 14

o Synthesis of the Physical Analysis

o Package Analysis

✓ Package Opening

✓ Package Cross-section

o Si IGBT Die

✓ IGBT Die View & Dimensions

✓ IGBT Die Process

✓ IGBT Die Cross-section

o Si Diode Die

✓ Diode Die View & Dimensions

✓ Diode Die Process

✓ Diode Die Cross-section

Manufacturing Process 78

o Si IGBT Fabrication Unit

o Si IGBT Process Flow

o Si Diode Fabrication Unit

o Si Diode Process Flow

o Final Test & Packaging Fabrication unit

o Packaging Process Flow

Cost Analysis 91

o Synthesis of the Cost Analysis

o Yields Explanation & Hypotheses

o Si IGBT

✓ IGBT Front-End Cost

✓ IGBT Wafer Cost per Process Step

✓ IGBT Die Probe Test & Dicing

✓ IGBT Die Cost

o Si Diode

✓ Diode Front-End Cost

✓ Diode Wafer Cost per Process Step

✓ Diode Die Probe Test & Dicing

✓ Diode Die Cost

o DBC Cost

✓ DBC BOM Cost

✓ DBC Assembly Cost

o Module Cost

✓ Module BOM Cost

✓ Packaging Assembly Cost

✓ Final Module Cost

Selling Price Analysis 113

o Estimation of selling price

Comparison 115

o Infineon IGBT Evolution : Technology & Cost Comparison

Feedbacks 118

Company Services 120

Page 3: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 3

Overview / Introductiono Executive Summaryo Marketo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Executive Summary

The market outlook for power electronics industry is promising. In 2019, the power semiconductor devices market segmentrepresented US$17.5 billion, with a CAGR 2019-2025 of 4.3%.

IGBT modules, which represent $3.7B in 2019, are traditionally used in applications such as industrial or renewable energyconverters. These applications are today driven by efficiency regulations or increase of clean energy goals, and they account for 46%of the total IGBT module market. Nevertheless, the key application for power IGBT modules is undoubtedly EV/HEV, with anexpected growth of 18% from 2019 to 2025, reaching $5.4B by 2025.

In this dynamic market, Infineon Technologies introduced the new IGBT7 technology for its Easy housing platform in March 2019.Based on the new micro-pattern trench technology, the TRENCHSTOP™ IGBT7 chip shows a new cell structure in contrast to theformerly used square trench cells in IGBT3 and IGBT4.

System Plus Consulting provides a full reverse costing study of the Infineon EasyPACK™ FS100R12W2T7.

This power module uses the newest IGBT and Diode technologies from Infineon: TRENCHSTOP™ IGBT7 and EC7 Diode. It drives anominal current of 100A with a voltage rating of 1200V.

Supported by a full teardown of the module’s components and housing, this report reveals Infineon technological choices in its newIGBT7 chip as well as the design of its diode, and the module packaging structure.

This report provides insights on technology data, manufacturing cost and selling price of the module. It includes an estimatedmanufacturing cost of all the module’s components and its selling price analysis.

Also included a technology and cost comparison between Infineon IGBT3, IGBT4, IGBT5, and IGBT7.

Page 4: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 4

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Synthesis of the Physical Analysis

Page 5: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 5

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Package Cross-Section #1

Page 6: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 6

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Die Process – Delayering

Page 7: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 7

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Die Cross-Section

Page 8: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 8

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Die Cross-Section – EDX Analysis : Cartography

Page 9: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 9

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis

Manufacturing Process Flowo Si IGBT Fab Unito Si IGBT Process Flowo Si Diode Fab Unito Si Diode Process Flowo Packaging Fab Unito Packaging Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

IGBT Process Flow (2/3)

Page 10: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 10

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis

Manufacturing Process Flow

Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

IGBT Front-End Cost

Page 11: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 11

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis

Manufacturing Process Flow

Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Diode Wafer Cost Per Process Steps

Page 12: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 12

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis

Manufacturing Process Flow

Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

DBC Cost – Assembly Cost Breakdown

Page 13: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 13

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis

Manufacturing Process Flow

Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Module Cost – Assembly Cost

Page 14: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 14

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Estimated Manufacturer Price

Page 15: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 15

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparisono Infineon IGBT Evolution

Feedback

Related Reports

About System Plus

IGBT3 vs IGBT4 vs IGBT5 vs IGBT7 from Infineon

Page 16: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 16

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Plus

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

POWER SEMICONDUCTORS & COMPOUND• Industrial Power Module Packaging Comparison 2020• StarPower GD820HTX75P6H Tri-Pack IGBT Module• Hitachi Double-Side Cooling Power Module from Audi e-tron’s

Inverter• Infineon PrimePACK™2 1200V Power Module with IGBT5 and

EC5 Diode• ABB LinPak 1700V 2x1000A Power Module

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

Power Electronics• Status of the Power Electronics Industry 2020• Status of the Power Module Packaging Industry 2019• Status of the Inverter Industry 2019

Page 17: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 17

COMPANYSERVICES

Page 18: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 18

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Pluso Company Serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings

Page 19: Infineon EasyPAK™ FS100R12W2T7

©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 19

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related Reports

About System Pluso Company Serviceso Contact

Contact

www.systemplus.fr

NANTESHeadquarters

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

KOREAYOLE

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 809CN: [email protected]

America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]

CORNELIUSYOLE Inc.