infineon easypak™ fs100r12w2t7
TRANSCRIPT
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 1
Infineon EasyPACK™ FS100R12W2T7Discover the newest IGBT technology from Infineon: TRENCHSTOP™ IGBT7 with EC7 Diode in EasyPACK™ Module.
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
SP20572 - Power report by Amine AllouchePhysical analysis by Véronique Le Troadec
October 2020 – Sample
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 2
SUMMARY
Overview / Introduction 4
o Executive Summary
o Market
o Reverse Costing Methodology
o Glossary
Company Profile 9
o Infineon Company Profile
o Datasheet & Technology
Physical Analysis 14
o Synthesis of the Physical Analysis
o Package Analysis
✓ Package Opening
✓ Package Cross-section
o Si IGBT Die
✓ IGBT Die View & Dimensions
✓ IGBT Die Process
✓ IGBT Die Cross-section
o Si Diode Die
✓ Diode Die View & Dimensions
✓ Diode Die Process
✓ Diode Die Cross-section
Manufacturing Process 78
o Si IGBT Fabrication Unit
o Si IGBT Process Flow
o Si Diode Fabrication Unit
o Si Diode Process Flow
o Final Test & Packaging Fabrication unit
o Packaging Process Flow
Cost Analysis 91
o Synthesis of the Cost Analysis
o Yields Explanation & Hypotheses
o Si IGBT
✓ IGBT Front-End Cost
✓ IGBT Wafer Cost per Process Step
✓ IGBT Die Probe Test & Dicing
✓ IGBT Die Cost
o Si Diode
✓ Diode Front-End Cost
✓ Diode Wafer Cost per Process Step
✓ Diode Die Probe Test & Dicing
✓ Diode Die Cost
o DBC Cost
✓ DBC BOM Cost
✓ DBC Assembly Cost
o Module Cost
✓ Module BOM Cost
✓ Packaging Assembly Cost
✓ Final Module Cost
Selling Price Analysis 113
o Estimation of selling price
Comparison 115
o Infineon IGBT Evolution : Technology & Cost Comparison
Feedbacks 118
Company Services 120
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 3
Overview / Introductiono Executive Summaryo Marketo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Executive Summary
The market outlook for power electronics industry is promising. In 2019, the power semiconductor devices market segmentrepresented US$17.5 billion, with a CAGR 2019-2025 of 4.3%.
IGBT modules, which represent $3.7B in 2019, are traditionally used in applications such as industrial or renewable energyconverters. These applications are today driven by efficiency regulations or increase of clean energy goals, and they account for 46%of the total IGBT module market. Nevertheless, the key application for power IGBT modules is undoubtedly EV/HEV, with anexpected growth of 18% from 2019 to 2025, reaching $5.4B by 2025.
In this dynamic market, Infineon Technologies introduced the new IGBT7 technology for its Easy housing platform in March 2019.Based on the new micro-pattern trench technology, the TRENCHSTOP™ IGBT7 chip shows a new cell structure in contrast to theformerly used square trench cells in IGBT3 and IGBT4.
System Plus Consulting provides a full reverse costing study of the Infineon EasyPACK™ FS100R12W2T7.
This power module uses the newest IGBT and Diode technologies from Infineon: TRENCHSTOP™ IGBT7 and EC7 Diode. It drives anominal current of 100A with a voltage rating of 1200V.
Supported by a full teardown of the module’s components and housing, this report reveals Infineon technological choices in its newIGBT7 chip as well as the design of its diode, and the module packaging structure.
This report provides insights on technology data, manufacturing cost and selling price of the module. It includes an estimatedmanufacturing cost of all the module’s components and its selling price analysis.
Also included a technology and cost comparison between Infineon IGBT3, IGBT4, IGBT5, and IGBT7.
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 4
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Synthesis of the Physical Analysis
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 5
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Package Cross-Section #1
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 6
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Die Process – Delayering
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 7
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Die Cross-Section
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 8
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT Designo Si Diode Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Die Cross-Section – EDX Analysis : Cartography
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 9
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo Si IGBT Fab Unito Si IGBT Process Flowo Si Diode Fab Unito Si Diode Process Flowo Packaging Fab Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
IGBT Process Flow (2/3)
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 10
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
IGBT Front-End Cost
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 11
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Diode Wafer Cost Per Process Steps
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 12
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
DBC Cost – Assembly Cost Breakdown
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 13
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Module Cost – Assembly Cost
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Estimated Manufacturer Price
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparisono Infineon IGBT Evolution
Feedback
Related Reports
About System Plus
IGBT3 vs IGBT4 vs IGBT5 vs IGBT7 from Infineon
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Plus
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
POWER SEMICONDUCTORS & COMPOUND• Industrial Power Module Packaging Comparison 2020• StarPower GD820HTX75P6H Tri-Pack IGBT Module• Hitachi Double-Side Cooling Power Module from Audi e-tron’s
Inverter• Infineon PrimePACK™2 1200V Power Module with IGBT5 and
EC5 Diode• ABB LinPak 1700V 2x1000A Power Module
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
Power Electronics• Status of the Power Electronics Industry 2020• Status of the Power Module Packaging Industry 2019• Status of the Inverter Industry 2019
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 17
COMPANYSERVICES
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Pluso Company Serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | SP20572 - Infineon EasyPACK™ FS100R12W2T7 | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related Reports
About System Pluso Company Serviceso Contact
Contact
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