imec presentation
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imec'sversatilecapabilitiesTRANSCRIPT
IMECAT A GLANCEAT A GLANCE
HISTORY
▸ Established by state
HISTORY
▸ Established by state government of Flanders in 1984
▸ Independent non-profit organization
▸ Worldwide reach
▸ Initial investment: 62M€
▸ Initial staff: ~70
© IMEC 2012© IMEC 2012
MISSION
▸ W ld l di h i
MISSION
▸ World-leading research in nano-electronics
▸ Scientific knowledge with Scientific knowledge with innovative power of global partnerships in ICT, healthcare and energyhealthcare and energy
▸ Industry-relevant technology solutionstechnology solutions
▸ International top talent in a unique high-tech environment committed to provide building blocks for a better life in a
© IMEC 2012
sustainable society
FULL ECO SYSTEMFULL ECO SYSTEM
Universities
GovernmentEurope IMEC
Industryy
FACTS & FIGURES
▸ Total revenue in 2011 of
FACTS & FIGURES
▸ Total revenue in 2011 of 300M€, a growth of 5%
▸ 1 773 publications R&D 1,773 publications R&D related in 2011
▸ 132 patents awarded & p133 patents submitted in 2011
▸ Collaboration with 600 companies & 208 universities
▸ 600 residents
© IMEC 2012
Top 5 foreign employees1 The Netherlands (# HEADCOUNT 1. The Netherlands (#
159)2. China (# 87)3. France (# 86)4. India (# 76)May 2012:
HEADCOUNT
4. India (# 76)5. Japan (# 61)▸ 1,077 Belgians
▸ 72 foreign nationalities 159
140
160
87 8676
100
120
46
76
59 61
43
40
60
80
1 1 3 1 2 27 7 5
1 1 1 4 4
16
1 1
30
18
1 1 2 1
13
3
13
2 1
31
1 1 2 5 81 3 1 1 1 4 1 4
10
2
1015
8 5 61 2
25
4 2
28
1
12
15
1 17
10
20
40
IMEC IN THE WORLDIMEC IN THE WORLD
BelgiumBelgium
The NetherlandsThe Netherlands
office Japanoffice Japanoffice USoffice USChinaChina
TaiwanTaiwanIndiaIndia
Silicon Organic solar cell
NERF 200mm pilot line
Silicon solar cell
lineline NERF
lab
300mm pilot line
Nano biolabs
450mm 450mm ready
STATE-OF-THE-ART RESEARCH FACILITIESRESEARCH FACILITIES
300mm PILOT LINE300mm PILOT LINE
IMEC TOWER
‣ Expansion of 14 208 m2‣ Expansion of 14,208 m
‣ 16 floors – capacity of 450 people & lab space
RESEARCH PROGRAMS FOR FULL ECO SYSTEM
Green RadioLow power
wireless communication
ImagingImage sensors
& vision systems
EnergyPhotovoltaicsPower devices
LEDs
Sensor systems for industrial applications
BANLife Sciences
Human++
communication
OrganicCMORE
LEDsapplications
Core CMOSelectronicsMEMS, Sensor
PhotonicsLithography Devices Interconnects
SCALINGSCALING
‣ 1965: 1965: Lithography enabled scaling
‣ 2002-2003: ~ 90 nm2002 2003: 90 nmMaterials enabled scaling
‣ ~ 14 nm:‣ 14 nm:3D enabled scaling
© IMEC 2012
FINFETFINFET
‣ 22nm – 14nm22nm 14nm
‣ FinFET introduction at 22nm for high-end 22nm for high end applications
‣ 14nm for foundry ‣ 14nm for foundry processes
© IMEC 2012
LOGICLOGIC
‣ High mobility channelHigh mobility channel
‣ 10 nm – 7nm
GeGe
© IMEC 2012
LOGICLOGIC
‣ High mobility channelHigh mobility channel
‣ 10nm – 7nm
Ge
InGaAs
GeInP
GaAs
Si
Ge
GaAs
© IMEC 2012
LOGICLOGIC
‣ New device concepts
Tunnel FET
New device concepts
‣ Tunnel FETPinch-off FET
‣ Pinch-off FET
‣ 7nm – 5nm
© IMEC 2012
ReRAMReRAM
‣ Resistive RAMResistive RAM
‣ Integration in a vertical conceptconcept
‣ In 2011: world’s smallest, fully-functional HfO2-based fully-functional HfO2-based ReRAM cell, with an area of less than 10 x 10nm²
© IMEC 2012
DRAMDRAM
‣ STT RAM as stand alone STT RAM as stand alone and for embedded memory
© IMEC 2012
<20nm
3D INTEGRATION3D INTEGRATION
‣ Reducing floor space –Reducing floor space small form factor
‣ 3D stacking of memory on 3D stacking of memory on logic or RF on interposer
© IMEC 2012
OPTICAL I/OOPTICAL I/O
‣ Extreme high bandwidth Extreme high bandwidth I/O in high performance computing
‣ Imec world-first sub-100nm photonics components on 300mm Si technology with optical li h hlithography
© IMEC 2012
EUVEUV
‣ ASML preproduction ASML preproduction scanner NXE:3100 for extreme UV lithography
© IMEC 2012
LITHO POWERLITHO POWER
‣ 16nm half pitch16nm half pitch
‣ Phenomenal lithographic power can be achievedpower can be achieved
© IMEC 2012
DIRECTED SELF DIRECTED SELF ASSEMBLY
‣ Extending optical g plithography beyond its current limits
‣ Alternative patterning enabling frequency multiplication through use p gof block copolymers
© IMEC 2012
INSITEINSITE
‣ Technology insights for gy gproduct roadmapsSYSTEM DESIGN
(Fabless - Fablite)
INSITE
PROCESS TECHNOLOGY(Foundry)
© IMEC 2012
INSITEINSITE
‣ Linking process technology
Technology Option
selection g p gy& system design
Path-findingTechnology-
designTest chips
Design & gco-exploration build
ModelMeasure &
© IMEC 2012
Measure & characterize
300mm PILOT LINE300mm PILOT LINE
‣ Investment > 1B$$
‣ Unique lithography cluster centered around ASML equipment
‣ Advanced equipment and preproduction toolspreproduction tools
‣ Ballroom type of cleanroom
4 800 ² l 1 000 ‣ 4,800m² class 1,000 area
© IMEC 2012
300mm PILOT LINE300mm PILOT LINE
300mm PILOT LINE:
‣ Silicon pilot line for (sub-)22nm‣ Silicon pilot line for (sub-)22nm
‣ Semi-industrial operation - 24/7, process monitoring, short cycle time
PREPARING 450mmPREPARING 450mm
‣ Funding Flemish gGovernment
‣ Towards Europe’s innovation engine
© IMEC 2012
GLOBAL NETWORK
SYSTEM COMPANIES
MEMORY IDM LOGIC IDM FOUNDRIES FABLITE FABLESS
EQUIPMENT SUPPLIERS
MATERIAL SUPPLIERS
SOFTWARE SUPPLIERS
GLOBAL NETWORK
Foundries Fablite FablessLogic IDMMemory IDM
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CORE CMOS PARTNERS
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LamRESEARCH
RESEARCH PROGRAMS FOR FULL ECO SYSTEM
Green RadioLow power
wireless communication
ImagingImage sensors
& vision systems
EnergyPhotovoltaicsPower devices
LEDs
Sensor systems for industrial applications
BANLife Sciences
Human++
communication
OrganicCMORE
LEDsapplications
Core CMOSelectronicsMEMS, Sensor
PhotonicsLithography Devices Interconnects
BODY AREA NETWORKSNETWORKS
BODY AREA internetdoctor BODY AREA
NETWORKShospital
W bl h l h d ▸ Wearable health and comfort monitoring
© IMEC 2012
HEALTH PATCHHEALTH PATCH
M l i ▸ Multi parameter: - heartbeat - skin temperature- skin conductance- sweat analysis - chemical sensingg
© IMEC 2012
HEALTH PATCHECG PATCHECG PATCH
Ul l ECG ▸ Ultra-low power ECG patch
▸ Bluetooth low energygy▸ Embedded algorithm▸ 30 days autonomy
© IMEC 2012
WIRELESS EEGWIRELESS EEG
A li iApplications:▸ Improving traffic safety
through drowsiness gmonitoring
▸ Games that adapt to the player’s cognitive stateplayer s cognitive state
▸ E-learning that adapts to the user’s concentration
▸ Accurate EEG monitoring at home, e.g. epilepsy patients
© IMEC 2012
patients
ULTRA LOW ULTRA LOW ENERGY DESIGN
Di i l d i f ▸ Digital system design for battery operated and harvested devices with 10-100 times less power consumption
▸ Reliable near-threshold Reliable near threshold design
▸ Ultra energy efficient bi di l ibiomedical processing
© IMEC 2012
MOBILE MOBILE DIAGNOSTICS
Aff d bl ▸ Affordable ▸ Health monitoring to rural
environments in developing countries
© IMEC 2012
CMUT
4D RT imaging
CMUT
C i i Mi hi d
4D RT imaging
▸ Capacitive MicromachinedUltrasonic Transducers technology
▸ Towards mobile real-time 4D ultrasound
▸ More precise & faster
Mock up
▸ More precise & faster ultrasound scans
© IMEC 2012
CMUT: BASED ON CMUT: BASED ON SiGe MEMS
SiG MEMS f ▸ SiGe MEMS on top of CMOS
▸ Membranes integrated gwith electronics
▸ More compact, faster, more sensitive increasing more sensitive, increasing pixel density
© IMEC 2012
LIFE SCIENCES:EARLY DIAGNOSTICSEARLY DIAGNOSTICS
EARLYEARLYDETECTION
E l d i f ▸ Early detection of cancer cells
▸ Secondary tumors are ymain cause of most cancer deaths
▸ Challenge: detecting one ▸ Challenge: detecting one in 5 billion cells
© IMEC 2012
INSPECTION INSPECTION CIRCUITS
Chi i h h d f ▸ Chip with thousands of parallel inspection circuits
▸ Each containing gelectronics, microfluidics & imaging hardware
▸ Goal: inspect 20 million ▸ Goal: inspect 20 million cells per second with high reliability
© IMEC 2012
LIFE SCIENCES:PERSONALIZED THERAPYPERSONALIZED THERAPY
STEM CELLSSTEM CELLS
T di b i b ▸ Treat diabetes patients by replacing faulty pancreas cells with new pancreas cells
▸ Reprogrammed on the basis of own stem cellsbasis of own stem cells
© IMEC 2012
STEM CELL STEM CELL BIOREACTOR
G i ll & i ▸ Growing cells & tissues on chips
▸ Two-way communication ybetween electronics & cells
▸ Expertise in electrode ▸ Expertise in electrode arrays on active CMOS for cell recording of
& di llneurons & cardiac cells
© IMEC 2012
PRECISE PRECISE REPROGRAMMING
Ch ll l f f ▸ Challenge: a platform for precise reprogramming and growth of stem cells
▸ Built on expertise in advanced semiconductor equipment & advanced equipment & advanced metrology
© IMEC 2012
NERF LABNERF LAB
▸ I & VIB & KU L▸ Imec & VIB & KU Leuven▸ Unraveling the human
brain
▸ Research interests: - sensory integration &
i i h processing in the zebrafish brain
- neural circuits &behavior
- functional assembly of l i it
© IMEC 2012
neural circuits
HUMAN++ PROGRAM PARTNERSHUMAN++ PROGRAM PARTNERS
RESEARCH PROGRAMS FOR FULL ECO SYSTEM
ImagingImage sensors
& vision systems
EnergyPhotovoltaicsPower devices
LEDs
Sensor systems for industrial applications
BANLife Sciences
Human++ Green RadioLow power
wireless communication
OrganicCMORE
LEDsapplications
Core CMOS
communication
electronicsMEMS, Sensor Photonics
Lithography Devices Interconnects
WIRLESS SENSORSWIRLESS SENSORS
▸ Improving connectedness▸ Improving connectedness
▸ Smarter world: - smart healthcare- smart buildings - smart phone
smart display- smart display
© IMEC 2012
WIRELESS WIRELESS COMMUNICATION
▸ Innovative solutions for ▸ Innovative solutions for tomorrow’s wireless communication
▸ By combining advanced IC technology with innovative design strategies & smart design strategies & smart software techniques
▸ Fully-integrated energy-efficient solutions with more performance & flexibility
© IMEC 2012
y
RECONFIGURABLE RECONFIGURABLE RADIOS
▸ Towards low cost & low▸ Towards low-cost & low-power reconfigurable radios
▸ Enabling future 4G networks and digital video broadcasting
▸ Reconfigurable analog front-Reconfigurable analog frontend
▸ Reconfigurable digital b b dbaseband
▸ Spectrum sensing▸ Record breaking ADCs
© IMEC 2012
▸ Record breaking ADCs
mmWAVEmmWAVESOLUTIONS
‣ Wireless solutions that ‣ Wireless solutions that exploit the bandwidth capacity available at 60GH f h t 60GHz for short-range Gigabit/s communication
‣ Radar & backhaul Radar & backhaul applications emerging
© IMEC 2012
ULTRA-LOW ULTRA LOW POWER RADIOS
‣ Radios for battery & ‣ Radios for battery & energy harvested devices with power consumption th t i 10 100 ti l that is 10-100 times lower than conventional low-power systems
© IMEC 2012
PARTNERS WIRELESS TECHNOLOGYS W SS C O OG
RESEARCH PROGRAMS FOR FULL ECO SYSTEM
Green RadioLow power
wireless communication
EnergyPhotovoltaicsPower devices
LEDs
Sensor systems for industrial applications
BANLife Sciences
Human++ ImagingImage sensors
& vision systemscommunication
OrganicCMORE
LEDsapplications
Core CMOSelectronicsMEMS, Sensor
PhotonicsLithography Devices Interconnects
TARGET MARKETSTARGET MARKETS
▸ Spacep▸ Instrumentation▸ Machine vision▸ Medical▸ Biology
© IMEC 2012
SPECIALIZED SPECIALIZED IMAGING
▸ Ultra fast ▸ Non-visible light▸ Enhanced performance▸ Hyperspectral▸ Lensless
© IMEC 2012
ULTRA FAST ULTRA FAST IMAGING
Challengeg▸ Fast readout at low
power consumption▸ Towards million
frames/sec
Building on imec expertise:▸ High speed ADCs▸ Embedded CCD
© IMEC 2012
IMAGING NON IMAGING NON VISIBLE LIGHT
▸ Fully qualified EUV sensors y qinstalled in customer’s product: ASML/3100 lithography toollithography tool
- EUV Energy sensor to monitor EUV dosemonitor EUV dose
- 2 EUV position sensors to calibrate, align and focus lens systems
© IMEC 2012
ENHANCED ENHANCED PERFORMANCE
▸ Backside illumination for:- High quantum
efficiencyBroad spectral range - Broad spectral range from 193nm to 1μm
© IMEC 2012
HYPERSPECTRALHYPERSPECTRALIMAGING
Advantages: g▸ More spectral
information (than RGB)▸ Extreme miniaturization▸ Low cost▸ High speed▸ High speed▸ Wafer-level filter
integration
© IMEC 2012
LENSLESSLENSLESS
Microscopic imaging over a p g glarge area
Biomedical applications:▸ Cell sorting & monitoring
(flow cytometry)▸ Molecular diagnostics Molecular diagnostics
(biomarkers assays)▸ DNA sequencing150 µm
© IMEC 2012
RESEARCH PROGRAMS FOR FULL ECO SYSTEM
Green RadioLow power
wireless communication
ImagingImage sensors
& vision systems
EnergyPhotovoltaicsPower devices
LEDs
BANLife Sciences
Human++ Sensor systems for industrial applicationscommunication
OrganicCMORE
LEDs
Core CMOS
applications
electronicsMEMS, Sensor Photonics
Lithography Devices Interconnects
APPLICATIONSAPPLICATIONS
‣ Smart buildingsg
‣ Preventive maintenance
‣ LogisticsLogistics
‣ Automotive
‣ Monitoring environmental ‣ Monitoring environmental parameters
© IMEC 2012
SENSOR SYSTEMSSENSOR SYSTEMS
‣ Long-time autonomy g y
‣ Ultra-low power wireless solutions: 10 – 100 times lower than conventional low-power systems p y
© IMEC 2012
MEMSMEMSHARVERSTER
‣ Piezoelectric harvesters
‣ MEMS harvester to power intelligent tire
‣ Record output of 489µW
© IMEC 2012
ETHYLENEETHYLENESENSOR
‣ Sensor in one single chipg p
‣ Monitor fruit ripening
‣ Low detection limits low Low detection limits, low cost, low power consumption
© IMEC 2012
2.3/2.4 GHZ 2.3/2.4 GHZ TRANSMITTER
‣ Multi-standard transceiver for sensor networks
‣ 2.3/2.4GHz transmitter for wireless sensor applications compliant with 4 wireless standards
‣ 3 to 5 times more power efficient than state-of-the-
Bl h LE art Bluetooth LE
© IMEC 2012
RESEARCH PROGRAMS FOR FULL ECO SYSTEM
Green RadioLow power
wireless communication
ImagingImage sensors
& vision systems
Sensor systems for industrial applications
BANLife Sciences
Human++ EnergyPhotovoltaicsPower devices
LEDscommunication
OrganicCMORE
applications
Core CMOS
LEDs
electronicsMEMS, Sensor Photonics
Lithography Devices Interconnects
ENERGY ENERGY STRATEGY
▸ Solar energy generationSolar energy generation
▸ Switching energy
▸ Storing energy▸ Storing energy
▸ Saving energy
© IMEC 2012
SILICONPVPV
COMBININGCOMBININGEXPERTISE
▸ Process steps▸ Process steps▸ Materials ▸ Device/module conceptsp
Towards world record performance
© IMEC 2012
SILVER SILVER REPLACEMENT
▸ 7% of all silver used in PV▸ 7% of all silver used in PV▸ A major part of PV cell cost
is silver▸ Replacing silver by copper
© IMEC 2012
Cu-PLATED Cu PLATED Si SOLAR CELL
▸ Copper electroplating▸ Copper electroplating▸ >21% efficiency
© IMEC 2012
INTERDIGITATEDINTERDIGITATEDBACK-CONTACT SiSOLAR CELL
▸ > 23% efficiency
SOLAR CELL
▸ > 23% efficiency
© IMEC 2012
I-MODULEI MODULE
▸ Cell integration of ultra▸ Cell integration of ultra-thin wafers onto module glass
▸ Integrating additional electronics to module for power conversion & load poptimization
© IMEC 2012
Si-PV IIAP PARTNERS
OPV
ORGANIC CELLSORGANIC CELLS
▸ Towards: - 10% efficiency
10 years lifetime- 10 years lifetime
© IMEC 2012
INVERTED INVERTED POLYMER CELL
▸ World record efficiency 8,3%
© IMEC 2012
COMBINING COMBINING EXPERTISE
▸ Materials and cell architectures
▸ Collaboration between ▸ Collaboration between world-class chemical companies, innovative d l developers & imec
© IMEC 2012
GaN-on-Si LEDsGaN on Si LEDs
▸ LED on 200mm GaN-on-Si wafers
▸ To make LEDs cheaper▸ To make LEDs cheaper
© IMEC 2012
GaN-on-Si LEDsGaN on Si LEDs
▸ Process flow fully compatible with 200mm CMOS processing lineCMOS processing line
© IMEC 2012
GaN-ON-Si power GaN ON Si power devices
▸ GaN power devices on 200mm Si substrates
© IMEC 2012
OLEDOLED
▸ New flexible OLED lighting program
▸ Economically scalable ▸ Economically scalable route to high-volume manufacturing
▸ Low power consumption, high resolution, large area, outdoor readability, outdoor readability, flexibility & light weight
© IMEC 2012
GaN PARTNERS
25 year solar25 year solar cell research
RESEARCH PROGRAMS FOR FULL ECO SYSTEM
Green RadioLow power
wireless communication
ImagingImage sensors
& vision systems
EnergyPhotovoltaicsPower devices
LEDs
Sensor systems for industrial applications
BANLife Sciences
Human++
communication
Organic
LEDsapplications
Core CMOS CMOREelectronicsLithography Devices Interconnects MEMS, Sensor
Photonics
CMORE
MEMS NANO-PHOTONICS
CMORE
‣ Turn your silicon concept y pinto a product
SENSORS POWER-HIGH V-HBT
BIO-INTERFACE GaN
© IMEC 2012
CMORE
STEP 1 STEP 4
CMORE
PR
O
‣ Turn your silicon concept
- CONCEPT DESIGN - PROTOTYPING - LOW-VOLUME MANUFACTURING AT IMEC
OT
OT
YP
IN y pinto a product
STEP 2
- PROCESS DEVELOPMENT
AT IMEC
STEP 5
TRANSFERLOP
ME
NT
NG
- PROCESS DEVELOPMENT - PACKAGING - TESTING - RELIABILITY
- TRANSFER
O-)
DE
VE
L
STEP 3
- PRODUCT QUALIFICATION
STEP 6
- HIGH-VOLUME MANUFACTURING
(CO
PR
OD
U
QUALIFICATION MANUFACTURING AT FOUNDRY PARTNER
CT
ION
© IMEC 2012
EUV SENSORSEUV SENSORS
‣ High-quality EUV sensors g q yfor ASML’s next-generation lithography tools
‣ Main requirements:- superior lifetime - sensitivity to direct and yhigh doses of EUV irradiation
N i‣ Next generation:- NXE:3100- NXE: 3300
© IMEC 2012
BIOSENSORSBIOSENSORS
‣ Biosensor chips for pGenalyte diagnostic & molecular detection equipmentequipment
‣ CMORE service making use of imec’s silicon photonic ptechnology
© IMEC 2012
CMORE PARTNERS
RESEARCH PROGRAMS FOR FULL ECO SYSTEM
Green RadioLow power
wireless communication
ImagingImage sensors
& vision systems
EnergyPhotovoltaicsPower devices
LEDs
Sensor systems for industrial applications
BANLife Sciences
Human++
communication
CMORE
LEDsapplications
Core CMOS OrganicMEMS, Sensor
PhotonicsLithography Devices Interconnects electronics
SYSTEM ON FOILSYSTEM ON FOIL
Thin-film electronics on flexible plastic foils
Applications:Applications:
▸ rollable displays for tablet computers or phonesp p
▸ electronics printed on objects
▸ intelligent food packaging, or paper with integrated electronics
© IMEC 2012
electronics
MICROPROCESSOMICROPROCESSOR
▸ First microprocessorp
© IMEC 2012
IMECWHAT WE OFFERWHAT WE OFFER
BUSINESS MODELBUSINESS MODEL
Services TrainingServices Training
Spin-offs Transfer & licenses
Joint Joint R&D
© IMEC 2012
OPEN OPEN INNOVATION
Ri kRi kIP
CostCostRiskRisk
Services Training
TalentTalent Spin-offs
Transfer & licensesoffs licenses
Joint
Accelerated, ff R&D
Joint R&D
© IMEC 2012
cost-effective R&D
OPEN OPEN INNOVATIONPartner
A
Partner B
Partner E
ProgramBE
Services Training
Partner C
Partner D
Spin-offs
Transfer & licensesoffs licenses
Joint
I i d t i l ffili ti
Joint R&D
© IMEC 2012
Imec industrial affiliation programCustomized programs
RESEARCH RESEARCH PROGRAMS
System
Fabless
System
Services Training
FablessFablite
Logic IDM
Memory IDMSpin-offs
Transfer & licensesFoundries
Suppliers
offs licenses
Joint SuppliersEquipmentSuppliers
MaterialSuppliers
EDA SAT
Joint R&D
© IMEC 2012
RESEARCH PROGRAMS FOR FULL INDUSTRY ECO SYSTEMFOR FULL INDUSTRY ECO SYSTEM
Foundries Fablite FablessLogic IDMMemory IDM
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SERVICES
▸ ASIC services:
SERVICES
- Design- Prototyping to low-volume
▸ CMORE platform:- Design- Process techn.
Services Training
development- Prototyping to low-volume
Spin-offs
Transfer & licenses
▸ CAMS:- A unique set of reliability and Joint
offs licenses
q ycharacterization services
Joint R&D
© IMEC 2012
TRAINING
▸ Imec Academy
TRAINING
y
▸ Training for industry & academia on advanced concepts and technologies
▸ Advanced training programs on IC technology and design and related Services Training
▸ E-learning and web-based training
▸ On-line knowledge exchange Spin-offs
Transfer & licenses
Joint
offs licenses
Joint R&D
© IMEC 2012
www.imec-academy.be
SPIN-OFFSSPIN OFFS
Services Training
Spin-offs
Transfer & licensesoffs licenses
Joint Integrated in Cypress Integrated in Agilent T h l i
Integrated in Synopsis Inc. Joint R&D
g ypTechnologies
Integrated in ARM Belgium Integrated in Huawei
© IMEC 2012
Alphabit & UCB Electronics integrated in Agilent TechnologiesCobrain integrated in Matrix Integrated Systems, Inc.
TRANSFER & TRANSFER & LICENSES
▸ Process steps, modules, technologies: 65nm and 28nm CMOS platform
Services Training▸ IP blocks:- ADCs
Spin-offs
Transfer & licenses
ADCs- Software-defined radio- Reconfigurable processor- offs licenses
Joint
- …
Joint R&D
© IMEC 2012
IMECIN FLANDERSIN FLANDERS
LEVERAGE TO FLANDERS
With a dedicated team stimulating, initiating &
coordinating cooperation with Flemish companies & with Flemish companies &
innovation actors
Exploration, transfer & consolidation in Flanders
Worldwide industrial networkof top companies
Build up of technology portfolio in generic R&D ProgramsBuild-up of technology portfolio in generic R&D Programs
COOPERATION WITH LOCAL COMPANIES / ACTORSLOCAL COMPANIES / ACTORS
Timely insight and inputs for LT research
Participation in LT/MT/ST
h
Sharing technological
LT research research
Application of Application of 1 few
Focussed added valuetechnological know-how
ppresearch results
ppresearch results
Cooperation with local
Informing about technological
Support for development of
d
Support for development of
d local companies/actors
technological opportunities new products
and processesnew products and processes
1 manyLow threshold
1 1High thresholdLow threshold
Generic added valueHigh thresholdSpecific added value
EXPANSION MODEL: MICROELECTRONICS FOR BENEFIT OF OTHER SECTORSMICROELECTRONICS FOR BENEFIT OF OTHER SECTORS
AutomotiveTextile
FoodBiomedical
Construction Health & WellnessElectronic Design
IMEC’S IMPACT ON THE LOCAL INDUSTRYEVOLUTION COLLABORATION LOCAL COMPANIESEVOLUTION COLLABORATION LOCAL COMPANIES
464486500
600
1984 2001: 142 local companies
350381
411447
464
400
5002002 2011: 344 extra local companies, >60% SME’s!
222
261
306
350
300
102 110127
142166
222
200
26 32 45 5774 86
102 110
0
100
01992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011
OUR PARTNERS
1066 4
38
3
810
20
32
11
1510
9
38
Hasselt8 24
20
58
102 68
PARTNERS SPREAD OUT OVER FLANDERS
A SAMPLE OF THE FLEMISH PARTNERS
COOPERATION IN DIFFERENT SECTORS 2011WITH LOCAL COMPANIES WITH LOCAL COMPANIES
22%
34%
Non-ICTMicroelectronics
TextileAutomotive
Medical
26%
FoodGraphicsWellness
H lth
18% Electronic prod.
ICT (others)
HealthChemical
ConstructionDomotics