i. 태양전지개요 ii. cigs 박막태양전지구조및공정 iii.cigs 박막태양 ... · 2018....
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태양전지 및 이차전지 기술 동향청주대 미래창조관
I. 태양전지 개요
II. CIGS 박막 태양전지 구조 및 공정
III. CIGS 박막 태양전지 저가화 및 고효율화
IV. CIGS 박막 태양전지 기술 전망
V. 한국전자통신연구원 연구개발 현황
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Virtual e-learning System
Flexible Solar CellDigital Actor
Dog-Horse Robot
Flexible Display
Bio-ShirtMIT Device Emotion Robot “Kobie”
Silicon Photonics SAN-based Remote Maintenance Ship Device
4G(LTE, WiBroAdv)Terrestrial DMB
WiBro
Major Achievements
Top of the world in US patents by IPIQ (2012, global 237 research institutes)
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Geothermal
Other REs
Solar heat
Solar Electricity20% 70%
Wind
Biomass adv
Biomass trad
Hydro-PWNuclear PW
GasCoalOil
WBGU: German Advisory Council on Global Change
http://www.wbgu.de/
WBGU’s World Energy Vision 2100
Necessary to develop fundamental technology for Post Grid Parity
Today and Tomorrow of Photovoltaics
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Industry Applications (1/2)
(Grid-connected Domestic Systems)
(Grid-connected Power Plant) (Off-Grid Systems for Rural Electrification)
(Hybrid systems) (Consumer Goods : automobile sun roof) (Off-Grid Industrial Applications)
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Industry Applications (2/2)
power 5.5 W
PV-powered HatPV-powered jacket
유비쿼터스 : 움직이는 동력원(예) 입는 컴퓨터
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Solar Cell Structure and Principle
h e-
Semiconductor materials for PV:
1) Crystalline : Si (Mono, Poly)
2) Compound : CIGS, CdTe, GaAs
3) Organic, Dye-sensitized
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Classification of Solar Cell Materials
Solar Cell Compound
Others
Mono-Si
Si
Thin-film
Wafer-basedPoly-Si
Poly-Si thin-film
Amorphous/microcrystalline thin-film
Group I-III-VI
Group II-VI
Group III-V
CuInSe2, Cu(In,Ga)Se2
CdTe
Cu2S
GaAs
InP
Thin-film
Bulk
Organic, Dye-sensitized, Quantum structure etc.
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Solar Cell Efficiency
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2013년 세계 태양광시장은 설치용량 기준으로 35~40GW에 달할 것으로 예상되며(연초 대비10~20% 상승), 2014년은 42~50GW 정도가 신규로 설치될 전망.
자료 : New Energy Finance , EPIA 한국수출입은행 경제연구소 (‘13)
세계 태양광 시장 추세 및 전망
보수적 전망치 긍정적 전망치
일본, 중국, 미국이 세계 태양광시장을 리드→ 일본은 2013년에 7GW 전후의 규모로 신규 설치될 전망 (작년의 3배를 초과하는 규모)→ 중국은 2013년에 6~9GW를 형성할 전망 (당초 10GW까지 전망했지만 계통연계 여건이 좋지 않음)→ 미국은 2013년에 4~5GW를 신규로 설치할 예정(작년 대비 30% 이상 증가)
PV Market Outlook
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Type a-Si CIGS/CIS CdTe
Technology-Amorphous Si on glass substrate-TFT-LCD mature technology,non-toxic materials
-Cu, In, Ga, Se compound-Price of In materials issue in platpanel display industry
-CdTe compound-Toxic materials and massproduction issue-environmental risk
Efficiency(production)
5~9% 10~13% 7~11%
Efficiency(Laboratory)
> 12% > 19% > 16%
Process Normal Most complicated Relatively simple
Cost Medium Low Low
Environmental risk
Low Medium High
Flexible substrate Easy Difficult Medium
Merits-Mature technology-Easy process-Various substrate
High conversion efficiency Low-cost
Demerits Low conversion efficiency Complicated process Toxic materials (Cd)
IssuesTandem, Triple structure for highefficiency
Scale-up for productionMass production, environmentalrisk
Company Sharp, Mitsubishi, United Solar Nano Solar, Scheuten First Solar, ANTEC Solar
Type of Thin-film Solar Cell
Source: IITA and Credit Suisse 2008.3
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Thin-Film PV Technologies
TechnologyEfficiency
(%)
Relative performance
(Standard Si: 1)Cost
Future relative-cost
Crystalline Si
Non-standard 19.8 1.181.0
→
0.85
Stnadard 17.0 1.00 1.00
Thin-film
a-Si (1-j) 8.0 0.47
0.5
1.06
a-Si/c-Si 9.7 0.57 0.88
CIGS 15.9 0.92 0.55
CdTe 13.2 0.78 0.64
Note) Conversion efficiency of production can be increased to 80% of laboratory efficiencyProduction cost of thin-film: 50 % compared with crystalline
Reference: Bolko von Roedern and Harin S. Ullal (NREL), 33rd IEEE PVSC, 2008
Estimation of PV module cost
Industrial competitiveness of thin-film CIGS technology is the most outstanding
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Solar Cell Efficiency Tables (Version 42)
Prog. Photovolt: Res. Appl. 2013; 21:827-837
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Cell Efficiency (%) Module efficiency (%) M/C
Si (crystalline) 25.0±0.5 22.9±0.6 91.6
Si (multicrystalline) 20.4±0.5 18.5±0.4 90.7
CIGS 19.6±0.6 15.7±0.5 80.1
CdTe 19.6±0.4 16.1±0.5 82.1
a-Si/a-SiGe/nc-Si
(tandem)13.4±0.4 10.5±0.4 78.4
Dye sensitized 11.9±0.4 - N/A
Efficiency: Cell and Module
Prog. Photovolt: Res. Appl. 2013; 21:827-837
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Efficiency and Solar Cell Cost
With higher efficiency modules, thecost per unit area can be much higherfor a given cost target of electricity inkWh. To achieve the proposed targetwith 10% efficient modules requiresthat the modules be less than $10/m2.With modules of 20% efficiency, it isstill possible to meet the proposedtarget with modules that are $75/m2
http://pvcdrom.pveducation.org/main.html
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History of CuInSe2
1953 - CuInSe2 crystals first synthesized by H. Hahn
1974 - First CuInSe2 solar cells from Bell labs, optimized to 12 % efficiency:Wagner et al.
1976 - First thin film CuInSe2/CdS solar cell: L. Kazmierski
1980’s - Advances from Boeing group: >10 % efficiency, elementalevaporation, alloying with Ga
1980’s - Advances from Arco Solar: reaction of metal precursors, thinCdS/ZnO window layers. Module production
1993 - Beneficial role of Na indentified: L. Stolt
1990’s - Advanced absorber fabrication => very high efficiencies: NRELand many others
2000’s - Spurt in investment, many new companies worldwide
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Properties of Cu(InGa)Se2 (1/2)
Chalcopyrite structure: Sphalerite (zincblende) structure with ordered substitution ofGroup I (Cu) and group III (In or Ga)elements
Tetragonal distortion: deviation from c/a=2,changes with Ga/In
Composition fall along tie-line betweenCu2Se and In2Se3
Broad chalcopyrite single phase region ()
Low Cu => -phase: ordered defectcompound (ODC)
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Properties of Cu(InGa)Se2 (2/2)
Demerits◆ Expensive In materials and
production cost still high
◆ Not as efficient as crystalline Si
◆ Complicated process for 4 elements
◆ Standard process equipments issues
Merits◆ Direct band-gap semiconductor; high
efficiency
◆ Wide band-gap engineering: 1.0 ~ 2.7 eV (with Ga, Al, S doping)
◆ High absorption constant; > 105 cm-1 for CIS
◆ Stability & Radiation resistant
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CIGS Structure and Process
Layers Materials Process
Grids Al / Ni E-beam evaporator
(AR coating) MgF2 E-beam evaporator
Window n-ZnO / i-ZnO RF sputtering (MOCVD)
Buffer CdS Chemical bath deposition
Absorber Cu(In,Ga)Se2 (CIGS) Co-evaporationSputtering+Se/S
Backelectrode
Mo DC sputtering
Substrate Soda-lime glass, Stainless Steel foil, Polymer
Cleanig
ZnO250 nm
CdS70 nm
Mo0.5-1 µm
Glass
CIGS1-2.5
µm
Substrate
Mo
CuInGaSe2
CdS
MgF2
Al/Ni contacts
+
-
n-ZnO/i-ZnO
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Isolation(2)
Substrate Back contact Isolation(1) Absorber Buffer
WindowIsolation(3)Attach leads
I-V test LaminationModule
assemblyI-V test
Buffer
Solar module
CIGS Process Flow
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Vacuum compatibilityNot degassing during CIGS deposition
Thermal stabilitywithstand temperatures exceeding 350 C
Suitable thermal expansionComparable coefficient of thermal expansion
Chemical inertnessDuring processing and use
Sufficient humidity barrierAgainst the penetration of water vapor
Surface smoothnessSpike and cavity may lead to shunts
Cost, energy consumption, availability, weightCheap, abundant, lightweight
Requirements for Substrates
F. Kessler, and D. Rudmann, Sol. Energy 77, 685 (2004).
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(Planar magnetron) (Cylindrical magnetron)
New Linear Source for better uniformity
Elemental co-evaporationSimultaneous delivery of Cu, In, Ga, Se to a hot substrate.
Produces the highest efficiency devices
Control of film composition, gradient
Manufacturing: pioneering work by Boeing in 1980’sIn-line process in development or production by several companies
Large area module > 13%
Precursor reaction – two-step processes:Cu + In + Ga + (Se) Cu(InGa)(SeS)2
First – deposition of precursor film
Second – reaction with Se/S
Potential for lower cost – uniform, high materials utilization
Cell performance: less reported, comparable with wide Eg
Manufacturing: pioneering work by Arco Solar in 1980’sBatch, RTP process in development or production by several companies.
Large area module > 13%
CIGS Deposition
Se, S
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Cu(InGa)Se2 Co-evaporation
◆ Elemental Cu, In, Ga, Se vapor onto heated substrate
◆ Independent control of each element:
▷ Co-evaporation Ga / (In + Ga) gradient Energy band-gap gradient
▷ Cu-rich thin film growth
PBase 110-6 torrPRun 210-5 torr
To Vac. Pump
Substrate Heater (~550C)
Thickness Monitor
Thermal Evaporation Sources for
Cu, In, Ga, Se, (S)
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In-line Evaporation
◆ Translation of heated substrate over of
sequential array of sources
◆ Can be implemented with glass substrate or
roll-to-roll flexible substrate
▷ Roll-to-roll process high throughput
▷ Reproducibility
▷ Scalable to wide areas
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Precursor Reaction: 2-step Process
◆ Cu, In, Ga precursors
▷ Selection: low cost, uniformity, efficient material use Sputtering – commercial equipment available Ink printing – maximizing material use, non-vacuum Electro-deposition – frequent batch process
◆ Hydride gas (H2Se, H2S) or elemental atomic vapor (Se, S)
▷ Batch or in-line▷ Rapid Thermal Process (RTP)
◆ Multi-step process for Cu(InGa)Se2 phase formation
Mo/Cu/Ga/InH2Se/H2S,
Se/S reaction
400 – 600C
Mo/Cu(InGa)Se2
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CIGS Structure: Rigid vs. Flexible
Flexible substrate
Insulator
Back elctrode
Absorber
Buffer
Window
Impurities
Grids
Grids
Substrate
Mo
CuInGaSe2
CdS
MgF2
Al/Ni contacts
+
-
n-ZnO/i-ZnO
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Helios Flying by AeroVironment Inc.
Highly flexibleVarious shapes and sizes
Customized and integratedVarious lengths and widths
Thin and lightweightLightness and aesthetic integration
UnbreakableTough, durable and safe to use
Environmentally friendlyShorter energy payback time
Advantages of Flexible Solar Devices
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CIGS PV Modules: Status
Nominal output(W)
Open circuit voltage (V)
Short circuit current (A)
Dimension (mm)Weight
(kg)Specific
Power (W/kg)
Module (M사) 111 24.9 6.80 665 x 1611 x 28 18.0 6.17
Module (S사) 165 110 2.20 977 x 1257 x 35 20.0 8.25
Module (G사) 62 28 4.2368 x 216 x 36 (fold)
1333 x 762 x 2.5 (deployed)1.41 43.97
Module (S사) 115 24.1 7.61 800 x 1320 x 11.5 1.40 82.14
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Properties of Materials
Steel category
Steel grade Chemical composition (%) Physical properties
KS (JIS) C Cr Ni MoSpecific heat
J/gC
Modulus of elasticity
×10³N/mm2
Coefficient of thermal expansion
×10-6/C(20-100℃)
Thermalconductivity×10W/mC(20-100℃)
Austenitic 316 ≤ 0.08 16.0-18.0 10.00-14.0 2.00-3.00 0.50 194 16.0 16.3
Ferritic 430 ≤ 0.12 16.0-18.0 0.46 200 10.4 26.4
F. Kessler, and D. Rudmann, Sol. Energy 77, 685 (2004).
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2~3 m-thick SiO2, SiOx, SiOx:Na, Al2O3, ZnO
Radio frequency sputtering, plasma enhanced chemical vapor deposition, orsol–gel deposition
Adhesion properties and mechanical stability
Dielectric Layer for Diffusion Barriers
F. K. D. Herrmann et al., Mater. Res. Soc. Symp. Proc., San Francisco, USA, 763, pp. 287–292(2003).
C. Y. Shi et al., Sol. Energy Mater. Sol. Cells 93, 654 (2009).
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Enhanced performancein amounts of typically about 0.1 at.%
better film morphology, passivation of grain-boundaries
higher p-type conductivity, reduced defect concentration
Supply methodsIn case SLG substrates, incorporated into CIGS during growth by diffusion
Na or Na compound (for examples, NaF, Na2S or Na2Se) prior to or during back contactdeposition, onto the back contact prior to CIGS growth, co-evaporation during CIGSdeposition, and Na in-diffusion into as-grown absorbers.
Na Incorporation
D. Rudmann, in Department of Physics (Swiss Federal Institute of Technology, Zurich, 2004).
Na or Na compound
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CIGS Efficiencies with Various Substrates
S. Niki et al., Prog. Photovolt: Res. Appl. 18, 453 (2010).
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Flexible CIGS PV: Roll-to-roll
(1) Co-Evaporation in Vacuum
(2) Physical Vapor Deposition + Selenization
(3) Non-vacuum Deposition + Selenization
(1)
(2)
(3)
Source: J. S. Britt (Global Solar Energy Inc.), PVSC2008
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Roll-to-roll Manufacturing
(FHR’S roll-to-roll System)
( Fraunhofer’s Roll to Roll System concept)
(Ascent Solar’s roll-to-roll system)
(Miasole’s roll-to-roll system)
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Fabrication of Modules
Tempered glass as cover glass
Al frame
CIGS-based circuit
Junction box with leads
Soda-lime glass as substrate
EVA
EVA/Tedler
Sealant
Surface protective film
Flexible solar cell submodule
Connective lead
Transparent bond
Surface protective film
Lead wire
Y. Hamakawa, Thin-Film Solar Cells: Next Generation Photovoltaics and Its Applications (Springer, Heidelberg, 2004).
cover glass
laminating
cells
laminating
plastic backing
junction boxaluminum
frame
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Monolithic Integration in Flexible Module
(a) rigid substrate (SLG)
(b) flexible substrate (Polyimide)
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Barrier requirements for different applications.
Flexible Packages
Florian Schwager, Elements 31 (2010).
Requirements on water vapor and oxygen transferof barrier films for solar cells are particularly high.
C. Charton et al., Thin Solid Films 502, 99 (2006).
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Tandem Cell Structure
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High performance photovoltaic project,
National Renewable Energy Laboratory(2001)
Monolithic Tandem
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Mechanically Stacked
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CdTe/CIGS Tandem
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DSSC/CIGS Tandem
S. Wenger et al., Appl. Phys. Lett., 94 (2009) 173508.
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Future Challenges and OpportunitiesDevice structure varies between monolithically & mechanically integrated modules
Today Forward
ZnO, ITO (2500 Å)• Sputter
Hardened TCO (moisture barrier)
CdS (700 Å)• Chemical Bath Depo
sition • Sputter
Cd-free; dry, eliminate
CIGS (1-2.5 µm)• Multiple methods
(coevaporation,sputtering,
printing,electrodeposition)
Increase Ga-%,Reduce thickness, Rapid deposition
Uniformity (composition, temp., thickness)
Mo (0.5-1 µm)• Sputter
Na dosing
Glass,Metal Foil,
Plastics
High temp. glassMetal foils: smooth,
flex-dielectric (monolith.)
• Screen Print Ag • Reduce shadowing• Faster application
Front Contact Grid
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Module costs must be considered in the context of module efficiency (impact oninstallation costs)
CIGS Manufacturing Costs
Courtesy of NREL (2011)
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Layer Stacks and Module Process
LayersProcess / materials
Avancis Solar frontier Sulfurcell Wuerth solarAscent,Solarion
Global solar
N-type TCO (1 m) + i-ZnO
RF-sputter,MOCVD
ZnO:Al ZnO:B ZnO:Al ZnO:Al ZnO:Al / ITO ZnO:Al
Buffer (50-100 nm)
CBD,ALD, ILGAR
CdS Zn(S,OH) CdS CdS CdS CdS
Absorber (1.5-2.5 m)
Evaporation, sputter-reaction
Cu(In,Ga)(S,Se)2
Cu(In,Ga)Se2, Cu(In,Ga)
(S,Se)2
CuInS2 Cu(In,Ga)Se2 Cu(In,Ga)Se2 Cu(In,Ga)Se2
Back contact (0.5-1.0 m)
DC-sputter Mo+barrier Mo+barrier Mo Mo Mo Mo+barrier
Substrate Rigid, flexible Window glass Window glass Window glass Window glass PolyimideStainless steel
foil
Absorber growthTechnology
-Sputter-
RTASputter-Furnace
Sputter-Furnace
Evaporation Evaporation Evaporation
rigid flexible
S. Niki, M. Contreras, I. Repins, M. Powalla, K. Kushiya, S. Ishizuka, and K. Matsubara, Prog. Photovolt: Res. Appl. 18, 453 (2010).
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