color specific powder paint not de- posited on the article in the re- claim system; and the collected powder paint in the reclaim sys- tem thereby providing a source for application of reclaimed pow- der paint on subsequent articles without cleaning the reclaim sys- tem when changing to a different color specific powder paint.

WATER-BASED METALLIC TOPCOAT U.S. Patent 6,099,968. Aug. 8, 2000 H. Harakawa and K. Suzuki, assignors to Kansai Paint Co., Limited, Amagasaki, Japan

An aqueous metallic coating com- position comprising 100 parts, based on solids, of a film-forming aqueous acrylic polymer; and 2 to 100 parts by weight of metallic flake pigment.

POWDER COATING U.S. Patent 6,103,794. Aug. 15, 2000 H.S. Laver, assignor to Ciba Specialty Chemicals Corp., Tarrytown, N.Y.

A powder coating composition comprising an organic film-form-

ing binder, which is an epoxy resin, a polyester-hydroxyalkylamide, a polyester-glycoluril, an epoxy-poly- ester resin, a polyester-triglycidyli- socyanurate, a hydroxy-functional polyester-blocked polyisocyanate, a hydroxy-functional polyester- uretdione, an acrylate resin with hardener or a mixture of such res- ins, and a stabilizer.

POWDER SPRAY GUN U.S. Patent 6,105,886. Aug. 22, 2000 T.E. Hollstein et al., assignors to Nordson Corp., Westlake, Ohio

A powder spray gun, which com- prises a housing including a body, a powder flow path extending through the body; a powder dis- tributor mounted for rotation on the body; and a drive mechanism located within the housing and connected to the distributor to ro- tate the distributor.

HOT-DIP COATING POT U.S Patent 6,106,620. Aug. 22, 2000 B.R. Morrison et al., assignors to BHP Steel (JLA) Pty Ltd., Melbourne, Australia

A hot-dip coating apparatus com- prising a pot for containing a bath of molten metal, duct means de- fining an elongate strip inlet pas- sage having a longitudinal direc- tion extending downwardly from an opening being dimensioned so that a metal strip may move up- wardly through the passage and the opening into the bath without contacting the apparatus or the duct means; and electromagnetic plugging means to prevent leak- age of bath fluid from the pot through the passage.

HIGH-SOLIDS CONDUCTIVE COATINGS U.S. Patent 6,106,742. Aug. 22, 2000 J.N. Argyropoulos et al., assignors to Union Carbide Chemicals & Plastics Technology Corp., Danbury, Conn.

A composition of matter compris- ing a nonconductive polymeric component, a conductive pigment, a solvent component, and option- ally, at least one additive compo- nent, wherein solvent component comprises at lest one aromatic hy- drocarbon component, which

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gives resistive stability when a voltage is applied to the unstirred composition and the composition has a total weight solids content greater than 20%.

ULTRA-SMOOTH ELECTROLESS NICKEL COATINGS U.S. Patent 6106,927. Aug. 22, 2000 L.L. Zhong and C.C. Liu, assignors to Seagate Technology Inc., Scotts Valley, Calif:

An article comprising a substrate; and a nickel coating electrolessly deposited using a bath containing aluminum and/or copper ions in an amount effective to achieve an as-deposited average surface roughness less than 30”.

PRIMER FOR PROMOTING ADHESION U.S. Patent 6,110,327. Aug. 29, 2000 T.G. Rukavina and R.M. Hunia, assignors to PPG Industries Ohio Inc., Cleveland

A method of adhering a coating selected from the group consisting of metal coatings, metal nitride coatings, and electroconductive metal oxide coating to a plastic

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substrate comprising providing a plastic substrate, wherein said substrate is selected from the group consisting of polycarbonate polyurethane, bis phenol-A poly- carbonate, polyether carbonate and stretched acrylic; cleaning by wiping with hexane and metha- nol; directing a carbonate diol- based polyurethane primer com- position onto the surface by a process selected from the group consisting of dipping, spraying spinning, or flowing; said plastic substrate; air drying at room tem- perature until sufficient solvent has evaporated to render the primer composition tack free; cur- ing composition at a temperature of at least 230°F for approxi- mately 1 to 2 hours whereupon cross-linking will occur to form a cross-linked primer on the sub- strate; and applying the coating over the primer.

ELECTROPLATING FIXTURES FOR HIGH DENSITY SUBSTRATES U.S. Patent 6,110,815. Aug. 29, 2000 C.J. Chia et al., assignors to LSI

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A method of electroplating the end of conductive traces forming conductive trace lands on an inte- grated circuit (IC) substrate for attaching to an IC chip.

POWDER PAINT SYSTEM U.S. Patent 6,112,999. Sept. 5, 2000 P.J. Fingleton et al., assignors to Steelcase Development Inc., Grand Rapids, Mich.

A method comprising providing a plurality of supply tanks having different colors of powder paint therein, each having a supply line extending therefrom; operably connecting a spray gun to a se- lected one of supply lines for ap- plying powder paint from one of the supply tanks; and disconnect- ing the one supply line from the spray gun when finished applying the powder paint and connecting the one supply line to a purge air source for back purging residue material in the one supply line back to the associated one supply tank.

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