high-density multi-layer screen-print circuits...we specialize in high‐density silkscreen printing...

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High-Density Multi-Layer Screen-Print Circuits Display modules, and Membrane Keypad assemblies. We specialize in highdensity silkscreen printing process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper, Glass, etc. Conductors can be printed by silver, Ag/AgCl, copper, carbon, silver nanowire, CNT, PEDOT. We provide highmix volume productions as well as quickturn prototype service. 1 Alliance Flex Tech Printed Electronics, IME (inmoldelectronics), Wearable Electronics, Capacitive Sensors, ePaper  Alliance Corporation is a total solutions provider for design, manufacturing, and assembly of

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Page 1: High-Density Multi-Layer Screen-Print Circuits...We specialize in high‐density silkscreen printing process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper,

High-Density Multi-LayerScreen-Print Circuits

Display modules, and Membrane Keypad assemblies. We specialize in high‐density silkscreenprinting process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper, Glass, etc.Conductors can be printed by silver, Ag/AgCl, copper, carbon, silver nano‐wire, CNT, PEDOT. Weprovide high‐mix volume productions as well as quick‐turn prototype service.

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Alliance Flex Tech

Printed Electronics, IME (in‐mold‐electronics), Wearable Electronics, Capacitive Sensors, e‐Paper

 

Alliance Corporation is a total solutions provider for design, manufacturing, and assembly of

Page 2: High-Density Multi-Layer Screen-Print Circuits...We specialize in high‐density silkscreen printing process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper,

In-Mold Electronics (IME)Functional Circuits

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Printed Electronics, IME (in‐mold‐electronics), Wearable Electronics, Capacitive Sensors, e‐PaperDisplay modules, and Membrane Keypad assemblies. We specialize in high‐density silkscreenprinting process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper, Glass, etc.Conductors can be printed by silver, Ag/AgCl, copper, carbon, silver nano‐wire, CNT, PEDOT. Weprovide high‐mix volume productions as well as quick‐turn prototype service.

Alliance Corporation is a total solutions provider for design, manufacturing, and assembly of

Page 3: High-Density Multi-Layer Screen-Print Circuits...We specialize in high‐density silkscreen printing process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper,

3D Formable Circuits

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Printed Electronics, IME (in‐mold‐electronics), Wearable Electronics, Capacitive Sensors, e‐PaperDisplay modules, and Membrane Keypad assemblies. We specialize in high‐density silkscreenprinting process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper, Glass, etc.Conductors can be printed by silver, Ag/AgCl, copper, carbon, silver nano‐wire, CNT, PEDOT. Weprovide high‐mix volume productions as well as quick‐turn prototype service.

Alliance Corporation is a total solutions provider for design, manufacturing, and assembly of

Page 4: High-Density Multi-Layer Screen-Print Circuits...We specialize in high‐density silkscreen printing process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper,

Transparent Circuits

Product Features: Line width / Line space = 50um / 50um Double‐sided printings STH (silver‐through‐hole) VLT > 85% ~ 95% Volume resistance < 150 Ω/ □ Formable

Material Options: Substrate      PET film, Polycarbonate, Colorless PI film Conductor    Ag, Ag Nano, CNT, PEDOT  Insulation     UV, Thermo‐cure, OCA Molded Material    ABS, PC, PMMA

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Printed Electronics, IME (in‐mold‐electronics), Wearable Electronics, Capacitive Sensors, e‐PaperDisplay modules, and Membrane Keypad assemblies. We specialize in high‐density silkscreenprinting process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper, Glass, etc.Conductors can be printed by silver, Ag/AgCl, copper, carbon, silver nano‐wire, CNT, PEDOT. Weprovide high‐mix volume productions as well as quick‐turn prototype service.

Alliance Corporation is a total solutions provider for design, manufacturing, and assembly of

Page 5: High-Density Multi-Layer Screen-Print Circuits...We specialize in high‐density silkscreen printing process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper,

In-Mold Electronics (IME)with LEDs / Connectors embedded

Product Features: Line width / Line space = 50um / 50um Double‐sided printings STH (silver‐through‐hole) VLT > 85% ~ 95% Volume resistance < 150 Ω/ □ Connectors, Headers, LEDs can be in‐molded to printed electronicse

Material Options: Substrate      PET film, Polycarbonate, Colorless PI film Conductor    Ag, Ag Nano, CNT, PEDOT Insulation     UV, Thermo‐cure, OCA Molded Material    ABS, PC, PMMA

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Printed Electronics, IME (in‐mold‐electronics), Wearable Electronics, Capacitive Sensors, e‐PaperDisplay modules, and Membrane Keypad assemblies. We specialize in high‐density silkscreenprinting process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper, Glass, etc.Conductors can be printed by silver, Ag/AgCl, copper, carbon, silver nano‐wire, CNT, PEDOT. Weprovide high‐mix volume productions as well as quick‐turn prototype service.

Alliance Corporation is a total solutions provider for design, manufacturing, and assembly of

Page 6: High-Density Multi-Layer Screen-Print Circuits...We specialize in high‐density silkscreen printing process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper,

Printed Conductors on Fabricsin Healthcare Applications

Product Features: Durable, Reliable, Light‐weight ! Conductors printed by silver, carbon inks Carbon switch contact Low resistance Volume resistance < 150 Ω/ □

Material Options: Substrate      men‐made fiber, cotton, non‐woven fabric,  woven‐fabric Conductor    Ag, Ag/Cl, Carbon Insulation     Clear insulation

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Printed Electronics, IME (in‐mold‐electronics), Wearable Electronics, Capacitive Sensors, e‐PaperDisplay modules, and Membrane Keypad assemblies. We specialize in high‐density silkscreenprinting process using various kinds of substrate materials, like PI, PET, PC, Fabric, Paper, Glass, etc.Conductors can be printed by silver, Ag/AgCl, copper, carbon, silver nano‐wire, CNT, PEDOT. Weprovide high‐mix volume productions as well as quick‐turn prototype service.

Alliance Corporation is a total solutions provider for design, manufacturing, and assembly of