high density and low cost approach for the pcb of
TRANSCRIPT
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High Density and Low Cost Approachfor the PCB of semiconductor tester
Takehisa SakuraiHitachi Chemical Co. America, Ltd.
Masahiro KatoHitachi Chemical Co. Ltd.
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Contents
1. Technical trend for PCB2. MWB technology3. Hybrid MWB for advanced PCB4. Summary
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Technical trend for testing
Speed of electric device is getting higher
・ High Density ;
・ High Speed ;
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More signal is required- increasing in Pin count- Pair drive for High speed signal
Testing system becomes complicated andvarious components to be required
- pin count of comps. increased and pin pitchbecome narrow due to comps. downsizing
・ Fine Pattern ;
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Conflicting PCB Requirements
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High Speed
High Density
LowerCost
Trace width
Material
Finepattern
Suitable for MWB Suitable for HDI P/E
Suitable for standard P/E
Routing density / Pin
Yield
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*MWB is a PCB which replaces etched signaltraces with copper wires
*Signal lines are able tocross over each otherbecause copper wire isinsulated with resin coating.
MWB technology
X-section
Adhesive Layer
Insulation Layer(Polyimide)
Conductor Wire (Cu)
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Actual wiring operation
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Print and Etch (P/E) MWB
Signal LayerCAM Image
Index # of signalsper layer
12.5
* Average based on achievements(convert fm P/E to MW)
Multi-Wire has abilities to,- Route 2.5 times of signals than P/E PCB into one layer.- Increase total # of routed signals in PCB.
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High Density Wiring
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~ 500 DUT ~750 DUT ~ 1500 DUT~ 1000 DUT
MWB - High signal capacity
3k 6k 9k 12k 15k 18k 21k
24 (34)
30 (45)
36 (56)
42 (67)
48 (78)
MWB (P/E)
54 (89)
Laye
r Cou
nt
# of Signal Nets24k
60 (100)
0.065 wire
0.080 wireP/E
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1.25mm 1.25mm
1.0mm1.0mm
Based on Achievements for Probe Card PCB
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Item Unit P/E0.5oz HVLP MWB
Material - FX-2(s) Dk3.6
I-671Dk3.6*
PCB Thickness mm 6.2Drill Dia. (Dh) mm 0.25Pad Dia. (Dp) mm 0.40 -Line width (L) mm 0.080 0.065Space L-L (SL) mm 0.080 0.113Space P-L (SP) mm 0.080 -
Resistance Ω/m 11.9 5.3Crosstalk % 9.8 2.5
Attenuation@3GHz dB -4.9 -4.6
Dh L
SlSpDp
0.8
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Design study for pair drive (1)
* Nominal value for MWB structure
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Print and Etch (P/E)
10um
Multi-Wire (MW)Formed by Die DrawingFormed by Etching Process
Comparison of Signal Shape
Diamond Die
10um
P/E0.08mm, 0.5oz Compared item MW
0.065mm
1X-section size index
Low resistance (Low attenuation) 2.3
+/- 0.010mmTolerance of Conductor Width
Easy impedance control +/- 0.003mm
~ 10umConductor Surface Roughness
Low skin effect , Low attenuationin high frequency
~ 0.5um
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Item P/E MWBCharacteristic
impedance (Zo) Differential 100Ω Differential 100Ω
Base material FX-2(s) (Dk:3.6) I-671 (Dk:3.6*)Line width 0.080mm
0.065mmLine thickness 0.018mm
Structure
H 1.485mm 0.550mm (63% reduced)
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Design study for pair drive (2)
MWB can reduce total thickness with keeping high routing density
H H 0.178mm0.160mm0.210mm
0.285mm
* Nominal value for MWB structure
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P/E 0.5oz
MWB1
2
3
4
5
00.04 0.06 0.08 0.12 0.160.10 0.14
Signal Line Resistance comparison
Line width or Wire diameter (mm)
DC
Res
ista
nce
(Ω)
@ 3
00m
m
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Cross-talk (Backward) Comparison
(Condition) L : 300mm, Z0 : 50Ω, Rise Time : 35psLine Pitch (mm)
Bac
kwar
d C
ross
talk
(%)
2
4
6
8
10
0100 150 200 250
P/E 0.5oz
MWB Φ0.065
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Attenuation = Dielectric Loss (Dk, Df) + Conductor Loss (Re)
Cu Foil type
Material
Trace
Mid-RangeHE-679G
FR4E-679
High-endFX-2(s)
Line width = 0.08mm, 0.5oz Foil Wire diameter = 0.065mmStandard VLP HVLP
0
-2
-4
-6
-8
-10Atte
nuat
ion@
3GH
z, d
B/3
00m
m3GHz Signal attenuation
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P/E
Dielectric LossConductor Loss
MWB
StandardI-671MWB
Mid-RangeHE-679G
MWB
High-endFX-2(s)MWB
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Summary of MWB technology• Signal Density per layer of MWB is 2.5 times
higher than P/E PCB by using cross over wires.
• Low resistance, Low crosstalk characteristics of MWB bring better signal integrity for high speed application.
• Compared with P/E PCB, MWB can reduce a insulation thickness with keeping high density routing and high electrical performance.
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Hybrid MWB for advanced PCB
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Routing density / Pin
Target for Hybrid MWB
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High Speed
High Density
LowerCost
Finepattern
Suitable for MWB
Suitable for standard P/E
Trace width
Material
Yield
GOAL:Bridge the gap
between conflicting PCB
requirements with the
development of Hybrid MWB
Suitable for HDI P/E
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Application field for Hybrid MWB
Super High-endProbe card
10
20
30
40
50
100
High-endTester, Probe card, Server
Tester, Server, Router
100 8075
65 50
Laye
r cou
nt
Line width (μm)
MWB + P/E
P/E PCB+ Material Hybrid
Advanced MWB
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Target area for Hybrid MWB
19Signal Capacity Index
100
125
150
100 200 300
Cos
t Ind
ex
P/E**
150 250
MWB
MWB + P/E
175A-MWB*
** Print and Etch PCB with Low Dk,Df material* Advanced MWB
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Material Hybrid
SignalCore:FX-2(S)Prepreg:E-679
Power/GNDCore:E-679Prepreg:E-679
-25
-20
-15
-10
-5
0 1 2 3 4 5 6
Core : FX-2(S)Prepreg :E-679
Core :HE-679GPrepreg :HE-679G
Core :E-679Prepreg :E-679
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Power/GNDCore:E-679Prepreg:E-679
Frequency, GHz
Atte
nuat
ion,
dB
• Lower Dk, Df material for high speed signal layers• Conventional FR-4 (high Dk, Df) for Power / GND layers
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• MW for critical signals (high speed, shortest, equal length, etc.)• P/E for other signal layers (DC signal, etc.)• P/E for Power / GND layers
MWB + P/E Hybrid (e.g. 1)
Layer Type MWBMWB + P/E Hybrid
e.g. 1
Power/GND
I-671 E-679
CriticalSignal
2L - MW
I-671
2L - MW
I-671 orHE-679G or
FX-2(s)
OtherSignal
4L- MW
I-67110L- P/E
E-679
MW
P/E
P/E
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Layer Type MWBMWB + P/E Hybrid
e.g. 2
Power/GND
I-671 I-671
CriticalSignal
2L - MW
I-6712 wires / pin
6L- P/EFX-2(S)
1 trace / pin
OtherSignal
4L- MW
I-6712 to 5 wires/ pin
4L- MW
I-6712 to 5 wires/pin
MW
P/E
P/E
• P/E with lower Dk, Df material for critical signals• Wider trace (lower density routing) is also applicable to
improve electrical performance. -> Routing density decreases, However, MWB can cover it.
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MWB + P/E Hybrid (e.g. 2)
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P/E Unit MW unit
・P/E unit and MW unit Lamination
・Drilling・Plating・Outer Layer Formation・Resist and Screen Printing・External form processing・Inspection
Enlargeof wire joint
Hybrid MWB process flow
Power/GND Signal
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Each unit have different CTE (Coefficient of Thermal Expansion) .Key technologies which control CTE-related problem are required.
InsulatedWire
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Key tech. (1) - Optimized stack up -Concern : Bow / TwistKey tech.: Optimized (Symmetrical) stack up
MW unit
MW unit
MW unit
P/E
P/E
MW unit
P/E
P/E
MW unit
MW unit
P/E2
P/E1
P/E2
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MWB MWB + P/E (e.g.1) MWB + P/E (e.g.2)
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- Throwing Power *
Key tech. (2) - Electroless Cu Plating -
ElectrolyticΦ0.30
ElectrolessΦ0.30
A
B
Electroless Electrolytict 2.4 t 4.3 t 2.4 t 4.3
60
70
80
90
100
Thro
win
g P
ower
,%
Φ0.20 Φ0.25 Φ0.30 Φ0.70
*Throwing power =Plating thickness in the hole (B) / Plating thickness on the surface (A)25
Concern : Plated through hole reliability Key tech.: Uniform (High throwing power) plating by electroless Cu plating
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Reliability for Hybrid PCBs
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Hybrid MWB with electroless Cu plating has good reliability.Test condition: 125 /30min. ⇔ -65 /30min.PCB thickness : t6.35mm,Drill Diameter : Φ0.30mm
Res
ista
nce
Cha
nge
Rat
io, %
Number of Test Cycle
0 100 200 300
-10
10
02468
-8-6-4-2
Upper Limitation
Lower Limitation
FX-2(s)+ E679 Hybrid
MWB + P/E Hybrid
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“A-MWB” Further advanced approach
MWB
Example for Sub Unit
Item e.g. 1 e.g. 2
PCBType
P/E HDI or P/E(Pitch converter)
MWB
FeatureAssembly for Narrow Pitch
Comps.
Further more High Density
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SubUnit
- Assembly for Narrow Pitch Comps. - Further more High Density ( Addition of DUT count )
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Summary- Application of MWB provides one of the best
solution for Higher density and Higher speed PCB.
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- Hybrid PCB technology provides advancedcharacteristics.
MWB + P/E Hybrid structure providescost- effective solution.
A-MWB Hybrid structure is a further advancedapproach for super high density PCB.
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Thank You!
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