high-current, high-performance drmos power modulemosfet. these pins are used for zero cross...

AOZ5516QI-02High-Current, High-Performance

DrMOS Power Module

General DescriptionThe AOZ5516QI-02 is a high efficiency synchronousbuck power stage module consisting of two asymmetricalMOSFETs and an integrated driver. The MOSFETs areindividually optimized for operation in the synchronousbuck configuration. The High-Side MOSFET is optimizedto achieve low capacitance and gate charge for fastswitching with low duty cycle operation. The Low-SideMOSFET has ultra low ON resistance to minimizeconduction loss. The compact 5mm x 5mm QFNpackage is optimally chosen and designed to minimizeparasitic inductance for minimal EMI signature.

The AOZ5516QI-02 uses PWM and/or FCCM input foraccurate control of the power MOSFETs switchingactivities, is compatible with 5V (CMOS) logic andsupports Tri-State PWM.

A number of features are provided making theAOZ5516QI-02 a highly versatile power module. Thebootstrap diode is integrated in the driver. The Low-SideMOSFET can be driven into diode emulation mode toprovide asynchronous operation and improve light-loadperformance. The pin-out is also optimized for lowparasitics, keeping their effects to a minimum.

Features 4.5V to 25V power supply range 4.5V to 5.5V driver supply range 55A continuous output current

- Up to 80A with 10ms on pulse- Up to 120A with 10us on pulse

Up to 2MHz switching operation 5V PWM / Tri-State input compatible Under-Voltage LockOut protection FCCM pin control for Shutdown / Diode Emulation /

CCM operation Standard 5mm x 5mm QFN-31L package

Applications Notebook computers Memory and graphic cards VRMs for motherboards Point of load DC/DC converters Video gaming console

Typical Application Circuit

HS Driver

VIN

BOOT

CBOOT CIN

VSWH L1 VOUT

PWMCOUT

GL

VCC PGND

PGND5V

PWMController

Driver Logic and

Delay

LS Driver

CPVCC

4.5V ~ 20V

FCCM

PVCC

AGND

CVCC

PHASE

THWN

VCC

Rev. 2.0 May 2020 www.aosmd.com Page 1 of 17

AOZ5516QI-02

Ordering Information

AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.

Pin Configuration

QFN5x5-31L(Top View)

Part Number Junction Temperature Range Package EnvironmentalAOZ5516QI-02 -40°C to +150°C QFN5x5-31L RoHS

31 30 29 28 27 25 24

1

2

23

3

PWM

22

4

PGND

21

5

10 11 12 13 14 15

FCCM

VCC

NC

PHASE

VIN

VIN

VIN

PGN

D

PGN

D

PGN

D

PGN

D

VSWH

VSWH

VSWH

VSWH

VSW

H

GL

PGN

D

PVC

C

THW

N

NC

VIN

GL

6

7

8

BOOT

VIN

NC 20

19

18

17

16 VSWH

VSWH

VSWH

VSWH

9

26

PGND

VSW

H

VSW

H


wwww.aosmd.com/web/rohs_compliant.jsphttp://www.aosmd.com/media/AOSGreenPolicy.pdfhttp://www.aosmd.com/media/AOSGreenPolicy.pdfhttp://www.aosmd.com/media/AOSGreenPolicy.pdf

AOZ5516QI-02

Pin Description

Pin Number Pin Name Pin Function

1 PWM PWM input signal from the controller IC. This input is compatible with 5V and Tri-State logic level.

2 FCCMContinuous conduction mode of operation is allowed when FCCM = High.Discontinuous mode is allowed and diode emulation mode is active when FCCM = Low.High impedance on the input of FCCM will shutdown both High-Side and Low-Side MOSFETs.

3 VCC 5V Bias for Internal Logic Blocks. Ensure to position a 1µF MLCC directly between VCC and PGND (Pin 28).4 NC Internally connected to PGND paddle. It can be left floating (No Connect) or tied to PGND.

5 BOOT High-Side MOSFET Gate Driver supply rail. Connect a 100nF ceramic capacitor between BOOT and the PHASE (Pin 7).6 NC Internally connected to VIN paddle. It can be left floating (no connect) or tied to VIN.7 PHASE This pin is dedicated for bootstrap capacitor AC return path connection from BOOT (Pin 5).

8, 9, 10, 11 VIN Power stage High Voltage Input (Drain connection of High-Side MOSFET).12, 13, 14, 15 PGND Power Ground pin for power stage (Source connection of Low-Side MOSFET).16, 17, 18, 19, 20, 21, 22, 23,

24, 25, 26VSWH

Switching node connected to the Source of High-Side MOSFET and the Drain of Low-Side MOSFET. These pins are used for Zero Cross Detection and Anti-Overlap Control as well as main inductor terminal.

27 GL Low-Side MOSFET Gate connection. This is for test purposes only.

28 PGND Power Ground pin for High-Side and Low-Side MOSFET Gate Drivers. Ensure to connect 1µF directly between PGND and PVCC (Pin 29).

29 PVCC 5V Power Rail for High-Side and Low-Side MOSFET Drivers. Ensure to position a 1µF MLCC directly between PVCC and PGND (Pin 28).

30 THWN Thermal warning indicator. This is an open-drain output. When the temperature at the driver IC die reaches the Over Temperature Threshold, this pin is pulled low.31 NC No Connect


AOZ5516QI-02

Functional Block Diagram

VSWH

ZCD

PVCC

GLPGND

DCM/CCMDetect andTri-State

REF/BIASUVLO

Level Shifter

HS Gate Driver

SequencingAnd

Propagation Delay Control

HS

Control Logic

DriverLogic

HS GatePHASE Check

ZCD Detect

LS

PWMTri-State

Logic

PWM

Tri-StateLS Gate

LS Gate Driver

FCCM

PWM

VINBOOTVCC

PHASE

PVCC

ThermalMonitor

THWN AGND

Boot

VCC


AOZ5516QI-02

Absolute Maximum RatingsExceeding the Absolute Maximum ratings may damagethe device.

Notes:1. Peak voltages can be applied for 10ns per switching cycle. 2. Peak voltages can be applied for 20ns per switching cycle.3. Devices are inherently ESD sensitive, handling precautions are

required. Human body model rating: 1.5 in series with 100pF.

Recommended Operating ConditionsThe device is not guaranteed to operate beyond theMaximum Recommended Operating Conditions.

Parameter RatingLow Voltage Supply (VCC, PVCC) -0.3V to 7VHigh Voltage Supply (VIN) -0.3V to 30VControl Inputs (PWM, FCCM, THWN)

-0.3V to (VCC+0.3V)

Bootstrap Voltage DC(BOOT-PGND)

-0.3V to 35V

Bootstrap Voltage Transient(1) (BOOT-PGND)

-8V to 40V

Bootstrap Voltage DC (BOOT-PHASE/VSWH)

-0.3V to 7V

BOOT Voltage Transient(1) (BOOT-PHASE/VSWH)

-0.3V to 9V

Switch Node Voltage DC(PHASE/VSWH)

-0.3V to 30V

Switch Node Voltage Transient(1) (PHASE/VSWH)

-8V to 38V

Low-Side Gate Voltage DC(GL)

(PGND-0.3V) to(PVCC+0.3V)

Low-Side Gate Voltage Tran-sient(2) (GL)

(PGND-2.5V) to(PVCC+0.3V)

VSWH Current DC 55AVSWH Current 10ms Pulse 80AVSWH Current 10us Pulse 120AStorage Temperature (TS) -65°C to +150°CMax Junction Temperature (TJ) 150°CESD Rating(3) 2kV

Parameter RatingHigh Voltage Supply (VIN) 4.5V to 25VLow Voltage / MOSFET Driver Supply (VCC, PVCC)

4.5V to 5.5V

Control Inputs(PWM, FCCM, THWN)

0V to VCC

Operating Frequency 200kHz to 2MHz


AOZ5516QI-02

Electrical Characteristics(4)

TJ = 0°C to 150°C, VIN = 12V, VOUT = 1V, PVCC = VCC = 5V, unless otherwise specified. Min/Max values are guaranteed by test, design or statistical correlation.

Symbol Parameter Conditions Min. Typ. Max. Units

GENERALVIN Power Stage Power Supply 4.5 25 VVCC Low Voltage Bias Supply PVCC = VCC 4.5 5.5 V

RJC(4)

Thermal ResistanceReference to High-Side MOSFET temperature rise

2.5 °C / W

RJA (4) Freq = 300kHz. AOS Demo Board 12.5 °C / W

INPUT SUPPLY AND UVLOVCC_UVLO Undervoltage LockOut

VCC Rising 3.5 3.9 VVCC_HYST VCC Hysteresis 400 mV

IVCC Control Circuit Bias Current

FCCM = FloatingPWM = Floating 3 µA

FCCM = 5VPWM = Floating 170 µA

FCCM = 0VPWM = Floating 180 µA

PWM INPUTVPWM_H Logic High Input Voltage 4.2 V

VPWM_L Logic Low Input Voltage 0.72 VIPWM_SRC PWM Pin Input Current

PWM = 0V -200 µAIPWM_SNK PWM = 5V 200 µAVPWM_TRI PWM Tri-State Window 1.6 3.4 V

FCCM INPUTVFCCM_H Logic High Input Voltage 3.9 VVFCCM_L Logic Low Input Voltage 1.1 V

IFCCM_SRC FCCM Pin Input CurrentFCCM = 0V -50 µA

IFCCM_SNK FCCM = 5V 50 µAVFCCM_TRI FCCM Tri-State Window 2.0 3.0 VtPS4_EXIT PS4 Exit Latency 5 15 µs

GATE DRIVER TIMINGtPDLU PWM to HS Gate PWM: H L, VSWH: H L 30 nstPDLL PWM to LS Gate PWM: L H, GL: H L 25 nstPDHU LS to HS Gate Deadtime GL: H L, VSWH: L H 15 nstPDHL HS to LS Gate Deadtime VSWH: H 1V, GL: L H 13 ns

tTSSHD Tri-State Shutdown DelayPWM: L VTRI, GL: H L andPWM: H VTRI, VSWH: H L

150 ns

tTSEXIT Tri-State Propagation DelayPWM: VTRI H, VSWH: L H PWM: VTRI L, GL: L H

45 ns

tLGMIN LS Minimum On Time FCCM = 0V 350 ns


AOZ5516QI-02

Electrical Characteristics(4) (Continued) TJ = 0°C to 150°C, VIN = 12V, VOUT = 1V, PVCC = VCC = 5V, unless otherwise specified. Min/Max values areguaranteed by test, design, or statistical correlation.

Notes:4. All voltages are specified with respect to the corresponding AGND pin.5. Characterization value. Not tested in production.

Symbol Parameter Conditions Min. Typ. Max. Units

THERMAL NOTIFICATION(5)

TJTHWN Junction Thermal Threshold Temperature Rising 135 °CTJHYST Junction Thermal Hysteresis 20 °CVTHWN THWN Pin Output Low ITHWN = 0.5mA 60 mVRTHWN THWN Pull-Down Resistance 120 Ω


AOZ5516QI-02

Timing Diagrams

Figure 1. PWM Logic Input Timing Diagram

Figure 2. PWM Tri-State Hold Off and Exit Timing Diagram

VPWMH

tPDLL

90%

1V 1V

90%

1V

tPDHU

tPDLU

tPDHL

PWM

GL

VSWH1V

VPWML

tTSSHD

tPTS

tTSSHD

tPTS

tTSSHD

tPTS

tTSSHD

tPTS

PWM

GL

GH



AOZ5516QI-02

Typical Performance CharacteristicsTA = 25°C, VIN = 12V, VOUT = 1V, PVCC = VCC = 5V, unless otherwise specified.

Figure 3. Efficiency vs. Output Current, VOUT = 1.8V Figure 4. Power Loss vs. Output Current, VOUT = 1.8V

Figure 5. Efficiency vs. Output Current, VOUT = 1.0V Figure 6. Power Loss vs. Output Current, VOUT = 1.0V

Figure 7. PWM Threshold vs. Temperature Figure 8. FCCM Threshold vs. Temperature

VIN=12V, Vo=1.8V, Fsw=600k

VIN=12V, Vo=1.8V, Fsw=750kVIN=19V, Vo=1.8V, Fsw=600k


Output Current (A)

5 10 15 20 25 30 35 40

Effic

ienc

y (%

)

96%

94%

92%

90%

88%

86%

84%

82%

80%45 50





Output Current (A)

5 10 15 20 25 30 35

Pow

er L

oss

(W)

16

14

12

10

8

6

4

2

040 45 50

VIN=12V, Vo=1V, Fsw=600k




Output Current (A)

5 10 15 20 25 30 35 40

Effic

ienc

y (%

)

94%

92%

90%

88%

86%

84%

82%

80%

78%45 50


VIN=12V, Vo=1V, Fsw=750kVIN=19V, Vo=1V, Fsw=600k


Output Current (A)

5 10 15 20 25 30 35

Pow

er L

oss

(W)

16

14

12

10

8

6

4

2

040 45 50

PWM

Vol

tage

(V)

Temperature (°C)-50 -25 0 25 50 75 100 125 150

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

Logic High Threshold

Tri-state Window

Logic Low Threshold

FCC

M V

olta

ge (V

)

Temperature (°C)-50 -25 0 25 50 75 100 125 150

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

Shutdown to CCM

CCM to Shutdown

Shutdown to DCM

DCM to Shutdown


AOZ5516QI-02

Typical Performance CharacteristicsTA = 25°C, VIN = 12V, VOUT = 1V, PVCC = VCC = 5V, unless otherwise specified.

Figure 9. UVLO (VCC) Threshold vs. Temperature Figure 10. PWM Threshold vs. VCC Voltage

Figure 11. High-Side MOSFET SOA Figure 12. Low-Side MOSFET SOA

VCC

Vol

tage

(V)

Temperature (°C)-50 -25 0 25 50 75 100 125 150

3.7

3.6

3.5

3.4

3.3

3.2

3.1

3.0

2.9

Rising Threshold

Falling Threshold

PWM

Vol

tage

(V)

VCC Voltage (V)4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

Logic High Threshold

Logic Low Threshold

Tri-state Window

0.0

0.1

1.0

10.0

100.0

1000.0

10000.0

0.01 0.1 1 10 100

Dra

in C

urre

nt, ID

(A)

Drain - Source Voltage, VDS (V)

10µsRDS(ON) limited

IDM limited

10ms

TA = 25°C0.0

0.1

1.0

10.0

100.0

1000.0

10000.0

0.01 0.1 1 10 100

Dra

in C

urre

nt, I

D(A

)

Drain - Source Voltage, VDS (V)

10µsRDS(ON) limited

IDM limited

10ms

TA = 25°C

AOZ5516QI-02


Application InformationAOZ5516QI-02 is a fully integrated power moduledesigned to work over an input voltage range of 4.5V to25V with a separate 5V supply for gate drive and internalcontrol circuitry. The MOSFETs are individuallyoptimized for efficient operation on both High-Side andLow-Side for a low duty cycle synchronous buckconverter. High current MOSFET Gate Drivers areintegrated in the package to minimize parasitic loopinductance for optimum switching efficiency.

Powering the Module and the Gate DrivesAn external supply PVCC = 5V is required for driving theMOSFETs. The MOSFETs are designed with optimallycustomized gate thresholds voltages to achieve the mostadvantageous compromise between high switchingspeed and minimal power loss. The integrated gate driveris capable of supplying large peak current into the Low-Side MOSFET to achieve fast switching. A ceramicbypass capacitor of 1F or higher is recommended fromPVCC (Pin 29) to PGND (Pin 28). The control logicsupply VCC (Pin 3) can be derived from the gate drivesupply PVCC (Pin 29) through an RC filter to bypass theswitching noise (See Typical Application Circuit).

The boost supply for driving the High-Side MOSFET isgenerated by connecting a small capacitor (100nF)between the BOOT (Pin 5) and the switching nodePHASE (Pin 7). It is recommended that this capacitorCBOOT should be connected to the device across Pin 5and Pin 7 as closely as possible. A bootstrap switch isintegrated into the device to reduce external componentcount. An optional resistor RBOOT in series with CBOOTbetween 1Ω to 5Ω can be used to slow down the turn onspeed of the High-Side MOSFET to achieve both shortswitching time and low VSWH switching node spikes atthe same time.

Under-voltage LockOutAOZ5516QI-02 starts up to normal operation when VCCrises above the Under-Voltage LockOut (UVLO)threshold voltage. The UVLO release is set at 3.5Vtypically. Since the PWM control signal is provided froman external controller or a digital processor, extra cautionmust be taken during start up. AOZ5516QI-02 must bepowered up before PWM input is applied.

Normal system operation begins with a soft startsequence by the controller to minimize in-rush currentduring start up. Powering the module with a full duty cyclePWM signal may lead to many undesirableconsequences due to excessive power. AOZ5516QI-02provides some protections such as UVLO and thermalmonitor. For system level protection, the PWM controllershould monitor the current output and protect the load underall possible operating and transient conditions.

Input Voltage VINAOZ5516QI-02 is rated to operate over a wide input rangefrom 4.5V to 25V. For high current synchronous buckconverter applications, large pulse current at highfrequency and high current slew rates (di/dt) will be drawnby the module during normal operation. It is stronglyrecommended to place a bypass capacitor very close tothe package leads at the input supply (VIN). Both X7R orX5R quality surface mount ceramic capacitors aresuitable.

The High-Side MOSFET is optimized for fast switching byusing a low gate charge (QG) device. When the module isoperated at high duty cycle ratio, conduction loss from theHigh-Side MOSFET will be higher. The total power loss forthe module is still relatively low but the High-SideMOSFET higher conduction loss may have highertemperature. The two MOSFETs have their own exposedpads and PCB copper areas for heat dissipation. It isrecommended that worst case junction temperature bemeasured for both High-Side MOSFET and Low-SideMOSFET to ensure that they are operating within SafeOperating Area (SOA).

PWM InputAOZ5516QI-02 is compatible with 5V (CMOS) PWMlogic. Refer to Figure 1 for PWM logic timing andpropagation delays diagram between PWM input and theMOSFET gate drives.

The PWM is also compatible with Tri-State input. Whenthe PWM output from the external PWM controller is inhigh impedance or not connected, both High-Side andLow-Side MOSFETs are turned off and VSWH is in highimpedance state. Table 1 shows the thresholds level forhigh-to-low and low-to-high transitions as well as Tri-State window.

There is a Holdoff Delay between the correspondingPWM Tri-State signal and the MOSFET gate drivers toprevent spurious triggering of Tri-State mode which maybe caused by noise or PWM signal glitches. The HoldoffDelay is typically 150ns.

Table 1. PWM Input and Tri-State Thresholds

Note: See Figure 2 for propagation delays and Tri-State window.

Thresholds VPWMH VPWML VTRIH VTRILAOZ5516QI-02 4.20V 0.72V 1.60V 3.40V

AOZ5516QI-02

Diode Mode Emulation of Low-Side MOSFET (FCCM)AOZ5516QI-02 can be operated in the diode emulationor pulse skipping mode using FCCM (Pin 2). Thisenables the converter to operate in asynchronous modeduring start up, light load or under pre-bias conditions.

When FCCM is high, the module will operate inContinuous Conduction Mode (CCM). The Driver logicwill use the PWM signal and generate both the High-Sideand Low-Side complementary gate drive outputs withminimal anti-overlap delays to avoid cross conduction.

When FCCM is low, the module can operate inDiscontinuous Conduction Mode (DCM). The High-SideMOSFET gate drive output is not affected but Low-SideMOSFET will enter diode emulation mode. See Table 2for the truth table for PWM and FCCM inputs.

Table 2. Control Logic Truth Table

Gate DrivesAOZ5516QI-02 has an internal high current high speeddriver that generates the floating gate driver for the High-Side MOSFET and a complementary driver for the Low-Side MOSFET. An internal shoot through protectionscheme is implemented to ensure that both MOSFETscannot be turned on at the same time. The operation ofPWM signal transition is illustrated as below.

1) PWM from logic Low to logic High

When the falling edge of Low-Side Gate Driver output GLgoes below 1V, the blanking period is activated. After apre-determined value (tPDHU), the complementary High-Side Gate Driver output GH is turned on.

2) PWM from logic High to logic Low

When the falling edge of switching node VSWH goesbelow 1V, the blanking period is activated. After a pre-determined value (tPDHL), the complementary Low-SideGate Driver output GL is turned on.

This mechanism prevents cross conduction across theinput bus line VIN and PGND. The anti-overlap circuitmonitors the switching node VSWH to ensure a smoothtransition between the two MOSFETs under any loadtransient conditions.

Thermal Warning (THWN)The driver IC temperature is internally monitored and athermal warning flag at THWN (Pin 30) is asserted if itexceeds 150°C. This warning flag is reset when thetemperature drops back to 120°C. THWN is an opendrain output that is pulled to AGND to indicate an over-temperature condition. It should be connected to VCCthrough a resistor for monitoring purpose. The device willnot power down during the over temperature condition.

FCCM PWM GH GL

L L L H if IL > 0AL if IL < 0A

L H H LH L L HH H H LL Tri-State L LH Tri-State L L

Tri-State X L L


AOZ5516QI-02

PCB Layout GuidelinesAOZ5516QI-02 is a high current module rated foroperation up to 2MHz. This requires high switchingspeed to keep the switching losses and devicetemperatures within limits. An integrated gate driverwithin the package eliminates driver-to-MOSFET gatepad parasitic of the package or on PCB.

To achieve high switching speeds, high levels of slewrate (dv/dt and di/dt) will be present throughout thepower train which requires careful attention to PCBlayout to minimize voltage spikes and other transients.As with any synchronous buck converter layout, thecritical requirement is to minimize the path of the primaryswitching current loop formed by the High-Side MOSFET,Low-Side MOSFET, and the input bypass capacitor CIN.The PCB design is greatly simplified by the optimizationof the AOZ5516QI-02 pin out. The power inputs of VINand PGND are located adjacent to each other and theinput bypass capacitors CIN should be placed as closeas possible to these pins. The area of the secondaryswitching loop is formed by Low-Side MOSFET, outputinductor L1, and output capacitor COUT is the nextcritical requirement. This requires second layer or “Inner1” to be the PGND plane. VIAs should then be placednear PGND pads.

While AOZ5516QI-02 is a highly efficient module, it stilldissipates a significant amount of heat under high powerconditions. Special attention is required for thermaldesign. MOSFETs in the package are directly attached toindividual exposed pads (VIN and PGND) to simplifythermal management. Both VIN and VSWH pads shouldbe attached to large areas of PCB copper. Thermal reliefpads should be placed to ensure proper heat dissipationto the board. An inner power plane layer dedicated toVIN, typically the high voltage system input, is desirableand VIAs should be provided near the device to connectthe VIN pads to the power plane. Significant amount ofheat can also be dissipated through multiple PGND pins.A large copper area connected to the PGND pins inaddition to the system ground plane through VIAs willfurther improve thermal dissipation.

As shown on Figure. 13, the top most layer of the PCBshould comprise of wide and exposed copper area forthe primary AC current loop which runs along VIN padoriginating from the input capacitors C10, C11, and C12that are mounted to a large PGND pad. They serve asthermal relief as heat flows down to the VIN exposed padthat fans out to a wider area. Adding VIAs will only helptransfer heat to cooler regions of the PCB board throughthe other layers beneath but serve no purpose to ACactivity as all the AC current sees the lowest impedanceon the top layer only.

Figure 13. Top Layer of Demo Board, VIN, VSWH and PGND Copper Pads

As the primary and secondary (complimentary) ACcurrent loops move through VIN to VSWH and throughPGND to VSWH, large positive and negative voltagespikes appear at the VSWH terminal which are causedby the large internal di/dt produced by the packageparasitic. To minimize the effects of this interference atthe VSWH terminal, at which the main inductor L1 ismounted, size just enough for the inductor to physicallyfit. The goal is to employ the least amount of copper areafor this VSWH terminal, only enough so the inductor canbe securely mounted.

To minimize the effects of switching noise coupling to therest of the sensitive areas of the PCB, the area directlyunderneath the designated VSWH pad or inductorterminal is voided and the shape of this void is replicateddescending down through the rest of the layers. Refer toFigure 14.

Figure 14. Bottom Layer of PCB

Positioning VIAs through the landing pattern of the VINand PGND thermal pads will help quickly facilitate thethermal build up and spread the heat much more quickly


AOZ5516QI-02

towards the surrounding copper layers descending fromthe top layer. (See RECOMMENDED LANDINGPATTERN AND VIA PLACEMENT section).

The exposed pads dimensional footprint of the 5x5 QFNpackage is shown on the package dimensions page. Foroptimal thermal relief, it is recommended to fill the PGNDand VIN exposed landing pattern with 10mil diameterVIAs. 10mil diameter is a commonly used VIA diameteras it is optimally cost effective based on the tooling bitused in manufacturing. Each via is associated with a20mil diameter keep out. Maintain a 5mil clearance(127um) around the inside edge of each exposed pad incase of solder overflow, which could potentially short withthe adjacent exposed thermal pad.


AOZ5516QI-02

Package Dimensions, QFN5x5-31L

RECOMMENDED LAND PATTERN

UNIT: mmNOTECONTROLLING DIMENSION IS MILLIMETER.CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT.


AOZ5516QI-02

Tape and Reel Drawing, QFN5x5-31L


AOZ5516QI-02

1. Life support devices or systems are devices orsystems which, (a) are intended for surgical implant intothe body or (b) support or sustain life, and (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can bereasonably expected to result in a significant injury ofthe user.

2. A critical component in any component of a lifesupport, device, or system whose failure to perform canbe reasonably expected to cause the failure of the lifesupport device or system, or to affect its safety oreffectiveness.

LIFE SUPPORT POLICY

ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.

As used herein:

Part Marking

Part Number Code

Assembly Lot CodeYear Code & Week Code

AOZ5516QI-02(5mm x 5mm QFN)

B R 0 2

Y W L T

LEGAL DISCLAIMER

Applications or uses as critical components in life support devices or systems are not authorized. AOS does not assume any liability arising out of such applications or uses of its products. AOS reserves the right to make changes to product specifications without notice. It is the responsibility of the customer to evaluate suitability of the product for their intended application. Customer shall comply with applicable legal requirements, including all applicable export control rules, regulations and limitations.

AOS' products are provided subject to AOS' terms and conditions of sale which are set forth at:http://www.aosmd.com/terms_and_conditions_of_sale


high-current, high-performance drmos power modulemosfet. these pins are used for zero cross...

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