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HiALL

NC

TECHNICAL SPECIFICATION

~ Freedom of speech for smart machines ~

Note d’étude / Technical document : URD1 – OTL 5717.1 - 004 / 72589 Edition 2.4

HiAll NC TECHNICAL SPECIFICATION 2012-06-06 - page 2/39

Direction des Recherches et des Développements Etablissement de Rueil Malmaison - Rueil Malmaison R&D Center

NOTE D'ETUDE / TECHNICAL DOCUMENT

FICHE RECAPITULATIVE / SUMMARY SHEET

Ed Date

Date

Observations

Comments 0.0 2011/07/22 - Document creation 1.0 2011/09/05 - UART pins renamed for HiloNC3GPS compatibility

- Module thickness change - Board Footprint change - GLONASS available in standard configuration - Add GSM/GNSS antenna isolation requirement - Recommended stencil design change in TBD

2.0 2011/11/14 - add information about DTE/DCE convention (p8) - change module thickness to 2.7mm (p8, p34) - improve FLASH memory fir USER DATA to 1.5MB - UART-1 is full 8-pin UART (p15) - Improve GPIO number and mapping versus HiloNC3GPS (p17) - Add note “PIN ASSIGNMENT DEFINED BELOW APPLIES ONLY FROM HIALLNC B2 RELEASE” (p21) - Add SPI_IRQ, PPS, 2G_RF_IND signals (p24)

2.1 2011/12/05 - power consumption in GSM mode (p8, p25) - add ISO 16750, remove AECQ100 (p6) - GNSS channels (p9,p12) - clarification of EXT_SIM_DET signal use (p13) - module behaviour out of normal temperature range (p30)

2.2 2012/01/11 - SIM selection principle (p13) - MTBF calculation (p32) - mechanical tolerances (p33) - stencil design (p37) - reflow profile example (p38)

2.3 2012/05/14 - Type approval reference list update (p5,6) - Weight update (p9) - Bloc diagram change (p11) - Update GPS figures: power consumption, time to fix, CET, sensitivity (p9,p30) - Add PPS, GPS_LNA_EXT_EN and 2G_RF_IND information - ESD model changed (p35) - Module thickness tolerance changed (p36)

2.4 2012/06/06 - Update hot start TTFF & CET (p31)



Direction des Recherches et des Développements Etablissement de Rueil Malmaison - Rueil Malmaison R&D Center

SOMMAIRE / CONTENTS 1. INTRODUCTION ........................................................................................................................................................5

1.1 PRODUCT CONCEPT..................................................................................................................................................5 1.2 STANDARDS.............................................................................................................................................................5 1.3 TERMS AND ABBREVIATION.....................................................................................................................................7 1.4 CONVENTIONS.........................................................................................................................................................8 1.5 PRODUCT FEATURES OVERVIEW..............................................................................................................................9

2. HIALL NC BLOCK DIAGRAM & PINOUT.............................................................................................................11 3. FUNTIONAL DESCRIPTION & INTERFACES................. ..................................................................................13

3.1 ECALL ....................................................................................................................................................................13 3.2 GNSS....................................................................................................................................................................13

3.2.1 GNSS Main features .....................................................................................................................................13 3.2.2 Assistance data..............................................................................................................................................13

3.3 SIM CARD .............................................................................................................................................................14 3.3.1 Embedded SIM .............................................................................................................................................14 3.3.2 SIM card interface ........................................................................................................................................14 3.3.3 SIM CARD selection....................................................................................................................................15

3.4 AUDIO .................................................................................................................................................................15 3.4.1 Analog Audio ...............................................................................................................................................15 3.4.2 Digital audio .................................................................................................................................................15

3.5 DATA...................................................................................................................................................................16 3.5.1 Data services.................................................................................................................................................16 3.5.2 Main UART..................................................................................................................................................16 3.5.3 Second UART...............................................................................................................................................17 3.5.4 DATA/ COMMAND multiplexing...............................................................................................................17

3.6 SPARE I/O............................................................................................................................................................17 3.7 PWON ..................................................................................................................................................................18 3.8 RESET..................................................................................................................................................................18 3.9 ADC......................................................................................................................................................................18 3.11 PPS .......................................................................................................................................................................19 3.12 GPS_EXT_LNA_EN............................................................................................................................................19 3.13 BACKUP..............................................................................................................................................................19 3.14 VGPIO..................................................................................................................................................................19 3.15 POWER SUPPLIES .............................................................................................................................................20

4. PINOUT.......................................................................................................................................................................21 4.1 PIN LOCATION...................................................................................................................................................21 4.2 PIN ASSIGNMENTS.................................................................................................................................................22

5. ELECTRICAL SPECIFICATIONS.........................................................................................................................27 5.1 VBAT POWER SUPPLY...........................................................................................................................................27 5.2 VBAT CURRENT CONSUMPTION............................................................................................................................27 5.3 VGPIO..................................................................................................................................................................28 5.4 VBACKUP ..............................................................................................................................................................28 5.5 VSIM ....................................................................................................................................................................28 5.6 DIGITAL INTERFACES.............................................................................................................................................28 5.7 PWON ..................................................................................................................................................................29 5.8 RESET..................................................................................................................................................................29 5.9 SIM.......................................................................................................................................................................29 5.10 ADC......................................................................................................................................................................29 5.11 PPS .......................................................................................................................................................................30 5.12 ANALOG AUDIO SIGNALS.......................................................................................................................................30

5.12.1 Analog inputs................................................................................................................................................30 5.12.2 Analog outputs..............................................................................................................................................30

5.13 GSM PERFORMANCES .....................................................................................................................................30



5.14 GNSS PERFORMANCES....................................................................................................................................31 5.14.1 GNSS Sensitivity ..........................................................................................................................................31 5.14.2 GNSS Time To Fix and CET........................................................................................................................31

5.15 GSM ANTENNA CONNECTION............................................................................................................................32 5.15.1 Load mismatch..............................................................................................................................................32 5.15.2 Antenna matching network...........................................................................................................................32

5.16 GNSS ANTENNA CONNECTION...........................................................................................................................32 5.16.1 Emdedded filtering .......................................................................................................................................32 5.16.2 Antenna.........................................................................................................................................................32

5.17 EXTERNAL ANTENNA ISOLATION ...........................................................................................................................32 5.18 OUT OF NORMAL TEMPERATURE RANGE.......................................................................................................32

6. ESD ..............................................................................................................................................................................33 7. MTBF ..........................................................................................................................................................................33 8. MECHANICAL SPECIFICATIONS .......................................................................................................................34

8.1 DESCRIPTION.........................................................................................................................................................34 8.2 PHYSICAL DIMENSIONS..........................................................................................................................................34 8.3 DECOMPOSITION....................................................................................................................................................35 8.4 PIN OUTLINE DIMENSIONS ............................................................................................................................35 8.5 RECOMMENDED DESIGN.......................................................................................................................................36

8.5.1 Recommended footprint ...............................................................................................................................36 8.5.2 Recommended Stencil design.......................................................................................................................37

8.6 REFLOW PROFILE...................................................................................................................................................38 8.7 PACKAGING ...........................................................................................................................................................38 8.8 MSL......................................................................................................................................................................38 9.3 REFERENCES .....................................................................................................................................................39



1. INTRODUCTION This document describes the interfaces, features and performances of the SAGEMCOM HiAllNC M2M module.

1.1 PRODUCT CONCEPT The HiAllNC module is a GPRS module including a GPS & GLONASS feature and a SMT SIM card. The main target application is the automotive market, and is also dedicated for all M2M applications requiring cellular connectivity & GNSS location as tracking system, alarm, etc. Main characteristics can be summarized thereafter:

• LGA format for low profile design and mechanical robustness • Automotive qualification (ISO 16750 used as a guideline to qualify the module) • Scalability with HiLoNC-3GPS ( HSUPA & HSDPA LGA module) • inBand modem for PAN EUROPEAN eCall support • Analog & digital audio • GPS&GLONASS receiver • Virtual Machine embedded (Optional) to allow the customer to develop its own applications inside

the module As with other SAGEMCOM GSM/GPRS/EDGE/3G modules, HiAllNC has a full set of AT commands, that has been enriched with new features as GNSS and eCall.

1.2 STANDARDS This product, together with its evaluation board, has been approved and is in compliance with the directives and standards listed below: EU Directives 99/05/EC « Directive of the European Parliament and of the council of 9 March 1999 on radio

equipment and telecommunications terminal equipment and the mutual recognition of their conformity », in short referred to as R&TTE Directive 1999/5/EC

2004/108/EC Directive on electromagnetic compatibility 2006/95/EC « Directive on electrical equipment designed for use within certain voltage limits » (Low

Voltage Directive) 2002/95/EC RoHS Directive 95/94/EC Automotive EMC Directive

PTCRB/GCF conformance 3GPP TS 51.010-1 V10.0.0 (2012-03)

Digital cellular telecommunications system (Phase 2+); Mobile Station (MS) conformance specification; Part 1: Conformance specification

3GPP TS 51.010-2 V10.0.0 (2012-03)

Digital cellular telecommunications system (Phase 2+); Mobile Station (MS) conformance specification; Part 2: Protocol Implementation Conformance Statement (PICS) proforma specification

GCF-CC v3.45.1 (2012-03)

Global Certification Forum – Certification Criteria

NAPRD03 v5.10 (2012-01)

GSM N.A. Permanent Reference Document



CE

EN 301511 V9.0.2 (2003-03)

Global System for Mobile Communications (GSM); Harmonized EN for Mobile Stations in the GSM 900 and GSM 1800 Bands Covering Essential Requirements Under Article 3.2 of the R&TTE Directive (1999/5/EC)

EN 301489-1 V1.9.2 (2011-09)

Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements

EN 301489-3 V1.4.1 (2002-08)

Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 3: Specific conditions for Short-Range Devices (SRD) operating on frequencies between 9 kHz and 40 GHz

EN 301489-7 V1.3.1 (2005-11)

Electromagnetic Compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) Standard for Radio Equipment and Services; Part 7: Specific Conditions for Mobile and Portable Radio and Ancillary Equipment of Digital Cellular Radio Telecommunications Systems (GSM and DCS)

EN 60950-1 IEC 60950-1:2005/A1:2009 EN 60950-1:2006/A11:2009/A1:2010/A12:2011 Information technology equipment – safety- and general requirements

EN 300440-1 v1.6.1 (2012-08)

Electromagnetic compatibility and Radio spectrum Matters (ERM); Short range devices; Radio equipment to be used in the 1 GHz to 40 GHz frequency range; Part 1: Technical characteristics and test methods

EN 300440-2 V1.4.1 (2012-08)

Electromagnetic compatibility and Radio spectrum Matters (ERM); Short range devices; Radio equipment to be used in the 1 GHz to 40 GHz frequency range; Part 2: Harmonized EN under article 3.2 of the R&TTE Directive

FCC FCC Part 15B Subpart B - Radio frequency devices subpart B – Unintentional Radiators FCC Part 22H Cellular Radiotelephone Service; Subpart H: Cellular Radiotelephone Service FCC Part 24E Personal Communications Service; Subpart E: Broadband PCS. IC RSS-132 , Issue 2:2005

Cellular telephones employing new technologies operating in the 824-849 MHz and 869-894 MHz bands.

RSS-133, Issue 5:2009

2 GHz personal communications services

A-Tick

AS/ACIF S042.1 Requirements for connection to an air interface of a telecommunications network Part 1; General

AS/ACIF S042.3 Requirements for connection to an air interface of a Telecommunications Network - Part 3: GSM Customer Equipment

AS/NZS 60950.1:2011 Safety of information technology equipment (IEC 60950-1, Ed.2.0: 2005, MOD) SRRC

SRRC State Radio Regulation Center - China Type Approval

E-marking E13 ECE-R10-03 directive Requirements of quality ISO 16750 Environmental conditions and testing for electrical and electronic equipement. ISO

16750 is used as a guide line to qualify the HiAllNC module. ISO TS 16959 HiAllNC module is manufactured in factory certified ISO TS 16959.



1.3 TERMS AND ABBREVIATION ADC Analog to Digital Converter CEP Circular Error Probable CODEC Coder-Decoder CLIP Calling Line Identification Presentation COLP Connected Line Identification Presentation CLIR Calling Line Identification Restriction COLR Connected Line Identification Restriction CTS Clear To Send CSD Circuit Switched Data CS Codec Scheme DCS Digital Communications System DSR Data Set Ready DTR Data Terminal Ready EDGE Enhanced Data Rate for GSM Evolution EGSM Extended GSM ENS Enhanced network selection EONS Enhanced operator name string ESD Electrostatic Discharge ETS European Telecommunication Standard GLONASS GLObal NAvigation Satellite System GNSS Global aeronautical Navigation Satellite System GSM Global System for Mobile communication GPRS General Packet Radio Services GPS Global Positioning System HBM Human Body Model HDOP Horizontal Dilution Of Precision HSCSD High Speed Circuit Switched Data HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access HSPA+ Evolved High-Speed Packet Access IC Integrated Circuit IEEE Institute of Electrical and Electronics Engineers I/O Input / Output ISO International Standards Organization ITU International Telecommunication Union IVS In-Vehicule System JTAG Joint Test Action Group Kbps kilobit per second LCD Liquid Crystal Display LED Light Emitting Diode LTO Long Term Orbits Mbps Megabit per second MSD Minimum Set of Data NAD Network Access Device PBCCH Packet Broadcast Channel PCB Printed Circuit Board PCM Pulse Code Modulation PCS Personal Communication System PSAP Public Safety Answering Point PWM Pulse Width Modulation RAM Random Access Memory RF Radio Frequency RI Ring Indication RMS Root Mean Square RTS Ready To Send RX Reception SIM Subscriber Identification Module



SMS Short Message Service SV Satellite Vehicle TBC To Be Clarified TTFF Time To First Fix TX Transmission UART Universal Asynchronous Receiver and Transmitter UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USSD Unstructured Supplementary Service Data VAD Vehicle Access Device VM Virtual Machine

1.4 CONVENTIONS Throughout this document, DTE (data terminal equipment) indicates the equipment which masters and controls the module device HiAllNC by sending AT commands via its serial interface. DCE (data communication equipment) indicates the HiAllNC module device.

AT commands

microcontroler, µprocessor, computer, …

DTE DCE

AT commands


AT commands


DTE DCE

Warning: The UART signals names have changed from HiAll NC/HiLo NC-3GPS to reflect the correct naming convention between DTE and DCE, as shown below.

DSR is an INPUT of the module, connected to the DTR signal of the DTE, and able to control the sleep mode of the module. RTS is an OUTPUT of the module, connected to the CT S signal of the DTE, and raised when the module is ready.



1.5 PRODUCT FEATURES OVERVIEW Mechanical & environment Temperature range Normal range: –40°C to +85°C (fully compliant)

Storage: –40°C to +105°C Weight 5.65g (typ) ESD ±2 kV (IEC61000-4-2) Physical dimensions 28.5 x 34mm x 2.7mm (typical) Connection LGA-116 pins Power supply 3,7V Nominal (Minimum 3,2V / Maximum : 4,5V) Power consumption Off mode:36 µA

Stand-by mode: - 1.2mA in DRX5 (GNSS OFF) Communication mode at Pmax (GNSS OFF) - 220mA GSM 900 / 850 - 170mA DCS / PCS GNSS mode (@GSM in registered mode) - 35mA to 120mA

Embedded Memory FLASH memory size for JAVA PROGRAMM CODE

Up to 512KBytes or (High Density Memory OPTION- Contact SAGEMCOM)

FLASH memory size for USER DATA (including JAVA DATA)

Up to 1.5MByte or (High Density Memory OPTION- Contact SAGEMCOM)

Interfaces Voltage interface 2.8V Main UART interface with flow control Up to 1Mbps (Up to 115.2 Kbps with auto-bauding) Second UART interface Up to 1Mbps (Up to 115.2 Kbps with auto-bauding)

Second UART dedicated for NMEA frames output or standard UART (Planned in roadmap)

SPI trace interface Only for SAGEMCOM use (software traces in debug mode)

Power on pin Available, low level active Reset pin Available, low level active General purpose I/Os pin Up to 6 ADC 2 ADC SIM interface Interface to external 2FF 3V or 1.8V SIM card with

SIM detection feature Embedded IC SIM (OPTION) MFF2 format SIM priority External SIM priority Audio Audio up-link 1 differential input is provided for microphone Audio down-link 1 differential output is provided for non stereo

earphone Digital audio Highly configurable PCM interface Voice codec Half Rate, Full Rate, Enhanced Full Rate, Adaptive



Multi Rate GSM Frequency bands Quad-band GSM: GSM850, EGSM900, DCS1800,

PCS 1900 GSM class Small MS Transmit power Class 4 (2W) for GSM850 / EGSM900

Class 1 (1W) for DCS1800 / PCS1900 GSM release R99 Data services Data/command multiplexing Software management of data/command multiplexing

on the serial link UART. Data services CSD, GPRS Class 10 Supplementary services (supported via AT commands)

Caller Line Identification, Call Waiting, Call Hold, Call Forwarding, Multiparty, Call Barring, Advice of Charge, USSD, CPHS

GPRS

SMG 31bis, Multi slot class 10, class B terminal, PBCCH support

GNSS GPS constellation GPS L1 Band (1575.42 MHz)

24 channels receiver Support for passive or active antenna

GLONASS constellation GLONASS L1 Band (FDMA 1602MHz) Simultaneous GPS/GLONASS constellation tracking

SBAS WAAS, MSAS, QZSS GNSS tracking sensitivity -164dBm Note 1 GNSS acquisition sensitivity (cold start) -148dBm Note 1 GNSS time to first fix (cold start) <30s GNSS assistance (OPTION) LTO mode: assistance data (7days validity) through

HTTP connection PPS Pulse synchronized with GPS time (1µs accuracy) eCall Pan-European eCall in-Vehicule emergency call as

specified by ETSI and ISO Inband Modem Release 10.0 Note 1: with optional external LNA



2. HiAll NC BLOCK DIAGRAM & PINOUT

Figure 1: HiAllNC Block Diagram



3. FUNTIONAL DESCRIPTION & INTERFACES

3.1 ECALL The eCall system embedded into HiAllNC uses an in-band data modem to transmit the MSD information over the voice path to the PSAP, as specified in the ETSI specifications. The HiAllNC module is designed to be integrated into an IVS. The eCall can be initiated through an AT command or by a GPIO as an alternative. HiAllNC fully fulfil ISO and 3GPP specifications listed in §1.2 and in particular support the following features:

- Configurable content of the MSD sent to the PSAP, through specific AT command - Support of call-back from the PSAP to send a new MSD - Activation from AT command or GPIO

More information about eCall feature, as well as AT command specification for eCall is reported in reference [1].

3.2 GNSS

3.2.1 GNSS Main features HiAllNC provide the following GNSS features:

- internal LNA and SAW filter - capability of generating measurements for up to 18 satellites GPS and GLONASS simultaneously - NMEA frames output with time, position, altitude & speed either on main UART1 or second UART0 - test command to perform statistical measurements - capability to store position in file system with configurable periodicity - support of passive or active antenna - LTO (Long Term Orbit) support - PPS output timing pulse synchronized with GPS time (1µs accuracy)

3.2.2 Assistance data HiAllNC supports, as an option, the Long Term Orbits (“LTO”) solution. The LTO consists of GNSS satellite and assistance data (ephemeris, timing and other information used by the GNSS receiver) to download every 7 days through an HTTP connection. Assistance data allow the user to enhance the GNSS receiver performances (improved time to fix and capability to perform a fix in weak signal conditions).



3.3 SIM CARD

3.3.1 Embedded SIM HiAllNC module embeds an IC SIM Card as an optional feature (MFF2 format according to ETSI standard). To get information about possible IC SIM Card subscription, please contact SAGEMCOM.

3.3.2 SIM card interface The SIM Card Interface, available through the LGA pad out, is compatible with the ISO 7816-3 IC card standard on the issues required by the GSM 11.11 Phase 2+ standard and adapts to 3V and 1.8V SIM cards. To prevent SIM card damage, the power supply of the module must be turned off before any manipulation of the SIM card. The SIM card interface includes:

- Power supply output (SIM_VCC) - Bi-direction data signal (SIM_DATA), - Clock output (SIM_CLK) - Reset signal (SIM_RST) - Optional external SIM card detection feature (GPIO2 for default pin)

Figure 2: External SIM connection

Note: A reference schematic of the SIM card connection is given in the application note [2]

Signal Module connector pin

number Description

SIM_RST 79 SIM reset SIM_CLK 35 SIM clock SIM_VCC 33 SIM supply voltage SIM_DATA 34 SIM serial data line, input and output



3.3.3 SIM CARD selection HiAllNC can be configured to support one of the following configurations:

- Use of external SIM only - Use of embedded SIM only - External SIM priority mechanism if both SIM cards are presents (based on hardware detection of

internal SIM) See HiAllNC Hardware Application Note [2] for more detail about SIM selection.

3.4 AUDIO The HiAllNC module features both analog and digital audio interfaces.

3.4.1 Analog Audio The module supports the following voice codec:

- Half-Rate - Full-Rate - Enhanced Full Rate - Adaptive Multi Rate

It manages an external microphone (MIC_P/MIC_N) in differential mode and an external earphone (32 Ohms HSET_P/HSET_N) in differential mode.

Signal Module connector

pin number Description

HSET_N 23 Negative polarized output signal for external speaker HSET_P 24 Positive polarized output signal for external speaker MIC_N 26 Negative polarized input signal for microphone MIC_P 25 Positive polarized input signal for microphone

Characteristics of microphone, speaker and reference schematic are given in the application notes [2].

3.4.2 Digital audio The HiAllNC M2M module features a PCM interface. The PCM interface is a High speed full duplex interface that can be used to send and receive digital audio data to external audio ICs. The HiAllNC PCM interface is highly configurable:

- PCM master or slave mode - 8bits or 16 bits data word length - MSB or LSB first - Rising or falling sampling clock edge - Configurable PCM bit clock rate up to 1MHz

Signal Module connector pin number

Description

PCM_CLK 21 Clock PCM_IN 66 Digital audio input



PCM_OUT 65 Digital audio output PCM_SYNC 22 Audio signal frame synchronization

3.5 DATA

3.5.1 Data services The module supports the following services:

- Built-in data / fax Modem - Data over CSD: - 9.6 kbps - Non transparent mode only - V.32 or V.110 - Data over GPRS: - 2 PDP contexts at the same time - Internal IP stack: 8 sockets can be opened at the same time. But only 1 FTP socket can be open at the same time. E.g.: 1 FTP socket, 1 FTP server and 6 TCP/UDP connections.

3.5.2 Main UART The UART1 V24 interface is provided on external pins of the module with the following signals:

- RX/TX - RTS/CTS - DTR/DSR - RI - DCD

The following convention is used for signal direction:

HiAllNC

DCE

UART1_RX

UART1_TX

Host microcontroller

DTE

UART1_CTS

UART1_RTS

UART1_DSR

UART1_RI

UART1_DTR

UART1_DCD

Figure 3 : 8 wires UART connections

It supports up to 1 Mbps and in auto bauding mode up to 115.2 Kbps.

Signal Module connector pin Description UART1_DSR 15 Data Set Ready UART1_DCD 58 Data Carrier Detect UART1_TX 60 Transmit UART1_RTS 59 Request To Send UART1_RX 17 Receive UART1_CTS 16 Clear To Send UART1_RI 61 Ring Indicator UART1_DTR 14 Data Terminal Ready



3.5.3 Second UART This interface (UART 0) is provided on external pins of the module with the following signals:

- RX/TX - RTS/CTS

This interface could be used for example to output NMEA frames.

Figure 4 : 4 wires secondary UART connections

Signal Module connector pin Description UART0_TX 18 Transmit UART0_RX 62 Receive UART0_CTS 63 Clear To Send UART0_RTS 19 Request To Send

3.5.4 DATA/ COMMAND multiplexing The serial link between the DCE and a DTE (microcontroller, etc) is used to send two different kinds of data flow: AT commands and PPP data packets. HiAllNC module implements the GSM 07.10 standard that allows multiplexing of AT command & data packet on a same physical interface. Source code is provided to the customer to develop its own driver.

3.5.5 SPI A SPI link is available for the SW traces debug port. It’s strongly recommended to leave this interface accessible through test points for debug purposes.

Signal Pin n° Description

SPI_IN 72 SPI data in

SPI_OUT 73 SPI data out

SPI_SEL 74 SPI chip-select output

SPI_IRQ 37 SPI IRQ

SPI_CLK 75 SPI clock output

3.6 SPARE I/O There are 6 GPIOs that can be customized easily from the customer’s application through appropriate AT commands and they can be configured as input or output:



Signal Pin N° Description

GPIO1 36 General Purpose Input/Output 1






3.7 PWON One power input pin is available to start up the module. This pin is low level active.

Signal Pin N° Description PWON 32 Low level active input signal to power up the module

3.8 RESET One reset input pin is available to reset the module in case of undesirable behavior.

Signal Pin N° Description RESET 27 Low level active input signal to reset the module

3.9 ADC 2 ADC input pins are available to measure an external analog voltage through dedicated AT commands. These pins can also be used to detect external antenna presence.

Signal Pin N° Description ADC1 30 Analog to digital converter input ADC0 31 Analog to digital converter input

3.10 RF BURST INDICATOR A digital output signal is available to indicate the RF transmissions. It is high level active and can therefore be connected to a transistor and a LED to give a visual indication of the RF activity.

Signal Pin N° Description 2G_RF_IND 87 RF power transmitting indicator

RF_TX

HiAll NC

VBAT

R



Figure 5: RF TX burst indicator

3.11 PPS The Pulse-Per-Second output is a software-enabled feature, which generates pulses synchronized with GPS time with a 1µs accuracy (outputs enabled only in tracking mode).

Signal Pin N° Description PPS 13 Pulse Per Second

3.12 GPS_EXT_LNA_EN The GPS_EXT_LNA_EN is a software-enabled feature, that generates an enable signal for external LNA supply when use of active antenna.

Signal Pin N° Description GPS_EXT_LNA_EN

39 Enable for external LNA supply

3.13 BACKUP A VBackup pin is available to keep supplying the real time clock at 32768 Hz in case of main battery loss.

Signal Pin N° Description VBACKUP 28 Power supply for backup battery

It is used to connect a backup battery coin cell or rechargeable backup battery or super cap. Depending on the main battery voltage, the internal RTC is supplied by the VBACKUP or by the main power supply voltage: RTC supply with external BACKUP present: - If VBAT < VBACKUP, internal RTC is supplied by VBACKUP - If VBAT ≥ VBACKUP, internal RTC is supplied by VBAT More details about the battery choice and the charge schematics are given in the Application Notes [

3.14 VGPIO This Voltage pin is the reference voltage for the internal digital I/O’s and it can be used as a power supply and also as a module power status (ON/OFF). VGPIO is high when the module starts and remains at this level until the module is OFF.

Signal Pin N° Description VGPIO 71 Digital Power supply and power up status

The current capability for 2.85V output: - 50mA in the active mode - 3mA in sleep mode.



3.15 POWER SUPPLIES Connecting all power supply pins, 2 for the VBAT, and 2 for the VBAT_PA is strictly mandatory. Connecting all GND is strongly recommended.

Signal Pin N° Description

VBAT 29,57 VBAT power input pins for Base band & GNSS

VBAT_PA 43, 44 VBAT power input pins for GSM PA

GND 1~3, 5~8,10,12,45~56,89~116

Ground pins



4. PINOUT

4.1 PIN LOCATION

Figure 6: HiAllNC Pinout TOP VIEW



4.2 PIN ASSIGNMENTS Pin N° Pin name IO Type Description Power

Domain Note 1

1 GND GND GND 0V

2 GND GND GND 0V

3 GND GND GND 0V

4 RF_GSM RF GSM RF IN/OUT

5 GND GND GND 0V

6 GND GND GND 0V

7 GND GND GND 0V

8 GND GND GND 0V

9 RESERVED (For 3G module compatibility)

RESERVED (For 3G module compatibility)


10 GND GND GND 0V

11 RF_GPS RF GPS RF IN

12 GND GND GND 0V

13 PPS Digital output buffer Pulse Per Second 2.8V

14 UART1_DTR Digital output buffer UART data terminal ready 2.8V

15 UART1_DSR Digital input buffer UART1 data set ready 2.8V

16 UART1_CTS Digital input buffer UART1 clear to send 2.85V

17 UART1_RX Digital input buffer UART1 receive 2.85V

18 UART0_TX Digital output buffer UART0 transmit 2.85V

19 UART0_RTS Digital output buffer UART0 ready to send 2.8V




21 PCM_CLK Digital bi-directional buffer Digital audio clock 2.85V

22 PCM_SYNC Digital bi-directional buffer Digital audio sync 2.85V

23 HSET_N Analogue output Differential output to earphone 32 ohms

3.7V

24 HSET_P Analogue output Differential output to earphone 32 ohms

3.7V

25 MIC_P Analogue input Differential input from microphone

2.85V

26 MIC_N Analogue input Differential input from microphone

2.85V



27 RESET Digital input buffer General Reset input 2.8V

28 VBACKUP Power supply input/output Backup battery power supply

3V

29 VBAT Power supply input +3.7 V power supply (nominal)

3.7V

30 ADC1 Analog input Analog input to digital converter

2.85V

31 ADC0 Analog input Analog input to digital converter

2.85V

32 POK_IN Digital input Module power on signal 3.0V

33 SIM_VCC Power supply output SIM power supply 1.8 or 2.9V

34 SIM_DATA Digital bi-directional buffer SIM data 1.8 or 2.9V

35 SIM_CLK Digital output buffer SIM clock 1.8 or 2.9V

36 GPIO1 Digital bi-directional buffer General purpose input/output 1

2.8V

37 SPI_IRQ Digital input power Serial peripheral interface. To be connected for debug purpose.

2.8V

38 RESERVED (for futur use)

RESERVED (for futur use)

RESERVED (for futur use)

39 GPS_EXT_LNA_EN

Digital output buffer Enable for external LNA supply

2.8V


2.8V


2.8V

42 TRST Digital input buffer JTAG reset 2.8V

43 VBAT _PA Power supply input +3.7 V power supply (nominal) for GSM power amplifier

3.7V

44 VBAT_PA Power supply input +3.7 V power supply (nominal) for GSM power amplifier

3.7V

45 GND GND GND 0V

46 GND GND GND 0V

47 GND GND GND 0V

48 GND GND GND 0V

49 GND GND GND 0V

50 GND GND GND 0V

51 GND GND GND 0V

52 GND GND GND 0V

53 GND GND GND 0V

54 GND GND GND 0V

55 GND GND GND 0V



56 GND GND GND 0V

57 VBAT Power supply input +3.7 V power supply (nominal)

3.7V

58 UART1_DCD Digital output buffer UART data carrier detect 2.8V

59 UART1_RTS Digital output buffer UART1 ready to send 2.85V

60 UART1_TX Digital output buffer UART1 transmit 2.85V

61 UART1_RI Digital output buffer UART1 ring indicator 2.8V

62 UART0_RX Digital input buffer UART0 receive 2.85V

63 UART0_CTS Digital input buffer UART0 clear to send 2.8V




65 PCM_OUT Digital output buffer Digital audio out 2.85V

66 PCM_IN Digital input buffer Digital audio in 2.85V













71 VGPIO Power supply output +2.85V power supply output

2.8V

72 SPI_IN Digital input buffer Serial peripheral interface. To be connected for debug purpose.

2.8V

73 SPI_OUT Digital output buffer Serial peripheral interface. To be connected for debug purpose.

2.8V

74 SPI_SEL Digital bi-directional buffer Serial peripheral interface. To be connected for debug purpose.

2.8V

75 SPI_CLK Digital bi-directional buffer Serial peripheral interface. To be connected for debug purpose.

2.8V

76 TMS Digital input buffer JTAG mode select input 2.8V

77 TDI Digital input buffer JTAG data input 2.8V

78 TDO Digital output buffer JTAG data output 2.8V

79 SIM_RST Digital output buffer SIM reset 1.8 or 3V

80 JTAG_TEST Digital input buffer JTAG TEST Input 2.8V

81 RESERVED RESERVED Do not connect (Factory used only)



82 TCK Digital input buffer JTAG clock input 2.8V


2.8V


2.8V


2.8V

86 VIO_SEL Digital input buffer VGPIO voltage selection 2.8V

87 2G_RF_IND Digital output buffer 2G Burst Transmit indicator

2.85V

88 RTCK Digital output buffer JTAG return clock 2.8V

89 GND GND GND 0V

90 GND GND GND 0V

91 GND GND GND 0V

92 GND GND GND 0V

93 GND GND GND 0V

94 GND GND GND 0V

95 GND GND GND 0V

96 GND GND GND 0V

97 GND GND GND 0V

98 GND GND GND 0V

99 GND GND GND 0V

100 GND GND GND 0V

101 GND GND GND 0V

102 GND GND GND 0V

103 GND GND GND 0V

104 GND GND GND 0V

105 GND GND GND 0V

106 GND GND GND 0V

107 GND GND GND 0V

108 GND GND GND 0V

109 GND GND GND 0V

110 GND GND GND 0V

111 GND GND GND 0V

112 GND GND GND 0V

113 GND GND GND 0V

114 GND GND GND 0V



115 GND GND GND 0V

116 GND GND GND 0V

Note 1: VIO_SEL (pad86) left unconnected.



5. ELECTRICAL SPECIFICATIONS If not specified, all electrical values are given for VBAT=3.7V and an operating temperature of 25°C.

5.1 VBAT POWER SUPPLY HiAllNC module is supplied through the VBAT signal with the following characteristics:

Parameter Name Minimum Typical Maximum VBAT voltage (V) VBAT 3,2 3,7 4,5 Transient voltage (V) 2,9 _ _ Noise level (Vrms)@ 100kHz-1 MHz

_ _ 50 mV

5.2 VBAT CURRENT CONSUMPTION The current consumption values are obtained at nominal 3.7V VBAT voltage. All measurements in the communication mode are done at the maximum RF power transmission (PCL max).

-40°C 25°C +85°C

Typ. Typ. Max Typ.

Off mode 36 µA

GSM DRX2 – registered to the network 1.5 mA 1.7 mA 2.0 mA 2.6 mA



GNSS stand-by mode (to maintain hot start conditions) (@GSM DRX5)

1.2mA

GNSS active mode (@GSM DRX5) 30mA-120mA

Note 1 125 mA

GSM900 / GSM850 (PCL=5)

220mA 225 mA 250mA 225 mA GSM in communication mode DCS / PCS

(PCL=0) 160mA 165 mA 180mA 165mA

GSM900 / GSM850 (PCL=5)

400 mA GPRS (2 TX,3 RX)

DCS / PCS (PCL=0)

270 mA

GSM900 / GSM850 1.40 A 1.50 A 1.7 A 1.50 A Current consumption during a burst DCS / PCS 0.90 A 0.95 A 1.5 A 0.95 A

Note 1: GNSS Power consumption is ranging from 30mA (low power tracking mode) to 120mA (peak acquisition)



5.3 VGPIO

Parameter Min Typ Max Remarks

Voltage level(V) 2.65 2.80 2.95 Both active mode and sleep mode

Current capability active mode(mA)

- - 50

Current capability sleep mode (mA)

- - 3 32KHz system clock enable

Line regulation(mV/V) - - 50 Iout = MAX

Rise Time(ns) - - 6 Test load capacitor = 30 pF

5.4 VBACKUP

Parameter Min Typ. Max. Remarks

Voltage level(V) 3

5.5 VSIM Parameter Min Typ Max Remarks

2.7 3 3.15 The appropriate output voltage is auto detected and selected by software.

Output Voltage(V)

1.65 1.80 1.95

Output Current (mA) - - 10 In sleep mode Max output current = 3 mA

Line Regulation (mV/V) - - 50 At Iout_Max

Power-up Setting Time (us) from power down

- 10 -

5.6 DIGITAL INTERFACES The digital interfaces listed below have the following characteristics.

- UART0 - UART1 - PCM - GPIOs - SPI


Input Current-High(µA) -10 - 10

Input Current-Low(µA) -10 - 10

DC Output Current-High(mA) (1)

- - 15 Pin driving a "1" with output set at "0"

DC Output Current-Low(mA) (1)

-15 - - Pin driving a "0" with output set at "1"



Input Voltage-High(V) 2.4 3.2

Input Voltage-Low(V) - - 0.4

Output Voltage-High(V) 2.7 - 3.2

Output Voltage-Low(V) - - 0.1

(1) The maximum current for one GPIO is 15mA, but all GPIOs can not provide 15mA at a time since the VIO is limited to 50mA

5.7 PWON The PWON signal has the following characteristics:

Parameter Min Typical Max Input voltage-Low (V) - 0.4 Input Voltage-High 2.4 - 3.3V Powerup period (ms) from POK_IN falling edge

2000 - -

5.8 RESET The RESET signal has the following characteristics:

Parameter Min Type Max

Input Voltage-Low(V) - 0.4

Input Voltage-High(V) 2.4 -

Power up Period (ms) from RESET falling edge

38 - -

5.9 SIM

VL (V) VH (V) Signal

Min. Max. Min. Max.

SIM_RST

SIM_CLK

SIM_DATA

Fully compliant to the GSM11.11 and ISO/IEC 7816-3 standards

5.10 ADC Both ADC have the following characteristics.


ADC Resolution(bits) - 10 -

Input Voltage Range(V) 0 - 3 general purpose input

Update rate per channel(kHz)

- - 200

Differential Nonlinearity(bits)

-1 - +3



Integral Nonlinearity(bits) -2.5 - +2.5

Offset Error(mV) - 5 -

Gain Error(mV/LSB) - 0.02 -

Input Resistance (kΩ) 120 150 -

Input Capacitance (pF) - - 10

5.11 PPS

Parameter Min Typ Max Test Conditions

Frequency 1Hz

Puse width 100µs

Synchronization to GPS time 1µs

Note: This output is available only when GNSS is in tracking mode

5.12 ANALOG AUDIO SIGNALS

5.12.1 Analog inputs


Maximum input range 1.4V Gain = - 6dB

Nominal reference level 16mV Gain = + 34dB

Input Micro amplifier gain (dB) -6 + 50

5.12.2 Analog outputs


Maximum output range 1.65 Vrms Load=32Ω, THD=1%, Output gain = 8 dB

Load resistance (Ω) 32

Output amplifier gain (dB) -28 - 8

5.13 GSM PERFORMANCES

Frequency band GSM850 EGSM

Typ/Max Typ Max Typ Max ETSI value

Sensitivity (dBm) -109 -107 -109 -107 < -102

Frequency band DCS PCS

Typ/Max Typ Max Typ Max ETSI value

Sensitivity (dBm) -109 -106 -109 -106 < -102



Frequency band GSM850 EGSM ETSI value Typ/Max Typ Min Typ Min Min Max Output power @max PCL (dBm)

32.5 30.5 32.5 30.5 30.5 35.5

Frequency band DCS PCS ETSI value Typ/Max Typ Min Typ Min Min Max Output power @max PCL (dBm)

29.5 27.5 29.5 27.5 27.5

32.5

5.14 GNSS PERFORMANCES

5.14.1 GNSS Sensitivity Sensitivity is measured in the followings conditions:

- GPS & GLONASS constellations - All satellites at same power level

With optional

external LNA Note 1 Without external LNA

Typ Typ Max

Tracking sensitivity (dBm) GNSS standalone

-164 - 161 - 158

Tracking sensitivity (dBm) GNSS with GSM traffic mode (Pmax)

-164 - 161 - 158

Acquisition sensitivity (dBm) Cold start

-148 - 146 - 145

Note 1: with LNA reference MAX2657

5.14.2 GNSS Time To Fix and CET

- GPS & GLONASS constellations - All satellites at -130dBm

TTFF 50% TTFF 67% TTFF 95% CEP 50% CEP 67% CEP 95%

Hot start - autonomous

1.5s 1.7s 4s 1.8m 2.5m 5m

Warm start - autonomous

29s 30s 30s 1m 1m 4m

Cold start - autonomous

29s 29s 30s 0.4m 0.5m 2m



5.15 GSM ANTENNA CONNECTION

5.15.1 Load mismatch The module accepts a VSWR < 20:1 (all phase angles) without damage or permanent degradation. The module accepts a VSWR < 12:1 (all phase angles) without any spurious emission > - 30dBm on GSM port.

5.15.2 Antenna matching network HiAllNC is optimized for a 50 ohm load. An external π-type matching network is recommended to provide optimum adaptation to customer antennas.

5.16 GNSS ANTENNA CONNECTION

5.16.1 Emdedded filtering HiAllNC embeds a high performance SAW filter, allowing tight integration with cellular modem (embedded SAW filter is optimized for a minimum of 40dB rejection in cellular frequencies).

5.16.2 Antenna HiAllNC support both passive and active antenna. The passive antenna can be used if antenna is close to the module and with good view of satellites. An external power source shall be used in case of active antenna. This power source can be driven by the digital GPS_LNA_EN signal from HiAllNC. A typical schematic is provided in Application Note [2].

5.17 EXTERNAL ANTENNA ISOLATION The product performances are guaranteed with 30dB isolation between GSM & GNSS antennas in the range 800MHz-2100MHz.

5.18 OUT OF NORMAL TEMPERATURE RANGE SAGEMCOM does not guarantee ETSI performances out of the normal temperature range. However, HiAllNC is designed to target the below specification (Planned in roadmap).

Temperature range Comments +85°C to +105° Features still functional:

- communication on UART - synchronization to GSM network - emergency call operation



6. ESD

HiAllNC can stand for +/-2kV ESD on all the LGA pins, following IEC61000-4-2 model.

7. MTBF

HiAllNC MTBF is calculated according to standards profiles.

7.1 RESULTS TELECOM PROFILE AUTOMOTIVE PROFILE Temperature +25°C See profile below HiAllNC MTBF (hours) 8200000 (122 fits) 1670000 (598 fits)

7.2 AUTOMOTIVE PROFILE (PRODUCT IN PASSENGER COMPA RTMENT).

Mission profiles described hereinafter correspond to the MIL-HDBK-217F “Ground; mobile” environment.

Several working phases are considered.

1. The working rates consider three different internal working temperatures for the equipment, and take into account the annual working hours for each of these temperatures. The overall working time is estimated to be 500 h

2. Two thermal cycling are considered: Phase 1: 2 night starts; Phase 2: 4 day light starts; Phase 3: non-used vehicle, dormant mode 30 days per year.

Mission profile phases

Temp. 1 Temp.2 Temp. 3 Ratios on/off 2 night starts 4 day light starts

Non used vehicle

Application types

(tac)1°C τ1 (tac)2°C τ2 (tac)3°C τ3 τon τoff n1 ∆T1 n2 ∆T2 n3 ∆T3

Passenger compartment

27 0.006 30 0.046 85 0.006 0.058 0.942 670 30

3+

∆ jT

1340 20

3+

∆ jT

30 10

7.3 TELECOM PROFILE (GROUND NON STATIONARY SEVERE). This MTBF is calculated with RDF2000 standard and the following parameters: - Room temperature: Tac = 25°C - Average temperature at components vicinity: Tae = 25°C - Time of operation: 100% - Transmission mode: 1% - Idle mode: 99% - Thermal cycles per year: 365 - Temperature change between day and night: ∆T = 0°C



8. MECHANICAL SPECIFICATIONS

8.1 DESCRIPTION The HiAllNC size is 28.5x34x2.7mm

Figure 7: HiAllNC module 3D top and bottom views

8.2 PHYSICAL DIMENSIONS Notes: all dimensions are in millimeters.

Figure 8: HiAllNC dimensions



8.3 DECOMPOSITION Shield frame is soldered on HiAllNC PCB. Shield cover is assembled with shield frame and is removable. Decomposition is detailed in the figure below

Figure 9: HiAllNC decomposition

8.4 PIN OUTLINE DIMENSIONS Notes: all dimensions are in millimeters.

Figure 10 : HiAllNC Pads Outlines (Top View)



8.5 RECOMMENDED DESIGN HiAllNC is directly soldered on the customer board through its 116 pads.

8.5.1 Recommended footprint

Notes: all dimensions are in millimetre.

Figure 11: Recommended Land pattern (top view)



8.5.2 Recommended Stencil design

Figure 12: Recommended Stencil Outlines



Recommended stencil thickness: 125µm

8.6 REFLOW PROFILE Typical lead-free profile is shown on the next figure.

Peak temperature: 235~250 Degree C. Reflow zone (Above 220 Degree C): 30~70 sec. Preheat zone (140~190 Degree C.): 60~120 sec.

8.7 PACKAGING The HiAllNC is delivered in Tape and Reel packaging to be mounted in fully automatic SMT process with standard pick-and place-equipment.

8.8 MSL According to IPC/JEDEC J-STD 20, HiAllNC module meets the MSL level 3, according to following conditions:

Soak requirements Level Floor Life Standard Accelerated Equivalent

Time Conditions Time (hours) Conditions Time (hours) Conditions 3 168

hours <= 30°C/60% RH 192 +5/-0 30°C / 60% RH 40 +1/-0 60°C / 60%RH



9. ORDERING AND CONTACT INFORMATION

9.1 PART NUMBER Reference Part number GPS/GLONASS Virtual

MachineHigh densitymemory

MFF2 ICSIM

HiAllNC Module 253438670 xHiAllNC Module 253438689 x xHiAllNC DEV KIT 253455569 x xTBC ANY COMBINATION CAN BE STUDIED

9.2 CONTACT Email: [email protected] Web: http://www.sagemcom.com/ SAGEMCOM Energy & Telecom Wireless M2M Modules 250, route de l’empereur 92848 Rueil-Malmaison Cedex FRANCE

9.3 REFERENCES [1] URD1 5635.1 008 70248 - AT Command Set for SAGEMCOM Modules [2] URD1 5717.1 005 72630 - HiAllNC Hardware Application Note [3] URD1 5717.1 012 72832 - HiAllNC Development kit Application Note

hiallnc technical specification - sagemcomsupport.sagemcom.com/site/livret/urd1_5717_1_004... ·...

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