henkel standard template with sample slides · 2020. 3. 31. · 5 prelude: challenges and...

SOLDERIntroducing LOCTITE GC 50Engineering Manual

Technology TeamMarch 2020

2

LOCTITE GC 50 Solder Paste

Section Pages Topics

03 - 14 Prelude: Challenges and Introduction to LOCTITE GC 50

15 - 30 Handling, Viscosity and Deposition

31 - 49 Reflow

50 - 56 Reliability

57 – 66 Storage Stability

67 – 72 Summary

73 – 78 Appendix – Reflow Profiles

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3

Prelude: Solder Paste and Challenges facedSolder Paste

Solder Paste • Solder paste comprises two components

• Flux and solder powder• Two components that impact over 50 physical and application properties

4

Technology and

Application Challenges

Prelude: Solder Paste and Challenges facedSolder Paste

Printed Circuit Boards

• Electronic circuit boards have evolved over time

• Printing conditions Cpk, void levels, QFN, flux spatter, AR, pad ratio, tin whiskers, ENIG reliability, reliability of application build under high duress of temperature/humidity/thermal cycling/ageing, HiP, NWO, shear strength, cratering, mid-chip balling elimination, compatibility and product agility are some of the challenges.

• Test vehicle(s) can determine limits ahead of time of current product, and provide direction to match vision

5

Prelude: Challenges and Introduction to LOCTITE GC 50 Solder Powder PSD

March 25, 2020

Solder Powder Particle Size

Particle Size:T5

• Component miniaturization and HDI is causing the need for finer particle distribution for improved process control

• For LOCTITE GC 50 the PSD of choice is T5 (as tabulated below)• With a finer powder, allows for improved CpK using tighter process tolerances

Particle SizeParticle Size Distribution (PSD)

Mesh SizeMils Millimeters Microns

Type 1 3.0 - 6.0 0.075 – 0.150 75 – 100 -100/+200

Type 2 1.8 - 3.0 0.045 – 0.075 45 – 75 -200/+325

Type 3 1.0 – 1.8 0.025 – 0.045 25 – 45 -325/+500

Type 4 0.8 – 1.5 0.020 – 0.038 20 – 38 -400/+500

Type 5 0.6 – 1.0 0.015 – 0.025 15 – 25 -500/+635

Type 6 0.2 – 0.6 0.005 – 0.015 5 - 15 -635

6March 25, 2020

Solder Alloy

• SAC305:• Tin 96.5%• Silver 3.0%• Copper 0.5%

• Properties

ATTRIBUTES SAC305Regulatory compliance ROHS

EICC

Alloy SAC305

Industry recognition in high reliability Concern since 1999 ROHS

PROPERTIES:Melting point – liquidus/solidus (°C) 217-219

Minimum peak temperature ( °C) 235

Wetting time @ 250°C (seconds) 1.1

Wetting force @ 250°C (mN) 5.6

UTS (MPa) @ RT/150 (°C) 53.3 / 14.3

Yield stress (MPa) @ RT/150 (°C) 30.5 / 12.5

Creep stress MPa @ RT 48

Electrical conductivity (Ω m) 1.2 x 10-7

Thermal conductivity (Wm-1K-1) 61.7

CTE 22.7

Density (kgm-3) 7.41

Strain @ 0.001/s @ RT/150 (°C ) 47.6/13.98

Strain @ 0.1/s @ RT/150 (°C ) 73.5/37.40

Prelude: Challenges and Introduction to LOCTITE GC 50Solder Alloy

7

Solder Volume Measurements…

Components getting

smaller, deposition control on small deposition volumes

critical

Prelude: Challenges and Introduction to LOCTITE GC 50Technology Inflection

• Nominal solder volume = stencil Gerber data requirements• Target nominal volume = 100%• Data generated by Koh Young 3D inspection system for each

solder deposit and compared to nominal target volumes.

• Statistical data generated for process capability analysis

8

Cpk is an index which measures how close a process is running to its specification limits, relative to the natural variability of the process

• Use these metrics to challenge perceived Cpk or yield(s) as part of driving an improved sustainability future culture. Improve yield, improve capacity, improve ownership.

• New products should: improve wetting; reduce slump; improve TE; lower void levels; eliminate HiP; reduce solder balling; and improve reliability.

• Use tools that can both educate and show why decision metrics are important with accountability

Prelude: Challenges and Introduction to LOCTITE GC 50Technology InflectionWhat is Cpk?

Measuring

improvements

Cpk σ (Signma level)Defects Per

Million (DPM)

0.33 1 317,311

0.67 2 45,500

1.00 3 2,700

1.33 4 63

1.67 5 1

2.00 6 0.002

9

Impact of Cpk

Statistical Significance

(Cpk)Transfer Efficiency Reflow Challenges Commentary

High>2.0

• Thin stencil: high Cpk more challenging to maintain with process optimization

• Small pad geometries and large pad geometries on same assembly

• Homogenous paste

• TAL for IMC• Flux Choice

• Excellent transfer efficiency, improves yield, reduces underside stencil wipe frequency, and increases line capacity.

• Reduced rework. • Confirmed tolerance settings.

Medium1.3 – 2.0

• Volume inconsistencies• Slump (cold)• Temperature (rheological impact)• Stability of paste (stencil life/abandon time)• Underside stencil wipe frequency• Area ratio limitation• Re-centering of mean volumes

• Mid-chip solder balls• Graping• De-wetting• HiP• Die Tilt

• A mid-level Cpk can cause significant rework. Rework can be quick and easy (misprint cleaning), or rework can be complex (component replacement).

• Confirmed tolerance settings

Low< 1.3

• Volume inconsistencies• Slump (cold)• Temperature (rheological impact)• Stability of paste (stencil life/abandon time)• Process setup - underside stencil wiping• Area ratio limitation• Re-centering of mean volumes

• Mid-chip solder balls• Graping• De-wetting• HiP• Die Tilt

• Low Cpk produces very poor TE consistency: resulting in rework levels that impact average price per unit.

• Correction of bringing process into control, by understanding product/process limits vs requirements.

• Confirmed tolerance settings.

Prelude: Solder Paste and Challenges facedImpact of Cpk on defects?

Mid-Chip Solder Balling

Head in Pillow (HiP)

Bridging

Open No Wetting

10

Challenge Board/Component Complexity

Thermal board temperature

reliability

Improve Cpk due to increase

HDI

Void reduction – specifically

large QFN

Alternate solution to printing - Jetting

LOCTITE GC 18 LOCTITE GC 50Material Delighter: Sustainable

https://www.youtube.com/watch?v=v-JacyuSKKI&feature=youtu.be

Prelude: Solder Paste and Challenges facedNew Technology: Brief introduction to solder applications

Proposal Solution

Symptom

https://www.youtube.com/watch?v=v-JacyuSKKI&feature=youtu.be

11

• Complex PCB with HDI with large/small components causing reliability challenges from process choices not yielding 100%

• Eliminate over-engineering of printing solutions (step-stencils and preforms, and smaller powder across circuit board)

• Out of specification deposit tolerances that cause failures and• HiP and NWO due component PCB warpage (CTE mis-match)

• “Jet fluid with the consistency of toothpaste at a weight of 2.5x of a snowflake• Through a hurricane• Accelerated to 10g, hitting a diameter of a hair, with a speed of 20ms-1,

without any splashing, 300 times per second… without pause• Plus: consider at the same time, accelerating sideways 2x as much as a F1

car at a distance 400µm over a PCB• And get no more errors than probability of winning lotto**”

• More precision, improved yield and reduced complexity (BGA; CSP; fine pitch)• Slow down PSD miniaturization and over engineering costs• Eliminate over-engineering process• Improve sustainability technology covers all printing requirements • Compatible Jetting and dispensing platforms• Compatible with adjacent technologies

Stepped Stencil

Preforms

Jetting Paste

Prelude: LOCTITE GC 50 Solder PasteWhy jetting technology?

Challenge

Solder Paste Jetting

Proposal Solution

** Industry supplier

Requirement

12

Prelude: LOCTITE GC 50 Solder PasteJetting Solder Paste

Naming Convention

Data Contained

• Paste: LOCTITE GC 50 SAC305 T5 84V 62K• Flux: GC 50 is a proprietary flux formulation designed specifically for Halogen

free requirements• Alloy: SAC305• Powder Size: T5 powder (25 - 15µm)• Metal loading: 84 – 84.0% (w/w) • Mixing: V - vacuum mixed• Package configuration: 62K (example)

• All data presented in this document has been generated on production batches of paste; the results should therefore be considered representative of commercially available material

13

Prelude: LOCTITE GC 50 Solder PasteSolder Paste Jetting Solution

Naming Convention Flux Description GC 50

Alloy SAC305

Henkel Powder Size Type 5

Powder Size range (m) 25 - 15

Metal Content (% wt.) 84.0

Malcom Viscosity, 10rpm (typical) 110 Pa.s

TI (typical) 0.73

IPC Solder Balling Preferred

Shelf-life at 5 – 25oC (41-77oF) 6 months

Shelf-life at 40oC (104oF) 1 month

14





31 - 49 Reflow

50 - 56 Reliability


67 – 72 Summary


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For more detailed information on handling LOCTITE GC 50, please refer to the Handling Guidelines document.

LOCTITE GC 50 Solder PasteHandling, Viscosity and Deposition

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Storage: It is recommended that LOCTITE GC 50 solder paste is stored below 25oC (77°F) to guarantee a

minimum of 6 months shelf life. Storage below this temperature will have no negative effect on the material properties and performance. Storage above 25°C (77°F) may reduce the storage stability of the material.

LOCTITE GC 50 cartridges should ALWAYS be stored:▪ With tip cap attached (no needle)▪ In a vertical position tip-down (in a rack)

▪ Without removal of end cap

LOCTITE GC 50 cartridges should NOT be stored• Without tip cap• With needle attached

• In a non-vertical position

• Without the end cap

Paste shelf life: 6 months when stored between 5-25°C (41-77°F)

Handling:

Shelf Life

16

Handling and Storage


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Paste Life: In most applications the paste should be dispensed completely.

However partially used cartridges can be resealed and kept in a vertical position, tip-down for up to 2 weeks

at 20-25°C (68-77°F).

Working Environment: Maintaining an ambient temperature of between 20-25°C (68-77°F) at a relative humidity of 30 – 60% will ensure consistent performance and work-life of the paste.

Conditioning: To ensure consistent dispense quality, it is recommended that 10-20mm bead of solder paste

be manually pressed out. This should be followed by purging in the dispense head until the paste comes out

of the needle.

This should be practiced for both unused and correctly stored used cartridges.

Thinning: The addition of any material to LOCTITE GC 50 solder paste is never recommended

For more detailed information on handling LOCTITE GC 50, please refer to the Handling Guidelines document.

Handling:

Shelf Life

17GC 50 Solder Paste

Target:

If at RT, 0 minutes.

If refrigerated,

18

LOCTITE GC 50 Solder PasteHandling, Viscosity and DepositionTechnology inflection

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Note:For jetting, control is linked to target “diameter” and not volume. Volume is governed by ejector head choice

Deposition control

(Cpk impact on tolerance)

Voids Meets market requirements Meets market requirements

ReflowDesigned for air reflow

(nitrogen capable)Designed for air reflow

(nitrogen capable)

Shelf life @ 5-25°CHenkel GC platform 12 months

Industry reference 1 month6 months

Reliability ROL0 – halide/halogen free ROL0 – zero halogen

Attribute Solder Paste Printing LOCTITE GC 50 Jetting

Deposition rate Up to 3M deposits per hour Up to 1M deposits per hour

Volume control

tolerance (Cpk)

± 50% > 1.67 > 5.00

± 15% > 1.00 > 1.50

Volume LimitsStencil aperture,

printer settingEjector head I/O valve

diameter

Smallest definition before slump

75µm 290µm

LOCTITE GC 50 material properties

Target: High Cpk

Deposition comparison:

Printing v Jetting

19

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Ejector head choice determines volume

Ejector head used for this jetting study

was AG04

LOCTITE GC 50 Solder PasteHandling, Viscosity and DepositionTechnology inflection

APAG

AQ

Attribute Solder Paste Printing LOCTITE GC 50 Jetting

Deposition rate Up to 3M deposits per hour Up to 1M deposits per hour

Volume control

tolerance (Cpk)

± 50% > 1.67 > 5.00

± 15% > 1.00 > 1.50

Volume LimitsStencil aperture,

printer settingEjector head I/O valve

diameter

Smallest definition before slump

75µm 290µm

LOCTITE GC 50 material properties

Note:For jetting, control is linked to target “diameter” and not volume. Volume is governed by ejector head choice

Deposition control

(Cpk impact on tolerance)


Printing v Jetting

Target: High Cpk

20

❶ LOCTITE GC 50 Solder PasteHandling, Viscosity and DepositionTechnology inflection

Comparison Deposits: Jetting vs Printing

Note:• Jetting delivers

individual deposits

at high rate, but

visibly different if

covering a large pad

• Wetting not

impacted

Lines Connector QFN 28 Wetting Circle

JETTING

PRINTING

Pass

Board Henkel SPTV1.1

Imagery to showcase

differences in appearance

Analysis: • Print vs Jetting it is possible to distinguish individual deposits.• Jetting multiple single deposits creates a controlled deposit shape.Impact: • Visually should be no impact. Control of deposition is key.


Printing v Jetting

Target: Achieved

21

LOCTITE GC 50 Solder PasteHandling, Viscosity and DepositionIn-Process Stability (consistency through cartridge at 28°C)

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Using AG04: Target diameter 400µm

Diameter Initial Middle End

µ (µm) 405 406 407

± σ (µm) 8.9 9.63 9.41

Cpk 5.95 5.5 6.5

AG04 44K deposits from one cartridge: Diameter target 400µm


Pass

Target:Cpk > 1.33 for 400µm

Tolerance ± 50% Analysis: • Target diameter of 400µm with minimal deviation achieved throughout full cartridgeImpact: • Cpk >5.0 indicates process control and paste homogeneity

Using AG04 ejector head depositing 44K droplets of paste

Deposition:400µm diameter

consistency through a cartridge of paste

22


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Viscosity measured over time

Time interval(hours)

Shear viscosity η

(Pa.s)

Δ% from of η

0 16.01 -3.1%

1 16.77 -7.5%

2 15.42 0.6%

3 14.29 8.6%

4 15.96 -2.8%

6 14.64 6.0%

of η 15.52 -

• Under constant shear using parallel plate• Simulate and demonstrate homogeneity and structure

Pass

Target:

Viscosity stable over

time

Analysis: • Stability: 5.0Impact:• Paste homogeneity throughout cartridge improves deposition consistency

Rheology:Measurements taken

over 6 hours period

Deposition:

Rheological Consistency

through a cartridge of paste

She

ar v

isco

sity

(P

a.s)

Time (sec)

23

LOCTITE GC 50 Solder PasteHandling, Viscosity and DepositionProcess Capability: Diameter Limits, Tolerance and Cpk

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Pad diameter target 300µm

Pad Diameter

120μm 150μm 180μm 200μm

# of pads 108 84 84 84

Size 220μm 250μm 280μm 300µm

# of pads 117 91 91 91

Pass

Target:

Cpk > 1.33 for>300µm

diameter pads

Evaluation: • Using circuit board with different pad sizes to determine Cpk• Evaluate diameter capability and assessing tolerance impact on Cpk

Test board has many geometries – focus on

one section

Deposition:

300µm diameter target

24

❶ LOCTITE GC 50 Solder PasteHandling, Viscosity and DepositionProcess Capability: Diameter Limits, Tolerance and Cpk

Pad diameter target 300µm

Diameter 300µm process measured by Cpk with different tolerances

Tolerance ±15% Tolerance ±20% Tolerance ±25% Tolerance ±50%

Cpk 0.71 Cpk 0.95 Cpk 1.19 Cpk 2.37

9900

000

9000

000

8100

000

7200

000

6300

000

5400

000

4500

000

LSL USL

LSL 5.99292e+006

Target *

USL 8.10807e+006

Sample Mean 7.05049e+006

Sample N 13195

StDev (Within) 495230

StDev (O v erall) 573355

Process Data

C p 0.71

C PL 0.71

C PU 0.71

C pk 0.71

Pp 0.61

PPL 0.61

PPU 0.61

Ppk 0.61

C pm *

O v erall C apability

Potential (Within) C apability

PPM < LSL 30011.37

PPM > USL 26373.63

PPM Total 56384.99

O bserv ed Performance

PPM < LSL 16359.28

PPM > USL 16359.26

PPM Total 32718.54

Exp. Within Performance

PPM < LSL 32552.44

PPM > USL 32552.40

PPM Total 65104.84

Exp. O v erall Performance

Within

Overall

Process Capability of Volume(um3)_1:0.30mmDIA

9900

000

9000

000

8100

000

7200

000

6300

000

5400

000

4500

000

LSL USL

LSL 5.64039e+006

Target *

USL 8.46059e+006


Sample N 13195



Process Data

C p 0.95

C PL 0.95

C PU 0.95

C pk 0.95

Pp 0.82

PPL 0.82

PPU 0.82

Ppk 0.82

C pm *



PPM < LSL 6290.26

PPM > USL 4698.75

PPM Total 10989.01


PPM < LSL 2204.17

PPM > USL 2204.17

PPM Total 4408.33


PPM < LSL 6958.79

PPM > USL 6958.78

PPM Total 13917.57


Within

Overall


9900

000

9000

000

8100

000

7200

000

6300

000

5400

000

4500

000

LSL USL

LSL 5.28787e+006

Target *

USL 8.81312e+006


Sample N 13195



Process Data

C p 1.19

C PL 1.19

C PU 1.19

C pk 1.19

Pp 1.02

PPL 1.02

PPU 1.02

Ppk 1.02

C pm *



PPM < LSL 909.44

PPM > USL 757.86

PPM Total 1667.30


PPM < LSL 185.99

PPM > USL 185.99

PPM Total 371.99


PPM < LSL 1055.24

PPM > USL 1055.24

PPM Total 2110.48


Within

Overall


1000

0000

9000

000

8000

000

7000

000

6000

000

5000

000

4000

000

LSL USL

LSL 3.52525e+006

Target *

USL 1.05757e+007


Sample N 13195



Process Data

C p 2.37

C PL 2.37

C PU 2.37

C pk 2.37

Pp 2.05

PPL 2.05

PPU 2.05

Ppk 2.05

C pm *



PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00


PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00


PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00


Within

Overall


• Deposition process control documented• Variation of “same deposition”, but Cpk determined with different tolerances

Pass

Target:


diameter pads

Analysis: • Tolerance 1.33. However, for ±50%, Cpk > 1.33 Impact:• With AG04, for Cpk> 1.33, tolerance needs to be ±50%


one section

Deposition:300µm diameter target:

Tolerance impact

25


Pad diameter target 260-500µm

Analysis: • Target diameter >250µm, with tolerance ±50%, Cpk >1.33 is achievable• Target diameter >400µm, with tolerance ±20%, Cpk >1.33 is achievableImpact:• With AG04, for Cpk> 1.33, tolerance can be ±20% for target diameters of >400µm


ToleranceCpk measured against pad diameter (µm)

260 300 400 500

± 15% 0.66 0.71 1.11 1.08

± 20% 0.88 0.95 1.44 1.44

± 25% 1.10 1.19 1.85 1.80

± 50% 2.20 2.37 3.69 3.01

Pass

Target:


diameter pads


one section

Deposition:

260-500µm diameter

target: Tolerance impact

26


Pad diameter target 260-500µm


Cpk measured against pad diameter (µm)

Tolerance

CSP 56 BGA 144 0201 QFN 28 BGA 100 QFP 100W

260µm (0.5mm)

500µm(1.0mm)

430 x 280µm 300 x 800µm400µm

(0.8mm)400 x

1900µm

± 15% 0.66 0.60 0.89 1.08 1.11 1.37

± 20% 0.88 0.80 1.14 1.44 1.48 1.83

± 25% 1.10 1.00 1.49 1.80 1.85 2.29

± 50% 2.20 2.01 2.20 3.60 3.69 4.57

Analysis: • For all components noted, with tolerance ±50%, Cpk >1.33 is achievable• 0201 and smaller, tolerances of ±20%, Cpk >1.33 is achievableImpact:• With AG04, for Cpk> 1.33, tolerance can be ±20% for specific components.Pass

Target:


diameter pads


one section

Deposition:

260-500µm diameter

target: Tolerance impact

27


Analysis: • Cpk is >1.33 is achievable for 280-500µm target diameters with AG04 (tolerance ± 50%).• Consistent diameter deposition for all target pads.Impact:• Improved Cpk over conventional printing over time. No down time.

Diameter 280-500µm process measured by Cpk with ± 50% tolerances

280μm pad 300μm pad 400μm pad 500μm pad

Cpk 2.49 Cpk 2.61 Cpk 2.89 Cpk 3.20


Pass

Target:

Cpk > 1.33 with±50%

tolerance

Pad diameter target 280-500µm - Consistency


one section

Deposition:

260-500µm diameter

target:

±50 Tolerance impact

28

Tackiness: Impact of time

Preload 300g

Preload time 5 seconds

Retraction speed 2.5mms-1

Deposit diameter 5.1mm

Deposit height 0.25mm

Test temperature 25oC

LOCTITE GC 50 Solder PasteHandling, Viscosity and PrintingTackiness

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80% of peak force

Tackiness determined using IPC method

Pass

Target:

Retains minimum 80%

peak tack after 48 hours

Analysis: • After 48 hours LOCTITE GC 50 tackiness is greater than 80% of peak measured.Impact: • Tackiness over 48 hours helps overcome any downtime on lines, and avoidance of

finished assembled boards not reflowed in time

• Tack life determined as 80% of peak force• Tack force measured every 4 hours

Tackiness:IPC method TM-650

2.4.44

29


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Printing Condition Status

1. Handling Guidance for process setup

2. Deposition Control Target diameter 400µm

3. Deposition Control Rheological consistency within cartridge

4. Deposition Control Target diameters: Impact of tolerance on Cpk

5. Deposition Control Limitations of AG04 and T5 powder

6. Tack Meets tackiness targets of greater than 48 hours

30





31 - 49 Reflow

50 - 56 Reliability


67 – 72 Summary


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Solder Ball: IPC 2.4.4.3 (+ increased storage time at higher

temperature/ humidity)

LOCTITE GC 50 Solder PasteReflowSolder Balling: Humidity resistance

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Solder Ball Test: Reflowed using convection reflow oven

Pass

Target: Class 1

Extended IPC type solder balling test

(48 hours at 80% RH)

Reflowed immediately

Preferred

Reflowed after storage at

48 hours 27C 80% RH

Preferred

Analysis: • After 48 hours exposure to humidity, LOCTITE GC 50 has good coalescence and no

solder balling.Impact: • LOCTITE GC 50 enhanced humidity resistance improves production yields and scrap if

there are undesirable down time

32

Coalescence:

Study impact of

aperture design and reflow process

solderability

Parameter L LS HS

Time above 217oC (sec) 62 65 100

Time between 150-190oC (sec) 38 136 62

Peak temperature (oC) 245 238 265

Time to peak (sec) 230 312 330

Time (mins)


250

200

150

100

50

0

217°C

HS LLS

Reflow profiles evaluated

Tem

pe

ratu

re °

C

LOCTITE GC 50 Solder PasteReflow Solderability (LS, LL and HS): Profiles

Target:No graping in air

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Evaluation:• Reflow profiles used to assess LOCTITE GC 50• Reflow evaluation done on OSP-Cu pad

Impact of reflow profile on coalescence

33

LOCTITE GC 50 Solder PasteReflow Deposit visual before reflow: Benchmarking against industry reference

Pass

QFP100 1206 0402 (small deposit) 0402 (large deposit)

LOCTITE GC 50

REFERENCE

Comparison Deposits: Jetting industry comparison

❷

Analysis: • LOCTITE GC 50 with improved definition. • Note how you can control the volume on the 0402 deposition.Impact: • Improved definition implies better deposition control

Target:No graping in air

Impact of reflow profile on coalescence of

different componentpads

Deposition:

Impact of technology

34

LOCTITE GC 50 Solder PasteReflow Solderability (L): : Benchmarking against industry reference

Pass

QFP100 1206 0402 (small deposit) 0402 (large deposit)

LOCTITE GC 50

REFERENCE

Comparison Deposits: Reflow L

❷

Analysis: • LOCTITE GC 50 shows good coalescence and wetting on all deposition areas.• Long linear profile shows that with LOCTITE GC 50, this flux assists protection of SAC

powder for improved solderabilityImpact: • Good solderability on small pad depositions, removes the need for nitrogen• Improve sustainability metrics

Target:

LOCTITE GC 50 small

pad coalescence in air



Deposition:

impact of technology

35

LOCTITE GC 50 Solder PasteReflow Solderability (L): Benchmarking against industry reference

Pass

QFN28 0201 0.5mm CSP CTBGA144

LOCTITE GC 50

REFERENCE

Comparison Deposits: Reflow L

❷

Target:

LOCTITE GC 50 small


Analysis: • LOCTITE GC 50 shows good coalescence and wetting on all deposition areas.• Linear profile shows that LOCTITE GC 50 assists protection of SAC powder for improved

solderabilityImpact: • Good solderability on small pad depositions, removes the need for nitrogen• Improve sustainability metrics



Deposition:


36

LOCTITE GC 50 Solder PasteReflow Solderability (LS): Benchmarking against industry reference

Pass

QFN28 0201 0.5mm CSP CTBGA144

LOCTITE GC 50

REFERENCE

Comparison Deposits: Reflow LS

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coalesced

coalesced

coalesced

Partial coalesced

coalesced coalesced

Partial coalesced

Partial

coalesced

Analysis: • LOCTITE GC 50 shows good coalescence and wetting on all deposition areas.• Long soak profile shows that LOCTITE GC 50 assists protection of SAC powder for

improved solderabilityImpact: • LOCTITE GC 50 has good solderability on small pad deposits. Remove need for nitrogen• Improve sustainability metrics



Target:

LOCTITE GC 50 small


Deposition:


37

LOCTITE GC 50 Solder PasteReflow Solderability (L, LS and HS): Benchmarking against industry reference

Pass

CSP 260µm Profile L Profile LS Profile HS

LOCTITE GC 50

Reflow evaluation

REFERENCE

Reflow evaluation

Comparison Deposits: Reflow L v LS v HS (Pads 260µm, pitch 500µm)

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coalescedcoalesced

coalesced

coalesced

Partial coalesced

Partial coalesced

Deposition onto 260µm CSP pads with pull back

coalescence

Analysis: • LOCTITE GC 50 shows good coalescence and wetting for all 3 profiles• Note the comparison and need for nitrogen for reference materials.Impact: • LOCTITE GC 50 has good solderability on small pad deposits. Remove need for nitrogen• Improve sustainability metrics

Target:

LOCTITE GC 50 small


Deposition:


38

LOCTITE GC 50 Solder PasteReflow Deposit visual post reflow (L, LS and HS): Benchmarking against industry reference

Pass

150µm pads Profile L Profile LS Profile HS

LOCTITE GC 50

Reflow evaluation

REFERENCE

Reflow evaluation

❷

coalescedcoalescedcoalesced

coalesced Partial coalesced

Partial coalesced

Analysis: • LOCTITE GC 50 shows good coalescence and wetting for all 3 profiles 150µm pads• Note the comparison and need for nitrogen for reference materials.Impact: • LOCTITE GC 50 has good solderability on small pad deposits. Remove need for nitrogen• Improve sustainability metrics

Deposition onto 150µmpads with pull back

coalescence

Target:

LOCTITE GC 50 small


Deposition:

Small pad deposition

and reflow in air to highlight coalesce


39


Pass

300µm pads Profile L Profile LS Profile HS

LOCTITE GC 50

Reflow evaluation

REFERENCE

Reflow evaluation

❷


coalesced Partial coalesced

Partial coalesced

Deposition onto 300µmpads. Overprint with

pull back coalescence

Analysis: • LOCTITE GC 50 shows good coalescence and wetting for all 3 profiles for 300µm pads• Note the comparison and need for nitrogen for reference materials.Impact: • LOCTITE GC 50 has good solderability on small pad deposits. Remove need for nitrogen• Improve sustainability metrics

Target:

LOCTITE GC 50 small


Deposition:

Small pad deposition

and reflow in air to highlight coalesce


40


Pass

0201 pads Profile L Profile LS Profile HS

LOCTITE GC 50

Reflow evaluation

REFERENCE

Reflow evaluation

Comparison Deposits: Reflow L v LS v HS

❷


coalescedcoalesced Partial

coalesced

Analysis: • LOCTITE GC 50 shows good coalescence and wetting for all 3 profiles for 0201 pads• Note the comparison and need for nitrogen for reference materials.Impact: • LOCTITE GC 50 has good solderability on small pad deposits. Remove need for nitrogen• Improve sustainability metrics

Impact of reflow profile on coalescence of 0201

pads

Target:

Coalescence same over

all profiles

Deposition:0201 Small pad

deposition and reflow in

air to highlight coalesce

41

LOCTITE GC 50 Solder PasteReflow Deposit visual post reflow (L): Impact of humidity resistance on reflow

Pass

initial 24 hours after Jetting 48 hours after Jetting

BGA 25°C/50%RH 27°C/80%RH 25°C/50%RH 27°C/80%RH

25

0µ

m3

00

µm

Comparison Deposits: Reflow Profile L - Humidity impact

❷

Target:

Coalescence same as

initial after 48 hours

Analysis: • LOCTITE GC 50 shows good coalescence and wetting on all deposition areas• Excellent solder paste humidity resistance on ceramic is replicated on PCB test board• No need for nitrogen to assist reflow, even 48 hours after deposition.Impact: • LOCTITE GC 50 has good solderability on small pad deposits. Remove need for nitrogen• Improve sustainability metrics

Overprint with pull back coalescence 250-300µm

pads. Impact oftemperature/humidity

Deposition:BGA Small pad

deposition and reflow in

air to highlight coalesce

42

LOCTITE GC 50 Solder PasteReflowVoiding: BGA100

❷

Parameter SL LH

Time above 217oC (sec) 37 88

Time between 150-190oC (sec) 60 141

Peak temperature (oC) 244 254

Time to peak (sec) 198 270


Pass

Target:Meet Void levels mean(x)̄

43

Voiding: BGA10050

40

30

20

10

0

Vo

id %

10%

ҧ𝑥 =0.3% ҧ𝑥 = 0.2%

Examples

❷

QFN68 Void Low High

ҧ𝑥 0.32% 0.24%

σ

44March 25, 2020

Parameter SL LH A B

Time above 217oC (sec) 37 88 72 60

Time between 150-190oC (sec) 60 141 102 144

Peak temperature (oC) 244 254 240 250

Time to peak (sec) 198 270 210 240

Pass

Target: No probe clogging


Tem

pe

ratu

re °

C

Time (mins)

250

200

150

100

50

0

Evaluation: ICT testing• Effect of profile on ability to penetrate flux residues

LOCTITE GC 50 Solder PasteReflow Pin Testing (In-circuit Testing)

Impact of reflow conditions

❷

217°CSL LH

AB


ICT Testing:Penetration of residue

using crown probe

45

Pad diameter target 900µmParameters Setup

Pads 500 pads per board, 2 boards tested

Probe0.9mm 4 point plain crown light spring probe 100g spring force

Profiles 4 reflow profiles

Atmosphere Air

Pass

Target:No probe clogging

LOCTITE GC 50 Solder PasteReflow Pin Testing (In-circuit Testing)

Profile 1: 100% pass 2: 100% pass 3: 100% pass 4: 100% pass

Imagery after 1000 in-circuit tests

❷


Analysis: Voids under BGA• Post reflow, all 4 profiles give solder paste residues are that are penetrable• After 500 and 1000 contacts, 100% success is achievedImpact: • Irrespective of profile, the residues are penetrable.

ICT Testing:Penetration of residue

using crown probe

46

LOCTITE GC 50 Solder PasteReflow Head-in-Pillow (HiP) Test

• Solder paste printed onto a copper plate (0402 pad) stencil thickness 125µm• The copper plate is transferred to a heated stage at 250oC• When the solder paste starts to melt, a solder sphere (SAC305, Ø 0.76mm) is placed on the

solder deposit

250±5˚C

… First defectInitial 3 seconds 6 seconds

• Spheres are placed at 3 seconds intervals until the solder sphere fails to coalesce into the deposit

• The placement (heating) time at first defect is recorded

X seconds

Evaluation:• Flux activity after exposure to elevated temperatures for an undetermined time. • Used to simulate high temperature reflow programs to ensure flux has enough activity to

avoid HiP incidents.

Target: Heating time >6 seconds

❷

HiP: Study of effect of time above liquidus and

impact on coalescence

47

Me

an h

eat

ing

tim

e t

o f

ailu

re (

secs

)

referenceImpact of flux technology on HiP

pass

LOCTITE GC 50 Solder PasteReflow Head-in-Pillow (HiP) Test

Passequivalent to TSS printing paste

Target:

Heating time >6

seconds

❷

LOCTITE GC 50 Printing Paste

Analysis: • LOCTITE GC 50 can mitigate HiP (equivalent to a printing paste).Impact:• If time above liquidus (TAL) needs to be modified for other improvements, HiP will not

be impacted. Flux activity remains, for good solderability.

HiP: Study of effect of time above liquidus and

impact on coalescence

48

LOCTITE GC 50Reflow

❷

Reflow Condition Status

1. Humidity Resistance IPC requirements of 27°C/80% RH – 48 hours

2. Small pad coalescenceQFP100, CR1206, BGA, CSP, QFN28 - 3 reflow profiles (AIR)1 test vehicle, 1 surface finish

3. Small pad coalescence150 and 300µm over diameter pad coalescence - 3 reflow profiles (AIR)1 test vehicle, 1 surface finish

4. Small pad coalescence250-300µm deposition(s) exposed to 27°C/80% RH – 48 hoursSurface finishes and 1 reflow profile (AIR)

5. BGA voidingBGA 100 – 2 reflow profiles (AIR)1 test vehicle, 1 surface finishes

6. In-Circuit Testing Crown Probe: 4x reflow (AIR)

7. Head in Pillow Meets requirements industry expects

49





31 - 49 Reflow

50 - 56 Reliability


67 – 72 Summary


❺

❶

❷

❸

❹

50

Flux induced corrosion

(Cu mirror) TM 2.3.32

No breakthrough observed

Flux type L

Flux corrosion

TM 2.6.15:

No evidence of corrosion or pitting

Flux type L

Halogen test

TM 2.3.35.1

(SGS)

Meets requirements of

Halogen free

Surface insulation resistance (SIR)

TM 2.6.3.7>1.0 x108 Ω after 168 hours

Pass (6.2x109Ω)

Electromigration

TM 2.6.14.19.0 x1011 Ω after 500 hours Pass

Evaluation of Flux Reliability: LOCTITE GC 50 Result Summary:

LOCTITE GC 50 Solder PasteReliability:Flux Classification (IPC) ROL0

❸

Pass All

Targets:

Pass requirements to

ROL0 classification

Test: in accordance

with IPC J-STD-004B

51

Evaluation of Flux Reliability:

LOCTITE GC 50 Solder PasteReliability:Surface Insulation Resistance (SIR) - IPC 2.6.3.7 (Hot Soak Profile)

• SIR testing completed in accordance to IPC TM-650 2.6.3.7• Reflowed using hot soak profile (shown)

40oC, 90% RH

200 µm gap

+5V bias/ measurement

(25V/mm)

Time (days)

control

❸

Exceeds 1 x 108 Ω

Targets:

Insulation resistance

≥ 1 x 108 Ω

Test: in accordance

with IPC TM-650 2.6.3.7

Reflow: Hot Soak (HS) profile, air

Analysis: • LOCTITE GC 50 passes SIR test with 100x resistance measured over pass criteria.Impact:• Under the profile examined, the flux residues are not hygroscopic and hydrophilic.

SIR

Ω’s

10^12

10^11

10^10

10^9

10^8

10^7

10^6

LOCTITE GC 50

pass

52


LOCTITE GC 50 Solder PasteReliability:Electrochemical Migration Resistance (ECM) - IPC 2.6.14.1

• Prepared in accordance to IPC TM-650 2.6.14.1

96 hours/ Ω

500 hours/ Ω

Control 1.3x1012 8.3x1011

LOCTITE GC 50 3.3x1011 2.6x1011

Pass 3.7x109 3.7x109

❸

No dendritic growth

Targets:

No electro-migration

after testing

Test: in accordance with IPC TM-650

2.6.14.1

ECM

Ω’s


65oC, 85% RH

+10V bias, 500 hours

100V measurement

Analysis: • LOCTITE GC 50 passes ECM test with 100x resistance measured over pass criteria.Impact:• Under the profile examined, the flux residues are not hygroscopic and hydrophilic.

4 days 21 days

10^12

10^11

10^10

10^9

10^8

10^7

10^6

pass

LOCTITE GC 50

control

53



40oC, 90% RH

200 µm gap


(25V/mm)

Time (days)

control

❸

Exceeds 1 x 108 Ω

Targets:


≥ 1 x 108 Ω

Test: in accordance

with IPC TM-650 2.6.3.7



SIR

Ω’s

10^12

10^11

10^10

10^9

10^8

10^7

10^6

LOCTITE GC 50

pass

LOCTITE GC 50 Solder PasteReliability with print grade solder paste:Solder Paste Compatibility – using SIR (Surface Insulation Resistance)

54



40oC, 90% RH

200 µm gap


(25V/mm)

Time (days)

❸

Exceeds 1 x 108 Ω

Targets:


≥ 1 x 108 Ω

Test: in accordance

with IPC TM-650 2.6.3.7



SIR

Ω’s

10^12

10^11

10^10

10^9

10^8

10^7

10^6

LOCTITE GC 50 Solder PasteReliability with print grade solder paste:Solder Paste Compatibility – using SIR (Surface Insulation Resistance)

pass

control

LOCTITE GC 50

55

LOCTITE GC 50 Solder PasteReliability

❸

Printing Condition Status

1. Flux Classification In accordance with IPC J-STD-004B

2. SIR Extended IPC J-STD-004B with 2 reflow profiles

3. ECM Extended IPC J-STD-004B with 2 reflow profiles

4. Compatibility Assessment with printed solder paste

56





31 - 49 Reflow

50 - 56 Reliability


67 – 72 Summary


❺

❶

❷

❸

❹

57

LOCTITE GC 50 Solder PasteStorage Stability:Malvern Parallel Plate Viscosity on Storage for 12 months at 25°C (77F)

❹

Parallel Plate – viscosity measured on impact of increasing shear rate

No change

Target:

Stable over time and

temperature

Using 20mm parallel plate

Analysis:• 12 months storage data shows no viscosity change in comparison to fresh material

Storage: Viscosity and Performance post

ageing

58

LOCTITE GC 50 Solder PasteStorage Stability:In-Process Stability

❹

Life in cartLife in ejector

head – on bench

Life in ejector head – paused

28°C

Life in ejector head – in use 28°C

In-process Storage

Stability Test

Approved storage time/ temperature

1 week at 50°C, 1 month at 40°C, 6 months at 25°C

> 2 weeks at 25°C> 1 week at 28°C

> 2 weeks at 28°C

Evaluation of in-process stability

No change

Target:

Cpk target > 5.0

(44K deposits)

Using AG04 ejector head

Analysis: • Target diameter of 400µm with minimal deviation achieved throughout full cartridge

deposition. Impact: • Cpk >5.0 indicates process control and paste homogeneity

Storage: Deposition Performance post

ageing

59


❶



µ (µm) 405 406 407

± σ (µm) 8.9 9.63 9.41

Cpk 5.95 5.5 6.5

AG0444K deposits from one cartridge: Diameter target 400µm


Pad diameter 400µm (on BGA)

Pass

Target:

Cpk > 1.33 for 400µm


Using AG04 ejector head depositing 44K

droplets of paste

Deposition:

400µm diameter


60


❷

Parameter SL LH






250

200

150

100

50

0


217°C

Pass

Target:Meet Void levels mean(x̄)

61

Deposition:

400µm diameter


LOCTITE GC 50 Solder PasteHandling, Viscosity and Deposition (and SL reflow)In-Process Stability (consistency through cartridge at 28°C)

❶



µ (µm) 405 406 407

± σ (µm) 8.9 9.63 9.41

Cpk 5.95 5.5 6.5




Pass

Target:




droplets of paste

62

LOCTITE GC 50 Solder PasteStorage Stability:In-Process Stability (consistency through cartridge at 28°C – reflow profile SL)


droplets of paste


Initial Middle End

Image of deposition throughout

µ (µm) 405 406 407

± σ (µm) 8.9 9.63 9.41

Cpk 5.95 5.5 6.5




Pass

Target:


Tolerance ± 50%

❹

Analysis: • Target diameter of 400µm with minimal deviation achieved throughout full cartridge

deposition. Impact: • Cpk >5.0 indicates process control and paste homogeneity

Deposition:

400µm diameter


63

LOCTITE GC 50 Solder PasteStorage Stability:In-Process Stability (impact of time in ejector head at 28°C)


droplets of paste


initial 1 hour 20 hours 72 hours 168 hours

Image of deposition

after storage interval

µ (µm) 403 405 448 410 423

± σ (µm) 10.8 9.49 11.24 9.74 9.87

Cpk 6.05 5.8 6.2 5.8 5.7

AG0444K deposits from one cartridge: Diameter target 400µmMounted in ejector head at 28°C for one week



Pass

Target:


Tolerance ± 50%

❹

1400

0000

1260

0000

1120

0000

9800

000

8400

000

7000

000

5600

000

4200

000

LSL USL

LSL 4.71e+006

Target *

USL 1.413e+007


Sample N 22176



Process Data

C p 6.55

C PL 5.80

C PU 7.30

C pk 5.80

Pp 3.54

PPL 3.14

PPU 3.95

Ppk 3.14

C pm *



PPM < LSL 45.09

PPM > USL 0.00

PPM Total 45.09


PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00


PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00


Within

Overall

XP157 initial Process Capability of Volume(um3)

Analysis: • After paste in ejector head for a week at elevated temperature, target diameter of 400µm with

minimal deviation achieved.Impact: • Cpk >5.0 indicates process control, paste homogeneity and paste stability

Deposition:400µm diameter

consistency over time

64

LOCTITE GC 50 Solder PasteStorage Stability:Stability (impact of time/temperature on process capability)


droplets of paste

Analysis: • Each cartridge is unaffected in terms of application performance after storage periods. • Target diameter of 400µm with minimal deviation over all storage periods. Impact: • Cpk >5.0 indicates process control, paste homogeneity and paste stability.


Diameter initial 1 week 50°C1 month

40°C12 months

25°C12 months

5°C

Image of deposition

after storage interval

µ (µm) 414 402 400 398 390

± σ (µm) 9.37 8.89 8.9 7.95 7.85

Cpk 6.0 5.5 6.4 5.3 6.2

AG04Storage stability at different time conditions.



Pass

Target:


Tolerance ± 50%

❹

1400

0000

1260

0000

1120

0000

9800

000

8400

000

7000

000

5600

000

4200

000

LSL USL

LSL 4.71e+006

Target *

USL 1.413e+007


Sample N 22176



Process Data

C p 6.55

C PL 5.80

C PU 7.30

C pk 5.80

Pp 3.54

PPL 3.14

PPU 3.95

Ppk 3.14

C pm *



PPM < LSL 45.09

PPM > USL 0.00

PPM Total 45.09


PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00


PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00


Within

Overall

XP157 initial Process Capability of Volume(um3)

initial

1 week 50°C

4 weeks 40°C

52 weeks 25°C

52 weeks 5°C

Deposition:

400µm diameter

consistency assessed

after storage

65

LOCTITE GC 50Storage Stability

❹

Storage Test Condition (reference against time zero in Section) Status

1. Viscosity (v initial)Stability evaluation (RT for 12 months)

2. Deposition ControlTarget Diameter 400µm - In-Process StabilityConsistency throughout cartridge

3. Deposition ControlTarget Diameter 400µm - In-Process StabilityLife in ejector head at 28°C

4. Deposition ControlTarget Diameter 400µm - Stability evaluation After refrigeration, RT for 12 months

5. ReflowTarget Diameter 400µm - Stability evaluation After refrigeration, RT for 12 months

❶

66





31 - 49 Reflow

50 - 56 Reliability


67 – 72 Summary


❺

❶

❷

❸

❹

67

❺ LOCTITE GC 50 Solder Paste Summary

ATTRIBUTES TYPICAL TECHNOLOGY LOCTITE GC 50

FLUX

Regulatory compliance Halide containing, Halide-free Zero halogens added (Halogen free)

IPC J-STD 004B classification (Inc. SIR) ROL1/ROL0 ROL0

Cleanability Challenging Easy

Tackiness Acceptable < 24 hours Maintained > 48 hours

POWDERParticle Size Distribution Type 5 Type 5

Alloy SAC305 SAC305

STORAGE

Performance stable at 5°C 6 months 12 months

Performance stable at 25°C Not stable 6 months

Performance stable at 40°C Not stable 1 month

Performance stable at 50°C Not stable 1 week

DEPOSITION PROCESS

Smallest component 0402 0201

In-process ejector head stability (28°C) < 1 day in application > 2 weeks in application

In-process ejector head stability (28°C) < 1 day in pause > 1 week in pause

Smallest diameter deposition with AG04 400µm 290µm

Startup time 4 – 6 hours 0 hours without refrigeration

REFLOW

Long Linear Profile ( 150µm (oversize diameter pull back)

In Circuit Testing Hard residues Easy to penetrate

LOCTITE GC 50 Benefits

68

❺ LOCTITE GC 50 Solder Paste Summary

Designed as improved process and sustainable solution

Benefits of high-speed Jetting Solder Paste

Repair of misprinted boardsOvercomes board/component topography challenges with enhanced volume/diameter deposition control

Addition of solder paste to pre-printed boards Allows capability of 3D deposits across a board with tooling

Enables add-ons of different shapes and heights Fast prototype turnarounds

Eliminate the need for step stencils and preforms Accelerated production of small batch assemblies

Reduce over-engineering printing paste using ultra-fine powders Reduces need for intricate stencil designs for high density challenges

LOCTITE GC 50 Benefits

69

LOCTITE GC 50 solder paste – properties and storage

ATTRIBUTES Market Leading T5 LOCTITE GC 50 T5 Comments: LOCTITE GC 50 benefitsRegulatory compliance Halide/halogen containing Halogen Free Zero halogens added Truly halogen free

Particle Size Distribution Type 5,6,7 Type 5,6 Type 5 Flux enhanced Cpk avoiding over engineering solution

Alloy SAC305 SAC305 SAC305 EICC and ROHS compliant

Flux ROL0/ROL1 ROL0/ROL1 ROL0 Zero halogen to J-STD004B

STORAGE:Performance stable at 0-10°C 3 months SAC 6 months SAC 12 months Can be stored traditionally

Performance stable at 5-25°C 1 week @ 25°C 1 week @ 25°C SAC 6 months Enhance utilization of paste

Performance stable at 40°C Not available < 1 hour SAC 1 month Enhance utilization of paste

Performance stable at 50°C Not available < 1 hour SAC 1 week Enhance utilization of paste

Monitor Impact of stability on sustainability

Value Add

Value Add

Note:• LOCTITE GC 50 shipped with and

without cold packs. Dependent on customer requirements

Value Add

Value Add

Value Add

Value Add

Note:• Competitor materials require halide

containing activity

Note:• Competitor materials require finer

powders for

70

ATTRIBUTES Market Leading T5 LOCTITE GC 50 T5 Comments: LOCTITE GC 50 benefits

PROCESSOn-line paste utilization 40-50% > 50% > 95% Near full use of cartridge – no ejector head issue

Start-up time 4-24 hours 4 hours 0 hours Eliminates shift down time

PROCESS Jetting:Deposition consistency 400µm, Cpk initial (±50%) >1.33 >1.33 >3.00 Competitor material consistency not maintained

Deposition consistency 400µm, Cpk 4hours (±50%) 1.00 >2.00 ALL Competitor needs T6 and nitrogen reflow

Deposition consistency 300µm, Cpk initial (±25%)

71

AttributeIndustry

Reference T5LOCTITE GC 50 T5 LOCTITE GC 50 Benefit

Life in ejector head

< 8 hours 2 weeks in pause Each ejector head €500Current market paste will clog ejector heads after 5.0 over shelf life study. Built-in stability increases process robustness, improves sustainability and Cost of ownership

Shelf life stability at 40°C

0 hours(refrigeration required)

1 month

Shelf life stability at 50°C

0 hours(refrigeration required)

1 week

Smallest pad size without overprint

>400µmDemonstrated down to

290µm

Jetting – 44K dots(400µm diameter)

Initial, achieved Initial, achievedCapable of jetting down to 0201 and in future 01005 chamber development

After 1 week at 28°C, not achieved

After 1 week at 28°C , achieved

Smallest achievable diameter for T5. Outperforms reference paste. Cpk >5.00 achievable

❺

LOCTITE GC 50

Designed with improved performance and stability

High Cpk

LOCTITE GC 50 Solder PasteSummary: Differentiation in the market

72





31 - 49 Reflow

50 - 56 Reliability


67 – 72 Summary


❺

❶

❷

❸

❹

73

LOCTITE GC 50 Solder Paste Appendix – Reflow Profiles

Links:Profiles, Test Boards, and Components

Parameter TDS SL LH A B LL LS HS

Time above 217oC (sec) 40 – 100 37 88 72 60 62 65 100

Time 150oC to 200oC (sec) 60 – 140 60 141 102 144 38 136 62

Peak temperature (oC) 238 – 265 244 254 240 250 245 238 265

Time to peak (sec) 200 - 330 198 270 210 240 230 312 330

Time to 150°C (sec)

Test Vehicle Henkel SPTV-2 board Henkel SPTV-1.1 board

Page Referenced (appendix) 22, 45, 76, 77 35, 74, 75

Evaluation Pages22, 23, 24, 45, 46, 47, 48, 63, 64,

65, 76, 7735, 37, 38, 39, 40, 41,

42, 43, 44, 74, 75

Void - BGA 46

Small Pad 150µm 41

Small Pad 250-500µm 23, 24, 63, 64, 65, 40, 42, 44

Solderability (QFP, CSP, QFN, 0402, 0201, 01005)

37, 38, 39, 43

Pin Testability 47, 48,

Surface Finish Cu-OSP Cu-OSP

Summary

74

LOCTITE GC 50 Solder Paste Appendix – Reflow Profiles

Parameter LL LS HS

Time above 217oC (sec) 62 65 100

Time between 150-190oC (sec) 38 136 62

Peak temperature (oC) 245 238 265

Time to peak (sec) 230 312 330

Time (mins)


250

200

150

100

50

0

217°CHS LLLS


Tem

pe

ratu

re °

C

Pass

Target: Good reflow in air

Reflow Testing: Study of effect of

impact of three reflow

profiles

75


Parameter SL LH






250

200

150

100

50

0


217°C

Pass

Target:Meet Void levels mean(x̄)

76March 25, 2020

Parameter SL LH A B

Time above 217oC (sec) 37 88 72 60

Time between 150-190oC (sec) 60 141 102 144

Peak temperature (oC) 244 254 240 250

Time to peak (sec) 198 270 210 240

Pass

Target: no probe clogging


Tem

pe

ratu

re °

C

Time (mins)

250

200

150

100

50

0

Evaluation: ICT testing• Effect of profile on ability to penetrate flux residues

LOCTITE GC 50 Solder PasteReflow Pin Testing (In- Circuit Testing)


217°CSL LH

AB


ICT Testing:

Penetration of residue

using crown probe

77

Prelude: Solder Paste and Challenges facedTest Vehicles Used to tackle challenges

QFN100

Henkel SPTV-1 board

PackageSize

(package)Size

(central pad)Finish

QFN100 12 x 12mm 8.3mm Tin


BGA100 CSP SAC305

1206 Tin

0402/0201

QFN88

QFN100

QFN28

Henkel SPTV-2 board

PackageSize

(package)Size

(central pad)Finish




BGA100 SAC305

Chip Components

CR1206CR0402CR0201

Tin

Test Vehicles: Each board >15K interconnects – covers many sizes of BTC

Test Vehicle(s): Gives both printing Cpkand Reflow indicators

78


Thank you!

henkel standard template with sample slides · 2020. 3. 31. · 5 prelude: challenges and...

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